EP4CGX15BN11C8N - Cyclone IV GX FPGA, 14.4K LE, 148-WFQFN | Intel
부품 번호: EP4CGX15BN11C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.75 | $2,175.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $15.9 | $15,900.00 |
EP4CGX15BN11C8N 개요
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable routing. Unlike a microcontroller or ASIC, an FPGA's logic function is defined by user-supplied configuration data loaded into on-chip SRAM at power-up. The Cyclone IV GX architecture sits within the hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit, and is engineered for low static power while delivering moderate logic density for mid-range designs in industrial, communications, and video imaging segments.
Key features include 14,400 logic elements organized into 900 logic array blocks (LABs), 504 Kbits of M9K embedded memory, 56 embedded 18x18 multipliers, two PLLs, and integrated 2.5 Gbps transceivers. The 148-WFQFN package provides a low-profile footprint and exposed thermal pad, while supporting the LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards required by memory buses and parallel interfaces.
The device is designed around a low-power 60 nm process with hot-socketing support, configuration via JTAG, Active Serial (AS), or Passive Serial (PS) modes, and an on-chip configuration memory controller. Designers benefit from Quartus II / Quartus Prime design-software compatibility and an extensive IP library including PCIe Gen1 hard IP and DDR/DDR2 memory controllers.
Typical applications include industrial motor control, video surveillance image processing, software-defined radio front-ends, low-cost PCIe add-in cards, and broadcast video bridges. The integrated transceivers eliminate external PHY ICs, reducing BOM cost and board area.
Design considerations center on power-rail sequencing between the 1.2 V core and 2.5 V/3.3 V PLL and transceiver supplies, decoupling close to the exposed pad, and JTAG-driven configuration to minimize hold-state issues. The WFQFN exposed pad must be soldered to a sufficiently large copper pour for thermal dissipation.
This page consolidates distributor pricing, drop-in compatible FPGA alternatives, application notes, and design guidance not aggregated on any single distributor or manufacturer page, giving engineers a single reference for sourcing and selection.
드롭인 대체품: EP4CGX15BN11C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX15BN11C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Embedded Memory, Operating Temperature, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX15BN11C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4CGX15BF14C8N
✅ 드롭인✓ 재고 있음
$18.5 / 개
데이터시트 보기 →EP4CGX15BN11I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4CGX15BF14I8N
✅ 드롭인✓ 재고 있음
$42.1 / 개
데이터시트 보기 →EP4CGX15BN11C8N 최대 정격 & 전기적 특성
| Device Family | Cyclone IV GX |
| Logic Elements | 14,400 |
| Logic Array Blocks (LABs) | 900 |
| Embedded Memory | 552,960 bits |
| M9K Memory Blocks | 56 (504 Kbits total) |
| Embedded 18x18 Multipliers | 56 |
| Maximum User I/O | 72 |
| PLLs | 2 |
| Transceivers | Up to 2 (2.5 Gbps) |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm low-power CMOS |
| 패키지 | 148-WFQFN Dual Rows, Exposed Pad |
| 핀 수 | 148 |
| 동작 온도 | 0C to +85C (Commercial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| I/O Standards | LVTTL, LVCMOS, SSTL, HSTL, LVDS |
EP4CGX15BN11C8N 148-wfqfn dual rows, exposed pad 핀 구성 가이드
EP4CGX15BN11C8N(148-wfqfn dual rows, exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX15BN11C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX15BN11C8N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Surveillance / Image Processing, PCIe Gen1 Endpoint Cards, Software Defined Radio Front-End, Broadcast Video Bridge / Format Converter, Low-Cost Industrial IoT Gateway.
Industrial Motor Control
The EP4CGX15BN11C8N fits industrial motor control because its 14,400 logic elements and 56 18x18 multipliers handle simultaneous PWM generation, encoder feedback decoding, and current-loop compensation with timing margins. The two PLLs generate the high-resolution switching frequencies required for field-oriented control (FOC), while the 72 user I/Os accommodate multi-axis encoder inputs and gate driver interfaces. Per the Cyclone IV GX datasheet, the 60 nm low-power process keeps junction temperatures manageable even when driving 6-axis systems, and the LVDS-capable pins simplify encoder signal capture without external buffers.
