EP4SGX360HF35C4 - Stratix IV GX FPGA, 353.6K LE, 564 I/O | Intel
부품 번호: EP4SGX360HF35C4 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2450 | $2,450.00 |
| 10 | $2350 | $23,500.00 |
| 100 | $2200 | $220,000.00 |
| 500 | $2050 | $1,025,000.00 |
| 1,000 | $1900 | $1,900,000.00 |
EP4SGX360HF35C4 개요
A Field Programmable Gate Array is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that can be re-programmed after manufacturing to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven processors: they offer hardware parallelism and deterministic timing without the NRE cost of an ASIC, while providing far more flexibility than a microcontroller. Within the broader programmable logic family, FPGAs > CPLD > programmable logic devices > digital ICs > semiconductors, and the Stratix IV series specifically targets high-performance, transceiver-rich applications such as wireline communications, broadcast video, and high-end test equipment.
Key features of the EP4SGX360HF35C4 include eight dedicated phase-locked loops (PLLs) for clock management, embedded transceiver blocks capable of multi-gigabit-per-second serial I/O, 564 general-purpose user I/Os supporting single-ended and differential signaling standards, and on-chip memory with parity support. The 'HF35C4' suffix decodes as follows: HF = 1152-pin FC-FBGA, F35 = 35 mm × 35 mm package body, C = commercial temperature grade (0 °C to +85 °C), and 4 = speed grade 4. The flip-chip BGA package exposes a large die-to-board thermal path, enabling sustained high utilization without external heatsinking in properly designed boards.
Architecturally, Stratix IV GX devices combine an adaptive logic module (ALM) fabric, MLAB memory blocks, M9K and M144K RAM blocks, hard DSP blocks with 18 × 18 multipliers and accumulators, and dedicated physical coding sublayer (PCS) and physical medium attachment (PMA) blocks for the transceivers. This heterogeneous hard-IP approach is what differentiates Stratix IV GX from softer FPGA fabrics: a designer can implement multi-gigabit serial channels, complex DSP pipelines, and wide data-path processing in a single device.
Typical applications include wireline backplane and line-card aggregation, high-end ASIC prototyping and emulation, broadcast video processing and format conversion, radar and software-defined radio (SDR) baseband, medical imaging acceleration, and high-performance computing co-processors. The combination of dense logic, abundant transceivers, and substantial embedded memory makes the EP4SGX360HF35C4 well-suited to data-plane designs where deterministic throughput is critical.
When designing with the EP4SGX360HF35C4, observe Intel's pinout guidelines for FC-BGA packages: use the full recommended BGA breakaway pattern, follow via-in-pad or dog-bone fan-out rules specified in the device handbook, and provide at least four PCB layers with continuous ground and power planes beneath the device. For power, decouple each PLL and transceiver supply pin with low-ESR ceramic capacitors placed as close as possible to the balls. Operating the device outside the commercial 0 °C to +85 °C range requires the 'I' temperature grade variant.
This page synthesizes current distributor pricing, drop-in pin-compatible Stratix IV alternatives, and practical PCB and thermal design notes not collated in the manufacturer handbook.
드롭인 대체품: EP4SGX360HF35C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360HF35C4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Transceivers, Family, Mounting Type, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX360HF35C3
✅ 드롭인✓ 재고 있음
$6850 / 개
데이터시트 보기 →EP4SGX360HF35C2
✅ 드롭인✓ 재고 있음
$9750 / 개
데이터시트 보기 →EP4SGX360HF35C4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3700 / 개
데이터시트 보기 →EP4SGX360FF35C4
✅ 드롭인✓ 재고 있음
$5189.41 / 개
데이터시트 보기 →EP4SGX360FH29C4
✅ 드롭인✓ 재고 있음
$3225 / 개
데이터시트 보기 →EP4SGX360FF35I4
✅ 드롭인✓ 재고 있음
$1019.4 / 개
데이터시트 보기 →EP4SGX290NF45I4N
✅ 드롭인✓ 재고 있음
$2095 / 개
데이터시트 보기 →EP4SGX360HF35C4 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| Adaptive Logic Modules (ALMs) | 141,440 |
| User I/Os | 564 |
| Total Embedded Memory | 23,105,536 bits |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| PLLs | 8 (4 enhanced + 4 fast PLLs) |
| 패키지 | 1152-ball FC-FBGA, 35 mm × 35 mm |
| Temperature Grade | Commercial (0 °C to +85 °C) |
| Speed Grade | 4 |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP4SGX360HF35C4 1152-ball fc-fbga, 35 mm × 35 mm 핀 구성 가이드
EP4SGX360HF35C4(1152-ball fc-fbga, 35 mm × 35 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360HF35C4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX360HF35C4 적합 용도: 7 애플리케이션s: Wireline Backplane and Line-Card Aggregation, ASIC Prototyping and Emulation, Broadcast Video Processing and Format Conversion, Radar and Software-Defined Radio Baseband, Medical Imaging Acceleration, High-Performance Computing Co-Processors, Test and Measurement Instrumentation.
