Altera

EP4CE75F23C8L - Cyclone IV E FPGA 75,408 LE | Altera

부품 번호: EP4CE75F23C8L ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.2 V Vdss 484-ball FBGA (23 x 23 mm) Package 362 MHz Speed
문의하기 가격 문의
MOQ: 1 |
가격 업데이트: 2026-09-09
볼륨 가격
수량 단가 합계
1 $0 $0.00
10 $0 $0.00
100 $0 $0.00
500 $0 $0.00
1,000 $0 $0.00
ℹ️ 모든 가격은 USD 기준입니다

EP4CE75F23C8L 개요

The Altera EP4CE75F23C8L is a Cyclone IV E field-programmable gate array (FPGA) containing 75,408 logic elements, 2,810,880 RAM bits and 292 user I/O in a 484-ball FBGA package measuring 23 x 23 mm with 1.0 mm pitch.

What is an FPGA? A field-programmable gate array is an integrated circuit whose logic fabric can be reconfigured after manufacturing. FPGAs contain programmable logic blocks, configurable routing, and embedded memory, enabling engineers to implement digital circuits in hardware without a fixed ASIC mask. In the device hierarchy, an FPGA is a programmable logic device within the broader integrated circuit family, and Cyclone IV E is Altera's low-cost 60 nm FPGA family. This reconfigurability makes FPGAs valuable for prototyping, low-to-mid volume production, and applications that require field updates or algorithmic changes after deployment.

Key verified characteristics include 60 nm technology, a 1.2 V core supply voltage, and a maximum clock frequency of 362 MHz. The device provides 2,810,880 RAM bits for on-chip FIFOs and line buffers, 292 user I/O pins for interfacing with peripherals, and 4,713 CLBs as reported by FindIC. These resources support logic-intensive designs in industrial automation, video processing, wired communications, and test equipment. The 484-ball FBGA package gives designers a high pin-count option while keeping the 23 x 23 mm body compatible with compact mezzanine and main-board layouts.

Cyclone IV E uses a memory-rich fabric with dedicated clock management and I/O buffers, though the exact PLL count, configuration options, and supported I/O standards should be confirmed from the manufacturer datasheet because the verified snapshot does not include those details. The F23 package enables dense PCB routing while maintaining a manageable solder-ball pitch for mainstream assembly processes. Because the fabric is based on 60 nm technology, static power is higher than modern FinFET FPGAs, but the device remains widely used where Cyclone IV tool-chain maturity, low cost, and established IP availability are priorities.

Typical applications include industrial motor-control panels with PWM generation and encoder decoding, real-time video pipelines requiring line buffering and image filtering, protocol bridging in Ethernet edge devices, and medical or laboratory instruments that need deterministic signal acquisition. The 75k logic-cell capacity and 292 user I/O allow one FPGA to replace multiple discrete logic and fixed-function bridge chips, reducing part count and system power. The device also appears frequently in university and research boards because of mature Intel/Altera design flow support.

A key design consideration is that FPGAs must load their configuration bitstream at power-up. An active serial configuration device such as EPCS or EPCQ flash must be connected to the dedicated configuration pins, and the 1.2 V core requires clean decoupling over the full power pin set. Plan the power tree and pin assignments before layout to avoid ground bounce on simultaneous switching outputs and to preserve signal integrity on the high-speed I/O banks.

This page synthesizes distributor inventory, package-compatible alternatives, and practical design guidance that is not always collected in a single manufacturer datasheet. It is intended to support engineers and buyers during part selection, migration, and procurement of EP4CE75F23C8L.

드롭인 대체품: EP4CE75F23C8L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE75F23C8L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Modes, Process Technology, Operating Temperature, Speed Grade.

