EP4SGX360FH29C2XN - Stratix IV GX FPGA, 353.6K LE, 780-BGA | Intel
부품 번호: EP4SGX360FH29C2XN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2720 | $27,200.00 |
| 100 | $2540 | $254,000.00 |
| 500 | $2380 | $1,190,000.00 |
| 1,000 | $2210 | $2,210,000.00 |
EP4SGX360FH29C2XN 개요
A field-programmable gate array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit at the apex of the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA), allowing system architects to implement custom datapaths, protocols, and parallel processing engines on a single die that would otherwise require multiple discrete ASICs. The Stratix IV GX family specifically targets high-bandwidth serial interface applications.
Key features of the EP4SGX360FH29C2XN include 353,600 logic elements, 14,144 LABs (Logic Array Blocks), 289 maximum user I/Os, 23,105,536 bits of embedded memory, embedded DSP blocks, and integrated multi-gigabit transceivers (MGTs) that support serial protocols up to 8.5 Gbps. The Stratix IV GX family is built on a 40 nm low-power process and provides hard PCIe Gen2 and hard memory controller IP for streamlined system integration. The -C2 speed grade balances timing margin and Fmax, while the X-suffix denotes lead-free and RoHS-compliant package construction.
Typical applications include high-speed serial bridging, 10G/40G Ethernet line cards, telecom backhaul equipment, ASIC prototyping, high-performance DSP co-processing, and military/aerospace signal processing. The 780-ball H-BGA package supports the dense I/O and high transceiver count required by these systems, and is compatible with standard BGA assembly processes and lead-free reflow profiles.
When designing with this device, pay close attention to PCB escape routing for the H-BGA, transceiver channel loss budgeting, and decoupling strategy for the multiple supply rails (VCC, VCCA, VCCD_PLL, VCCH_GXB). Quartus II design software (or the appropriate Intel/Altera toolchain) is required for synthesis, place-and-route, and timing closure. Engineers should consult the Stratix IV GX handbook for transceiver reference designs and pin connection guidelines.
드롭인 대체품: EP4SGX360FH29C2XN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360FH29C2XN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Adaptive Logic Modules (ALMs), Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX360FH29C2X
✅ 드롭인✓ 재고 있음
$3050 / 개
데이터시트 보기 →EP4SGX360FF35I4N
✅ 드롭인✓ 재고 있음
$1245 / 개
데이터시트 보기 →EP4SGX360FF35I4
✅ 드롭인✓ 재고 있음
$1019.4 / 개
데이터시트 보기 →EP4SGX360FF35C4N
✅ 드롭인✓ 재고 있음
$3550 / 개
데이터시트 보기 →EP4SGX360FF35C2XN
✅ 드롭인✓ 재고 있음
$2600 / 개
데이터시트 보기 →EP4SGX360FH29C2XN 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Series | EP4SGX |
| Logic Elements | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| Embedded Memory (bits) | 23,105,536 |
| Maximum User I/Os | 289 |
| Number of Terminals | 780 |
| Package Type | 780-ball FCBGA (H-BGA) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Temperature Grade | Commercial C2 (0C to +85C) |
| Speed Grade | C2 |
| RoHS 상태 | Compliant |
| Lead-Free (X suffix) | Yes |
| Configuration | Field Programmable Gate Array |
EP4SGX360FH29C2XN 780-ball fcbga (h-bga) 핀 구성 가이드
EP4SGX360FH29C2XN(780-ball fcbga (h-bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360FH29C2XN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX360FH29C2XN 적합 용도: 6 애플리케이션s: 10G/40G Ethernet Line Card, Telecom Backhaul Equipment, ASIC Prototyping, High-Performance DSP Co-Processing, Military/Aerospace Signal Processing, High-Speed Serial Bridging.
