EP4SGX360FH29C3 - Stratix IV GX FPGA 353K LE | Intel
부품 번호: EP4SGX360FH29C3 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1500 | $750,000.00 |
| 1,000 | $1395 | $1,395,000.00 |
EP4SGX360FH29C3 개요
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, interconnects, and I/O cells that designers configure after manufacturing. FPGAs occupy the middle ground between fixed-function ASICs (Application-Specific Integrated Circuits) and general-purpose processors: unlike ASICs they can be re-programmed in the field, but unlike CPUs they execute deterministic parallel logic at hardware speeds. The Stratix IV family specifically targets high-end signal processing and serial connectivity applications where transceivers, DSP throughput, and logic density are simultaneously required.
Key features include 22.4 Mbits of embedded memory (M9K + M144K blocks), up to 1,040 embedded 18x18 multipliers for DSP, dedicated PCIe Gen1/Gen2 hard IP blocks, and high-speed serial transceivers supporting multi-gigabit rates. The 0.9 V core voltage with hot-socketing and power-on-reset support simplifies board bring-up, while the transceiver block delivers protocol support for CPRI, OBSAI, Serial RapidIO, PCI Express, and Gigabit Ethernet.
The EP4SGX360FH29C3 uses a fully buffered interconnect architecture with 8- or 10-input adaptive LUTs (ALMs) and per-LE configuration memory built on a 6-transistor SRAM cell. Fractional synthesis PLLs and 36 x 36 multiplier blocks feed hard-core DSP pipelines, while dedicated hard memory controllers interface to DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM II, and other external memory standards with on-die termination and read/write leveling.
Typical applications include 40G/100G optical line-card packet processing, basestation baseband processing, ASIC prototyping, high-end broadcast video processing, and high-performance computing accelerators. The 780-pin FCBGA footprint is shared across much of the Stratix IV GX family, simplifying PCB layout reuse across density grades.
When designing, pay close attention to transceiver reference-clock jitter and power-rail sequencing; the 0.9 V core requires multiple regulated rails generated by a compatible power supply such as the LTM4677 or ISL8215M. Decoupling, PCB stack-up, and thermal management are critical at this density - refer to the Stratix IV GX device handbook.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the same Stratix IV GX family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP4SGX360FH29C3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360FH29C3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, RoHS Status, Speed Grade, Adaptive Logic Modules (ALMs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX360FH29I3N
✅ 드롭인✓ 재고 있음
$1950 / 개
데이터시트 보기 →EP4SGX360FH29C4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3225 / 개
데이터시트 보기 →EP4SGX360FH29C2XN
✅ 드롭인✓ 재고 있음
$2210 / 개
데이터시트 보기 →EP4SGX360FH29C2X
✅ 드롭인✓ 재고 있음
$3050 / 개
데이터시트 보기 →EP4SGX360FH29I3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP4SGX360FH29C3 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Adaptive Logic Modules (ALMs) | 14144 LABs |
| Maximum User I/Os | 289 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm CMOS |
| 패키지 | 780-FCBGA (HBGA-780), 33 x 33 mm |
| Embedded Memory | 22.4 Mbits (M9K + M144K blocks) |
| Embedded 18x18 Multipliers | Up to 1,040 |
| Transceivers | Multi-gigabit serial transceivers (per device variant) |
| Memory Standards Supported | DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM II |
| Hard IP Blocks | PCIe Gen1/Gen2, CPRI, OBSAI, Serial RapidIO |
| 동작 온도 | Commercial (0C to +85C) |
| Speed Grade | C3 |
| 실장 유형 | Surface Mount (BGA) |
EP4SGX360FH29C3 780-fcbga (hbga-780), 33 x 33 mm 핀 구성 가이드
EP4SGX360FH29C3(780-fcbga (hbga-780), 33 x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360FH29C3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX360FH29C3 적합 용도: 6 애플리케이션s: 40G/100G Optical Line-Card Packet Processing, Wireless Baseband Processing (CPRI / OBSAI), ASIC Prototyping and Emulation, High-End Broadcast Video Processing, High-Performance Computing Accelerator, Industrial Test and Measurement Equipment.
40G/100G Optical Line-Card Packet Processing
The EP4SGX360FH29C3 fits 40G and 100G optical line cards because its 353,600 logic elements and multi-gigabit transceivers can process multiple 10G lanes in parallel for packet classification, policing, and queuing. The hard PCIe Gen2 and Interlaken IP blocks reduce soft-logic overhead, while 22.4 Mbits of embedded memory buffer line-rate traffic without spilling to external SRAM. Designers typically instantiate one EP4SGX360FH29C3 per line-card slot and feed it from CFP/CFP2 optical modules, achieving deterministic wire-speed forwarding that a CPU-based system cannot match.
추천
Wireless Baseband Processing (CPRI / OBSAI)
The EP4SGX360FH29C3 is well matched to LTE and WCDMA baseband units because its hard CPRI and OBSAI IP blocks carry fronthaul from the radio unit to the baseband card, while up to 1,040 embedded 18x18 multipliers accelerate FFT/iFFT, channel estimation, and turbo decoding. The 0.9 V core and 40 nm process keep dynamic power manageable across dense MIMO configurations. A typical RRH-to-BBU link uses four EP4SGX360FH29C3 devices operating at CPRI option 5/6/7 line rates.
