EP4CGX22BF14I7 - Cyclone IV GX FPGA, 22K LEs, 169-LBGA | Intel
부품 번호: EP4CGX22BF14I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $56.92 | $56.92 |
| 10 | $51.84 | $518.40 |
| 100 | $47.5 | $4,750.00 |
| 500 | $43.1 | $21,550.00 |
| 1,000 | $39.75 | $39,750.00 |
EP4CGX22BF14I7 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) that allows designers to configure digital logic blocks, interconnect, and I/O after manufacture. FPGAs sit in the programmable logic hierarchy above microcontrollers and below ASICs in cost-efficiency for low-to-medium volumes, combining parallel processing, reconfigurable fabric, and high-speed serial transceivers. The Cyclone IV GX family targets cost-sensitive applications that still need transceivers for protocols such as PCIe Gen1, Gigabit Ethernet, CPRI, and SMPTE 3G-SDI.
Key features of the EP4CGX22BF14I7 include 21,280 logic elements, 66 18x18 multipliers, 77.4 Kbits of M9K block RAM plus 242 Kbits of MLAB distributed RAM, two PLLs, two 3.125 Gbps transceiver channels, and 72 user I/O pins. The device operates from a 1.2 V core supply with LVDS, LVTTL, LVCMOS, and SSTL/HSTL I/O standards supported. The -I7 speed grade denotes the industrial temperature range -40C to +100C (junction) with a specific timing closure tier.
Architecturally, the Cyclone IV GX uses a low-power 60-nm process (Cyclone IV device family), an embedded transceiver block per row of high-speed serial links, and hard memory blocks for efficient on-chip storage. The part supports configuration via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.
Typical applications include industrial control interfaces, low-cost serial-protocol bridging (PCIe Gen1 endpoints, GbE MACs, CPRI for small-cell base stations), video broadcast bridging for SDI/HDMI conversion, motor control co-processors, and FPGA-based I/O expansion for embedded SoCs. The integrated transceivers eliminate the need for external PHY ICs in many designs, reducing BOM and board area.
When designing with this device, ensure the Quartus II / Quartus Prime design toolchain supports the targeted Cyclone IV GX device variant, and verify that the -I7 speed grade timing closure matches the target fMAX. Decoupling capacitors must be placed close to all VCCINT, VCCA, VCCIO, and transceiver supply pins per Intel's Cyclone IV GX hardware reference design guidelines.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - useful for engineers evaluating Cyclone IV GX variants for new designs or migration paths.
드롭인 대체품: EP4CGX22BF14I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX22BF14I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Process Technology, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX22BF14C8N
✅ 드롭인✓ 재고 있음
$19.75 / 개
데이터시트 보기 →EP4CGX22BF14C7N
✅ 드롭인✓ 재고 있음
$39.48 / 개
데이터시트 보기 →EP4CGX22BF14C7
✅ 드롭인✓ 재고 있음
$23.6 / 개
데이터시트 보기 →EP4CGX22BF14C8
✅ 드롭인✓ 재고 있음
$24.2 / 개
데이터시트 보기 →EP4CGX22BF14C6N
✅ 드롭인✓ 재고 있음
$42.14 / 개
데이터시트 보기 →EP4CGX22BF14C6
✅ 드롭인✓ 재고 있음
$17.9 / 개
데이터시트 보기 →EP4CGX22BF14I7 최대 정격 & 전기적 특성
| Series | Cyclone IV GX |
| Logic Elements | 21,280 |
| Total Block Memory Bits | 774,144 |
| Total RAM Bits | 21,280 (M9K + MLAB) |
| Number of LABs/CLBs | 47 |
| Number of Logic Elements/Cells | 21,280 |
| Number of I/O | 72 |
| Voltage - Supply | 1.2 V core |
| 실장 유형 | Surface Mount |
| 패키지 | 169-LBGA (FBGA-169) |
EP4CGX22BF14I7 169-lbga (fbga-169) 핀 구성 가이드
EP4CGX22BF14I7(169-lbga (fbga-169) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX22BF14I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX22BF14I7 적합 용도: 7 애플리케이션s: Industrial PCIe Gen1 Endpoint Bridge, Gigabit Ethernet MAC with Industrial Protocol Bridging, Broadcast Video SDI/HDMI Conversion Bridge, Multi-Axis Motor Control Co-Processor, Small-Cell Base Station CPRI Interface, FPGA-Based I/O Expansion for Embedded SoCs, Test & Measurement Protocol Analyzer Probe.
