EP4CGX150CF23I7 - Cyclone IV GX FPGA, 149760 LE, 484-FBGA | Intel
부품 번호: EP4CGX150CF23I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $218 | $109,000.00 |
| 1,000 | $192 | $192,000.00 |
EP4CGX150CF23I7 개요
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable routing, embedded memory, DSP blocks, and hard IP cores such as transceivers and PLLs. FPGAs belong to the broader hierarchy of programmable logic -> logic IC -> integrated circuit -> semiconductor, and the Cyclone IV GX family specifically occupies the low-power, cost-optimized tier of Intel's FPGA portfolio while still integrating multi-gigabit transceivers.
Key features include 720 Kbits of embedded memory (M9K blocks), 360 18x18 multipliers for DSP operations, hard PCIe Gen1 x4 controllers, eight 3.125 Gbps transceiver channels, and support for external memory interfaces including DDR2, DDR3, QDRII, and RLDRAM II. The -I7 speed grade and industrial temperature range (-40C to +100C ambient, 125C junction cap) make this part suitable for thermally and electrically harsh environments.
Cyclone IV GX architecture pairs a transceiver-rich die with power-optimized logic and routing. The 1.2 V core supply draws significantly less power than the prior Cyclone III generation, and the integrated hard IP blocks (PCIe, transceivers, PLLs) free up general fabric for application logic. Designers typically implement logic with Quartus Prime and the Platform Designer toolchain, using pre-verified IP cores to shorten development.
Typical applications include industrial video broadcast and image processing, low-cost protocol bridging (PCIe to Gigabit Ethernet), motor control and industrial drives, handheld and portable test equipment, and low-power wireless baseband processing. The integrated transceivers also make the device a popular choice for low-volume custom serial protocols in industrial and broadcast equipment.
When designing with this device, plan the power distribution network around the 1.2 V core, the 2.5 V/3.0 V PLL analog, and the 1.5 V/1.8 V/2.5 V/3.3 V transceiver supplies. A 484-pin BGA requires multi-layer PCB stack-up with microvia or via-in-pad technology for reliable assembly.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Quartus design notes that are not found in the manufacturer datasheet alone.
드롭인 대체품: EP4CGX150CF23I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX150CF23I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Embedded Memory, Operating Temperature, PLLs.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX150CF23I7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP4CGX150CF23C7N
✅ 드롭인✓ 재고 있음
$138.95 / 개
데이터시트 보기 →EP4CGX150CF23C8N
✅ 드롭인✓ 재고 있음
$112.8 / 개
데이터시트 보기 →EP4CGX150CF23I6N
✅ 드롭인✓ 재고 있음
$175.8 / 개
데이터시트 보기 →EP4CGX110CF23I7
✅ 드롭인✓ 재고 있음
$338.55 / 개
데이터시트 보기 →EP4CGX110CF23I7N
✅ 드롭인✓ 재고 있음
$1650.08 / 개
데이터시트 보기 →EP4CGX150CF23I7 최대 정격 & 전기적 특성
| Family | Cyclone IV GX |
| Logic Elements | 149,760 |
| Embedded Memory | 6,635,520 bits (6480 Kbits / 720 Kbits per M9K block) |
| DSP Blocks (18x18 Multipliers) | 360 |
| Maximum User I/O Pins | 270 |
| Transceivers | 8 channels, up to 3.125 Gbps |
| PCIe Hard IP | 1 Gen1 x4 controller |
| PLLs | 4 user PLLs + 4 transceiver PLLs |
| Process Technology | 60 nm low-power CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | I7 (industrial, fast) |
| 동작 온도 | -40C to +100C (industrial) |
| 패키지 | 484-pin Fine-pitch BGA (FBGA-484, F23) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
EP4CGX150CF23I7 484-pin fine-pitch bga (fbga-484, f23) 핀 구성 가이드
EP4CGX150CF23I7(484-pin fine-pitch bga (fbga-484, f23) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX150CF23I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX150CF23I7 적합 용도: 6 애플리케이션s: Industrial Video Broadcast and Processing, PCIe to Gigabit Ethernet Protocol Bridge, Motor Control and Industrial Drive, Handheld and Portable Test Equipment, Low-Power Wireless Baseband Processing, Custom Serial Protocol Bridging.
Industrial Video Broadcast and Processing
The EP4CGX150CF23I7 is widely deployed in SDI/HD-SDI/3G-SDI broadcast routers, multiviewers, and video format converters. Its 8 integrated transceivers deliver up to 3.125 Gbps per channel - directly matching the SDI family bit rates (270 Mbps, 1.485 Gbps, 2.97 Gbps) without external PHY chips. The 149,760 logic elements and 360 18x18 multipliers provide ample fabric for scaling, de-interlacing, alpha blending, and OSD overlay. The I7 speed grade ensures timing closure at 148.5 MHz pixel clocks for 1080p60 processing. Designers typically build IP cores for SDI TX/RX using Quartus Platform Designer, place the FPGA between a video crosspoint switch and HDMI encoder, and use the hard PCIe Gen1 IP for control-plane connectivity to a host CPU. The 484-FBGA package supports the multi-layer PCB stack-up required for BGA-mounted broadcast cards.