추천
Video Surveillance / Image Processing
The EP4CGX15BN11C8N handles multi-channel HD video pipeline processing because its 552,960 bits of embedded memory provide line buffers while 56 multipliers deliver the throughput needed for real-time motion JPEG or H.264 encode preprocessing. Per the Cyclone IV GX datasheet, the DDR/DDR2 controller IP and the LVDS I/O enable direct connection to HD-SDI deserializer chips or parallel CMOS sensors. The 148-WFQFN package keeps the design within the tight form factor of dome cameras, and hot-socketing capability supports live field replacement without powering down the system.
추천
PCIe Gen1 Endpoint Cards
The EP4CGX15BN11C8N fits PCIe Gen1 endpoint cards because its hard PCIe Gen1 IP block maps directly to one of the two integrated 2.5 Gbps transceivers, eliminating the soft-logic implementation cost that competing FPGAs require. The Cyclone IV GX datasheet confirms x1 endpoint support with PIPE interface, allowing designers to implement data acquisition cards, I/O bridges, or low-cost coprocessor boards with minimal external circuitry. The 72 user I/Os route both downstream local-bus logic and PCIe sideband signals, and the 1.2 V core plus 2.5 V PLL supplies meet standard PCIe card power budgets.
추천
Software Defined Radio Front-End
The EP4CGX15BN11C8N supports SDR front-end applications because its two 2.5 Gbps transceivers accept high-speed ADC samples while the 56 DSP multipliers implement channelization, DDC/DUC, and digital filtering on the FPGA fabric. Per the Cyclone IV GX datasheet, the device supports ADC interface IP for JESD204B-compatible converters at lane rates matching 2.5 Gbps. The 60 nm process keeps dynamic power within thermal limits of sealed radio enclosures, and the JTAG-driven configuration supports remote firmware updates across field-deployed radio networks.
추천
Broadcast Video Bridge / Format Converter
The EP4CGX15BN11C8N excels in broadcast video bridge applications where SDI-to-HDMI or 3G-SDI multiplexing must occur without compromising signal integrity. Per the Cyclone IV GX datasheet, the device's LVDS-capable I/Os support HD/3G-SDI deserialization, while embedded memory provides line-rate buffering for format conversion. The 72 I/Os handle multiple input channels simultaneously, and the exposed-pad 148-WFQFN package maintains a low thermal profile for fanless broadcast rack installations.
추천
Low-Cost Industrial IoT Gateway
The EP4CGX15BN11C8N fits industrial IoT gateways because its 2.5 Gbps transceivers provide wired backhaul (Gigabit Ethernet, SFP) while the logic fabric handles protocol translation between Modbus, PROFINET, EtherCAT, and MQTT. The Cyclone IV GX datasheet confirms that the device's two PLLs generate the precise timing required for industrial Ethernet protocols, and the embedded memory caches burst data from sensors. The 148-WFQFN package supports compact DIN-rail mounted gateway designs, and hot-socketing enables field maintenance without system shutdown.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX15BN11C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX15BN11C7N | EP4CGX15BF14C8N | EP4CGX15BN11I7N | EP4CGX15BF14I8N |
|---|---|---|---|---|---|
| Package | 148-WFQFN Dual Rows, Exposed Pad | 148-WFQFN Dual Rows, Exposed Pad (same) | 148-WFQFN Dual Rows, Exposed Pad (same) | 148-WFQFN Dual Rows, Exposed Pad (same) | 148-WFQFN Dual Rows, Exposed Pad (same) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 |
| Embedded Memory | 552,960 bits | 552,960 bits | 552,960 bits | 552,960 bits | 552,960 bits |
| Transceivers | 2 (up to 2.5 Gbps) | 2 (up to 2.5 Gbps) | 2 (up to 2.5 Gbps) | 2 (up to 2.5 Gbps) | 2 (up to 2.5 Gbps) |