추천
ASIC Prototyping and Emulation
The EP4SGX360FH29C3 serves as an ASIC prototyping vehicle because 353,600 logic elements can map large ASIC RTL partitions while preserving timing accuracy with adaptive logic modules. The 780-pin FCBGA footprint exposes hundreds of user I/Os and high-speed serial links, so prototype boards can wire multiple EP4SGX360FH29C3 devices in a multi-FPGA mesh via low-voltage serial transceivers. Designers favor it for early software development and gate-level verification before committing to 28 nm or 16 nm ASIC tape-out.
추천
High-End Broadcast Video Processing
The EP4SGX360FH29C3 handles broadcast video workloads because the 1,040 18x18 multipliers accelerate JPEG2000 and H.264 motion-estimation kernels, while embedded M9K/M144K memory blocks line-buffer HD-SDI and 3G-SDI streams. The 289 user I/Os drive parallel display interfaces and HDMI/SDI serialization channels without external bus multiplexing. Studios deploy EP4SGX360FH29C3 in production video switchers, format converters, and real-time color-correction frames.
추천
High-Performance Computing Accelerator
The EP4SGX360FH29C3 accelerates HPC workloads such as financial Monte Carlo simulation, genome alignment, and oil-and-gas seismic processing because its parallel fabric runs orders of magnitude faster than a general-purpose CPU on data-parallel kernels. The 22.4 Mbits of on-die memory keeps working sets resident, while PCIe Gen2 hard IP plugs directly into a host server backplane. A single server fitted with four EP4SGX360FH29C3 cards can deliver GFLOP-scale coprocessing at much lower power than GPU equivalents for some algorithmic classes.
추천
Industrial Test and Measurement Equipment
The EP4SGX360FH29C3 is used in ATE and bench instruments because its high logic density can host multiple test channels in parallel, while the multi-gigabit transceivers aggregate high-speed serial data from digitizers and pattern generators. The 0.9 V core and proven 40 nm process deliver stable thermal behavior over long calibration intervals. Manufacturers of oscilloscopes, BERTs, and protocol analyzers value the EP4SGX360FH29C3 as a long-lifecycle FPGA still in production in 2026.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX360FH29C3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX360FH29I3N | EP4SGX360FH29C4 | EP4SGX360FH29C2XN | EP4SGX360FH29C2X | EP4SGX360FH29I3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA (33x33 mm) | 780-FCBGA (33x33 mm) - same | 780-FCBGA (33x33 mm) - same | 780-FCBGA (33x33 mm) - same | 780-FCBGA (33x33 mm) - same | 780-FCBGA (33x33 mm) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Speed Grade | C3 (commercial) | I3 (industrial) | C4 (commercial, faster) | C2 (commercial, slower) | C2 (commercial, slower) | I3 (industrial) |
| Temperature Range | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C |
| Lead-Free (RoHS) | Yes | Yes | Yes | Yes | Yes | Yes |
| Embedded Memory | 22.4 Mbits | 22.4 Mbits | 22.4 Mbits | 22.4 Mbits | 22.4 Mbits | 22.4 Mbits |
| 18x18 Multipliers | Up to 1,040 | Up to 1,040 | Up to 1,040 | Up to 1,040 | Up to 1,040 | Up to 1,040 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
주요 차별점
- High density at 353,600 logic elements with multi-gigabit transceivers (vs EP4SGX230KF40C2X)
- Commercial speed grade C3 vs industrial I3N (vs EP4SGX360FH29I3N)
- C3 timing margin vs faster C4 (vs EP4SGX360FH29C4)
설계 노트
The EP4SGX360FH29C3 requires multiple regulated rails: 0.9 V core (VCC), 1.1 V VCCR for transceiver PMA, 1.1 V VCCT for transceiver PCG, 2.5 V VCCPGM/VCCPD for configuration, and 1.5 V-3.3 V VCCIO banks. Use a sequencing controller such as the Intel EM2120/LTC2922 or a TI UCD90120A to enforce the required 0.9 V core first/last sequencing rule. Estimated: with all rails loaded at typical Stratix IV GX 360K LE static and dynamic conditions, total board power can reach 18-25 W depending on toggle rate and transceiver utilization.
In a 780-FCBGA package, theta_JA is approximately 6-9 C/W with adequate forced airflow and top-side heat sink; without airflow and only bottom-side PCB copper, theta_JA rises above 14 C/W. Estimated: at 22 W total dissipation in still air, junction temperature rise is roughly 22 W x 14 C/W = 308 C, which exceeds the 125 C commercial maximum - a heat sink with thermal interface material or at least 200 LFM airflow is required for any realistic design using this device.
Use a high-layer-count stack-up (12+ layers) with a dedicated ground plane beneath the BGA. Each VCC decoupling capacitor should be placed within 100 mils of its BGA ball via microvias, and 1-10 uF MLCCs should be paired between each rail and ground. Differential transceiver pairs require 100-ohm controlled impedance, length matching within 5 mils, and AC-coupling capacitors placed near the FPGA receive pins.
Do not use pull-ups on configuration pins MSEL[3:0] without consulting the Stratix IV GX configuration handbook: each MSEL setting selects a configuration scheme (AS, AP, FPP, PS) and changing it changes the POR sequence. Also avoid driving JTAG pins TMS and TCK before VCC is stable or you risk latching the FPGA into an undefined state. Lastly, do not apply transceiver data input before VCCR and VCCT are fully ramped; otherwise the PMA may enter a latch-up condition.
규정 준수 정보
RoHS and REACH compliant per Intel Programmable Solutions Group material declaration. AEC-Q100 not applicable - this is a commercial-grade FPGA; for automotive choose the automotive-qualified Arria 10 or Cyclone V family instead.
