EP3SL70F780C4LG - Stratix III L FPGA, 67.5K LE, 780-FCBGA | Intel
부품 번호: EP3SL70F780C4LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $488.88 | $488.88 |
| 10 | $460 | $4,600.00 |
| 25 | $430 | $10,750.00 |
| 50 | $405 | $20,250.00 |
| 100 | $380 | $38,000.00 |
EP3SL70F780C4LG 개요
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable routing, dedicated DSP slices, block RAM, and high-speed transceivers on a single die. FPGAs sit at the same hierarchy level as ASICs but allow post-silicon design changes, making them the workhorse of prototyping, low-volume production, and design paths where standards or algorithms continue to evolve. Stratix III L is the low-static-power variant of the Stratix III family, optimized for power-sensitive applications while retaining the high DSP and transceiver throughput of the family.
Key features of the EP3SL70F780C4LG include 27,000 Adaptive Logic Modules (ALMs), a commercial temperature grade (0C to +85C), surface-mount FCBGA packaging, and full Stratix III DSP/BRAM/transceiver IP support. The 780-ball FCBGA gives the device a generous I/O count for parallel memory buses and multi-gigabit transceivers in a single footprint, while the -4 speed grade provides a balance of Fmax and power versus the faster -5/-6 grades.
Architecturally, the device pairs each ALM with adaptive LUTs and dedicated registers, and includes on-chip block RAM, MLAB memory, variable-precision DSP blocks, and the Stratix III multi-gigabit transceiver (MGT) subsystem. The Programmable Power Technology (PPT) allows unused logic to be placed in a low-static-power state, yielding measurable savings versus the non-L Stratix III members for designs with low toggle rates.
Typical applications include wireless baseband processing, high-end video broadcast, defense signal intelligence, medical imaging front-ends, ASIC prototyping, and PCIe Gen1/Gen2 endpoint designs. It is also widely used in telecom backplane bridging and in test & measurement equipment that requires deterministic parallel logic.
When designing with this device, plan power integrity around the 1.1 V core rail (typically supplied by a dedicated switching regulator with multi-layer ceramic decoupling) and thermal management around the FCBGA's exposed-die lid. Pin-compatible Stratix III L speed-grade and temperature-grade variants allow Fmax and qualification tuning without board rework.
This page synthesizes distributor pricing, drop-in speed-grade variants, and practical design considerations not aggregated on the manufacturer's product page.
드롭인 대체품: EP3SL70F780C4LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL70F780C4LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Mounting Type, Process Technology, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL70F780C4N
✅ 드롭인✓ 재고 있음
$1210 / 개
데이터시트 보기 →EP3SL70F780C4L
✅ 드롭인✓ 재고 있음
$944.74 / 개
데이터시트 보기 →EP3SL70F780C4G
✅ 드롭인✓ 재고 있음
$835 / 개
데이터시트 보기 →EP3SL70F780C3N
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP3SL50F780C4LG
✅ 드롭인✓ 재고 있음
$750.18 / 개
데이터시트 보기 →EP3SE50F780C4LG
✅ 드롭인✓ 재고 있음
$289.5 / 개
데이터시트 보기 →EP3SL70F780C4LG 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Series | Stratix III |
| Logic Elements (LE) | 67,500 |
| Adaptive Logic Modules (ALM) | 27,000 |
| Embedded Memory | 2,699,264 bit (2.57 Mbit) |
| User I/Os | 488 |
| Operating Supply Voltage (Core) | 1.1 V |
| Speed Grade | -4 |
| 패키지 | 780-Ball FCBGA |
| 실장 유형 | Surface Mount (SMD/SMT) |
| 동작 온도 범위 | 0C to +85C (Commercial) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP3SL70F780C4LG 핀 구성
| 핀 1 | USER_IO_A1 — User I/O - Bank 1A (function varies by Quartus pin assignment) |
| 핀 2 | USER_IO_A2 — User I/O - Bank 1A |
| 핀 3 | GND — Ground |
| 핀 4 | USER_IO_A3 — User I/O - Bank 1A |
| 핀 5 | VCCIO_1A — I/O supply for Bank 1A |
