EP4CGX15BF14C6 - Cyclone IV GX FPGA, 14.4K LEs, 169-BGA | Intel
부품 번호: EP4CGX15BF14C6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $21.5 | $21,500.00 |
EP4CGX15BF14C6 개요
What is an FPGA? A field-programmable gate array is a programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O resources that can be customized after manufacturing. Cyclone IV GX belongs to Intel's (formerly Altera's) low-cost, low-power FPGA family, with GX variants adding integrated transceivers for high-speed serial protocols. FPGAs sit between fixed-function ASICs and microcontrollers in the design hierarchy, offering hardware-level parallelism with full design reconfigurability.
Key features include up to 72 user I/O pins, 3.125 Gbps transceiver channels, embedded multipliers (DSP blocks), and a 1.2 V core supply with multi-voltage I/O support. The device supports common interfaces such as PCIe Gen1, Gigabit Ethernet, and DDR2 SDRAM controllers. The 169-ball FBGA package balances board area with thermal performance and is widely supported by mainstream PCB fabrication processes.
The Cyclone IV GX architecture combines a logic fabric with hard IP blocks for memory controllers and transceivers, eliminating the need for external PHY components in many designs. Compared to the non-GX Cyclone IV E, the GX variant trades some logic capacity for integrated serial transceivers, which reduces BOM cost and board complexity.
Typical applications include industrial motor control, video surveillance equipment, low-cost PCIe endpoint cards, communications line cards, and automotive infotainment prototypes. The integrated transceivers make it especially attractive for any design requiring point-to-point high-speed serial links without an external PHY.
Designers should use the Quartus Prime design software for synthesis, place-and-route, and timing closure. The FBGA-169 footprint requires careful PCB layout with microvia technology on standard 4-layer boards, and signal integrity simulation is recommended for transceiver channels operating above 1 Gbps.
This page synthesizes distributor pricing, drop-in compatible FPGAs in the same package, and design considerations not collected in any single manufacturer document, giving engineers a single reference for evaluation and sourcing decisions.
드롭인 대체품: EP4CGX15BF14C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX15BF14C6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Transceivers, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX15BF14C8N
✅ 드롭인✓ 재고 있음
$18.5 / 개
데이터시트 보기 →EP4CGX15BF14I7N
✅ 드롭인✓ 재고 있음
$23.1 / 개
데이터시트 보기 →EP4CGX15BF14A7N
✅ 드롭인✓ 재고 있음
$31.05 / 개
데이터시트 보기 →EP4CGX15BF14C7N
✅ 드롭인✓ 재고 있음
$20.85 / 개
데이터시트 보기 →EP4CGX15BF14C6N
✅ 드롭인✓ 재고 있음
$28.4 / 개
데이터시트 보기 →EP4CGX15BF14C6 최대 정격 & 전기적 특성
| Family | Cyclone IV GX |
| Logic Elements | 14,400 |
| Logic Array Blocks (LABs) | 900 |
| Total Memory Bits | 552,960 bits |
| User I/O Pins | 72 |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm |
| 패키지 | FBGA-169 (14 x 14 mm, 1.0 mm pitch) |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | C6 |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| Typical Max Frequency | 472.5 MHz |
EP4CGX15BF14C6 fbga-169 (14 x 14 mm, 1.0 mm pitch) 핀 구성 가이드
EP4CGX15BF14C6(fbga-169 (14 x 14 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX15BF14C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX15BF14C6 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Surveillance and Image Processing, Low-Cost PCIe Endpoint Cards, Communications Line Cards, Automotive Infotainment Prototyping, Test and Measurement Instrumentation.
Industrial Motor Control
The EP4CGX15BF14C6 fits industrial motor control applications thanks to its 14,400 logic elements, 72 user I/Os, and integrated 3.125 Gbps transceivers for encoder feedback or networked communication. With 60 nm low-power process technology and 1.2 V core voltage, the device delivers deterministic logic processing for PWM generation, FOC (field-oriented control) algorithms, and safety interlocks. The C6 speed grade provides timing margin for 472.5 MHz operation, supporting multiple simultaneous control loops. The FBGA-169 footprint is compatible with industrial-grade PCB stackups including ENIG finish and 4-layer FR-4 substrates commonly used in motor drive boards.
추천
Video Surveillance and Image Processing
The EP4CGX15BF14C6 suits video surveillance pipelines because its 14,400 logic elements and embedded multipliers handle real-time image preprocessing, motion detection, and basic video analytics. The integrated transceivers support high-speed camera link interfaces (CamLink, CoaXPress lite) and network uplinks, while 72 user I/Os accommodate parallel sensor interfaces such as BT.656 or LVDS. With 552,960 bits of embedded memory, the FPGA buffers multiple image frames for difference detection. The FBGA-169 14x14 mm footprint fits compact surveillance camera mainboards while leaving room for image sensor and power management ICs.
추천
Low-Cost PCIe Endpoint Cards
The EP4CGX15BF14C6 is well matched to PCIe Gen1 endpoint designs because the Cyclone IV GX family integrates PCIe hard IP cores alongside 3.125 Gbps transceivers, eliminating external PHY devices. With 14,400 logic elements, the FPGA handles protocol logic, DMA engines, and modest custom register maps for x1 Gen1 endpoint cards. The C6 speed grade provides comfortable timing margin for the PCIe 2.5 Gbps physical layer, while the FBGA-169 footprint supports standard add-in card form factors. Designers pair this part with downstream serializer/deserializer interfaces or external DDR2 memory for buffering.
