EP4SGX360FF35C4 - 353600-cell Stratix IV GX FPGA | Intel
부품 번호: EP4SGX360FF35C4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6908.55 | $6,908.55 |
| 5 | $6632.21 | $33,161.05 |
| 10 | $6354.86 | $63,548.60 |
| 25 | $5941.35 | $148,533.75 |
| 50 | $5527.84 | $276,392.00 |
| 100 | $5189.41 | $518,941.00 |
EP4SGX360FF35C4 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured after manufacturing. Within the programmable-logic taxonomy, an FPGA sits below ASICs and CPLDs in complexity per chip and above them in logic density, and Stratix IV GX specifically targets high-speed serial interface and digital signal processing (DSP) workloads. Embedded transceivers, hard memory controllers, and DSP blocks make this category the workhorse of wireline backplane, broadcast video, and military signal-processing designs.
Key features include eight full-duplex transceiver channels with multi-gigabit data rates, hard PCIe Gen1/Gen2 IP cores, dedicated DSP blocks for fixed- and floating-point math, and Partial Reconfiguration support that allows on-the-fly logic changes without halting the rest of the device. The device supports up to 17 Mbits of internal configuration memory, plus configuration via serial, parallel, and PCI Express interfaces. Its transceiver-rich I/O bank supports backplane speeds typically reserved for custom ASICs.
Typical applications include high-end wireline backplane aggregation, military radar baseband processing, 40G/100G bridge and packet-processor line cards, high-performance test and measurement equipment, and ASIC prototyping where the same Verilog/VHDL code base is later retargeted to a lower-volume custom silicon. The dense fabric also serves medical imaging front-end pre-processing.
When designing with this part, pay close attention to transceiver reference-clock jitter, multi-rail power sequencing (0.9 V core plus transceiver PLLs), and PCB escape routing for the 1152-ball FCBGA. Use the Quartus II design software with the Stratix IV device support installed, and review the pin-out guidelines in the manufacturer device handbook before floorplanning.
드롭인 대체품: EP4SGX360FF35C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360FF35C4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Process Technology, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX360FF35C3
✅ 드롭인✓ 재고 있음
$2285 / 개
데이터시트 보기 →EP4SGX360FF35C3N
✅ 드롭인✓ 재고 있음
$7610 / 개
데이터시트 보기 →EP4SGX360FF35C2X
✅ 드롭인✓ 재고 있음
$3450 / 개
데이터시트 보기 →EP4SGX360FF35C2XN
✅ 드롭인✓ 재고 있음
$2600 / 개
데이터시트 보기 →EP4SGX290NF45I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2095 / 개
데이터시트 보기 →EP4SGX360FF35C4 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements | 353600 |
| Number of LABs/CLBs | 14144 |
| Total RAM Bits | 23105536 |
| Number of I/O | 564 |
| Number of Transceivers | 8 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| 패키지 | 1152-BBGA, FCBGA (flip-chip) |
| 동작 온도 | 0C to +85C (commercial) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| Lead-Free | Yes (per BGA finish) |
| Supplier Device Package | 1152-FBGA |
EP4SGX360FF35C4 1152-fbga 핀 구성 가이드
EP4SGX360FF35C4(1152-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360FF35C4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX360FF35C4 적합 용도: 6 애플리케이션s: 100G/40G Wireline Aggregation Line Card, Military Radar Baseband Signal Processing, ASIC Prototyping and Emulation, High-End Test and Measurement Equipment, Software-Defined Radio Baseband, Broadcast Video Infrastructure.