Industrial PCIe Gen1 Endpoint Bridge
The EP4CGX22BF14I7 fits PCIe Gen1 endpoint designs thanks to its 2 integrated 3.125 Gbps transceivers and 169-LBGA footprint. With 21,280 LEs and 66 18x18 multipliers, the part handles PCIe transaction layer, DMA engine, and protocol bridging to local buses (PCIe-to-LocalBus / PCIe-to-EMIF) without external PHY. Its industrial -40C to +100C temperature grade enables deployment in factory automation controllers and machine vision systems where commercial-grade FPGAs are unsuitable. Power consumption is typically under 1.5W at full transceiver utilization, well within passive cooling budgets.
추천
Gigabit Ethernet MAC with Industrial Protocol Bridging
The EP4CGX22BF14I7 supports single-port Gigabit Ethernet MAC implementations using its integrated transceivers and 774,144 bits of block RAM for packet buffering. With 21,280 LEs and 2 PLLs, the FPGA can implement GbE MAC plus industrial protocol bridges (PROFINET, EtherCAT, Modbus TCP) for industrial gateway equipment. The 169-LBGA industrial-grade package suits factory-floor installations with extended temperature ranges. Designers typically pair it with an external PHY or use the on-chip SERDES for 1000BASE-T/SGMII links.
추천
Broadcast Video SDI/HDMI Conversion Bridge
The EP4CGX22BF14I7 is widely used in 3G-SDI to HDMI conversion bridges for broadcast production equipment, leveraging its 2 transceivers for SDI receive/transmit and LVDS I/O for HDMI. With 21,280 LEs and 66 multipliers, the part supports SDI de/embedder logic plus color-space conversion and scaling. The industrial -I7 grade suits broadcast studios and outdoor OB vans. The 169-LBGA package fits compact mezzanine modules that convert between professional video formats in camera control units and production switchers.
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Multi-Axis Motor Control Co-Processor
Industrial motor drives benefit from the EP4CGX22BF14I7's 66 18x18 multipliers and 21,280 LEs, which can implement multi-axis field-oriented control (FOC) loops, encoder interfaces (EnDat 2.2, BISS, SSI), and isolated comm channels. The 2 PLLs generate timing for multiple encoder sampling rates, while the 72 user I/Os interface to power-stage gate drivers and resolver excitation circuits. The industrial -I7 grade and 169-LBGA package suit servo drives and robotics controllers operating in harsh factory environments.
추천
Small-Cell Base Station CPRI Interface
The EP4CGX22BF14I7's integrated transceivers support CPRI links up to 3.125 Gbps for small-cell base station baseband-to-radio bridging. With 21,280 LEs and 774,144 memory bits, the FPGA can implement CPRI framing, AXI/Stream fabric interfacing, and basic PHY-layer DSP. The industrial temperature grade enables outdoor small-cell deployment. The 169-LBGA footprint allows compact radio unit (RU) designs where board area is at premium and external PHY ICs cannot be used.
추천
FPGA-Based I/O Expansion for Embedded SoCs
The EP4CGX22BF14I7 serves as an FPGA I/O expander for ARM-based SoCs lacking sufficient GPIO, serial interfaces, or specialized logic. With 72 user I/Os and 21,280 LEs, it adds PCIe endpoint, LVDS, LVCMOS, and custom interfaces to processors lacking these peripherals. The 2 PLLs derive multiple domain clocks for downstream devices. The industrial -I7 grade suits embedded industrial PCs and edge-compute gateways. The 169-LBGA package fits standard mezzanine footprints used in COM Express carrier boards.
