EP4SGX230TF35C4N - Stratix IV GX FPGA 228K LE FBGA-1152 | Intel
부품 번호: EP4SGX230TF35C4N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3990 | $39,900.00 |
| 100 | $3550 | $355,000.00 |
| 500 | $3180 | $1,590,000.00 |
| 1,000 | $2895 | $2,895,000.00 |
EP4SGX230TF35C4N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, DSP slices, and block RAM that can be reconfigured after manufacturing. Within the broader semiconductor hierarchy, FPGAs sit between standard microcontrollers and full custom ASICs: microcontrollers execute software sequentially on fixed hardware, whereas ASICs are fixed at fabrication; FPGAs offer hardware-level parallelism with the design flexibility of software-defined logic. The Stratix IV family belongs to the high-performance tier, incorporating transceivers and DSP blocks typically required in communications infrastructure, broadcast video, and high-end signal processing.
Key features include 8.5 Gbps transceiver support for protocols such as PCIe Gen2, XAUI, CEI-6G, and Serial RapidIO, 1,288 18x18 multipliers delivering up to 256 GMACs of DSP throughput, and 24 phase-locked loops (PLLs) for clock management. Partial and dynamic reconfiguration, dedicated encryption circuitry, and 1.4 Gbps LVDS support make the device suitable for designs that must remain in the field for many years.
The architecture is built on a 40 nm process and features Adaptive Logic Modules (ALMs) that pack eight inputs into fracturable look-up tables, improving effective density compared to older 4-input LUT designs. Hard memory blocks, DSP blocks, and transceiver channels are arranged in columns along the device perimeter to minimize routing delay, supporting timing closure on complex multi-gigabit pipelines.
Typical applications include 40G/100G line-card prototyping, wireless baseband processing, high-performance computing ASIC emulation, military secure communications, and broadcast video switching. The integration of transceivers and DSP on a single die reduces bill-of-materials cost and PCB area compared with multi-chip implementations.
When designing with this device, allocate sufficient PCB layers and power-supply decoupling to support the simultaneous switching of hundreds of I/O; a minimum of 12 power rails is typical. Use the Quartus II design software (recommended version 13.0 or later with service pack) for synthesis, place-and-route, and timing analysis to ensure reliable compilation of high-utilization designs.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV family, and practical design notes compiled from manufacturer datasheets and reference designs - information not aggregated on any single distributor page.
드롭인 대체품: EP4SGX230TF35C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX230TF35C4N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, User I/O Pins, Family, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX230TF35C4G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SGX230HF35I4G
✅ 드롭인✓ 재고 있음
$7900 / 개
데이터시트 보기 →EP4SGX230FF35C4N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SGX230KF40I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3725 / 개
데이터시트 보기 →EP4S40G2F40I2NAB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3120 / 개
데이터시트 보기 →XC7V2000TFLG1925-2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SGX230TF35C4N 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements | 228,000 |
| Embedded Memory (M9K blocks) | 1,288 blocks / 17,544 Kbits |
| MLAB Memory | 17.7 Mbits |
| DSP Blocks (18x18 Multipliers) | 1,288 (up to 256 GMACs) |
| Maximum User I/O Pins | 564 |
| Transceivers | Embedded multi-gigabit transceivers up to 8.5 Gbps |
| PLLs | 24 |
| Global Clock Networks | 16 |
| Process Technology | 40 nm |
| 패키지 | 1152-ball FBGA (FineLine BGA), 35x35 mm |
| Speed Grade | C4 (commercial) |
| 동작 온도 | 0C to +85C (commercial) |
| Configuration | Active/passive serial, fast passive parallel |
| Supply Voltage Core | 0.9 V (nominal) |
| Design Software | Quartus II (service pack recommended) |
EP4SGX230TF35C4N 1152-ball fbga (fineline bga), 35x35 mm 핀 구성 가이드
EP4SGX230TF35C4N(1152-ball fbga (fineline bga), 35x35 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX230TF35C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX230TF35C4N 적합 용도: 6 애플리케이션s: 10G/40G Communications Line Card, Wireless Baseband Signal Processing, ASIC Prototyping and Emulation, Broadcast Video Processing and Switching, Military and Aerospace Secure Communications, Industrial Test and Measurement Equipment.
10G/40G Communications Line Card
The EP4SGX230TF35C4N fits 10G/40G communications line cards because its 8.5 Gbps embedded transceivers support XAUI, PCIe Gen2, CEI-6G, and Serial RapidIO with hardware PCS and PMA blocks offloading the FPGA fabric. With 1,288 18x18 multipliers delivering up to 256 GMACs, the device can run forward-error-correction (FEC) and digital pre-distortion algorithms in parallel with packet processing. The 564 user I/Os route multiple SFP+/QSFP cages, DDR3 memory controllers, and backplane interfaces from a single device, reducing component count compared with multi-chip solutions. Designers typically pair the FPGA with external DDR3 RLDRAM II or QDR-IV memories for packet buffering.
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Wireless Baseband Signal Processing
The EP4SGX230TF35C4N is well suited to wireless baseband processing because its 1,288 DSP blocks execute up to 256 GMACs of operations per clock domain, supporting LTE, WiMAX, and proprietary PHY algorithms in real time. Embedded transceivers stream digitized RF samples between the baseband FPGA and external analog front ends, eliminating glue logic. The 17,544 Kbits of block RAM plus 17.7 Mbits of MLAB provide low-latency sample buffering for FFT/iFFT and channel-estimation matrices. Multiple PLLs (24) and 16 global clock networks simplify distribution of multi-rate sample clocks across the design.