10G/40G Ethernet Line Card
The EP4SGX360FH29C2XN fits 10G/40G Ethernet line card designs through its integrated multi-gigabit transceivers (MGTs) supporting serial rates up to 8.5 Gbps, enabling 10G XAUI or KR backplane connectivity. Its 353,600 logic elements provide ample resources for MAC, PCS, and traffic-management functions, while 23,105,536 bits of embedded memory (M20K blocks) handle packet buffering at line rate. The 780-ball H-BGA package supports the high pin density required for multiple SFP+ cages and QSFP+ connectors on a typical line card. Compared with discrete ASSP designs, this Stratix IV GX consolidates PHY, MAC, and forwarding logic on a single FPGA, simplifying board layout and BOM. Designers should budget transceiver channel loss to stay within the 8.5 Gbps specification, and use Intel's reference designs for PMA-layer adaptation.
추천
Telecom Backhaul Equipment
In telecom backhaul applications, the EP4SGX360FH29C2XN delivers the logic capacity and serial bandwidth required for CPRI, OBSAI, and Ethernet backhaul aggregation nodes. The 353,600 logic elements handle MAC-level packet processing and Quality-of-Service logic, while the integrated MGTs support the CPRI line rates used between baseband units and remote radio heads. The 289 user I/Os support multiple SFP+ transceivers and control-plane interfaces (I2C, SPI, GPIO) in a typical backhaul aggregation card. The 0.9 V core on the 40 nm process keeps total FPGA power within the thermal envelope of standard telecom chassis. Quartus II synthesis tools include IP cores for CPRI mapping and 10G Ethernet MAC that simplify firmware development for backhaul designs.
추천
ASIC Prototyping
The EP4SGX360FH29C2XN is widely used for ASIC prototyping because its 353,600 logic elements, abundant block RAM, and high I/O count can emulate complex system-on-chip designs before tape-out. The 23 Mbits of embedded memory map well to on-chip SRAM blocks of typical ASICs, while the 289 user I/Os support bring-up of peripheral interfaces (DDR, Ethernet, USB, PCIe). With FPGAs of the same family available in different densities (110K to 530K LE), multiple Stratix IV GX devices can be wired together via SERDES or board-level interconnect for multi-FPGA prototyping of large ASICs. The C2 commercial speed grade and standard JTAG configuration interface simplify bring-up lab setups. Quartus II Design and Synthesis tools provide ASIC-style RTL support, easing migration from prototype to production silicon.
추천
High-Performance DSP Co-Processing
The EP4SGX360FH29C2XN supports high-performance DSP co-processing through its embedded DSP blocks, which can implement fixed-point and floating-point arithmetic pipelines at hundreds of MHz. Typical applications include radar signal processing, software-defined radio baseband, and medical imaging front-end processing. The 353,600 logic elements host control and glue logic, while the DSP blocks handle FIR filters, FFT butterfly computations, and matrix operations offloaded from a host CPU. The integrated transceivers enable high-speed ADC-to-FPGA and FPGA-to-DAC links, supporting real-time signal processing at sample rates above 1 GSPS. Quartus II provides DSP Builder blocks that translate MATLAB/Simulink designs directly to FPGA fabric, accelerating algorithm development for DSP applications.
추천
Military/Aerospace Signal Processing
The EP4SGX360FH29C2XN is suitable for military and aerospace signal processing platforms requiring high logic density and multi-gigabit serial links for sensor aggregation. Its 40 nm low-power process and 0.9 V core reduce total power consumption, an important factor in size/weight/power (SWaP)-constrained platforms. The 780-ball H-BGA package supports ruggedized board assembly processes used in aerospace applications. The integrated transceivers aggregate high-speed data from radar antennas, electronic warfare receivers, and satellite communication payloads. While the C2 commercial speed grade is specified here, the broader Stratix IV GX family offers industrial and military temperature grades (e.g., EP4SGX360FF35I4N) for harsher environments. Radiation-tolerant screening typically requires additional part-level qualification beyond standard FPGAs.