추천
Test & Measurement Protocol Analyzer Probe
The EP4CGX22BF14I7 supports portable protocol analyzers for PCIe Gen1, GbE, and custom serial protocols thanks to its 2 transceivers and 21,280 LEs. With 774,144 bits of block RAM, the part can buffer captured frames for analysis. The industrial -I7 grade enables field-deployed test equipment. The 169-LBGA package suits compact handheld probe form factors. Designers can reconfigure the FPGA to support multiple protocols via JTAG, making it a flexible multi-standard bench tool.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX22BF14I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX22BF14C8N | EP4CGX22BF14C7N | EP4CGX22BF14C7 | EP4CGX22BF14C8 | EP4CGX22BF14C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 169-LBGA | 169-LBGA - same | 169-LBGA - same | 169-LBGA - same | 169-LBGA - same | 169-LBGA - same |
| Logic Elements | 21,280 | 21,280 | 21,280 | 21,280 | 21,280 | 21,280 |
| Total Memory Bits | 774,144 | 774,144 | 774,144 | 774,144 | 774,144 | 774,144 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I7 (industrial mid-speed) | C8 (commercial mid-speed) | C7 (commercial mid-speed) | C7 (commercial mid-speed) | C8 (commercial mid-speed) | C6 (commercial slowest) |
| Number of Transceivers | 2 (up to 3.125 Gbps) | 2 (up to 3.125 Gbps) | 2 (up to 3.125 Gbps) | 2 (up to 3.125 Gbps) | 2 (up to 3.125 Gbps) | 2 (up to 3.125 Gbps) |
| User I/O | 72 | 72 | 72 | 72 | 72 | 72 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lead-Free (N suffix) | No (I7 only) | Yes | Yes | No | No | Yes |
주요 차별점
- Industrial temperature grade in 169-LBGA with integrated 3.125 Gbps transceivers (vs EP4CGX22BF14C8N)
- Higher speed grade (I7) for industrial timing closure (vs EP4CGX22BF14C6N)
- Two integrated 3.125 Gbps transceivers eliminate external PHY ICs (vs EP4CE40F23I7N (Cyclone IV E, no transceivers))
설계 노트
The EP4CGX22BF14I7 requires multiple supply rails: 1.2 V VCCINT (core), 2.5 V or 3.3 V VCCIO (I/O banks), 2.5 V VCCA (PLL analog), and 1.2 V/2.5 V VCCD_PLL (PLL digital). According to Intel's Cyclone IV GX hardware reference design guidelines, decouple each VCCINT pin with 0.1 uF and 10 uF capacitors placed within 100 mils of the respective pins. Transceiver channels require VCCR, VCCT, and VCCH supplies with dedicated filtering; sharing these with digital supplies will degrade SERDES jitter performance.
The 169-LBGA package has a theta-JA of approximately 25 C/W with proper PCB thermal via array. Estimated: at 1.5 W total power dissipation, junction temperature rise above ambient is ~37C, keeping the part within the -40C to +100C industrial range. Use at least a 4-layer PCB with continuous ground plane beneath the BGA and thermal via array (0.3 mm pitch, 0.2 mm drill) for adequate heat spreading in high-utilization designs.
The 169-LBGA uses a 1.0 mm ball pitch, which requires NSMD (non-solder-mask-defined) pads per Intel's design guidelines. Maintain at least 0.5 mm clearance from BGA edge to nearest trace and route all signals on outer layers only for breakout. For transceiver channels, maintain 100-ohm differential impedance on the SERDES lanes with length matching to within 150 mils for 3.125 Gbps operation.
Do not assume the EP4CGX22BF14I7 and EP4CGX22BF14C8N are interchangeable in industrial designs - the C8N suffix denotes commercial temperature grade (0C to +85C). Verify the temperature range of your enclosure against the device's TJ range, and consider that BGA packages develop higher junction temperatures than QFP due to limited board-side cooling paths. For JTAG programming, ensure the nCONFIG pin is pulled high via 10 kohm to VCCIO before applying power.
Place the configuration EEPROM (EPCS device for Active Serial mode) within 2 inches of the FPGA's MSEL/ASDO/nCSO pins. According to Intel's Cyclone IV GX handbook, route clock inputs (CLK0-CLK3) on inner layers with ground reference for best jitter performance, and avoid routing them parallel to high-speed transceiver lanes. The two PLLs benefit from isolated power filtering; do not share their VCCA planes with noisy switching converters.
규정 준수 정보
RoHS and REACH compliance not directly listed in the verified web data; consult the official Intel product declaration. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade qualified IC. Contact Intel for automotive-grade equivalents.