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ASIC Prototyping and Emulation
The EP4SGX230TF35C4N is widely used as a building block in ASIC prototyping because its 228,000 logic elements can partition moderately large ASIC designs into a single device, cutting inter-FPGA pin count. The 564 user I/Os and 24 PLLs provide generous timing flexibility for mapping complex clock-domain crossings. The high block-RAM to logic ratio (17.7 Mbits total) is ideal for memory-intensive verification environments. Multiple boards can be cascaded through high-speed LVDS pairs or transceivers to emulate ASICs far larger than a single FPGA could hold.
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Broadcast Video Processing and Switching
The EP4SGX230TF35C4N fits broadcast video routers and processing frames because its embedded transceivers support SDI standards up to 3G-SDI while the 564 user I/Os route parallel video buses, control channels, and audio embedders. The abundant DSP blocks process video scaling, color-space conversion, and overlay blending in real time. Block RAM provides line-store buffering for video mixers and frame synchronizers. Industrial temperature and long-term Altera/Intel support make the device attractive for broadcast infrastructure that must remain in service for many years.
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Military and Aerospace Secure Communications
The EP4SGX230TF35C4N supports secure communications systems because its hard AES encryption block and design-security features protect configuration bitstreams and on-chip data from reverse engineering. Embedded transceivers at 8.5 Gbps link radios to digital signal-processing pipelines, while the high DSP count accelerates bulk cryptographic operations in hardware. The Stratix IV family is supported with extended-lifecycle programs and industrial/extended temperature variants (such as the EP4SGX230KF40I4N) that align with the long deployment windows typical of military programs. Designers should consult Intel/Altera's military-grade datasheet addendum for full environmental screening details.
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Industrial Test and Measurement Equipment
The EP4SGX230TF35C4N suits high-end oscilloscopes, logic analyzers, and protocol testers because the 564 user I/Os deliver wide parallel acquisition buses while the embedded transceivers capture high-speed serial lanes (USB 3.0, PCIe Gen2, SATA) for protocol analysis. The 1,288 DSP blocks perform real-time FFT, eye-diagram measurement, and jitter decomposition at line rate. Block RAM and MLAB provide deep sample storage for time-correlated acquisition across multiple channels. The commercial C4 speed grade supports laboratory temperature environments, with industrial variants available for production-floor deployment.
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추천 제품 요약
엔지니어링 참조 데이터: EP4SGX230TF35C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX230TF35C4G | EP4SGX230HF35I4G | EP4SGX230FF35C4N | EP4SGX230KF40I4N | XC7V2000TFLG1925-2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Xilinx |
| Package | 1152-ball FBGA (35x35 mm) | 1152-ball FBGA (35x35 mm) - same | 1152-ball FBGA (35x35 mm) - same | 1152-ball FBGA (35x35 mm) - same | 780-pin FBGA - different | 1925-ball FFG-BGA - different |
| Logic Elements | 228,000 | 228,000 | 228,000 | 228,000 | 228,000 | ~2,000,000 (SSI) |
| Transceiver Rate | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | no transceivers (F35 option) | 8.5 Gbps | 28 Gbps |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 28 nm |
주요 차별점
- Highest logic capacity in Stratix IV GX family at C4 commercial speed grade (vs EP4SGX180KF40I3N)
- Higher transceiver density than Cyclone IV GX family (vs EP4CGX150DF31I7N)
- Long-life industrial/military support variants (vs Xilinx XC7V2000TFLG1925-2)
설계 노트
Estimated: the EP4SGX230TF35C4N requires at least 12 distinct power rails (0.9 V core, 1.1 V PLL, 1.5 V/2.5 V I/O banks, transceiver analog supplies, configuration supply). Each rail should be filtered with ferrite beads and decoupled with a 470 uF bulk plus 0.1 uF + 1 uF + 10 uF ceramic stack. Simultaneous switching of hundreds of LVDS pairs makes the power-supply design the single largest determinant of timing closure; follow the Stratix IV Power Distribution Network (PDN) guidelines for layer stack-up.
Estimated: full-die operation with all transceivers active and 80 percent logic utilization dissipates approximately 18 to 25 W depending on toggle rate. The F1152 FineLine BGA exposes a heat-spreader lid; designers should attach a heat sink with thermal interface material and provide at least 400 LFM of airflow for commercial-grade systems. Use junction-temperature monitoring through the on-chip temperature-sensing diode and FPGA logic to throttle performance if Tj approaches 100C.
The 1152-ball FBGA uses a 1.0 mm ball pitch. PCB stack-up must support 4-6 routing layers with matched impedance for transceivers (100 ohm differential) and LVDS (100 ohm differential). Via-in-pad micro-vias or back-drilled through-vias are required for high-speed transceiver channels to maintain signal integrity above 6 Gbps. Use the Stratix IV GX pin-out file and IBIS-AMI models for channel simulation; sample schematics for Altera development kits provide proven layer-stack and decoupling patterns.
Estimated: do not assume the EP4SGX230TF35C4N and the EP4SGX230HF35I4G are interchangeable without re-running the Quartus II timing analysis - the I4 speed grade advances timing but the industrial temperature grade also changes the silicon behavior model. Configuration scheme must be selected correctly (active serial, passive serial, fast passive parallel, or JTAG) because the pin-out for configuration signals varies across schemes and re-using a previous design's pin assignments without checking is the single most common board-bring-up issue.
규정 준수 정보
RoHS compliant per Intel/Altera product page. Lead-free and halogen-free finish available. Industrial / military temperature variants available in same family for programs requiring extended environmental screening.
