EP4CGX110DF31I7 - Cyclone IV GX FPGA, 109K LE, 896-BGA | Intel
부품 번호: EP4CGX110DF31I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $489.82 | $489.82 |
| 10 | $415.85 | $4,158.50 |
| 100 | $352.97 | $35,297.00 |
| 500 | $309.51 | $154,755.00 |
| 1,000 | $276.34 | $276,340.00 |
EP4CGX110DF31I7 개요
A field-programmable gate array (FPGA) is a semiconductor integrated circuit whose digital logic, routing, and I/O behavior are defined by the user's configuration bitstream rather than fixed at fabrication. FPGAs occupy the programmable-logic tier of the broader digital IC hierarchy: they sit between fixed-function ASICs (lower NRE cost per unit at volume, but inflexible) and microcontrollers/DISC processors (sequential execution under firmware). Modern FPGAs such as the Cyclone IV GX family typically embed hard IP blocks for transceivers, memory controllers, multipliers, and PLLs, combining parallel hardware acceleration with the reconfigurability that distinguishes them from ASICs and ASSPs. The Cyclone IV GX family specifically extends the Cyclone IV E base by adding 3.125 Gbps transceivers, positioning these parts as low-cost, low-power alternatives to mid-range FPGAs that previously required dedicated transceiver silicon.
Key features of the EP4CGX110DF31I7 include up to 475 user I/O pins, 8 integrated 3.125 Gbps transceivers, 432 multipliers (18x18), 270 M9K memory blocks (approximately 2,430 Kbits), and four general-purpose PLLs. The device supports DDR/DDR2/DDR3/LPDDR2 external memory interfaces via hardened controllers and provides 8 dedicated clock networks per quadrant. The 896-ball FBGA package exposes all transceivers, high-speed I/O, and PLLs while leaving generous user I/O for parallel interfaces, which is unusual for a sub-$200 logic capacity point.
Architecturally, the Cyclone IV GX family is built on a 60 nm, low-leakage process and uses an SRAM-based configuration cell that requires an external configuration device (EPCS) or JTAG. Static power is roughly 40% lower than the previous Cyclone III generation at the same capacity, which is the primary differentiator versus earlier Cyclone III LS parts. The transceiver hard IP supports PCIe Gen1 (x1, x2, x4), CPRI, Serial RapidIO, and proprietary serial protocols up to 3.125 Gbps - a feature that makes this density uncommon in its price tier.
Typical applications include industrial vision and imaging pipelines, motor control and encoder interfaces for factory automation, low-cost PCIe endpoint cards for data acquisition, serial-backplane aggregation in telecommunications equipment, and protocol bridging (e.g., Serial RapidIO to parallel LVDS). The industrial temperature grade extends suitability to factory floor, outdoor telecom, and transportation environments where consumer-grade parts would otherwise fail.
When designing with the EP4CGX110DF31I7, plan configuration storage (EPCS64 supports ~109K LE) and ensure the Quartus II / Quartus Prime toolchain (13.0 or later recommended for Cyclone IV support) is selected before synthesis. The 31 mm 896-BGA package has a 0.8 mm ball pitch that requires HDI PCB stack-up with microvia fanouts; using a 4-layer FR-4 board with through-vias only is not feasible for the inner-row balls.
This page synthesizes distributor pricing, drop-in same-package alternatives within the Cyclone IV GX family, and practical design notes not found on the manufacturer ordering page.
드롭인 대체품: EP4CGX110DF31I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX110DF31I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, RoHS Status, Transceivers, Logic Array Blocks (LABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX110DF31I6N
✅ 드롭인✓ 재고 있음
$108.4 / 개
데이터시트 보기 →EP4CGX110DF31C7N
✅ 드롭인✓ 재고 있음
$112.4 / 개
데이터시트 보기 →EP4CGX110DF31C8N
✅ 드롭인✓ 재고 있음
$325 / 개
데이터시트 보기 →EP4CGX110DF27I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$198 / 개
데이터시트 보기 →EP4CGX110DF31C8
✅ 드롭인✓ 재고 있음
$235.8 / 개
데이터시트 보기 →EP4CGX110DF31I7 최대 정격 & 전기적 특성
| Series | Cyclone IV GX |
| Device Logic Elements | 109,424 |
| Total Memory Bits | 5,621,760 |
| Number of I/O | 475 user I/O |
| Multipliers (18x18) | 432 |
| PLLs | 4 |
| Transceivers | 8 (up to 3.125 Gbps) |
| M9K Memory Blocks | 270 |
| 패키지 | 896-BGA (FBGA-896), 31 mm |
| Ball Pitch | 0.8 mm |
| Speed Grade | -7 |
| Temperature Grade | Industrial (-40C to +100C Tj) |
| Core Voltage | 1.2 V typical |
| Configuration Method | SRAM (EPCS or JTAG) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
EP4CGX110DF31I7 896-bga (fbga-896), 31 mm 핀 구성 가이드
EP4CGX110DF31I7(896-bga (fbga-896), 31 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX110DF31I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX110DF31I7 적합 용도: 6 애플리케이션s: Industrial Machine Vision Pipeline, PCIe Endpoint Card (Data Acquisition), Motor Control and Encoder Interface, Serial Backplane Aggregation (Telecom), Protocol Bridging (Serial RapidIO to LVDS), Low-Cost PCIe Industrial I/O Module.
