EP1S10F672C7 - Stratix FPGA 10K LEs 672-BGA 1.5V | Altera
부품 번호: EP1S10F672C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $195 | $19,500.00 |
| 500 | $175 | $87,500.00 |
| 1,000 | $158 | $158,000.00 |
EP1S10F672C7 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy the upper tier of the digital logic hierarchy: programmable logic sits above fixed-function ASICs and microcontrollers for prototyping and low-volume production, and below custom ASICs for high-volume cost-optimized designs. The Stratix family was Altera's first high-end FPGA line to combine embedded memory, embedded multipliers, and dedicated DSP blocks on a single die, predating later Cyclone and Arria families.
Key features of the EP1S10F672C7 include 10,570 logic elements (LEs), approximately 920 Kbits of TriMatrix embedded memory, embedded DSP blocks supporting multiplication and accumulation, up to 345 user I/O pins distributed across multiple banks, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device also integrates a PLL-based clock management fabric with multiple phase-locked loops and a configuration interface supporting JTAG and passive/active serial modes.
The 672-pin FineLine BGA package supports vertical migration within the Stratix family, meaning a design targeting the EP1S10 can also be placed on EP1S20 or EP1S25 devices in the same package footprint without PCB rework. This migration flexibility is enabled by aligning dedicated pins, configuration pins, and power pins across density variants.
Typical applications include high-speed digital signal processing prototypes, telecommunications line cards, video and image processing pipelines, and ASIC prototyping for SoC validation. The 130 nm process and 1.5 V core voltage make it suitable for legacy systems where modern 28 nm or 14 nm parts are not pin-compatible.
When designing with the EP1S10F672C7, ensure all four core supply rails (VCCINT, VCCIO, VCC_PLL, VCCA) are properly decoupled with bulk and high-frequency capacitors per the Altera Stratix Device Handbook. Pin migration within the 672-pin BGA family must be planned at the schematic stage to avoid costly PCB respins.
This page synthesizes distributor pricing, drop-in same-package alternatives, and design considerations not consolidated in the manufacturer datasheet, helping engineers evaluating legacy Stratix designs make informed sourcing decisions.
드롭인 대체품: EP1S10F672C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S10F672C7 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Family, DSP Blocks, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S10F672C7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1S10F672C6
✅ 드롭인✓ 재고 있음
$72 / 개
데이터시트 보기 →EP1S10F672C6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S10F672C5
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S10F672C5N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S10B672C7
✅ 드롭인✓ 재고 있음
$140 / 개
데이터시트 보기 →EP1S10F672C7 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 10,570 |
| Embedded Memory | 920,448 bits |
| User I/Os | 345 |
| 패키지 | 672-pin FBGA (FineLine BGA) |
| Package Dimensions | 35 x 35 mm, 1.27 mm pitch |
| Process Technology | 130 nm CMOS |
| Core Voltage (VCCINT) | 1.5 V |
| Logic Cells | 10,570 |
| LABs (Logic Array Blocks) | 1,057 |
| 동작 온도 | 0 C to 85 C (Commercial) |
| 실장 유형 | Surface Mount |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Configuration Mode | JTAG, Passive Serial, Active Serial |
| RoHS 상태 | unknown |
EP1S10F672C7 35 x 35 mm, 1.27 mm pitch 핀 구성 가이드
EP1S10F672C7(35 x 35 mm, 1.27 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S10F672C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S10F672C7 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Telecommunications Line Card Processing, Video and Image Processing Pipelines, High-Speed Digital Signal Processing, Industrial Control and Machine Automation, Legacy Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP1S10F672C7's 10,570 logic elements and 920 Kbits of TriMatrix embedded memory make it well-suited for ASIC prototyping and SoC emulation workloads. Designers can map RTL blocks onto the Stratix fabric to validate functional correctness before committing to mask-set fabrication. The 345 user I/Os and LVDS support enable realistic chip-to-chip interface emulation, while the JTAG and passive-serial configuration paths accelerate compile-and-test iteration cycles in pre-silicon validation flows.
추천
Telecommunications Line Card Processing
The EP1S10F672C7 was widely deployed in telecom line-card DSP and packet-processing applications during the early-to-mid 2000s. Its embedded DSP blocks deliver multiplication-accumulation throughput suitable for FEC, equalization, and baseband processing, while LVDS-capable I/O banks interface cleanly with legacy framer and serializer silicon. The 672-FBGA package supports vertical migration to EP1S20 or EP1S25 within the same line-card PCB as channel counts scale.
추천
Video and Image Processing Pipelines
The EP1S10F672C7's TriMatrix memory bandwidth and embedded multipliers enable real-time video processing pipelines for broadcast and surveillance equipment. Designers implement deinterlacers, scalers, color-space converters, and motion estimators in the Stratix fabric, with LVDS-Extended interfaces routing pixel data to external video ADCs and DACs. The 345 user I/Os comfortably accommodate multi-channel SDI or parallel RGB streams with frame-buffer memory in external SSRAM or DDR.