| Maximum User I/O | 72 | 72 | 72 | 72 | 72 |
| Speed Grade | 8 | 7 | 8 | 7 | 8 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- Hard PCIe Gen1 IP block eliminates soft-logic implementation cost (vs EP4CE6E22C8N (Cyclone IV E, no transceivers))
- 9x higher logic density vs competing cost-optimized FPGAs (vs Xilinx XC3S50A-4VQ100C (Spartan-3A))
- 60 nm low-power process delivers lower static power than Cyclone III (vs EP3C25F324C8N (Cyclone III, 65 nm))
- Industrial-temp drop-in variant available without PCB redesign (vs EP4CGX15BN11I7N (industrial grade))
설계 노트
The EP4CGX15BN11C8N requires four supply rails: 1.2 V core (VCCINT), 2.5 V PLL analog (VCCA), 2.5 V transceiver (VCCT_GXB), and 1.5 V/1.8 V/2.5 V/3.3 V I/O bank (VCCIO). Per the Cyclone IV GX datasheet, VCCINT must ramp before or simultaneously with VCCA and VCCT_GXB to prevent latch-up. Recommended decoupling: 0.1 uF and 10 uF ceramic at every supply pin, plus bulk capacitance of 100 uF for the 1.2 V rail. Use a sequencer IC such as LM3880 or design RC sequencing if the rails share a common input. Estimated core current at 100% utilization is approximately 500 mA.
The 148-WFQFN package has an exposed thermal pad that must be soldered to a copper pour of at least 1 square inch on the top layer for reliable thermal dissipation. Without thermal pad soldering, junction temperatures can exceed 125C with continuous transceiver activity. Per the Cyclone IV GX datasheet, theta-JA for the 148-WFQFN with 4-layer PCB and thermal via array is approximately 22 C/W. For fanless enclosures, designers should budget 0.7-1.0 W typical dissipation and ensure ambient remains below 70C. Estimated junction rise at 1 W dissipation is 22C above ambient.
Differential transceiver pairs (GXB_RXp/n, GXB_TXp/n) must be routed as 100 ohm differential microstrip or stripline with intra-pair skew under 5 mil and inter-pair length matching. Per the Cyclone IV GX datasheet, transceiver signals require a continuous reference plane on an adjacent layer with no splits under the trace. Keep transceiver routes away from switching power supply nodes; minimum 3W (3x trace width) spacing is recommended. Place AC coupling capacitors within 200 mil of the FPGA transceiver pins and choose 0402 size to minimize inductance.
Common pitfalls when designing with EP4CGX15BN11C8N: (1) leaving JTAG TCK floating during configuration - always pull down through 10K; (2) omitting the MSEL[3:0] configuration mode strapping resistors, which default the device to JTAG mode and break standalone boot; (3) using LVTTL 3.3 V outputs into 5 V receivers without series resistors; (4) failing to instantiate the hard PCIe Gen1 IP correctly - the soft-logic fallback will not function; (5) under-budgeting configuration flash memory - Cyclone IV GX requires 16-32 Mbit EPCQ serial flash depending on design size.
For DDR/DDR2 memory interfaces, follow the Cyclone IV GX datasheet's Dynamic Phase Shift (DPS) and DQ pin-swapping guidelines to achieve 200 MHz operation. Place VTT termination resistors at the memory bus midpoint, not at the FPGA, to balance signal integrity. Use IBIS models from the Quartus Prime library for board-level simulation. Estimated setup/hold margin for DDR2-400 with proper PCB design is 200 ps; failures typically arise from address/command traces routed over split power planes or excessive via stubs on the memory data byte lanes.
규정 준수 정보
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified (this is a commercial-grade FPGA). Conflict-mineral declaration available from Intel Product Compliance. Halogen-free status not explicitly stated in available data.
