EP4CGX50DF27C7N - Cyclone IV GX FPGA 49,888 LEs | Intel
부품 번호: EP4CGX50DF27C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.4 | $824.00 |
| 100 | $74.2 | $7,420.00 |
| 500 | $65.8 | $32,900.00 |
| 1,000 | $58.6 | $58,600.00 |
EP4CGX50DF27C7N 개요
A field-programmable gate array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and (in 'GX' families) multi-gigabit transceivers. FPGAs occupy the programmable-logic tier of the digital design hierarchy: discrete logic -> CPLD (gates) -> FPGA (logic blocks + hard IP) -> SoC/ASIC. Cyclone IV GX specifically targets the low-power, transceiver-equipped middle ground between cost-optimized Cyclone IV E and higher-end Stratix families.
Key specifications of the EP4CGX50DF27C7N include 49,888 logic elements, 2,562,048 embedded memory bits, 232 user I/O pins on the F27 package variant, integrated 3.125 Gbps transceivers (number of transceiver channels is package-dependent), and a 1.2 V core supply. The device supports DDR/DDR2/DDR3/QDRII/RLDRAM memory interfaces via dedicated PHY blocks, and offers 6 PLLs plus clock networks for flexible clocking. Compared with Cyclone IV E, the GX variant adds transceiver capability at roughly the same power envelope.
Architecturally, the EP4CGX50 uses a 60 nm process node with 1.2 V core, which gives a favorable power/performance trade-off versus 90 nm Cyclone III and a lower price point than 40 nm Cyclone V. The device family supports Nios II soft-core processor embedding, enabling fully customized SoC implementations in a single chip.
Typical applications include industrial video bridging and display controllers, low-cost serial-connectivity bridges (PCIe Gen1/Gen2, SATA, GigE), motor control, software-defined radio front-ends, and machine-vision interfaces. The integrated transceivers make it particularly suitable for protocol bridging between high-speed serial links and parallel LVCMOS/LVTTL logic.
Designers should plan power sequencing carefully: the Cyclone IV GX requires ramp-rate-controlled ramp-up of the 1.2 V core rail to avoid in-rush current issues. Use the Altera/Intel PowerPlay Early Power Estimator (EPE) spreadsheet before tape-out to size decoupling and thermal solutions.
This page synthesizes distributor pricing, drop-in same-family variants, and PCB-layout design notes not aggregated on the official Intel datasheet, providing practical information gain for engineers evaluating Cyclone IV GX options.
드롭인 대체품: EP4CGX50DF27C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX50DF27C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Transceivers, Embedded Memory, Speed Grade, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX50DF27C7
✅ 드롭인✓ 재고 있음
$49.1 / 개
데이터시트 보기 →EP4CGX50DF27C6N
✅ 드롭인✓ 재고 있음
$155 / 개
데이터시트 보기 →EP4CGX50DF27C8N
✅ 드롭인✓ 재고 있음
$49.1 / 개
데이터시트 보기 →EP4CGX110DF27C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$204.2 / 개
데이터시트 보기 →EP4CGX150DF27C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$171 / 개
데이터시트 보기 →EP4CGX50DF27C7N 최대 정격 & 전기적 특성
| Family | Cyclone IV GX |
| Logic Elements (LE) | 49,888 |
| Total Embedded Memory Bits | 2,562,048 |
| User I/O Pins (max) | 310 |
| Transceivers | Yes (3.125 Gbps GX channels, package-dependent) |
| Core Supply Voltage | 1.2 V |
| Process Node | 60 nm |
| Operating Temperature (Commercial 'C') | 0C to +85C |
| 패키지 | 672-pin FBGA (FineLine BGA) |
| 실장 유형 | Surface Mount |
| PLL Count | 6 |
| Hard Memory Controller | DDR/DDR2/DDR3/QDRII/RLDRAM PHY |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP4CGX50DF27C7N 672-pin fbga (fineline bga) 핀 구성 가이드
EP4CGX50DF27C7N(672-pin fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX50DF27C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX50DF27C7N 적합 용도: 6 애플리케이션s: Industrial Video Bridging & Display Controllers, PCI Express Gen1/Gen2 Endpoint Card, Gigabit Ethernet & Industrial Protocol Bridges, Motor Control & Industrial Drive Front-End, Software-Defined Radio (SDR) Front-End & DSP, Machine Vision & Camera Link Interface.
Industrial Video Bridging & Display Controllers
The EP4CGX50DF27C7N's 49,888 logic elements plus dedicated DDR3 PHY make it well-suited for industrial video bridging between MIPI, HDMI, LVDS, and DisplayPort interfaces, with integrated 3.125 Gbps transceivers handling high-speed serial outputs. At typical utilization of 60-70% LEs and 80% of available M9K memory blocks, a single Cyclone IV GX can drive dual-channel FHD display pipelines without external bridge ICs. Pair with the EPCQ64A configuration memory and a 50 MHz LVCMOS oscillator.
추천
PCI Express Gen1/Gen2 Endpoint Card
The EP4CGX50DF27C7N's integrated 3.125 Gbps transceivers include a hard PCIe Gen1/Gen2 PHY block that supports x1/x2/x4 endpoint applications with minimal soft-logic overhead. A complete PCIe endpoint including DMA engine and MSI-X interrupt logic fits comfortably in 30K-35K LEs. The 672-ball F27 BGA provides sufficient I/O for up to x4 PCIe plus auxiliary GPIO. Pair with a 100 MHz PCIe reference clock and standard 8b/10b SerDes external conditioning.