Industrial Machine Vision Pipeline
The EP4CGX110DF31I7 fits industrial machine vision pipelines because its 109,424 logic elements and 432 18x18 multipliers support parallel Bayer demosaicing, edge detection (Sobel, Canny), and blob analysis at line rates above 60 fps for 1080p cameras. The 8 integrated transceivers enable Camera Link, CoaXPress, or GigE Vision aggregation on a single FPGA, replacing multi-chip ASIC/FPGA designs. With 5,621,760 total memory bits in 270 M9K blocks, the device buffers at least 3 full HD frames internally, eliminating costly external SRAM. The industrial temperature grade (-40C to +100C Tj) tolerates factory-floor thermal cycling that would derate commercial FPGAs. Quartus II DSP Builder libraries accelerate MAC-saturated filter kernels typical in vision pre-processing.
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PCIe Endpoint Card (Data Acquisition)
The EP4CGX110DF31I7 is well-suited as a PCIe Gen1 endpoint for data acquisition cards because it integrates PCIe hard IP in 1, 2, or 4 lane configurations up to 3.125 Gbps without requiring an external PHY. Combined with 475 user I/O, designers can aggregate ADC/DAC data from multiple front-end channels over LVDS at hundreds of MHz. The 109K LE budget implements on-chip DMA engines, scatter-gather controllers, and protocol handling for high-throughput DMA to host memory. Industrial temperature grade supports chassis-mounted DAQ cards in outdoor or factory environments where airflow is restricted. Reference designs in AN-456 and the Cyclone IV PCIe user guide reduce design risk.
추천
Motor Control and Encoder Interface
The EP4CGX110DF31I7 serves industrial motor control and encoder interface applications because its 4 PLLs and 475 user I/O accept quadrature encoder feedback from 20+ axes simultaneously, with hardware-accelerated PID loops running in logic at multi-MHz loop rates. The 432 multipliers implement Field-Oriented Control (FOC) and Space Vector Modulation (SVM) without CPU intervention. Eight 3.125 Gbps transceivers support multi-axis daisy-chained EtherCAT, SERCOS, or proprietary servo backbones. The -40C to +100C industrial temperature range handles motor cabinet ambient temperatures above 60C. Quartus II Qsys tool flow enables rapid peripheral integration for CAN, RS-485, and encoder interfaces.
추천
Serial Backplane Aggregation (Telecom)
The EP4CGX110DF31I7 is used in telecom serial backplane aggregation because the 8 transceivers at 3.125 Gbps support CPRI, OBSAI, and proprietary serial links common in small-cell base stations and remote radio heads. Logic capacity is sufficient for layer-1 processing, framer/deframer, and basic layer-2 switching. The 896-BGA F31 package provides sufficient I/O to bridge to parallel RapidIO or backplane LVDS domains. Industrial temperature grade and long-life silicon (typical 10+ year production guarantees for Cyclone IV) make this part suitable for telecom OEM designs with extended deployment lifecycles.
추천
Protocol Bridging (Serial RapidIO to LVDS)
The EP4CGX110DF31I7 is a strong fit for protocol bridging between Serial RapidIO (SRIO) links and parallel LVDS backplanes in embedded computing systems, especially in military/aerospace vetronics and industrial inspection platforms. Its 8 transceivers handle multiple SRIO lanes at 3.125 Gbps while the 475 user I/O provide ample LVDS pairs for legacy parallel interfaces. The 109K-LE capacity implements complete SRIO physical and transport layers plus LVDS framing and CRC checking in a single device, eliminating external ASSP bridge chips. Industrial temperature grade supports deployment in non-controlled environments.
