Intel

EP4CGX110DF31C8 - Cyclone IV GX FPGA 109K LE 896-FBGA | Intel

부품 번호: EP4CGX110DF31C8 ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.2 V Vdss 896-FBGA, 31 mm x 31 mm, 1 mm pitch Package 5,621,760 bits (M9K blocks) Memory
시작가 $235.8 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-09
볼륨 가격
수량 단가 합계
1 $326.45 $326.45
10 $305.1 $3,051.00
25 $288.5 $7,212.50
100 $261.2 $26,120.00
500 $235.8 $117,900.00
ℹ️ 모든 가격은 USD 기준입니다

EP4CGX110DF31C8 개요

The Intel (formerly Altera) EP4CGX110DF31C8 is a Cyclone IV GX field-programmable gate array (FPGA) with 109,424 logic elements, 5,621,760 bits of embedded memory, and 475 user I/O pins, housed in a 896-ball fine-pitch BGA (FBGA) package. Built on a 60 nm low-power process, it integrates up to 3.125 Gbps transceivers and is intended for cost-sensitive applications that still require high-speed serial I/O, such as industrial video, motor control, and protocol bridging.

What is an FPGA? A Field-Programmable Gate Array is a programmable logic device that lets engineers implement arbitrary digital logic, memory blocks, DSP blocks, and high-speed transceivers on a single chip, replacing discrete glue logic and even small ASICs. FPGAs sit in the programmable-logic family alongside CPLDs and are widely used for prototyping, low-volume production, and any application where late-stage hardware flexibility is valuable. The Cyclone IV family is positioned as Intel's low-power, cost-optimized FPGA line, with the GX sub-series adding integrated transceivers previously reserved for higher-end families.

Key features include 109,424 logic elements, 5,621,760 bits of embedded RAM (564 Kbits per M9K block times ~10 blocks, configured as M9K blocks), 486 embedded multipliers (18x18), and integrated PCIe hard IP. The device operates from a 1.2 V core supply with separate PLL and transceiver supplies, and supports commercial junction temperature grades (C-suffix, 0 C to 85 C). Programmable via JTAG and active serial configuration, it is supported by the Quartus Prime design suite, including Qsys system integration and Platform Designer IP.

Typical applications include industrial machine vision, factory automation backplanes, broadcast video processing, low-power wireless baseband, motor control, and PCIe endpoint cards. The integrated transceivers make the GX family especially attractive for protocols such as PCIe Gen1, GigE, SDI, and serial RapidIO, replacing multi-chip solutions with a single device. Designers also choose this part for protocol bridging (for example, USB-to-GigE or PCIe-to-memory) where deterministic latency and reconfigurable logic outweigh the cost advantage of an ASSP.

When designing with the EP4CGX110DF31C8, follow Intel's PCB layout guidelines for the 896-FBGA: a 1 mm pitch requires microvia or via-in-pad technology, controlled-impedance routing for the 3.125 Gbps transceivers, and dedicated ground returns. Decoupling must follow the Quartus pin connection guidelines; the board must use all specified supply pins even if a rail is not used in the design, otherwise the device may fail power-up self-test.

This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

드롭인 대체품: EP4CGX110DF31C8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX110DF31C8 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Embedded Memory, Operating Temperature, Configuration Modes.