추천
PCIe to Gigabit Ethernet Protocol Bridge
With both a PCIe Gen1 x4 hard IP block and 8 multi-gigabit transceivers, the EP4CGX150CF23I7 is a natural fit for low-latency PCIe-to-Ethernet bridge cards in servers and industrial PCs. The hard PCIe controller eliminates soft IP licensing fees and frees fabric for packet processing, while the transceivers drive SGMII / 1000BASE-X directly to a downstream PHY or SFP cage. The 6,635,520 bits of embedded memory buffer line-rate bursts, and 270 user I/Os provide flexible parallel interfaces to ASICs or DSPs on the same board. Typical implementation places the FPGA on a PCIe add-in card, configures Gen1 x4 link training in Quartus, and uses the transceiver channels to feed an SFP+ cage for fiber uplink. Industrial temperature rating is critical for embedded server rooms and outdoor cell-site applications.
추천
Motor Control and Industrial Drive
The EP4CGX150CF23I7 powers multi-axis servo and stepper motor controllers in factory automation, where deterministic real-time response to encoder feedback is mandatory. Its 360 DSP blocks execute field-oriented control (FOC), space-vector PWM, and PI control loops at the sub-microsecond latencies required for high-RPM servo drives. The 149,760 logic elements fit multi-axis state machines, safety logic, and EtherCAT or PROFIBUS slave protocol stacks implemented in fabric. Industrial temperature rating (-40C to +100C) and the rugged FBGA-484 package make the device reliable in sealed drive enclosures. Design pattern: place the FPGA adjacent to the power stage gate drivers, route encoder quadrature signals to user I/O banks, and use one transceiver channel for the optional high-speed serial encoder interface (EnDat 2.2, BiSS, Hiperface DSL).
추천
Handheld and Portable Test Equipment
Battery-powered oscilloscopes, logic analyzers, and protocol analyzers benefit from the Cyclone IV GX family's low static and dynamic power consumption. The EP4CGX150CF23I7 in this variant integrates enough logic for deep acquisition memory, complex triggering, and on-device protocol decoding (I2C, SPI, UART, CAN, USB) all in a single chip. The transceivers support optional high-speed serial test interfaces, and the industrial temperature range tolerates field-deployed use cases from cold storage to outdoor tower sites. Engineers typically configure the FPGA with the JTAG mode for development and use Active Serial (EPCS) flash for in-field firmware updates. The 484-FBGA package, despite its size, enables dense PCB layouts when paired with chip-scale memory and ADCs.
추천
Low-Power Wireless Baseband Processing
Small-cell and rural wireless baseband units use the EP4CGX150CF23I7 for CPRI / OBSAI fronthaul aggregation and baseband signal processing. The transceivers drive CPRI line rates up to 3.072 Gbps without external SERDES, and the DSP blocks implement channel filtering, FFT, and crest-factor reduction at low power per MHz. The 6.6 Mbit embedded RAM holds multiple LTE sub-frame buffers, while 270 user I/Os connect to RF front-end ICs and timing synchronization PLLs. The industrial temperature grade and 484-FBGA are standard for outdoor small-cell enclosures. A typical design couples the FPGA with an RF transceiver ASIC over LVDS, implements CPRI v6.1 in soft IP, and uses one transceiver channel for GPS-disciplined timing distribution.