추천
High-Speed Digital Signal Processing
Stratix DSP blocks support 9-bit, 18-bit, and 36-bit multiplication-accumulation operations, making the EP1S10F672C7 suitable for FFT, FIR filtering, and modulation/demodulation pipelines. The 130 nm process delivers deterministic timing closure at clock rates compatible with telecom baseband processing, while the dedicated PLL fabric enables multi-clock-domain signal chains. Legacy radar, sonar, and instrumentation systems continue to specify the EP1S10 due to its proven long-term supply history.
추천
Industrial Control and Machine Automation
The EP1S10F672C7 was deployed in industrial PLC, motion controller, and machine-vision platforms where its combination of embedded DSP, parallel logic, and flexible I/O standards simplified BOM consolidation. LVDS interfaces connect to high-resolution encoders; LVTTL/LVCMOS banks interface to legacy motor-driver ICs. With the part now obsolete, long-term maintenance sourcing requires careful authorized-channel qualification to avoid counterfeit risk in safety-critical automation systems.
추천
Legacy Test and Measurement Instrumentation
The EP1S10F672C7's deterministic timing and rich I/O flexibility made it a popular logic fabric for custom test and measurement platforms, including protocol analyzers, BERT testers, and logic-analyzer capture engines. Engineers used the embedded DSP blocks for FFT-based spectrum analysis and the TriMatrix memory for deep capture buffers. With the part now obsolete, test-equipment OEMs must qualify EP1S10F672C7N or last-time-buy stock for ongoing service contracts.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S10F672C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S10F672C7N | EP1S10F672C6 | EP1S10F672C6N | EP1S10F672C5 | EP1S10F672C5N | EP1S10B672C7 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Embedded Memory | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits |
| Speed Grade | C7 | C7 | C6 (slower by one bin) | C6 (slower by one bin) | C5 (slowest commercial bin) | C5 (slowest commercial bin) | C7 |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
| Lead-Free Finish | SnPb (no N suffix) | Yes (Pb-free) | SnPb | Yes (Pb-free) | SnPb | Yes (Pb-free) | SnPb (B suffix = no lead-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Higher speed grade within the EP1S10 family (vs EP1S10F672C6)
- Original SnPb finish variant for legacy programs (vs EP1S10F672C7N)
- Maximum speed grade in EP1S10 family (vs EP1S10F672C5)
- First-generation Stratix with proven long-term reliability (vs Cyclone IV GX EP4CGX30CF23C7N)
설계 노트
Estimated: Stratix EP1S10 core power scales with toggle rate and logic utilization. At 50% utilization and 100 MHz operation on the 1.5 V VCCINT rail, the EP1S10F672C7 typically draws approximately 0.5-1.2 A core current. Always provide separate bulk decoupling on VCCINT, VCCIO (per bank), VCC_PLL, and VCCA, with ferrite-bead isolation between VCCA (PLL analog) and VCCINT (digital core) to minimize jitter.
Estimated: the 672-pin FineLine BGA requires a 35 x 35 mm PCB land pattern with 1.27 mm pitch. Stack-up design must target controlled-impedance traces for LVDS pairs (typically 100 ohm differential) and 50 ohm single-ended for LVCMOS/LVTTL. Power-plane stitching vias should be placed on a 1.27 mm grid to maximize decoupling return paths, and BGA break-out traces should escape on inner layers to preserve top-layer routing channels.
Do not confuse the EP1S10 (Stratix, 1.5 V core, 130 nm) with later-generation Cyclone IV E (EP4CE, 1.2 V core, 60 nm) or Arria II GX parts that share a similar F672 footprint. These families are not pin-compatible - power rails, JTAG pinouts, and configuration pin assignments differ. When migrating within the Stratix family (EP1S10 -> EP1S20 -> EP1S25), verify against the Altera vertical-migration table before board revision.
Estimated: keep PLL analog supply traces short and isolated. Place ferrite beads between VCCA (PLL analog) and the shared 1.5 V regulator output, with 0.1 uF and 10 uF decoupling within 5 mm of each PLL VCCA pin. Maintain a 50-mil ground guard ring around PLL supply and feedback traces to minimize coupling from high-speed LVDS pairs.
Estimated: LVDS-Extended channels can achieve several hundred Mbps on the EP1S10F672C7 when properly terminated. Use 100 ohm differential intra-pair impedance, length-match within 50 mil across a LVDS pair, and place external 100 ohm termination resistors close to the receiver end of each LVDS pair. For source-synchronous LVDS interfaces, length-match clock-to-data at 1/4 UI accuracy across the entire bus.
규정 준수 정보
EP1S10F672C7 base part is SnPb finish; EP1S10F672C7N is the lead-free variant. AEC-Q100 not applicable for this commercial-grade FPGA family. RoHS, REACH, halogen, and conflict-mineral status not stated explicitly in available distributor data; consult Altera/Intel product compliance records for definitive certification.