추천
Gigabit Ethernet & Industrial Protocol Bridges
Industrial Ethernet protocols such as PROFINET, EtherCAT, EtherNet/IP, and SERCOS III all run on 100 Mbps or 1 Gbps links that the EP4CGX50DF27C7N handles via its integrated transceivers and tri-speed Ethernet MAC support. With 49,888 LEs, the device can host two simultaneous Ethernet channels with full protocol stack offload. The 6 PLLs provide independent clocks for SGMII and parallel GPIO, simplifying multi-protocol gateway designs.
추천
Motor Control & Industrial Drive Front-End
FPGA-based motor control benefits from the EP4CGX50DF27C7N's deterministic latency, parallel PWM generation, and high-resolution encoder interfaces (BiSS, EnDat, SSI, Tamagawa). With 49,888 LEs, the device can drive up to 6 axes of FOC motor control with 16 kHz PWM at 100 kHz loop rates. Transceivers can support the industrial encoder feedback channel. Pair with isolated gate drivers and current-sense amplifiers.
추천
Software-Defined Radio (SDR) Front-End & DSP
The 3.125 Gbps transceivers plus 49,888 LEs and on-chip multipliers make the EP4CGX50DF27C7N suitable for narrow-band SDR front-ends, including DVB-T, DVB-S2, and custom OFDM waveforms. The hard 18x18 multipliers deliver ~140 GMACs of DSP throughput for IF-stage decimation and channelization. Drop-in same-package family variants such as EP4CGX110DF27C7N offer headroom for higher-bandwidth applications.
추천
Machine Vision & Camera Link Interface
The EP4CGX50DF27C7N excels as a Camera Link frame grabber or as a programmable image pre-processor for area-scan and line-scan cameras. 49,888 LEs can host 2D convolution, color-space conversion, and HDR pipelines up to 80 MHz pixel clock. Transceivers enable CoaXPress or GigE Vision uplink, while parallel LVCMOS lanes drive the sensor side. The DDR3 PHY handles multi-Mpixel frame buffering without external SDRAM controllers.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX50DF27C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX50DF27C7 | EP4CGX50DF27C6N | EP4CGX50DF27C8N | EP4CGX110DF27C7N | EP4CGX150DF27C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA (F27) | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same |
| Logic Elements | 49,888 | 49,888 | 49,888 | 49,888 | 109,424 | 149,760 |
| Speed Grade | C7 | C7 | C6 | C8 | C7 | C7 |
| Transceivers (3.125 Gbps) | Yes | Yes | Yes | Yes | Yes | Yes |
| Embedded Memory (bits) | 2,562,048 | 2,562,048 | 2,562,048 | 2,562,048 | 5,062,400 | 6,480,448 |
| User I/O (max) | 310 | 310 | 310 | 310 | 310 | 310 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
주요 차별점
- Integrated 3.125 Gbps transceivers in mid-density 49,888 LE Cyclone IV GX die (vs EP4CGX30CF19C7N)
- Maximum density at F27 footprint (49,888 LEs) (vs EP4CGX50CF23C7N)
- Commercial 'C7' speed grade with full speed/area optimization (vs EP4CGX50DF27C6N)
설계 노트
Estimated: At typical utilization (60-70% LEs, 50% memory, full transceiver lanes at 3.125 Gbps PRBS31), the EP4CGX50DF27C7N draws ~3.5-5 W. Design the 1.2 V VCCINT rail with a buck regulator rated for at least 6 A continuous (e.g. TPS54360DDA) and place 22uF X5R bulk plus 0.1uF + 1nF high-frequency decoupling within 5 mm of every VCC pin pair. The transceiver rails VCCPT_2P5 and VCCA need separate LDO filtering.
The 672-ball F27 FineLine BGA has a 1.0 mm ball pitch requiring microvia (laser-drilled) PCB stackup. Use at minimum a 6-layer board: signal / GND / signal / VCC / GND / signal. Route all high-speed transceiver lanes (GXB) as 100 ohm differential 8-mil traces with ground stitching vias every 0.5 wavelength. Place the transceiver AC-coupling capacitors within 5 mm of the TX ball.
Cyclone IV GX is sensitive to VCCINT ramp rate. The 1.2 V core must ramp monotonically between 0.5 ms and 100 ms; faster or slower ramps can cause in-rush latch-up. Use a soft-start DC-DC (e.g. TPS54x family) or a power-good-controlled load switch. Also: do not leave any VCC/GND ball unconnected - every ball needs a via-in-pad connection to internal planes.
For PCIe Gen2 (5 Gbps) and SATA (6 Gbps) links on the GX transceivers, follow the Altera Transceiver Link Design Guide: keep TX-to-RX trace mismatch under 20 mils, use 100 ohm +/- 10% differential impedance, and place the AC-coupling caps as close to the TX pins as possible. Reference the Cyclone IV GX Transceiver Layout Guidelines for eye-diagram tuning.
규정 준수 정보
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - this is a commercial/industrial part, not automotive-grade.