추천
Custom Serial Protocol Bridging
Industrial and medical equipment often require custom serial protocols (modified RS-485, proprietary LVDS, low-latency fiber) that off-the-shelf ASSPs cannot address. The EP4CGX150CF23I7's 8 transceivers plus rich fabric make it ideal as a multi-protocol bridge between sensors, actuators, and main processors. Engineers implement custom 8b/10b, scrambling, and clock-data recovery in fabric, while the hard IP PCIe block tethers the bridge to a host CPU. Industrial temperature rating and the rugged F23 FBGA package support deployment in factory-floor enclosures and medical imaging carts. Typical design: route 4 transceivers to fiber SFP cages, use 2 transceivers for camera link LVDS, and dedicate 2 for downstream sensor daisy-chains.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX150CF23I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX150CF23I7N | EP4CGX150CF23C7N | EP4CGX150CF23C8N | EP4CGX150CF23I6N | EP4CGX110CF23I7 | EP4CGX110CF23I7N |
|---|---|---|---|---|---|---|---|
| Package | FBGA-484 (F23) | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 149,760 | 149,760 | 149,760 | 149,760 | 149,760 | 109,424 (-27%) | 109,424 (-27%) |
| Speed Grade | I7 (industrial, fastest) | I7 | C7 | C8 | I6 | I7 | I7 |
| Temperature Range | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Transceivers | 8 ch, up to 3.125 Gbps | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps |
| Embedded Memory | 6,635,520 bits | 6,635,520 bits | 6,635,520 bits | 6,635,520 bits | 6,635,520 bits | 4,884,096 bits (-26%) | 4,884,096 bits (-26%) |
| DSP Blocks (18x18 Multipliers) | 360 | 360 | 360 | 360 | 360 | 252 (-30%) | 252 (-30%) |
| Lead-Free / RoHS | RoHS compliant (Sn/Ag/Cu ball finish) | Lead-free (Pb-free) terminal finish | Lead-free (Pb-free) terminal finish | Lead-free (Pb-free) terminal finish | Lead-free (Pb-free) terminal finish | Standard SnPb or lead-free depending on lot | Lead-free (Pb-free) terminal finish |
주요 차별점
- Lead-free terminal finish for global RoHS compliance (vs EP4CGX150CF23I7)
- Lower-density, cost-optimized alternative with same transceiver count (vs EP4CGX110CF23I7)
- Slower speed grade for relaxed timing closure (vs EP4CGX150CF23I6N)
- Industrial temperature rating for harsh-environment deployment (vs EP4CGX150CF23C7N)
설계 노트
The EP4CGX150CF23I7 requires a clean 1.2 V core supply (VCCINT) plus separate 2.5 V PLL analog (VCCA_PLL), 1.2 V transceiver analog (VCCT_GXB), and per-bank VCCIO rails (1.2/1.5/1.8/2.5/3.0/3.3 V) for user I/O. Decoupling: place 0402 0.1 uF X7R capacitors within 100 mil of every VCC pin pair, with 10 uF bulk tantalum or ceramic per power plane. Power sequencing must follow Intel's Cyclone IV GX power-up sequence - VCCINT must rise before or simultaneously with VCCPD; transceivers require VCCT_GXB stable before reference clock is applied. Estimated: at typical utilization (50% LE, 50% memory, 4 active transceivers) total power is approximately 2.5 to 4 W depending on toggle rate.
The F23 package is a 484-pin fine-pitch BGA (1.0 mm ball pitch, 23 mm body). A 4- or 6-layer PCB stack-up is required with at least 2 ground planes for return-path integrity. Use laser-drilled microvias (0.1 mm) with via-in-pad for the inner BGA balls, and standard 0.2 mm mechanical vias for the outer rows. Recommended pad finish is ENIG (Ni/Au) for fine-pitch BGAs; OSP is acceptable for prototypes. Ground planes must extend unbroken under the entire BGA field to control impedance for the 3.125 Gbps transceiver channels. JEDEC MSL3 handling is required - bake at 125 C for 24 hours before assembly if the sealed pack has been open more than 168 hours.
Transceiver channels operating at 3.125 Gbps require controlled-impedance routing with 100 ohm differential (recommended) or 50 ohm single-ended. Use a 4-layer stack-up with stripline routing for inner layers to suppress crosstalk, and keep reference-clock traces shorter than 100 mil with a ground guard. Pre-emphasis and equalization settings are configured via Quartus Prime ALTGX IP core; default settings are typically sufficient for 3-inch FR-4 traces but PCB-level SI simulation is recommended for longer channels or backplane designs. AC-coupling capacitors (0.1 uF X7R, 0402) are required on each transceiver TX/RX lane; place them within 100 mil of the FPGA ball and never share capacitors between lanes.
Do not confuse F23, F27, and F31 FBGA packages - they share the same family prefix (EP4CGX150) but have different pin counts (484 / 672 / 896) and different ball maps. A board designed for the F23 footprint cannot accept F27 or F31 silicon without PCB rework. Also avoid mixing I7 and C7 speed grades if timing closure depends on the I7's tighter Fmax - downgrading to C7 may violate setup/hold slack. The 'N' suffix on I7N / C7N indicates lead-free terminal finish only; it does not change the speed grade or temperature range. Finally, never rely on the hard PCIe IP until you have read the Cyclone IV GX PCIe user guide - root complex vs endpoint mode requires different pin and reset configuration.
규정 준수 정보
RoHS and REACH compliant per Intel/Altera Cyclone IV GX product declaration. Pb-free terminal finish (N suffix variants) per JEDEC JESD97. AEC-Q100 is not applicable as this part is not marketed as automotive-grade. MSL3 moisture sensitivity per JEDEC J-STD-020.
