EP4SGX70DF29C4N - Stratix IV GX 72K Logic Elements FPGA | Intel
부품 번호: EP4SGX70DF29C4N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2400 | $2,400.00 |
| 10 | $2280 | $22,800.00 |
| 100 | $2100 | $210,000.00 |
| 500 | $1920 | $960,000.00 |
| 1,000 | $1750 | $1,750,000.00 |
EP4SGX70DF29C4N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and block RAM. FPGAs sit hierarchically between general-purpose processors (CPUs/MCUs) and ASICs in the computing continuum: they offer ASIC-level parallelism and deterministic latency while remaining reprogrammable. The Stratix IV family is Intel's mid-cycle, 40 nm node high-performance FPGA line, with the GX variant adding multi-gigabit transceivers for protocol bridging and chip-to-chip links.
Key specifications include 2,904 adaptive logic modules (ALMs), 462 DSP blocks configurable as 9-bit through 36-bit full-precision multipliers at up to 600 MHz, and embedded memory blocks (M9K, M144K) that can be combined to build true dual-port RAMs and FIFOs. The device operates at a core voltage of 0.9 V and supports industrial temperature grades with the C4 speed grade. Configuration is supported via JTAG, AS, PS, and FPP modes, with built-in CRC and encryption features.
Typical applications include high-speed serial interface bridging (PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI), wireline telecom backplanes, ASIC prototyping, test and measurement instrumentation, and DSP-intensive signal processing. The integrated transceivers and 372 user I/Os make it suitable for designs that require both high-bandwidth external connectivity and dense parallel processing.
Design considerations: maintain proper power sequencing for the 0.9 V core and auxiliary supplies, and follow Intel's recommended decoupling scheme on all power rails. For PCB layout, controlled-impedance routing is required for all transceiver differential pairs, and the BGA fanout demands a high-layer-count PCB (often 10+ layers) with microvia or via-in-pad technology for the dense ball grid.
드롭인 대체품: EP4SGX70DF29C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX70DF29C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Transceivers, Mounting Type, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX70DF29C3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SGX70DF29C2XN
✅ 드롭인✓ 재고 있음
$2450 / 개
데이터시트 보기 →EP4SGX70DF29C4G
✅ 드롭인✓ 재고 있음
$196.99 / 개
데이터시트 보기 →EP4SGX70DF29C2XG
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP4SGX70DF29C3G
✅ 드롭인✓ 재고 있음
$1425 / 개
데이터시트 보기 →EP4SGX70DF29C4N 최대 정격 & 전기적 특성
| Series | Stratix IV GX |
| Family | Stratix IV |
| Logic Elements | 72,600 |
| Adaptive Logic Modules (ALMs) | 2,904 |
| Logic Array Blocks (CLBs) | 2,904 |
| Maximum User I/O | 372 |
| Total Embedded Memory | 4,134 Kbit (5,648,880 bit) |
| Number of Logic Cells | 72,600 |
| DSP Blocks | 462 |
| DSP Multiplier Modes | 9x9, 12x12, 18x18, 36x36 bit |
| DSP Block Max Frequency | 600 MHz |
| Transceivers | 8 channels (GX) |
| Max Transceiver Data Rate | 3.125 Gbps |
| Process Node | 40 nm |
| Core Voltage | 0.9 V |
| Speed Grade | C4 |
| 패키지 | 780-ball FC-FBGA (29 x 29 mm) |
| 동작 온도 | 0C to +85C (commercial) |
| 실장 유형 | Surface Mount |
| Lead Free | Yes |
| RoHS 상태 | Compliant |
| Configuration Modes | JTAG, AS, PS, FPP |
| Configuration Security | Built-in AES encryption and CRC |
EP4SGX70DF29C4N 핀 구성
| 핀 A1 | I/O — General purpose user I/O / bank-dependent |
| 핀 A2 | I/O — General purpose user I/O / bank-dependent |
| 핀 A3 | VCCIO — I/O supply voltage |
| 핀 A4 | I/O — General purpose user I/O / bank-dependent |
| 핀 A5 | GND — Ground |
| 핀 A6 | I/O — General purpose user I/O / bank-dependent |
| 핀 A7 | VCC — Core supply voltage |
| 핀 A8 | I/O — General purpose user I/O / bank-dependent |
| 핀 A9 | GXB_REFCLK — Transceiver reference clock input |
| 핀 A10 | GXB_TX — Transceiver transmit differential pair |
일반적인 애플리케이션
EP4SGX70DF29C4N 적합 용도: 6 애플리케이션s: High-Speed Serial Interface Bridging, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, Digital Signal Processing and DSP Acceleration, Wireline Telecom Backplane Systems, Industrial Control and High-Speed I/O Aggregation.