Intel
Package: 484-FBGA
Process Technology: 60 nm
Operating Temperature: 0 C to +85 C
비교 대상: EP4CE75F23C8L →
Intel
Package: 484-FBGA (23 x 23 mm, 1.0 mm pitch)
Configuration Modes: Passive Serial, Active Serial, Fast Passive Parallel, JTAG
Process Technology: 60 nm low-power CMOS
비교 대상: EP4CE75F23C8L →
Intel
Package: 484-ball FBGA (F23)
Configuration Modes: JTAG, AS, PS, FPP
Process Technology: 60 nm low-power
비교 대상: EP4CE75F23C8L →
Intel
Package: 484-BGA (FBGA-484)
Configuration Modes: Serial, Parallel, JTAG
Process Technology: 60 nm low-power CMOS
비교 대상: EP4CE75F23C8L →
Intel
Package: 484-ball FBGA (FineLine BGA)
Configuration Modes: AS / PS / FPP / JTAG
Process Technology: 60 nm
비교 대상: EP4CE75F23C8L →
Intel
Package: 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch
Process Technology: 60 nm CMOS, low-power
Speed Grade: C9 (commercial, 9 ns)
비교 대상: EP4CE75F23C8L →
Intel
Package: 484-ball FBGA
Configuration Modes: AS, PS, FPP, JTAG
Operating Temperature: -40C to +85C (Industrial)
비교 대상: EP4CE75F23C8L →
Intel
Package: 484-ball FBGA (F23) 1.0 mm pitch
Configuration Modes: JTAG, AS, PS, FPP
Process Technology: 60 nm low-power CMOS
비교 대상: EP4CE75F23C8L →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP4CE75F23C8

✅ 드롭인 ⚠️ 사양 미검증
Intel
📦 484-FBGA (F23)
Cyclone IV E · 75,408 · 4,713 · 2,810,880 (4.5 Mbit) · M9K blocks · 274 · 4 · 292

✓ 재고 있음

$159.4 / 개

데이터시트 보기 →

EP4CE75F23C8N

✅ 드롭인 ⚠️ 사양 미검증
Intel
📦 484-FBGA (F23)
Cyclone IV E · 75,408 · 2,810,880 · 426 · 274 · 4 · 484-BGA (FBGA-484) · 1.15 V to 1.25 V

✓ 재고 있음

$42.3 / 개

데이터시트 보기 →

EP4CE75F23I8LN

✅ 드롭인 ⚠️ 사양 미검증
Intel
📦 484-FBGA (F23)
Cyclone IV E · Cyclone IV E (EP4CE75) · 75,408 · 305 blocks · 2,810,880 bits · 244 · 4

✓ 재고 있음

$199.5 / 개

데이터시트 보기 →

EP4CE75F23C8LN

✅ 드롭인 ⚠️ 사양 미검증
Intel
📦 484-FBGA (F23)
Cyclone IV E · 75,408 · 4,713 · 2,810,880 · 274 · 292 · 4 · 20

✓ 재고 있음

$108.5 / 개

데이터시트 보기 →

EP4CE55F23C8L

✅ 드롭인 ⚠️ 사양 미검증
Intel
📦 484-FBGA (F23)
Cyclone IV E · 55,856 · 2,396,160 · 324 · 3491 · 1.2 V · 60 nm · 484-FBGA

✓ 재고 있음

$112.9 / 개

데이터시트 보기 →

EP4CE75F23C8L 최대 정격 & 전기적 특성

Series Cyclone IV E
Type Field Programmable Gate Array (FPGA)
Number of Logic Elements 75408
Number of CLBs/LABs 4713
Total RAM Bits 2810880 bits
Number of User I/O 292
Maximum Operating Frequency 362 MHz
Core Supply Voltage 1.2 V
Technology 60 nm
Package Type 484-ball FBGA (23 x 23 mm)
Terminal Count 484
Ball Pitch 1 mm
실장 유형 Surface Mount
Lifecycle Active (orderable from distributors)

EP4CE75F23C8L 484-ball fbga (23 x 23 mm) 핀 구성 가이드

EP4CE75F23C8L(484-ball fbga (23 x 23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP4CE75F23C8L의 484-ball fbga (23 x 23 mm) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP4CE75F23C8L.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP4CE75F23C8L 적합 용도: 6 애플리케이션s: Industrial Control and Motor Drive, Video and Image Processing Pipeline, Wired Ethernet Edge Bridge, Medical Device Interface, Test and Measurement Instrumentation, IoT Edge Gateway and Aggregator.