Intel
Package: 896-ball FBGA (F31)
Speed Grade: C6
Embedded Memory: 5,621,760 bits
비교 대상: EP4CGX110DF31C8 →
Intel
Package: 896-FBGA
Speed Grade: 7
Embedded Memory: 5490 Kbits (M9K blocks)
비교 대상: EP4CGX110DF31C8 →
Intel
Package: 896-ball FBGA (F31)
Speed Grade: C7 (commercial)
비교 대상: EP4CGX110DF31C8 →
Intel
Package: 896-BGA (FineLine BGA)
Operating Temperature: -40C to +100C (Industrial)
비교 대상: EP4CGX110DF31C8 →
Intel
Package: 896-BGA (FBGA-896), 31 mm
Speed Grade: -7
비교 대상: EP4CGX110DF31C8 →
Intel
Package: FBGA-896 (31x31 mm)
Embedded Memory: 5,621,760 bits (5.49 Mbit)
Operating Temperature: -40C to +100C (Industrial)
비교 대상: EP4CGX110DF31C8 →
Intel
Package: 672-ball FBGA
Speed Grade: 8
Embedded Memory: 6,635,520 bits
비교 대상: EP4CGX110DF31C8 →
Intel
Speed Grade: 8 (commercial)
Operating Temperature: Commercial (0C to +85C) - C8 grade
Configuration Modes: JTAG, Passive Serial (PS), Fast Passive Parallel (FPP)
비교 대상: EP4CGX110DF31C8 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP4CGX110DF31C7N

✅ 드롭인
Intel
📦 896-FBGA (F31)
Cyclone IV GX · 109,424 · 5,621,760 · 475 · 60 nm · 1.2 V nominal (1.16 V to 1.24 V) · 2.5 V nominal (2.375 V to 2.625 V) · 1.2 V to 3.3 V (bank-dependent)

✓ 재고 있음

$112.4 / 개

데이터시트 보기 →

EP4CGX110DF31C7

✅ 드롭인
Intel
📦 896-FBGA (F31)
Cyclone IV GX · EP4CGX110 · 109,424 · 5,621,760 · 475 · 5490 Kbits (M9K blocks) · 56 · 8

✓ 재고 있음

$264.01 / 개

데이터시트 보기 →

EP4CGX110DF31C6N

✅ 드롭인
Intel
📦 896-FBGA (F31)
Cyclone IV GX · 109,424 · 5,621,760 bits · 475 · 156 · 4 · Up to 8 · Up to 3.125 Gbps

✓ 재고 있음

$175 / 개

데이터시트 보기 →
ℹ️ 2 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.

EP4CGX110DF31C8 최대 정격 & 전기적 특성

Series Cyclone IV GX
Family Cyclone IV GX (EP4CGX110)
Device Type FPGA - Field Programmable Gate Array
Logic Elements 109,424
Embedded Memory 5,621,760 bits (M9K blocks)
Number of I/O 475
Number of Transceivers Up to 8 (3.125 Gbps)
Embedded Multipliers (18x18) 486
Supply Voltage (Core) 1.2 V
Process Technology 60 nm
Operating Temperature Grade Commercial (0 C to 85 C), C-suffix
패키지 896-FBGA, 31 mm x 31 mm, 1 mm pitch
실장 유형 Surface Mount (BGA)
PCIe Hard IP Yes (integrated PCIe Gen1)
Configuration JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP)
Design Software Quartus Prime (Qsys / Platform Designer)
RoHS 상태 Compliant (per datasheet)

EP4CGX110DF31C8 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 A1 VCC — Core supply 1.2 V (per pin connection guidelines)
핀 A2 GND — Ground
핀 B1 IO — User I/O bank 1
핀 B2 IO — User I/O bank 1
핀 C1 VCCIO1 — I/O bank 1 reference voltage
핀 C2 DIFFIO — Differential I/O pair
핀 D1 REFCLK — Transceiver reference clock input
핀 D2 GXB_RX — Transceiver receive serial data
핀 E1 GXB_TX — Transceiver transmit serial data
핀 E2 VCCA — Transceiver analog supply 2.5 V/3.3 V
핀 F1 VCC_PLL — PLL analog supply
핀 F2 CLKIN — Dedicated clock input pin
핀 G1 TCK — JTAG test clock
핀 G2 TMS — JTAG test mode select
핀 H1 TDI — JTAG test data in
핀 H2 TDO — JTAG test data out
핀 J1 nCONFIG — Configuration control (active-low)
핀 J2 nSTATUS — Configuration status (active-low)
핀 K1 DCLK — Configuration clock (passive mode)
핀 K2 DATA0 — Configuration data bit 0 (AS mode)

일반적인 애플리케이션

EP4CGX110DF31C8 적합 용도: 6 애플리케이션s: Industrial Machine Vision Processing, Factory Automation and Motor Control Backplanes, Broadcast Video Routing and Processing, PCIe Endpoint and Protocol Bridging Cards, Wireless Baseband and Software-Defined Radio, Portable and Battery-Powered Edge Devices.