High-Speed Serial Interface Bridging
The EP4SGX70DF29C4N excels at protocol bridging between high-speed serial standards, leveraging its 8 integrated multi-gigabit transceivers operating up to 3.125 Gbps per channel. This FPGA bridges PCI Express Gen1/Gen2 to Serial RapidIO, Gigabit Ethernet to XAUI, or custom backplane protocols, eliminating the need for external PHY chips. With 72,600 logic elements and 462 DSP blocks, the device can simultaneously handle protocol translation, packet buffering in its 4,134 Kbit embedded memory, and data-path processing. The 780-ball FC-FBGA package supports the dense transceiver and I/O routing required for multi-protocol line cards in telecom and networking equipment.
추천
ASIC Prototyping and Emulation
The EP4SGX70DF29C4N is widely used for ASIC and SoC prototyping because of its 72,600 logic elements, large embedded memory capacity, and high I/O count of 372 pins. Designers map ASIC RTL into multiple Stratix IV FPGAs using partition-based synthesis, with the high-speed transceivers providing low-latency chip-to-chip interconnect between FPGAs in the emulation farm. The 0.9 V core voltage and 40 nm process deliver a balance of performance and power efficiency for long emulation runs. This application benefits from the device's Quartus II design-flow support, mature synthesis libraries, and extensive IP catalog.
추천
Test and Measurement Instrumentation
In test and measurement equipment such as logic analyzers, protocol analyzers, and signal generators, the EP4SGX70DF29C4N provides the DSP horsepower and I/O flexibility required for real-time signal acquisition and stimulus generation. The 462 DSP blocks operate as 18x18-bit multipliers at up to 600 MHz, enabling high-throughput FFTs, FIR filters, and modulation/demodulation pipelines. Its 372 user I/Os accept wide parallel data buses from high-speed ADCs and DACs, while the transceivers handle serialized trigger and result channels. The 780-ball BGA package supports the high pin density needed for multi-channel instruments.
추천
Digital Signal Processing and DSP Acceleration
The EP4SGX70DF29C4N provides 462 dedicated DSP blocks that can be configured as 9x9, 12x12, 18x18, or 36x36-bit full-precision multipliers operating at up to 600 MHz. This makes the device well-suited for fixed- and floating-point DSP applications including wireless baseband processing, software-defined radio, image processing pipelines, and audio codecs. Designers can also leverage the 4,134 Kbit of embedded memory for coefficient storage and data buffering, eliminating costly external memory accesses. Combined with 72,600 logic elements for control logic and glue logic, the FPGA serves as a single-chip DSP accelerator.
추천
Wireline Telecom Backplane Systems
Telecom backplane line cards require high-speed serial links to interconnect with switching fabrics, and the EP4SGX70DF29C4N delivers this with 8 transceivers supporting CPRI, OBSAI, Serial RapidIO, and standard Ethernet protocols. The 0.9 V core voltage aligns with telecom power-supply architectures, and the industrial temperature range options support central-office deployments. The 780-ball BGA's thermal performance enables reliable operation in airflow-constrained chassis. Combined with hard PCI Express blocks, the device can serve as the main processing FPGA on ATCA or AdvancedTCA line cards.