🏭

Industrial Control and Motor Drive

EP4CE75F23C8L fits industrial control boards because 75,408 logic elements provide enough fabric for multi-axis PWM generation, encoder decoding, and safety logic without an external MCU in many designs. With 292 user I/O, you can interface directly to gate-driver optocouplers, isolated ADCs, and incremental encoders while preserving headroom for a soft-core processor. The 1.2 V core lowers switching power compared to older 1.5 V FPGAs, which simplifies thermal design inside crowded IP20 enclosures. A common topology places EP4CE75F23C8L on the main control card, with external RS-485 transceivers and EtherCAT ASIC companion parts handling real-time networking. Because Cyclone IV E is not automatically AEC-Q100 qualified, use industrial-temperature-screened ordering variants for extended environments; verify the exact temperature range from the device datasheet.

📺

Video and Image Processing Pipeline

EP4CE75F23C8L can implement video timing, image scaling, and simple filtering tasks with 75,408 logic elements and 2,810,880 RAM bits. The embedded memory is useful for line buffers, while external DDR memory can be controlled by a soft controller for frame buffering. Its 292 user I/O allow 16/24-bit parallel video buses, LVDS camera inputs if supported, and display interfaces. A representative design receives a camera sensor, converts raw Bayer data, performs debayering and gamma correction in logic, then writes the resulting frame to DDR2 through an Altera memory controller IP. The FPGA's 60nm process and 1.2V core permit moderate clock rates, adequate for 1080p30 processing when optimized. Verify the exact numbers of I/O and supported standards from the Cyclone IV datasheet.

🌐

Wired Ethernet Edge Bridge

At the edge of industrial or enterprise networks, EP4CE75F23C8L can bridge non-standard parallel buses to Ethernet or serial protocols. 75,408 LEs are sufficient to run an Ethernet MAC soft-core with packet buffering in 2,810,880 RAM bits, leaving logic for custom checksum and filter functions. The 292 I/O can connect to a PHY chip through MII/GMII/RGMII, while the integrated clock management can synthesize the required 125 MHz Ethernet clock. Cyclone IV E's commercial temperature range fits indoor switching and gateway products. A design would typically include an external Ethernet transceiver, EEPROM for MAC address, and the FPGA's configuration flash; the FPGA performs store-and-forward frame processing without burdening the host processor.

💊

Medical Device Interface

EP4CE75F23C8L is suited for medical monitoring equipment that needs deterministic real-time acquisition and display. The FPGA has 75,408 logic elements for multichannel digital filtering, ECG denoising, and closed-loop alarm logic. Its 292 I/O connect to high-speed ADCs for physiological signals, while 2,810,880 RAM bits provide data FIFOs between acquisition and an application processor. Because FPGA logic executes without an operating system, timing for sample acquisition is deterministic. Medical designs should implement redundant power monitoring and watchdogs per IEC 60601 system-level guidance, but this component itself is not qualified as a medical device; system integrators perform safety certification. Verify the required temperature range and I/O standards for the specific signal-acquisition front-end.

🔧

Test and Measurement Instrumentation

EP4CE75F23C8L works well as the digital core of benchtop instruments: arbitrary waveform generators, data loggers, and protocol analyzers. 75,408 LEs can implement high-speed state machines, pattern generators, and trigger logic; 292 user I/O provide parallel lanes for DACs, ADCs, and front-panel displays. The 362 MHz maximum clock allows fast oversampling and pattern rates in low-cost instruments. Its 2,810,880 RAM bits store waveform samples and acquisition buffers to reduce external SRAM. Designers commonly pair this FPGA with a USB/UART bridge and an external SDRAM controller for larger captures. Because the F23 BGA package is compact for 484 pins, board layout with proper decoupling is straightforward; follow the manufacturer layout reference for power pins.

🧩

IoT Edge Gateway and Aggregator

For IoT edge gateways that connect sensors, local controllers, and cloud modules, EP4CE75F23C8L can perform protocol preprocessing and deterministic scheduling. The 75,408 logic elements are more than a simple hub needs, but they provide future-proofing for running a soft CPU, checksum offload, and protocol state machines concurrently. 292 user I/O handle multiple UART/SPI/I2C buses via soft IP, while 2,810,880 RAM bits buffer telemetry bursts. A common architecture has the FPGA collecting sensor frames, performing timestamping and validation, then forwarding over a UART/USB bridge to an embedded Linux MPU. The low 1.2 V core helps meet energy budgets in always-on edge products. Use the commercial temperature grade unless the gateway is deployed outdoors; select an industrial-grade order option if needed.