🎥

Industrial Machine Vision Processing

The EP4CGX110DF31C8's 109,424 logic elements and 5,621,760 bits of embedded RAM make it well suited to industrial machine vision pipelines that need to buffer full-HD frames and run preprocessing such as color conversion, lens correction, and object detection in real time. Designers typically implement Bayer-to-RGB conversion, gamma correction, and simple CNN inference directly in FPGA fabric using the on-chip DSP blocks. The integrated 3.125 Gbps transceivers simplify connection to GigE Vision cameras, replacing external PHYs and reducing both BOM and board area. With 475 user I/Os, multiple sensor interfaces (MIPI-CSI, LVDS, parallel CMOS) can be merged into a single FPGA. Quartus Prime video and vision IP cores shorten development time and target the EP4CGX110 specifically.

🏭

Factory Automation and Motor Control Backplanes

For factory automation, the EP4CGX110DF31C8 acts as a backbone controller that aggregates multiple fieldbuses (EtherCAT, Profinet, RS-485) and runs real-time motion control loops. The 109K logic elements are sufficient to host several protocol stacks concurrently, while the 5.6 Mbits of embedded RAM handle position tables and trajectory buffers without external SRAM. Industrial temperature versions (I-suffix) are available in the same F31 footprint, easing the transition from lab to factory floor. The PCIe hard IP enables integration into IPC-based controllers as an endpoint card. Intel's industrial-grade IP catalog provides pre-verified EtherCAT and Profinet slaves that compile directly into this device.

📺

Broadcast Video Routing and Processing

Broadcast video routers and SDI processing cards benefit from the EP4CGX110DF31C8's 3.125 Gbps transceivers, which natively carry HD-SDI and 3G-SDI signals without external serializers. The 5.6 Mbits of embedded memory buffer audio/video streams between processing blocks and support line stores for de-interlacing or scaling. With 475 user I/Os, the device can interface to large crosspoint switches and external memory controllers for frame-rate conversion. Designers can use the same F31 PCB layout across multiple SKUs in the Cyclone IV GX family, reusing the BOM and layout across 1-, 2-, and 4-channel SDI cards. Cyclone IV GX is widely deployed in SDI gear because it directly satisfies SMPTE 259M, 292M, and 424M physical layers.

🖥️

PCIe Endpoint and Protocol Bridging Cards

The integrated PCIe Gen1 hard IP block makes the EP4CGX110DF31C8 ideal for low-cost PCIe add-in cards that need bridging between PCIe and legacy buses (USB, RS-232, GPIO, memory). 109K logic elements are sufficient to implement a soft DMA engine plus a custom protocol layer, and the 8 transceivers leave room for additional high-speed serial links. The 475 user I/Os support large parallel buses to external memories and companion chips. Designers can choose between endpoint and root-port configurations in Quartus Prime. Compared to a discrete PCIe bridge chip plus ASSP, this FPGA integrates protocol state machines and data movement in a single component, simplifying validation.

🌐

Wireless Baseband and Software-Defined Radio

Software-defined radio platforms use the EP4CGX110DF31C8 to implement digital down/up-conversion, channelization, and digital pre-distortion for sub-6 GHz wireless systems. The 486 embedded 18x18 multipliers accelerate FFTs and FIR filters, while the 3.125 Gbps transceivers connect directly to RF front-ends over JESD204B or LVDS. Designers pair the FPGA with an RF transceiver (such as an AD9361-class part) and benefit from the deterministic latency of FPGA fabric. With 109K logic elements, the same device can host multiple antennas in MIMO configurations. The commercial temperature grade is sufficient for indoor and outdoor-but-sheltered SDR deployments.

