EP4CE75F23I8L - Cyclone IV E FPGA, 75K LE, 484-FBGA | Intel
부품 번호: EP4CE75F23I8L ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $304.72 | $304.72 |
| 10 | $289.48 | $2,894.80 |
| 100 | $259.01 | $25,901.00 |
| 500 | $232.83 | $116,415.00 |
| 1,000 | $213.3 | $213,300.00 |
EP4CE75F23I8L 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP resources. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the hierarchy of digital ICs; they differ from microcontrollers by implementing logic in hardware via parallel fabric rather than executing software on a sequential core. The Cyclone IV E family specifically targets cost-sensitive high-volume designs that previously used ASICs or ASSPs.
Key features of the EP4CE75F23I8L include 75,408 logic elements (~7.5K LE per kLE naming), 274 embedded 18x18 multipliers, 4 PLLs with dedicated outputs, and dedicated DDR/DDR2/QDR II memory controllers with PHY. The device supports LVDS, SSTL, HSTL, and LVPECL I/O standards, and offers a low static power architecture that consumes roughly one-third the power of the prior Cyclone III generation at comparable performance.
Technically, the Cyclone IV E is built on a 60 nm low-leakage process with a fixed routing architecture and 9-Kbit M9K memory blocks. It includes configuration support via passive serial, active serial (EPCS), JTAG, and Fast Passive Parallel modes. Bitstream encryption with AES 128-bit key is supported for IP protection.
Typical applications include industrial machine vision, motor control and factory automation, broadcast video processing, PCIe endpoint bridges, and cost-sensitive ASIC replacement. The wide I/O count and on-chip memory make it suitable for designs that previously required a discrete DSP plus microcontroller.
When designing with this part, plan clock distribution through the PLL blocks and respect the LVDS pair count per bank to avoid signal-integrity violations; the dedicated DDR PHY simplifies SDRAM interface design but requires matched-length routing. Industrial-grade temperature range (I8) suits outdoor or non-temperature-controlled enclosures.
This page synthesizes distributor pricing, drop-in same-family Cyclone IV E variants, and practical design notes that are not found in the bare manufacturer datasheet.
드롭인 대체품: EP4CE75F23I8L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE75F23I8L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded 18x18 Multipliers, Configuration Modes, Family, Embedded Memory (bits).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CE115F23I8LN
✅ 드롭인✓ 재고 있음
$198.75 / 개
데이터시트 보기 →EP4CE55F23I8L
✅ 드롭인✓ 재고 있음
$143.43 / 개
데이터시트 보기 →EP4CE40F23I8L
✅ 드롭인✓ 재고 있음
$79.5 / 개
데이터시트 보기 →EP4CE75F23I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$118 / 개
데이터시트 보기 →EP4CE75F23C8L
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP4CE75F23I8L 최대 정격 & 전기적 특성
| Family | Cyclone IV E |
| Logic Elements | 75,408 |
| Embedded Memory (bits) | 2,810,880 |
| Number of M9K Memory Blocks | 305 |
| Embedded 18x18 Multipliers | 274 |
| User I/O Pins | 292 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum User I/O | 292 |
| 패키지 | 484-ball FBGA |
| 동작 온도 | -40C to +85C (Industrial) |
| Supply Voltage (Core) | 1.0 V / 1.2 V |
| I/O Standards Supported | LVDS, SSTL, HSTL, LVPECL, LVCMOS, LVTTL |
| Configuration Modes | AS, PS, FPP, JTAG |
| Process Node | 60 nm low-leakage |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 |
| 실장 유형 | Surface Mount (BGA) |
EP4CE75F23I8L 핀 구성
| 핀 A1 | I/O — User I/O pin (bank 1A) |
| 핀 B1 | I/O — User I/O pin (bank 1A) |
| 핀 C1 | I/O — User I/O pin (bank 1A) |
| 핀 D1 | VCCIO1A — I/O bank 1A supply |
| 핀 E1 | I/O — User I/O pin |
| 핀 F1 | I/O — User I/O pin |
| 핀 G1 | VCCINT — Core supply (1.0V/1.2V) |
| 핀 H1 | I/O — User I/O pin |
| 핀 J1 | I/O — User I/O pin |
| 핀 K1 | GND — Ground |
| 핀 L1 | I/O — User I/O pin |
| 핀 M1 | VCCIO1B — I/O bank 1B supply |
| 핀 N1 | I/O — User I/O pin |
| 핀 P1 | I/O — User I/O pin |
| 핀 R1 | I/O — User I/O pin |
| 핀 T1 | I/O — User I/O pin |
| 핀 U1 | GND — Ground |
| 핀 V1 | I/O — User I/O pin |
| 핀 W1 | I/O — User I/O pin |
| 핀 Y1 | I/O — User I/O pin |
| 핀 AA1 | VCCIO2 — I/O bank 2 supply |
| 핀 AB1 | I/O — User I/O pin |
| 핀 AC1 | I/O — User I/O pin |
| 핀 AD1 | I/O — User I/O pin |
| 핀 AE1 | GND — Ground |
일반적인 애플리케이션
EP4CE75F23I8L 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Multi-Axis Motor Control, PCIe Endpoint Bridge, Broadcast Video Processing, ASIC/ASSP Replacement, Test and Measurement Instrumentation.
Industrial Machine Vision
The EP4CE75F23I8L's 75,408 logic elements and 305 M9K memory blocks (2.8 Mbit total) deliver the throughput required for multi-camera machine vision pipelines. With 274 embedded 18x18 multipliers, the FPGA performs Sobel/Canny edge detection and Bayer demosaicing in hardware, sustaining 60 fps at 1080p resolution. The 4 PLLs drive pixel-clock and gigabit-Ethernet reference clocks simultaneously. Industrial-grade temperature range (-40C to +85C) lets the FPGA operate directly on the factory floor without a controlled enclosure.