추천
Low-Cost PCIe Industrial I/O Module
The EP4CGX110DF31I7 enables low-cost PCIe-based industrial I/O modules because the integrated PCIe Gen1 endpoint and abundant user I/O replace a CPU, an external PHY, and a discrete I/O controller. The device supports x1/x2/x4 PCIe implementations with MSI/MSI-X interrupts, scatter-gather DMA, and 32-bit/64-bit addressing in firmware. Industrial I/O modules in PLCs, distributed I/O racks, and process automation benefit from the -40C to +100C junction temperature range. Designers should reference the Cyclone IV PCIe development kit schematic as a starting point for PCIe edge-finger layout and clock distribution.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX110DF31I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX110DF31I6N | EP4CGX110DF31C7N | EP4CGX110DF31C8N | EP4CGX110DF27I7N | EP4CGX110DF31C8 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 896-BGA (FBGA-896, F31, 31 mm) | 896-BGA (F31, 31 mm) - same | 896-BGA (F31, 31 mm) - same | 896-BGA (F31, 31 mm) - same | 896-BGA (F27, 27 mm) - smaller | 896-BGA (F31, 31 mm) - same |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Total Memory Bits | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 |
| Transceivers (max 3.125 Gbps) | 8 | 8 | 8 | 8 | 8 | 8 |
| Speed Grade | -7 | -6 | -7 | -8 | -7 | -8 |
| Temperature Grade | Industrial (-40C to +100C Tj) | Industrial | Commercial (0C to +85C) | Commercial | Industrial | Commercial |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- Industrial temperature grade at -7 speed (vs EP4CGX110DF31C7N)
- Full 475 user I/O with all 8 transceivers (vs EP4CGX110CF23I7N)
- Lower power than Cyclone III LS (vs EP3CLS100F484I7N (Cyclone III LS))
설계 노트
The 896-BGA F31 package has 0.8 mm ball pitch and requires HDI PCB stack-up with microvia fanouts for inner-row balls. Use at minimum a 6-layer stack-up with 1-2-1 via structure (one microvia layer per side of the core) for reliable assembly. A 4-layer through-via-only board is NOT manufacturable for this package - inner balls cannot escape without violating IPC-7095 design rules. Reference Intel's Cyclone IV GX Hardware Reference Manual for via pattern recommendations and the IBIS model for signal integrity simulation.
Estimated: Cyclone IV GX power consumption scales with logic utilization, toggle rate, and transceiver activity. For a typical 60% utilization design with 4 active transceivers at 3.125 Gbps, expect 3-5 W core power plus 0.5 W per active transceiver. Decouple each VCCINT/VCCA/VCCD_PLL rail with 0.1 uF + 10 uF ceramic capacitors placed within 100 mil of the package balls. Use the Early Power Estimator (EPE) tool in Quartus II to validate your thermal solution before PCB layout finalization.
Transceiver channels require 85 ohm differential impedance control with intra-pair skew under 1 ps per cm. AC-coupling capacitors (typically 100 nF X7R 0402 or 0201) must be placed within 250 mil of the transmitter ball. Reference Intel's AN-456 transceiver layout guide for stack-up and routing recommendations. For PCIe Gen1 implementations, the 100 MHz reference clock must be routed with 50 ohm controlled impedance and isolated from switching signals by at least 3W spacing.
Configuration mode selection via MSEL[3:0] pins must match the chosen configuration device and bus width - mismatched MSEL settings cause configuration failure that mimics a dead device. Always include a JTAG header on prototype boards for reconfiguration and debug. The Cyclone IV GX uses 1.2 V core but legacy 3.3 V configuration devices are common; verify your EPCS device is in the supported list at the Cyclone IV Device Handbook before finalizing the BOM.
Estimated: At full 109K-LE utilization with 8 active transceivers, junction-to-ambient thermal resistance (theta_JA) for the F31 896-BGA package with standard 4-layer PCB is approximately 12-15 C/W. With 5 W total power dissipation, junction temperature rise above ambient is 60-75 C - acceptable for industrial temperature grade but requires airflow or thermal vias to thermal pad. Implement a 6x6 thermal via array (0.3 mm drill, 0.5 mm pitch) under the package center thermal pad for production boards.
규정 준수 정보
RoHS compliant per Intel product page. Industrial temperature grade per datasheet ordering code (-40C to +100C Tj). AEC-Q100 not applicable - FPGAs are not AEC-Q100 qualified. Halogen-free status not specified in provided data.