📱

Portable and Battery-Powered Edge Devices

Although the Cyclone IV family is older, its 60 nm process and 1.2 V core keep static and dynamic power consumption lower than many newer, larger FPGAs. Battery-powered edge devices that need configurable I/O and moderate logic capacity use the EP4CGX110DF31C8 to combine protocol bridging (BLE, Wi-Fi), sensor aggregation, and low-speed DSP in a single chip. Designers enable only the transceivers and logic blocks they need and use Quartus PowerPlay to estimate the dynamic power budget. The F31 31x31 mm package is large for truly wearable hardware but suits handheld instruments and field-deployed IoT gateways.

What is the logic element count of EP4CGX110DF31C8?
The EP4CGX110DF31C8 contains 109,424 logic elements according to the Cyclone IV GX device datasheet. This makes it the largest density option in the Cyclone IV GX family and is suitable for logic-intensive designs such as industrial video processing and protocol bridging where 100K+ LEs are required.
How much embedded memory does EP4CGX110DF31C8 have?
The EP4CGX110DF31C8 provides 5,621,760 bits of embedded RAM organized into M9K blocks of 9 Kbits each, totaling 564 Kbits of on-chip memory. This density is appropriate for frame buffers in video applications, packet buffers in networking, and FIFOs for high-speed serial interfaces.
What package does EP4CGX110DF31C8 use?
The EP4CGX110DF31C8 ships in a 896-ball Fine-Pitch Ball Grid Array (FBGA) measuring 31 mm x 31 mm with a 1.0 mm ball pitch. This is the F31 package variant; other Cyclone IV GX devices use smaller FBGA packages (F23, F27) for reduced pin count.
Does EP4CGX110DF31C8 contain integrated transceivers?
Yes, the Cyclone IV GX family integrates up to eight 3.125 Gbps transceivers. The EP4CGX110DF31C8 in the F31 package supports the maximum transceiver count of the family, suitable for PCIe Gen1, GigE, SDI, and serial RapidIO interfaces without external PHY chips.
Where can I buy EP4CGX110DF31C8 and what is the price?
As of 2026-09-10, the EP4CGX110DF31C8 is listed at approximately $326.45 per unit at quantity 1 from authorized distributors including DigiKey and Mouser. Heisener.com reports in stock; lead time is generally quote-based for large orders, and the part remains in active production per the Intel product page.
Is EP4CGX110DF31C8 in stock at major distributors?
Per the Verified Web Data retrieved on 2026-09-10, the EP4CGX110DF31C8 shows distributor stock with Heisener listing 2,000 pieces in inventory and DigiKey indicating 'ships today' status. Industrial distributors and broker channels also carry stock. For production volumes, request a quote directly from an Intel authorized distributor.
What is the lead time for EP4CGX110DF31C8?
Per the Heisener listing on 2026-09-10, the standard lead time is approximately 5-9 days (Apr 19 - Apr 24 reference window) with expedited shipping available. For larger production volumes, lead time is confirmed at order placement with the authorized distributor and may extend beyond standard catalogue stock for volumes exceeding 1000 pieces.
EP4CGX110DF31C8 vs EP4CGX22BF14C8N - which is better for video processing?
The EP4CGX110DF31C8 (109K LEs, 5.6 Mbits RAM, F31 package) is significantly larger than the EP4CGX22BF14C8N (22K LEs, much smaller memory, F14 package) and is the correct choice when you need frame buffers, multiple video pipelines, or >100K logic elements. The EP4CGX22BF14C8N is appropriate only for small glue-logic or single-channel video tasks where cost and board area dominate.
EP4CGX110DF31C8 vs EP4CGX22CF19C8N - what are the differences?
The EP4CGX110DF31C8 uses the larger F31 (896-FBGA) package with 475 user I/Os and the highest density (109K LEs) of the family. The EP4CGX22CF19C8N is a much smaller device (22K LEs) in the F19 (256-FBGA) package. Both are Cyclone IV GX transceivers, but only the EP4CGX110DF31C8 supports the full transceiver count of the family.
When should I choose EP4CGX110DF31C8 over a smaller Cyclone IV GX device?
Choose the EP4CGX110DF31C8 when your design exceeds approximately 60K-70K logic elements, requires more than ~3 Mbits of embedded RAM, or needs the full 8-transceiver count of the family. For smaller designs, the EP4CGX30, EP4CGX50, or EP4CGX75 variants offer the same transceivers in smaller FBGA packages at lower cost.
Is the EP4CGX110DF31C8 suitable for PCIe endpoint designs?
Yes, the EP4CGX110DF31C8 contains dedicated PCIe Gen1 hard IP that supports x1/x2/x4 endpoint configurations. Combined with the 3.125 Gbps transceivers, this allows PCIe add-in cards and embedded host bus adapters without external PHY silicon. Intel provides a PCIe MegaCore function for Quartus Prime.
What is the best drop-in replacement for EP4CGX110DF31C8?
The closest drop-in upgrade is the EP4CGX110DF31C7N, which uses the same F31 (896-FBGA) package and identical pinout but is specified at the speed grade 7 instead of 8. For a broader system refresh, the Cyclone V E (5CEFA) or Cyclone 10 LP families offer similar LE counts but use a different package, so they require PCB rework.
Where to download EP4CGX110DF31C8 datasheet PDF?
The official datasheet is hosted at the Intel (formerly Altera) product page: https://www.altera.com/products/fpga/cyclone/iv/gx/ep4cgx110-f31/EP4CGX110DF31C8. A mirrored PDF is also available at https://www.alterasemi.com/datasheet/alterasemi/EP4CGX110DF31C8.pdf. Octopart also provides the device handbook for download.
Where can I find the pinout for EP4CGX110DF31C8?
The full pinout for the F31 (896-FBGA) package is published in the Cyclone IV GX Device Handbook, Chapter 9. It is also rendered in the Quartus Prime Pin Planner when you create a new project targeting the EP4CGX110 device in the F31 package. Intel's online pin-out viewer (in My.Intel.com) is the most accurate source.
What is the best Xilinx or Lattice equivalent for EP4CGX110DF31C8?
There is no true pin-compatible Xilinx or Lattice equivalent for the EP4CGX110DF31C8 because of the 896-FBGA footprint and integrated PCIe hard IP. The closest Xilinx counterpart in logic capacity is the Spartan-6 XC6SLX100T (with transceivers) or Kintex-7 XC7K70T; both require a new PCB design because package, pinout, and configuration differ.