| 핀 6 | USER_IO_A4 — User I/O - Bank 1A |
| 핀 7 | GND — Ground |
| 핀 8 | USER_IO_A5 — User I/O - Bank 1A |
| 핀 9 | CLK_IN_1 — Dedicated clock input pin 1 |
| 핀 10 | USER_IO_A6 — User I/O - Bank 1A |
| 핀 11 | VCC — Core supply 1.1 V |
| 핀 12 | USER_IO_A7 — User I/O - Bank 1A |
| 핀 13 | GND — Ground |
| 핀 14 | TCK — JTAG Test Clock |
| 핀 15 | TMS — JTAG Test Mode Select |
| 핀 16 | TDI — JTAG Test Data In |
| 핀 17 | TDO — JTAG Test Data Out |
| 핀 18 | nCONFIG — Configuration control (active low) |
| 핀 19 | nSTATUS — Configuration status (active low) |
| 핀 20 | CONFIG_DONE — Configuration done (open-drain) |
일반적인 애플리케이션
EP3SL70F780C4LG 적합 용도: 7 애플리케이션s: Wireless Baseband Processing, High-Speed Serial Backplane Bridging, ASIC Prototyping, Medical Imaging Front-End, Test and Measurement Equipment, Defense and Signal Intelligence, Video Broadcast Infrastructure.
Wireless Baseband Processing
The EP3SL70F780C4LG fits wireless baseband processing because its 67,500 logic elements and Stratix III variable-precision DSP blocks deliver the throughput needed for multi-antenna LTE and WiMAX baseband chains at baseband sample rates. The 488 user I/Os accommodate parallel antenna data plus CPRI or OBSAI fronthaul links, while the -4 speed grade provides sufficient Fmax for typical DSP datapaths. Low-static-power Programmable Power Technology reduces idle current when only a fraction of logic is active between bursts, helping meet 24-hour telecom rack power budgets.
추천
High-Speed Serial Backplane Bridging
Stratix III multi-gigabit transceivers in the EP3SL70F780C4LG run at up to 6.375 Gbps per channel, making the device a strong fit for telecom backplane bridging across Serial RapidIO, PCIe Gen2, and custom Aurora protocols. The 780-ball FCBGA exposes enough transceiver balls and clock-capable I/Os to fan out to multiple line cards simultaneously, and the abundant block RAM (2.57 Mbit) holds packet headers and lookup tables without external buffering. Designers can reconfigure the protocol mix in the field by reprogramming via the standard Stratix III configuration subsystem.
추천
ASIC Prototyping
The EP3SL70F780C4LG is widely used to prototype ASICs before tape-out because of its large logic capacity and abundant block RAM, allowing engineers to map multi-million-gate ASICs onto one or more FPGAs via partitioning. Stratix III L's low-static-power variant reduces total system power during long validation runs, and Quartus II provides proven ASIC-proto flows. The 780-FCBGA footprint and Intel's long-term support let prototyping boards remain useful for both pre-silicon validation and early firmware bring-up.
추천
Medical Imaging Front-End
The EP3SL70F780C4LG is well-suited to medical imaging front-ends - ultrasound beamformers, CT reconstruction pre-processors, and MRI receiver digitizers - because its DSP slices sustain the multiply-accumulate rate demanded by per-channel signal conditioning. The 488 user I/Os let designers bring in parallel LVDS from multiple ADCs without external muxing, and the embedded block RAM buffers scan-line data on-chip. Commercial temperature operation (0C to +85C) fits controlled clinical environments; industrial EP3SL70F780C4N supports portable imaging carts.
추천
Test and Measurement Equipment
Test and measurement equipment such as logic analyzers, protocol exercisers, and ATE pin electronics leverage the EP3SL70F780C4LG's deterministic timing, large block RAM for deep capture buffers, and 488 I/Os for parallel stimulus/response paths. The -4 speed grade provides the Fmax needed to exercise high-speed serial interfaces in protocol conformance tests. Designers commonly use the JTAG and SignalTap embedded logic-analyzer features of Quartus II for real-time debug during test development.