Wireline Backplane and Line-Card Aggregation
The EP4SGX360HF35C4 fits wireline aggregation line cards because its 353,600 logic elements and 23,105,536 bits of embedded memory can implement multi-gigabit serial protocol pipelines, packet classification tables, and traffic-shaping dataplanes in parallel. The dedicated multi-gigabit transceiver (PMA/PCS) blocks handle 6.375 Gbps CPRI/OBSAI or 6.25 Gbps Interlaken channels directly without external PHYs, reducing board area and BOM cost. Designers typically partition the device into transmit-side framers, receive-side deframers, and a fabric-interface block, with the 564 user I/Os carrying the parallel backplane to the switch ASIC. Compared with ASIC implementations, this approach reduces NRE to zero and allows late-bound feature changes. Throughput scales linearly with logic utilization up to roughly 70% before timing closure becomes the bottleneck.
추천
ASIC Prototyping and Emulation
The EP4SGX360HF35C4 is widely used for ASIC and ASSP prototyping because its 14,144 LABs and 564 user I/Os can be partitioned into multiple FPGA regions and stitched together with TDM-based pin multiplexing. Each device emulates roughly 3-5 million ASIC gates at typical 70% utilization, making a multi-FPGA farm practical for SoCs up to 20-30 million gates. The 40 nm process delivers deterministic timing under multi-clock domain emulation, while the eight PLLs supply the many clock phases required by ASIC designs. Engineers map ASIC clocks to dedicated PLL outputs, isolate each block in its own partition, and use Quartus II incremental compilation to maintain timing closure across design revisions.
추천
Broadcast Video Processing and Format Conversion
Broadcast studios deploy the EP4SGX360HF35C4 for real-time up/down/cross-conversion, color-space conversion, and frame-rate conversion between SD-SDI, HD-SDI, 3G-SDI, and emerging 4K/UHD formats. The hard DSP blocks implement polyphase filters and motion-adaptive deinterlacing with throughput that software on general-purpose CPUs cannot match. The 564 user I/Os interface to multiple SDI receiver PHYs and HDMI/DVI transmitters simultaneously, while 23 Mbits of embedded memory provide the line and frame buffers required for telecine and pull-down correction. Engineers typically pair each FPGA with external video serializer/deserializer (SerDes) PHYs and configure the FPGA I/O voltage to 1.5 V or 1.8 V HSTL for SDI compliance.
추천
Radar and Software-Defined Radio Baseband
In radar and SDR baseband designs, the EP4SGX360HF35C4's combination of high logic density, dedicated DSP blocks with 18 × 18 multipliers, and multi-gigabit transceivers makes it a strong fit for digital down-conversion, pulse compression, and adaptive beamforming. A single device typically handles 4-8 simultaneous receive channels with 100 MHz instantaneous bandwidth each, with the embedded memory providing enough buffering for FFT windows and overlap-save processing. The transceivers connect directly to ADC/DAC JESD204B interface SERDES, eliminating external clock-data-recovery parts. Designers map baseband DSP chains directly onto hard DSP blocks to free fabric resources for control and network interfaces.
추천
Medical Imaging Acceleration
The EP4SGX360HF35C4 accelerates medical imaging algorithms such as CT back-projection, MRI FFT pipelines, and ultrasound beamforming in CT, MRI, and ultrasound systems. Its parallel fabric can reconstruct CT slices roughly 10-50× faster than general-purpose CPU implementations, enabling real-time 3D rendering during scans. The 23 Mbits of embedded memory hold projection and reconstructed voxel data on-chip, avoiding external DDR bottlenecks for the inner reconstruction loops. Designers use the transceivers to ingest raw RF data from analog front-end ASICs at multi-gigabit rates, then apply filter kernels on hard DSP blocks. AEC-Q100 qualification is not provided on this commercial variant, so medical designs typically stay in controlled clinical environments.
추천
High-Performance Computing Co-Processors
The EP4SGX360HF35C4 is deployed as an FPGA co-processor in high-performance computing nodes, accelerating genomics, financial Monte Carlo simulation, and compression workloads. Each device pairs tightly with a host CPU over PCIe (using the hard PCIe IP) and acts as an offload engine for embarrassingly parallel kernels. Throughput gains typically range from 5× to 40× over CPU-only implementations, depending on the kernel's memory-access pattern and vector width. The 564 user I/Os support multiple DDR3/QDR-II+ memory controllers in parallel, delivering aggregate memory bandwidth above 25 GB/s. Designers use OpenCL or Intel's FPGA SDK for OpenCL to port CPU code without RTL design.