추천 제품 요약

EPCS16SI8N Altera 사용처: Industrial Control and Motor Drive, Video and Image Processing Pipeline, Medical Device Interface, IoT Edge Gateway and Aggregator AD7606 Analog Devices 사용처: Industrial Control and Motor Drive, Medical Device Interface MT47H64M16HR-3 DDR2 SDRAM used for external frame buffering 사용처: Video and Image Processing Pipeline, Test and Measurement Instrumentation LAN8720A Ethernet PHY for 10/100 Mbps MAC interface 사용처: Wired Ethernet Edge Bridge, IoT Edge Gateway and Aggregator EPCQ32SI16N Quad SPI configuration flash for FPGA image storage 사용처: Wired Ethernet Edge Bridge AD9767 High-speed DAC for arbitrary waveform output 사용처: Test and Measurement Instrumentation
What is EP4CE75F23C8L?
EP4CE75F23C8L is an Altera Cyclone IV E field-programmable gate array with 75,408 logic elements, 2,810,880 RAM bits and 292 user I/O in a 484-ball FBGA package. According to the DigiKey product listing, the device is a commercial-grade surface-mount FPGA and is currently orderable. It is built on a 60nm process with a 1.2V core, and its 362MHz maximum clock makes it appropriate for medium-density logic, communications, and industrial designs.
What is the price of EP4CE75F23C8L?
The verified distributor snapshot for EP4CE75F23C8L does not include a numeric unit price, so XAIPART quotes on request as of 2026-09-10. DigiKey shows the part as buyable, while Octopart provides distributor lanes for comparison. The price placeholders on this page are set to zero only because no catalog tier was captured; request a quote for current pricing.
Where to buy EP4CE75F23C8L online?
EP4CE75F23C8L can be bought from authorized distributors such as DigiKey and Mouser; the DigiKey page for part number 2288432 says 'Buy now, ships today' and the Mouser listing also shows inventory. XAIPART can source the same Altera MPN for volume orders. According to Octopart, pricing across multiple distributors is available for comparison.
What is the lead time for EP4CE75F23C8L and is it in stock?
Lead time is not explicitly stated in the snapshot, but DigiKey reports 'ships today' for EP4CE75F23C8L as of 2026-09-10. Mouser also lists the device with order availability. Because distribution stock can change quickly and XAIPART may use alternate sources, confirm current lead time on the quote form before production.
Is EP4CE75F23C8L the same as EP4CE75F23C8 or EP4CE75F23C8N?
EP4CE75F23C8L differs from EP4CE75F23C8 and EP4CE75F23C8N in the trailing suffix letters, while the middle C8 code shows commercial temperature grade and speed grade 8. In Altera ordering, N typically indicates lead-free finish and L may indicate a low-power variant, so the electrical limits and finish may differ slightly. The core resources—75,408 logic elements, 2,810,880 RAM bits, and 292 I/O—remain the same across these suffixes; confirm exact behavior in the Intel ordering table.
Which is better for high-density logic: EP4CE75F23C8L or EP4CE55F23C8L?
EP4CE75F23C8L is better for high-density logic because it provides 75,408 logic elements versus roughly 55,856 logic elements on EP4CE55F23C8L—a capacity increase of about 35% in the same 484-ball FBGA package. The larger device also contains more embedded RAM, reducing the need for external FIFOs in demanding designs. If your design fits in 55K LEs, the EP4CE55 variant may offer lower cost, but the EP4CE75 is the safe choice for designs that may grow.
What is the difference between EP4CE75F23C8L and EP4CE115F23C8N?
EP4CE75F23C8L has 75,408 logic elements, while EP4CE115F23C8N has about 114,480 logic elements, providing 52% more logic capacity in the same 484-ball FBGA package family. The EP4CE115 also has larger RAM and different I/O assignments in some banks. You cannot assume full pin compatibility; Intel's package migration tables and Quartus pin planner must confirm that every required ball is identical. Choose EP4CE115 only when the target design exceeds the 75K LE budget.