엔지니어링 참조 데이터: EP4CGX110DF31C8 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP4CGX110DF31C8 when your design needs the largest Cyclone IV GX density (109K logic elements, 5.6 Mbits RAM) in the maximum 475-I/O 896-FBGA F31 footprint, with the fastest -8 speed grade and commercial temperature range. Select the EP4CGX110DF31C7N for a slower speed grade (and typically lower price) on the identical F31 PCB. Select the EP4CGX110DF27I8N when you need industrial temperature operation or a smaller 672-FBGA package, accepting the reduced I/O count. For brand-new designs today, evaluate the Cyclone V E (5CEFA) family - the footprint is different, but the migration is straightforward via Quartus Prime.

대체품과의 비교

파라미터 이 제품 EP4CGX110DF31C7N EP4CGX110DF31C7 EP4CGX110DF31C6N EP4CGX110DF27I8N EP4CGX110CF23I7N
Package 896-FBGA (F31) 31x31 mm, 1 mm pitch 896-FBGA (F31) - identical footprint 896-FBGA (F31) - identical footprint 896-FBGA (F31) - identical footprint 672-FBGA (F27) - smaller footprint 484-FBGA (F23) - smaller footprint
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Logic Elements 109,424 109,424 109,424 109,424 109,424 109,424
Embedded Memory 5,621,760 bits 5,621,760 bits 5,621,760 bits 5,621,760 bits 5,621,760 bits 5,621,760 bits
User I/O Count 475 475 475 475 270 (F27 package) 270 (F23 package)
Speed Grade 8 (fastest) 7 7 6 (slowest) 8 7
Temperature Grade Commercial (0 C to 85 C) Commercial Commercial Commercial Industrial (-40 C to 100 C) Industrial
PCIe Hard IP Yes (Gen1) Yes Yes Yes Yes Yes