추천
Test and Measurement Instrumentation
Test and measurement equipment including high-end oscilloscopes, logic analyzers, and protocol analyzers benefit from the EP4SGX360HF35C4's high logic density, abundant transceivers, and large user I/O count. The device can simultaneously trigger on hundreds of digital channels at sample rates exceeding 1 GS/s while compressing, timestamping, and streaming data to host software through PCIe or 10 Gigabit Ethernet. The embedded memory serves as deep acquisition buffers, and the dedicated PLL blocks generate precise multi-phase clocks for the ADC and DAC front-end array. Compared with discrete ASIC implementations, this approach allows vendors to release new protocol decode options as firmware updates without spinning new hardware.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX360HF35C4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX360HF35C3 | EP4SGX360HF35C2 | EP4SGX360HF35C4N | EP4SGX360FF35C4 | EP4SGX360FH29C4 | EP4SGX360FF35I4 | EP4SGX290NF45I4N |
|---|---|---|---|---|---|---|---|---|
| Package | FC-FBGA-1152 (35 mm × 35 mm) | FC-FBGA-1152 (35 mm × 35 mm) - same | FC-FBGA-1152 (35 mm × 35 mm) - same | FC-FBGA-1152 (35 mm × 35 mm) - same | FC-FBGA-1152 (35 mm × 35 mm) - same | FC-FBGA-1152 (29 mm × 29 mm) - smaller body | FC-FBGA-1152 (35 mm × 35 mm) - same | FC-FBGA-1932 (45 mm × 45 mm) - larger |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 290,000 (-18%) |
| Speed Grade | 4 | 3 (slower) | 2 (slowest) | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 4 (same) |
| Temperature Grade | Commercial (0 °C to +85 °C) | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (0 °C to +100 °C) | Industrial (0 °C to +100 °C) |
| User I/Os | 564 | 564 | 564 | 564 | 564 | 564 | 564 | 560 |
| Embedded Memory | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 17,248,768 bits |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
주요 차별점
- Highest logic density in the Stratix IV GX family (vs EP4SGX290NF45I4N)
- Faster speed grade available within same footprint (vs EP4SGX360HF35C3)
- Commercial temperature grade with industrial upgrade path (vs EP4SGX360FF35I4)
설계 노트
Estimated: A 1152-ball flip-chip BGA at 1.0 mm ball pitch requires via-in-pad (VIPPO) or microvia fan-out for reliable manufacturing. Per the Stratix IV GX Device Handbook, recommended PCB stackup is a minimum 4-2-4 (signal-GND-power-signal) build-up using FR-4 with low-loss DF of 0.015 or better. Place a continuous GND plane in layer 2 beneath the device to provide a low-impedance return path for the high-speed transceivers and clock nets, and dedicate a power island in layer 3 for the 0.9 V core rail with stitching vias every 2-3 mm.
Estimated: The EP4SGX360HF35C4 typically draws 3-5 A on the 0.9 V VCC core rail at moderate logic utilization, with peaks up to 8 A during transceiver-heavy operation. Designers should select a multi-phase buck controller such as the LTC3774 or ISL6388 with at least 8 phases and place ceramic decoupling (22 µF + 4.7 µF + 0.1 µF per pin group) within 50 mil of each BGA ball. Each PLL supply pin requires dedicated ferrite-bead filtering, and the transceiver supply (VCCR, VCCT) rails must be isolated from the core rail with their own regulators to prevent crosstalk.
Estimated: Transceiver channels operating at 6.375 Gbps require channel loss below 6 dB at the Nyquist frequency and inter-pair skew below 100 fs. Use Megtron-6 or equivalent low-loss dielectric for the transceiver break-out region, length-match differential pairs to within 5 mil, and avoid 90-degree bends. Series AC-coupling capacitors of 100 nF must be placed close to the transmitter side. The eight PLLs each need an isolated analog supply with ferrite beads; share only the digital ground return with the core logic.
Estimated: At 80% logic utilization with active transceivers, the EP4SGX360HF35C4 dissipates approximately 10-15 W. The FC-FBGA package offers a thermal resistance θJA of approximately 8-10 °C/W with a standard 4-layer JEDEC test board. Designers must provide a thermal pad array on the PCB and recommend attaching a 20×20 mm heatsink with thermal interface material of 1.5 °C/W or better. For closed-enclosure designs, add 200 LFM of forced-air cooling above 8 W dissipation. Always validate with a thermal probe in the worst-case corner during bring-up.
Estimated: Common pitfalls include failing to length-match the JTAG TCK/TMS chain when multiple FPGAs are configured in series, omitting pull-ups on the nCONFIG, nSTATUS, and CONF_DONE pins (10 kΩ to VCCIO), and tying configuration banks to a 1.8 V rail when the JTAG chain needs 2.5 V. Engineers also frequently underestimate the configuration flash capacity needed for partial-reconfiguration bitstreams - select at least a 64 Mbit EPCQ device for this 353,600-LE device. Finally, never hot-swap the EP4SGX360HF35C4 without proper power sequencing; ramp VCCINT before VCCIO per the Stratix IV power-up timing diagram.
규정 준수 정보
RoHS and REACH compliance declared by Intel on the Stratix IV GX product page. AEC-Q100 qualification is not provided on this commercial-grade part. Halogen-free status not explicitly stated in the verified web data; set to 'unknown'.