When should I choose EP4CE75F23C8L over EP4CE55F23C8L?
Choose EP4CE75F23C8L when your synthesized design is likely to exceed 55K logic elements or when it needs the full 2,810,880 RAM bits and 292 user I/O available on this part. EP4CE55F23C8L is enough for smaller designs and can save money, but you must rerun fitting and timing because the smaller device has fewer routing resources. In production, keeping the EP4CE75 package compatible lets you migrate to higher-density members without changing the PCB if the pinout remains compatible.
What is a drop-in replacement for EP4CE75F23C8L?
For a drop-in replacement, use another EP4CE75F23 family member such as EP4CE75F23C8, EP4CE75F23C8N or EP4CE75F23C8LN—they use the same 75,408-LE die and the same 484-ball FBGA footprint, and the suffix changes are limited to finish/temperature options. EP4CE55F23C8L is a lower-density package-compatible member but should be verified pin-to-pin before use. According to Intel/Altera package migration guidance, same F23 package devices are often pin-compatible; still confirm with the Quartus pin planner.
Where can I download the EP4CE75F23C8L datasheet PDF?
Download the EP4CE75F23C8L datasheet from Intel/Altera Cyclone IV documentation or from datasheet aggregator pages such as datasheets.com and FindIC, which are listed in the data sources. The FindIC metadata shows a Cyclone IV family PDF of 17,205KB updated 2016-03-31. For authoritative device specifications, use the Intel Cyclone IV Device Handbook and the latest Cyclone IV E device datasheet rather than third-party summaries.
What are the key specifications of EP4CE75F23C8L that engineers should know?
Engineers should know that EP4CE75F23C8L is a Cyclone IV E FPGA with 75,408 logic elements, 2,810,880 RAM bits, 292 user I/O, a 484-ball FBGA (F23 23x23mm, 1mm pitch), 1.2V core supply, 60nm technology, and a 362MHz maximum clock. The part belongs to the Altera Cyclone IV E family and remains available at distributors as of 2026-09-10. Before design sign-off, verify temperature range, supported I/O standards, PLL count, and configuration scheme from the official Cyclone IV datasheet.
What is the maximum clock frequency of EP4CE75F23C8L?
EP4CE75F23C8L lists a maximum clock frequency of 362MHz in the FindIC datasheet metadata. This is the device-level maximum and not a guarantee for a specific design. Achievable clock speed depends on logic levels, routing, fanout, and I/O timing requirements, so use the Quartus timing analyzer to close timing for your design.
How much RAM does EP4CE75F23C8L have?
EP4CE75F23C8L includes 2,810,880 bits of embedded RAM, approximately 2.81Mbit, in addition to 75,408 logic elements and 292 user I/O. According to the DigiKey listing, the RAM is implemented in the Cyclone IV E memory blocks. Use it for FIFOs, line buffers, and small packet storage; for a full frame or large packet buffer, add external DDR memory through a memory controller.
Can EP4CE75F23C8L be used for industrial motor control?
Yes, EP4CE75F23C8L can support industrial motor control using its 75,408 logic elements to implement PWM generation, encoder decoding, current-loop filtering, and safety latches. The 292 I/O allow connection to gate-driver interfaces, isolated ADCs, and incremental encoders. This device is not automotive-qualified, so use it in industrial drives rather than underhood vehicle modules. Check the industrial temperature order option if your ambient exceeds commercial limits.