100G/40G Wireline Aggregation Line Card
The EP4SGX360FF35C4 fits 100G/40G line-card aggregation because its 353600 logic elements and 23105536 bits of embedded RAM can absorb multi-protocol packet-processing pipelines (Ethernet MAC, MPLS, IPsec) while the eight integrated multi-gigabit transceivers run at 6.5 Gbps or higher per channel, sufficient for 4x25G CAUI-4 or 10x10G breakouts. The 564 user I/O support ample chip-to-chip interconnect for lookaside TCAMs and DDR3 buffer memories. Designers place the FPGA between QSFP+ cages and the switch-fabric ASIC, using its hard PCIe Gen2 IP for control-plane uplinks and dedicated DSP blocks for FEC and traffic management at line rate.
추천
Military Radar Baseband Signal Processing
The EP4SGX360FF35C4 suits radar baseband processing because the dense DSP fabric executes FFTs, pulse compression, and MTI filters in real time on multi-GHz sample streams while 23 Mbits of internal RAM hold stage coefficients and overlap-save buffers. Eight multi-gigabit transceivers feed digitized antenna channels directly into the device at up to 6.5 Gbps, eliminating external SERDES. Industrial temperature variants and MIL-STD-810 screening paths are supported within the Stratix IV family. The device meets the deterministic-latency needs of beamforming, and partial reconfiguration lets you swap beam-steering weights without halting the rest of the radar pipeline.
추천
ASIC Prototyping and Emulation
The EP4SGX360FF35C4 works as an ASIC prototyping platform because its 353600 logic elements, 14144 LABs, and rich embedded memory are large enough to map millions of ASIC gates and on-chip bus fabrics. Quartus II synthesis for Stratix IV is mature and well-correlated with ASIC synthesis flows, enabling confident pre-silicon validation. Designers connect multiple FPGAs via the eight on-chip transceivers at multi-gigabit rates to scale prototyping capacity to tens of millions of gates. Partial Reconfiguration supports incremental design bring-up, and the part's commercial pricing is favorable for prototype budget constraints.
추천
High-End Test and Measurement Equipment
The EP4SGX360FF35C4 supports high-end oscilloscopes, BERT testers, and protocol analyzers because the 564 user I/O and 23 Mbit embedded RAM can drive parallel ADC/DAC capture at hundreds of MSps while the eight multi-gigabit transceivers handle serial trigger and remote-data ports. Hard PCIe Gen2 endpoints enable data streaming to a host CPU at 5 Gbps lane rates. Quartus II's SignalTap logic analyzer and the device's large RAM facilitate deep trace capture for protocol analysis. Industrial temperature variants allow deployment in lab, factory, or outdoor test environments where ambient conditions vary.
추천
Software-Defined Radio Baseband
The EP4SGX360FF35C4 suits SDR baseband processing because its DSP blocks run fixed-point and floating-point modulators, demodulators, and channel codecs in real time on multi-MHz LTE, WiMAX, or military waveform bandwidths. Eight multi-gigabit transceivers digitize RF-front-end samples or interface to RFICs. With 353600 LEs available, designers can run multiple concurrent channels within a single device. The 0.9 V core plus dedicated PLL blocks minimize power consumption relative to larger Stratix V devices, which is critical in outdoor base-station deployments.