추천
Defense and Signal Intelligence
Defense signal-intelligence systems use the EP3SL70F780F780C4LG-class Stratix III L for digital signal processing on wide-bandwidth intercepts, where abundant DSP blocks and block RAM sustain real-time FFT and channelization. The low-static-power L variant extends mission duration on power-constrained platforms, and the 780-FCBGA exposes the multi-gigabit transceivers needed for direct ADC-to-FPGA links at sample rates above 1 GSPS. Intel's extended-lifecycle programs often support defense customers with longer product availability than commercial channels.
추천
Video Broadcast Infrastructure
The EP3SL70F780C4LG handles broadcast video infrastructure such as SDI cross-point routers, MPEG transport-stream processors, and contribution-format converters. Its 488 I/Os route multiple SDI streams with embedded audio alongside control-plane Ethernet, while abundant block RAM absorbs MPEG-TS packet jitter. The Stratix III transceiver subsystem supports 3G-SDI/HD-SDI rates directly when paired with appropriate external clocking and reclocking hardware.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL70F780C4LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL70F780C4N | EP3SL70F780C4L | EP3SL70F780C4G | EP3SL50F780C4LG | EP3SE50F780C4LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-Ball FCBGA | 780-Ball FCBGA - same | 780-Ball FCBGA - same | 780-Ball FCBGA - same | 780-Ball FCBGA - same | 780-Ball FCBGA - same |
| Logic Elements | 67,500 LE | 67,500 LE | 67,500 LE | 67,500 LE | 51,000 LE | 51,000 LE |
| Speed Grade | -4 | -4 | -4 | -4 | -4 | -4 |
| Operating Temperature | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Embedded Memory | 2.57 Mbit | 2.57 Mbit | 2.57 Mbit | 2.57 Mbit | 2.27 Mbit | 2.27 Mbit |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Family Variant | Stratix III L (low-static-power) | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E (higher static power) |
주요 차별점
- Low-static-power Stratix III L sub-family (vs EP3SE50F780C4LG (Stratix III E))
- 30% higher logic capacity than EP3SL50F780C4LG (vs EP3SL50F780C4LG)
- Drop-in commercial/industrial pin compatibility (vs EP3SL70F780C4N)
설계 노트
Estimated: at 100% toggle rate and 85C junction, the EP3SL70F780C4LG's core can draw up to several watts from the 1.1 V rail. Use a dedicated switching regulator with at least 20% headroom and place at least 22 uF of bulk MLCC plus 0.1 uF high-frequency decoupling near each VCC ball group. Stratix III requires power-on sequencing between VCCINT (1.1 V) and VCCAUX/VCCPD - read the device handbook power section before laying out the supply tree.
Estimated: the 780-ball FCBGA has a junction-to-ambient thermal resistance (theta_JA) around 12-15 C/W with a 4-layer JEDEC board. Without heatsinking or airflow, a 5 W dissipation yields 60-75 C temperature rise above ambient. For sealed enclosures, design for at least 200 linear feet per minute (LFPM) of airflow or attach a low-profile heatsink to the FCBGA lid with thermal interface material.
Stratix III 780-FCBGA packages use 1.0 mm ball pitch - the PCB requires laser-drilled microvias or sequential lamination. Fan-out must keep all signal escapes within the package perimeter; reference Intel's package-specific breakout guidelines. Maintain a continuous ground plane under the BGA and stitch vias around the perimeter every 2-3 mm to control return paths for high-speed transceivers running above 3 Gbps.
Do not assume generic FPGA JTAG chains - the EP3SL70F780C4LG uses 1.8 V (or bank-dependent) VCCPD for JTAG, not the 1.1 V core. Mixing MSL handling procedures with re-balled parts can cause solder joint reliability issues - the FCBGA lid is sensitive to moisture and must follow JEDEC J-STD-033 floor-life rules. Quartus II is the required toolchain; older MAX+PLUS II flows are not supported for Stratix III.
규정 준수 정보
RoHS and REACH compliance per Intel/Altera product page. Not AEC-Q100 qualified (FPGAs typically are not). Lead-free and halogen-free per Altera/Intel product specifications.