추천
High-Speed Serial Bridging
The EP4SGX360FH29C2XN is well suited for high-speed serial bridging applications where multiple serial protocols must be aggregated, converted, or rate-matched on a single board. The integrated MGTs support protocols including PCIe Gen1/Gen2, XAUI, Serial RapidIO, and 10G Ethernet KR, enabling the FPGA to act as a multi-protocol bridge between incompatible ASICs, FPGAs, or ASSPs. The 353,600 logic elements implement protocol stacks and state machines, while the 23 Mbits of embedded memory buffer packets between domains. Compared with discrete ASSP bridges, this FPGA-based approach offers reconfiguration flexibility for evolving protocol requirements. Designers typically use Intel's transceiver toolkit to characterize signal integrity across the MGT channels and validate eye-mask compliance at 8.5 Gbps.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX360FH29C2XN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX360FH29C2X | EP4SGX360FF35I4N | EP4SGX360FF35I4 | EP4SGX360FF35C4N | EP4SGX360FF35C2XN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball H-BGA (FH29) | 780-ball H-BGA (FH29) | 1517 FBGA (FF35) | 1517 FBGA (FF35) | 1517 FBGA (FF35) | 1517 FBGA (FF35) |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| LABs | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| Maximum User I/Os | 289 | 289 | 640 | 640 | 640 | 640 |
| Temperature Grade | Commercial C2 (0C to +85C) | Commercial C2 | Industrial I4 (-40C to +100C) | Industrial I4 (-40C to +100C) | Commercial C4 | Commercial C2 |
| Speed Grade | C2 | C2 | I4 | I4 | C4 | C2 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
주요 차별점
- True pin-compatible 780-ball H-BGA drop-in alternative (vs EP4SGX360FH29C2X)
- Higher logic density with smaller footprint than FF35 package (vs EP4SGX360FF35I4N)
- Integrated multi-gigabit transceivers up to 8.5 Gbps (vs EP4SGX290NF45I4N)
- Commercial C2 speed grade with lead-free (X) packaging (vs EP4SGX360FF35C4N)
설계 노트
The 780-ball H-BGA package requires careful PCB escape routing to avoid signal-integrity loss. Use micro-via (laser-drilled) or via-in-pad designs for the inner rows of balls; follow-on balls should be routed on inner layers with reference plane continuity. Implement a high-density interconnect (HDI) stack-up with 1-2-1 or 2-2-2 via structures. Confirm land-pattern dimensions against the Intel H-BGA package drawing before fabrication.
Stratix IV GX devices require multiple supply rails: VCC (core), VCCA (PLL analog), VCCD_PLL (PLL digital), VCCH_GXB (transceiver), VCCPT (programming), and VCCIO (I/O). Decouple each rail with a combination of bulk, mid-frequency, and high-frequency ceramic capacitors placed as close to the package as possible. Follow the Stratix IV GX Hardware Reference Manual decoupling recommendations for capacitor values and placement topology.
Route high-speed transceiver (GXB) channels with controlled 100-ohm differential impedance and matched trace lengths within the pair (intra-pair skew < 1 ps). Keep GXB channels away from noisy digital signals, and maintain a continuous reference plane beneath them. Use the Intel/Altera transceiver toolkit to validate channel loss at the target data rate before tape-out.
Estimated: at high utilization with all transceivers active, the EP4SGX360FH29C2XN can dissipate 10-15 W. The H-BGA package has a typical theta_JA around 8-12 C/W with sufficient PCB copper area, producing junction temperature rises of 80-180 C above ambient. Provide adequate airflow or a heatsink attachment and monitor junction temperature with the on-die temperature-sensing diode.
Do not confuse the Stratix IV GX family (EP4SGX, with transceivers) with the Stratix IV E family (EP4SE, logic-only) - they have different feature sets despite similar naming. Also avoid mixing up the temperature and speed grades in the suffix (e.g., C2 = commercial speed 2 vs I4 = industrial speed 4); each combination requires its own specific datasheet parameters for timing and thermal analysis.
규정 준수 정보
RoHS compliant and lead-free per the X suffix on the part number. Not AEC-Q100 qualified (FPGAs in this density are not typically qualified for automotive). Halogen-free status not confirmed in verified web data. Conflict minerals compliance follows Intel's standard program.