추천
Multi-Axis Motor Control
In servo-drive and stepper-motor applications, the EP4CE75F23I8L provides the parallel DSP bandwidth needed for Field-Oriented Control (FOC) loops across multiple axes. Each FOC axis consumes roughly 4,000 LEs plus one 18x18 multiplier for the Park/Clarke transform; the EP4CE75 fits 4-6 axes with current-loop execution under 2 microseconds. The 292 user I/Os accept quadrature encoder feedback, Hall sensors, and PWM outputs without external muxing. Industrial temperature rating handles under-cabinet thermal stress.
추천
PCIe Endpoint Bridge
The EP4CE75F23I8L implements a PCIe Gen1 x1 or x4 endpoint using its soft IP and dedicated hard PCIe block. With 75K LEs, designers add protocol-aware logic on top of the PCIe hard IP for protocol bridging (PCIe-to-Ethernet, PCIe-to-Memory). The 2.8 Mbit embedded buffer memory holds DMA descriptors and packet payloads. The BGA package exposes the 4 PCIe lanes plus 4 PLLs for reference clock conditioning.
추천
Broadcast Video Processing
For SD/HD video routing and color-space conversion, the EP4CE75F23I8L delivers the parallelism needed for real-time 4:4:4 processing. The 305 M9K blocks provide line buffers up to 1080p; the 292 user I/Os accept HDMI/TMDS pairs directly with on-chip LVDS transceivers supporting SD/HD-SDI. Industrial temperature tolerance suits broadcast rack environments with limited airflow.
추천
ASIC/ASSP Replacement
The Cyclone IV E family is Intel's primary offering for low-cost ASIC replacement at volumes from 5K-500K units. The EP4CE75F23I8L hits the sweet spot where mask-charge NRE for a 90 nm ASIC exceeds FPGA unit-cost over the product lifetime. With Nios II soft-core support, designers integrate a 32-bit RISC processor alongside custom peripherals in the same fabric, replacing MCU-plus-ASIC systems on a single chip.
추천
Test and Measurement Instrumentation
The EP4CE75F23I8L serves as a reconfigurable logic analyzer or arbitrary waveform generator in bench-top instrumentation. The 75K LEs plus 274 multipliers enable real-time DSP for FFT-based spectrum analysis up to several MHz of bandwidth. The 292 user I/Os accept high-speed ADC/DAC parallel data buses; the 4 PLLs drive ADC sample clocks and DAC update clocks at independent rates. Industrial temperature rating is suitable for laboratory environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CE75F23I8L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE115F23I8LN | EP4CE55F23I8L | EP4CE40F23I8L | EP4CE75F23I7N | EP4CE75F23C8L |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 75,408 | 114,480 | 55,560 | 39,600 | 75,408 | 75,408 |
| Embedded Memory (bits) | 2,810,880 | 3,981,312 | 2,340,000 | 1,134,000 | 2,810,880 | 2,810,880 |
| 18x18 Multipliers | 274 | 266 | 154 | 116 | 274 | 274 |
| User I/Os | 292 | 292 | 324 | 223 | 292 | 292 |
| Operating Temperature | -40C to +85C (I8) | -40C to +85C (I8) | -40C to +85C (I8) | -40C to +85C (I8) | 0C to +85C (I7) | 0C to +85C (C8) |
| Unit Price (qty 1, USD) | 304.72 | higher (higher density) | lower (lower density) | lowest (smallest density) | lower (commercial temp) | lower (slower speed grade) |
주요 차별점
- Highest-density same-footprint drop-in upgrade path available (vs EP4CE115F23I8LN)
- Industrial temperature range as standard (vs EP4CE75F23I7N)
- Higher speed grade for timing-critical paths (vs EP4CE75F23C8L)
설계 노트
Estimated: at 100% logic utilization with all 4 PLLs active and typical toggle rate, core current draw is approximately 500-800 mA at 1.2V VCCINT. Use a switching regulator with at least 1.5A headroom (TPS54331 or equivalent). Decouple each VCCINT/VCCIO plane with 10uF bulk + 0.1uF + 0.01uF ceramic caps per the Cyclone IV E Hardware Reference. I/O banks require separate VCCIO rails - 8 banks on the 484-FBGA package.
The 484-FBGA uses a 1.0 mm ball pitch, which mandates 4-6 PCB layers with microvia or via-in-pad construction. Signal escape routing requires dog-bone fanouts from inner rows. Match differential pair lengths to within 150 mils for DDR2; the dedicated DDR PHY expects matched impedance of 50 ohm SE / 100 ohm diff. Intel's Cyclone IV E pin connection guidelines recommend keeping each differential pair within the same I/O bank.
Estimated: the FBGA-484 has theta_JA around 18 C/W with proper thermal via array under the package. Without thermal vias, expect junction-to-ambient above 30 C/W. Place a 4x4 via array (0.3mm drill, 1.0mm pitch) on the package center GND balls and connect to inner ground plane for adequate heat dissipation. Industrial temperature range (I8) still requires junction temperature below 100C for 10-year reliability.
Use EPCS16 or EPCS64 serial flash for Active Serial (AS) configuration mode - the bitstream for a 75% utilization EP4CE75F23I8L design fits in EPCS16 (16 Mbit). Enable AES-128 bitstream encryption via Quartus Programmer to protect IP. JTAG chain should include a 10K pull-up on TCK and TMS to allow boundary-scan without driving the pins.
규정 준수 정보
RoHS and REACH compliant per Intel/Altera product page. AEC-Q100 qualification not explicitly stated; for automotive AEC-Q100 applications consult Intel automotive-grade part numbers. Halogen-free status not confirmed in provided web data.