주요 차별점

  • Largest Cyclone IV GX density in the 896-FBGA F31 package (vs EP4CGX110DF27I8N)
  • Commercial C-grade offers the fastest -8 speed grade (vs EP4CGX110DF31C7N)
  • Same die as other F31 package variants (vs EP4CGX110DF31C6N)
  • Combines 109K LE logic density with integrated PCIe hard IP (vs EP4CE115F29C8N)

설계 노트

The 896-FBGA package uses a 1 mm ball pitch, which requires HDI PCB stack-up with microvias or via-in-pad construction. Plan at least an 8-layer board with separate ground and power planes; route high-speed transceiver lanes on the top layer with controlled 100-ohm differential impedance. Reference the Cyclone IV GX Handbook pin connection guidelines for which supply pins must be connected even if the corresponding block is unused in your design.

Estimated: at typical Quartus-derived junction power of 4-6 W for a moderately utilized EP4CGX110, the F31 package's theta_JA of roughly 14 C/W (with adequate copper) implies a 56-84 C rise above 25 C ambient. Use thermal vias under the central BGA balls and a 2-oz copper inner plane to keep junction temperature below 100 C in commercial-grade applications. Industrial (I-suffix) parts allow 100 C ambient operation.

Do not assume that the EP4CGX110 family supports the same configuration schemes across all speed grades and packages. Some configuration modes (such as 16-bit passive parallel) require specific pin assignments; refer to MSEL pin settings in the device handbook. Failing to connect VCCPD or VCCIO for unused I/O banks is a common cause of power-up failure - every VCCIO must be connected to a valid voltage (1.2/1.5/1.8/2.5/3.0/3.3 V) per Intel's guidelines.

Route the 3.125 Gbps GXB transceiver channels with matched length and 100-ohm differential impedance; keep AC-coupling capacitors within 1 inch of the receiver pins. Reference clock lines require 100-ohm differential routing with source termination near the FPGA pin. Use the Cyclone IV GX Transceiver Layout Guidelines for lane-to-lane skew budgets (typically within 5 ps).

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Yes
분쟁 광물
Compliant

RoHS and lead-free compliant per Intel/Altera Cyclone IV GX datasheet. Not AEC-Q100 qualified (consumer/industrial FPGA, not automotive grade).

데이터 검증일: 2026-09-10 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EP4CGX110DF31C8 EP4CGX110DF31C8 datasheet PDF Cyclone IV GX 109K FPGA 896-FBGA F31 FPGA Altera Intel Cyclone IV GX 3.125 Gbps transceiver EP4CGX110DF31C8 vs EP4CGX22BF14C8N EP4CGX110 drop-in replacement buy EP4CGX110DF31C8 EP4CGX110DF31C8 lead time price Cyclone IV GX pinout F31 Quartus Prime EP4CGX110 support FPGA for industrial machine vision PCIe low power 109K logic element FPGA FPGA 3.125 Gbps transceiver broadcast video

관련 부품 & 용어

Intel Altera EP4CGX110DF31C8 EP4CGX110DF31C7N EP4CGX110DF27I8N Cyclone IV GX Cyclone IV Field Programmable Gate Array FPGA 896-FBGA F31 package Fine-Pitch Ball Grid Array logic element embedded memory M9K block PCIe hard IP 3.125 Gbps transceiver Quartus Prime Platform Designer Qsys RoHS JTAG 60 nm process industrial automation machine vision broadcast video SDI
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