엔지니어링 참조 데이터: EP4CE75F23C8L — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose EP4CE75F23C8L when your design requires between roughly 55K and 75K logic elements, needs 292 user I/O, and benefits from 2.81 Mbit of embedded RAM in a proven 484-ball FBGA package. It is an excellent sweet spot for Cyclone IV designs that are too large for the EP4CE55 but do not warrant the cost of the EP4CE115. If your target is under 55K LEs, EP4CE55F23C8L may deliver lower cost with the same footprint. If your design will grow beyond 75K LEs, evaluate EP4CE115F23C8N early in the layout stage, but verify every pin assignment with the Quartus pin planner before assuming a drop-in migration. For lead-free assembly requirements, order the EP4CE75F23C8N or EP4CE75F23C8LN suffix instead of the plain L version; for extended-temperature operation, use the I-grade variant. Request current pricing and lead time from XAIPART before production.

대체품과의 비교

파라미터 이 제품 EP4CE75F23C8 EP4CE75F23C8N EP4CE75F23I8LN EP4CE75F23C8LN EP4CE55F23C8L
Package 484-FBGA (F23) 484-FBGA (F23) 484-FBGA (F23) 484-FBGA (F23) 484-FBGA (F23) 484-FBGA (F23)
Brand Altera Altera Altera Altera Altera Altera
Logic Elements 75408 75408 75408 75408 75408 55856 (approx)
Total RAM Bits 2810880 2810880 2810880 2810880 2810880 Not specified
Number of User I/O 292 292 292 292 292 Not specified
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V (family)
Technology 60 nm 60 nm 60 nm 60 nm 60 nm 60 nm (family)
Maximum Clock Frequency 362 MHz 362 MHz 362 MHz 362 MHz 362 MHz Not specified

주요 차별점

  • Provides 35% more logic elements than EP4CE55F23C8L while sharing the same F23 484-ball package (vs EP4CE55F23C8L)
  • Lowers board-level part count by integrating 2,810,880 RAM bits and 292 user I/O (vs EP4CE55F23C8L)
  • Keeps an upward migration path to the larger EP4CE115F23C8N in the same F23 package (vs EP4CE115F23C8N)

설계 노트

The EP4CE75F23C8L uses a 1.2 V core supply and multiple I/O bank supplies. Place low-ESR multilayer ceramic capacitors close to each power ball group, with at least one 100 nF capacitor per bank and additional 4.7 uF bulk capacitors on the board. For FPGAs of this I/O count, insufficient decoupling can cause core voltage droop during simultaneous switching outputs and lead to intermittent timing failures. Estimated: A typical 484-ball BGA design should include at least ten 100 nF capacitors in the power-ball area, distributed evenly across the package.

The 484-ball FBGA has 1 mm ball pitch and a 23 x 23 mm body. Use a controlled impedance stack-up for high-speed I/O and route the FPGA with a fan-out pattern that allows every ball to exit to inner layers. Place via-in-pad or use dogbone via fan-out depending on the board density. Avoid routing the 1.2 V core through long, narrow traces; use a dedicated power plane or wide copper pour to keep the core voltage within specification.

An FPGA cannot operate without a valid configuration image. Connect an active serial configuration flash such as EPCS or EPCQ to the dedicated DCLK, DATA0, nCSO, and ASDO pins. If the configuration device is omitted, the FPGA will have no user logic after power-up. In a JTAG-only prototyping setup, verify that the JTAG pins are pulled correctly and that no other device is driving the TMS/TCK bus. This is a common cause of 'no bitstream loaded' failures.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

Verified web data did not include formal RoHS/REACH declarations for this MPN. The 'N' suffix in Altera parts typically indicates lead-free finish, but this specific MPN uses an 'L' suffix; confirm compliance status from the manufacturer datasheet or a certificate of compliance before claiming lead-free.

데이터 검증일: 2026-09-10 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EP4CE75F23C8L datasheet EP4CE75F23C8L price EP4CE75F23C8L buy Altera Cyclone IV EP4CE75F23C8L Cyclone IV E FPGA 75408 logic elements 484-ball FBGA FPGA 292 I/O EP4CE75F23C8L vs EP4CE55F23C8L EP4CE75F23C8L equivalent EP4CE75F23C8L pinout Where to buy EP4CE75F23C8L in stock Cyclone IV motor control FPGA

관련 부품 & 용어

Altera Intel EP4CE75F23C8L EP4CE55F23C8L EP4CE115F23C8N Cyclone IV E FPGA Field Programmable Gate Array Programmable Logic Device 60nm 1.2V 484-ball FBGA F23 package 75,408 logic elements 2,810,880 RAM bits 292 user I/O DigiKey Mouser
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