추천
Communications Line Cards
The EP4CGX15BF14C6 addresses communications line card designs through its integrated 3.125 Gbps transceivers, which support protocols such as Gigabit Ethernet, Serial RapidIO, and basic SONET/SDH interfaces. With 72 user I/Os, designers connect to TDM buses, SPI/I2C management interfaces, and external PHY or framer devices. The 60 nm low-power process keeps board thermal design manageable in multi-port line cards where multiple FPGAs share a backplane. The FBGA-169 package supports standard telecom PCB stackups and is compatible with industrial temperature grade variants for outdoor deployment.
추천
Automotive Infotainment Prototyping
The EP4CGX15BF14C6 is attractive for automotive infotainment prototyping due to its transceiver-rich architecture, supporting MOST bus, Ethernet AVB, and LVDS display interfaces commonly used in cabin electronics. With 14,400 logic elements, the device handles video scaling, audio mixing, and HMI state machines. While the C6 speed grade is commercial temperature (0C to +85C), designers can migrate to the EP4CGX15BF14A7N automotive variant on the identical FBGA-169 footprint for production. Integrated multipliers accelerate audio DSP effects without external processor loading.
추천
Test and Measurement Instrumentation
The EP4CGX15BF14C6 fits test and measurement instrumentation because its 3.125 Gbps transceivers capture high-speed serial data streams while 72 user I/Os interface with analog front ends, ADCs, and DACs. The 14,400 logic elements implement custom trigger logic, deep state machines, and protocol-aware decoders for protocols such as I2C, SPI, UART, and parallel bus analysis. With 552,960 bits of embedded memory, the FPGA buffers captured samples before forwarding to a host processor. The FBGA-169 footprint supports benchtop and portable instrument form factors, and the C6 speed grade provides timing margin for precision timing applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX15BF14C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX15BF14C8N | EP4CGX15BF14I7N | EP4CGX15BF14A7N | EP4CGX15BF14C7N | EP4CGX15BF14C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-169 (14x14 mm) | FBGA-169 - same | FBGA-169 - same | FBGA-169 - same | FBGA-169 - same | FBGA-169 - same |
| Logic Elements | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 |
| Speed Grade | C6 | C8 (slower) | I7 (industrial) | A7 (automotive) | C7 (slightly slower than C6) | C6 (same) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +125C (Automotive) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| User I/O Pins | 72 | 72 | 72 | 72 | 72 | 72 |
| Total Memory Bits | 552,960 | 552,960 | 552,960 | 552,960 | 552,960 | 552,960 |
| RoHS / Lead-Free | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Unit Price (qty 1, as of 2026-09-10) | $38.50 | $34.80 | $42.10 | $48.50 | $36.90 | $39.20 |
주요 차별점
- C6 speed grade provides timing margin advantage over C8 in same package (vs EP4CGX15BF14C8N)
- Commercial temperature grade reduces cost vs industrial/automotive variants (vs EP4CGX15BF14I7N)
- Integrated 3.125 Gbps transceivers eliminate external PHY (vs EP4CE40F29C8N)
설계 노트
The FBGA-169 package uses 1.0 mm ball pitch, which is compatible with standard 4-layer PCB fabrication using microvia (laser-drilled) stackup technology. Designers should follow Intel's Cyclone IV GX hardware design guidelines for escape routing - typically 4 traces between balls using 0.1 mm via pitch. Thermal vias under the package center (BGA thermal pad array) are required to meet the 1.2 V core power dissipation budget at full utilization.
The Cyclone IV GX core operates at 1.2 V with multi-voltage I/O support (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V). Designers must provide separate regulator rails for VCCINT (core), VCCA (PLL analog), and VCCIO (I/O banks) with proper decoupling per the Cyclone IV GX power management application note. A bulk capacitance of at least 100 uF plus 0.1 uF/10 nF high-frequency decoupling near each power pin is recommended.
For transceiver channels operating above 1 Gbps, controlled-impedance routing (100 ohm differential) with matched length pairs is mandatory. According to Intel's Cyclone IV GX transceiver user guide, AC-coupling capacitors are required on each serial link and must be placed near the FPGA pin. Reference clocks to transceivers need dedicated low-jitter sources to meet PCIe and Gigabit Ethernet jitter budgets.
Common pitfalls when designing with the EP4CGX15BF14C6 include: (1) confusing C6/I7/A7 speed/temperature grades when ordering - always verify the suffix; (2) omitting JTAG pull-up resistors on TCK/TMS/TDI which can cause configuration failures; (3) using non-MSL3 handling procedures for the FBGA-169 which has MSL3 moisture sensitivity; (4) underestimating configuration time when designing system bring-up timing.
The EP4CGX15BF14C6's commercial temperature grade (0C to +85C) limits the device to benign thermal environments. For enclosed industrial cabinets, junction temperature can rise rapidly when utilization exceeds 70%. Thermal simulation using the Cyclone IV GX power estimator is recommended before committing to PCB layouts. Estimated junction-to-ambient thermal resistance from the package datasheet must be derated based on copper pour area and airflow.
규정 준수 정보
RoHS and lead-free compliant per Altera/Intel product page. AEC-Q100 qualification applies only to the EP4CGX15BF14A7N automotive variant. Conflict minerals reporting compliant per Intel policy.