추천
Industrial Control and High-Speed I/O Aggregation
The EP4SGX70DF29C4N is used in industrial control systems that aggregate large numbers of high-speed sensors, actuators, and fieldbus networks. Its 372 user I/Os handle wide parallel buses from image sensors, motor encoders, and high-speed analog front ends, while the 8 transceivers connect to EtherCAT, PROFINET, or SERCOS III networks. The 462 DSP blocks perform real-time control loop computations at microsecond latencies. The BGA package provides the ruggedness and vibration tolerance required for industrial environments, and the industrial temperature variants support factory-floor operation.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX70DF29C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX70DF29C3N | EP4SGX70DF29C2XN | EP4SGX70DF29C4G | EP4SGX70DF29C2XG | EP4SGX70DF29C3G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (29x29mm) | 780-ball FC-FBGA (29x29mm) - same | 780-ball FC-FBGA (29x29mm) - same | 780-ball FC-FBGA (29x29mm) - same | 780-ball FC-FBGA (29x29mm) - same | 780-ball FC-FBGA (29x29mm) - same |
| Logic Elements | 72,600 | 72,600 | 72,600 | 72,600 | 72,600 | 72,600 |
| Speed Grade | C4 | C3 (-10 to -15% Fmax) | C2 (-20 to -25% Fmax) | C4 (same) | C2 (-20 to -25% Fmax) | C3 (-10 to -15% Fmax) |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 channels, up to 3.125 Gbps | 8 channels, up to 3.125 Gbps | 8 channels, up to 3.125 Gbps | 8 channels, up to 3.125 Gbps | 8 channels, up to 3.125 Gbps |
| DSP Blocks | 462 | 462 | 462 | 462 | 462 | 462 |
| Embedded Memory | 4,134 Kbit | 4,134 Kbit | 4,134 Kbit | 4,134 Kbit | 4,134 Kbit | 4,134 Kbit |
| User I/O Count | 372 | 372 | 372 | 372 | 372 | 372 |
| Approx. Price @ Qty 1 (USD) | 2400 | 2200 | 1900 | 2400 | 1900 | 2200 |
주요 차별점
- Fastest speed grade in the EP4SGX70 family with same package (vs EP4SGX70DF29C3N)
- Same C4 performance with lead-free finish option (vs EP4SGX70DF29C4G)
- Higher Fmax versus C2 speed grade alternatives (vs EP4SGX70DF29C2XN)
- Integrated hardened PCI Express IP block (vs Generic FPGA without hard PCIe)
설계 노트
The EP4SGX70DF29C4N requires multiple supply rails: 0.9 V core (VCC), 0.9 V or 1.0 V analog supply (VCCA_PLL, VCCA_GXB), and per-bank I/O supplies (VCCIO) configurable from 1.2 V to 3.0 V. Intel specifies power-on and power-off sequencing to prevent latch-up. Decoupling requires at least 50 low-ESL ceramic capacitors distributed around the BGA perimeter and beneath the package. Bulk capacitance of 220 uF or more per rail is recommended for transient response under logic switching loads.
The 780-ball FC-FBGA uses 1.0 mm ball pitch, requiring a PCB with at least 10 layers and microvia or via-in-pad technology for full BGA fanout. Transceiver differential pairs must be routed as 100-ohm differential impedance with intra-pair length matching under 150 mil and inter-pair matching per protocol (PCIe requires 5 mil). Reference planes must be continuous under all high-speed signals to maintain 90-ohm single-ended impedance. Intel's pin-out file and Quartus II I/O planning tools should be used before finalizing stackup.
Estimated thermal dissipation at full utilization of all 72,600 logic elements, 462 DSP blocks, and 8 transceivers can reach 8-10 W. The 29 x 29 mm FC-FBGA package has a theta_JA of approximately 12 C/W with a standard 4-layer JEDEC test board. A heatsink or thermal pad with forced airflow is typically required for sustained high utilization; without cooling, junction temperature may exceed 100 C at maximum toggle rate and cause thermal throttling. Intel's Quartus PowerPlay analyzer gives design-specific estimates.
Avoid these common design errors: (1) connecting VCCIO banks to incompatible voltages (LVDS requires specific bank voltages); (2) omitting the transceiver reference clock which is required for GXB operation; (3) failing to program the configuration flash correctly, which can cause MSEL pin strapping errors; (4) routing JTAG signals with stubs or improper length matching; and (5) using Quartus versions newer than 15.1 which removed Stratix IV device support. Quartus II 15.1 is the last release with full Stratix IV compilation support.
규정 준수 정보
Stratix IV devices are RoHS and REACH compliant per Intel product documentation. AEC-Q100 does not apply to FPGAs. Lead-free ball finish is standard on the G suffix variants.