추천
Broadcast Video Infrastructure
The EP4SGX360FF35C4 is well-suited for broadcast video processing because the 23 Mbit embedded RAM acts as line and frame buffers for 4K/UHD format conversion, color-space translation, and overlay compositing. The eight multi-gigabit transceivers handle 3G-SDI or SMPTE 2022 IP transport, eliminating external SERDES chips. Designers can integrate on-screen displays, frame synchronizers, and standards converters in a single device. The commercial temperature grade suits controlled studio environments, and Quartus II reference designs shorten the development of HDMI/SDI bridge modules.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX360FF35C4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX360FF35C3 | EP4SGX360FF35C3N | EP4SGX360FF35C2X | EP4SGX360FF35C2XN | EP4SGX290NF45I4N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA (FF35 ball-map) | 1152-BBGA, FCBGA (FF35 ball-map) - same | 1152-BBGA, FCBGA (FF35 ball-map) - same | 1152-BBGA, FCBGA (FF35 ball-map) - same | 1152-BBGA, FCBGA (FF35 ball-map) - same | 1152-BBGA, FCBGA (NF45 ball-map) - different footprint |
| Logic Elements | 353600 | 353600 | 353600 | 353600 | 353600 | 291200 (-18%) |
| Embedded RAM (bits) | 23105536 | 23105536 | 23105536 | 23105536 | 23105536 | 17870848 (-23%) |
| Speed Grade | C4 (-4, fastest commercial) | C3 (-3, ~15-20% slower Fmax) | C3 (-3) Pb-free | C2 (-2, slowest) | C2 (-2) Pb-free | I4 (-4 industrial) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial Pb-free | Commercial | Commercial Pb-free | Industrial (-40C to +100C) |
| Number of Transceivers | 8 | 8 | 8 | 8 | 8 | 8 |
주요 차별점
- Largest Stratix IV GX density in the FF35 ball-map (vs EP4SGX290NF45I4N)
- Fastest commercial speed grade in the Stratix IV GX FF35 family (vs EP4SGX360FF35C3)
- Pin-compatible with C2X/C2XN for cost-down in volume production (vs EP4SGX360FF35C2X)
- RoHS compliance via lead-free ball finish (N-suffix variants available) (vs EP4SGX360FF35C3 (non-N))
설계 노트
Estimated: the EP4SGX360FF35C4 requires multi-rail power sequencing (0.9 V core, 1.1 V transceiver analog PLL, 2.5 V/3.0 V I/O, and 1.8 V auxiliary). Use a TI UCD9222 or Linear Tech LTC2974 to enforce monotonic ramp and the proper sequence (core before transceiver PLLs). The Stratix IV handbook recommends at least 1 ms between power-good transitions. Skip the power sequencer only if your power-supply ramp times are below 100 us and trims are pre-tested.
The 1152-ball FCBGA at 1.0 mm pitch requires 6 or 8-layer stack-up with matched impedance for the transceiver lanes (100-ohm differential). Recommended: ISOLA FR408HR or equivalent low-loss dielectric, with microvia-in-pad for inner ball rows. Reference-clock traces must be length-matched within 25 mil, and each MGT lane requires external AC-coupling capacitors placed within 150 mil of the ball. Use controlled-impedance vias (via-in-pad preferred) for the 8 transceiver channels.
Estimated: under full utilization (8 transceivers active at 6.5 Gbps with 80% logic toggle rate), the EP4SGX360FF35C4 dissipates approximately 18-22 W. The 1152-ball FCBGA has a typical theta_JA of 14 C/W with the recommended PCB stack-up, requiring either an active heatsink (forced-air 200 LFM) or a high-performance cold plate. Measure junction temperature via the built-in TSD (temperature-sensing diode) using a MAX31730 or equivalent remote-diode sensor.
Transceiver reference-clock jitter budget directly limits the achievable link margin. Use a high-stability crystal or VCXO with phase noise below -130 dBc/Hz at 100 kHz offset, and route the reference clock on an inner stripline layer with no adjacent high-speed digital nets. Series-terminate the clock buffer output with a 33-ohm resistor for backplane-tolerant impedance. Always validate channel compliance via BERT and eye-mask testing before committing the PCB to volume production.
Do not assume the EP4SGX360FF35C4 is current production - the Stratix IV family was declared end-of-life by Intel. Verify last-time-buy window with authorized distributors and stock your own production needs. Do not use generic 'FPGA' Thermal Interface Material (TIM); the package requires a high-K (>3 W/m-K) gap pad or thermal paste. Finally, do not route 100-mil-wide signals through the BGA break-out area - escape route width should follow the receiver impedance and not exceed 3x the dielectric thickness.
규정 준수 정보
RoHS status and halogen-free flag not directly stated in the Verified Web Data; lead-free indicated by BGA ball finish per Stratix IV family data. Intel/Altera conflict-mineral policy: compliant.
