Intel의 EP4SGX530NF45C4N - Stratix IV GX FPGA, 531K LE, 1932-FCBGA | Intel EP4SGX530NF45C4N - 전자 부품
Intel

EP4SGX530NF45C4N - Stratix IV GX FPGA, 531K LE, 1932-FCBGA | Intel

부품 번호: EP4SGX530NF45C4N ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
0.9 V Vdss FC-FBGA-1932 Package C4 (highest performance) Speed 28033024 bit (28 Mb) Memory
시작가 $3425 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-10
볼륨 가격
수량 단가 합계
1 $4250 $4,250.00
10 $4095 $40,950.00
100 $3880 $388,000.00
500 $3650 $1,825,000.00
1,000 $3425 $3,425,000.00
ℹ️ 모든 가격은 USD 기준입니다
데이터시트 보기 (PDF) 대체품 보기

EP4SGX530NF45C4N 개요

The Intel (formerly Altera) EP4SGX530NF45C4N is a high-density, high-performance Stratix IV GX Field-Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process and housed in a 1932-ball flip-chip BGA (NF45 package). The device integrates 531,200 logic elements, 28,033,024 bits of embedded memory, 21248 LABs/CLBs, 920 user I/Os, and embedded transceivers for high-speed serial connectivity, making it one of the largest members of the Stratix IV GX family.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines configurable logic blocks, programmable interconnect, programmable I/O, and on-chip memory into a single semiconductor. Within the system hierarchy, FPGAs sit between Application-Specific ICs (ASICs) and general-purpose processors, offering ASIC-like performance and parallelism with the re-programmability of software. Stratix IV GX devices extend this model with multi-gigabit transceivers, hard PCIe and memory controller IP blocks, and DSP blocks, so the EP4SGX530NF45C4N is used wherever designers need ASIC-class throughput without paying NRE costs.

Key features of the EP4SGX530NF45C4N include 531,200 logic elements (the highest density option in the Stratix IV GX family), 28 Mb of embedded SRAM, 24 transceivers supporting data rates up to 8.5 Gbps, 920 user I/Os in 24 banks, 1,024 18x18 multipliers for DSP, an 0.9 V core voltage, and hard PCI Express Gen1/Gen2 IP blocks. The -C4 speed grade targets the highest performance corner; the N suffix denotes a lead-free, RoHS-compliant package.

Architecturally, the device uses Altera's adaptive logic module (ALM) which combines 8-input fracturable LUTs with two adders, allowing designs to map to either fine-grained logic or arithmetic-heavy structures. Combined with the hard transceiver PCS/PMA blocks and the TriMatrix memory architecture (MLAB, M9K, M144K blocks), the EP4SGX530NF45C4N supports >1500 GMACS of fixed-point DSP performance at typical operating conditions.

Typical applications include high-end telecommunications line cards (100G/40G OTN, packet processing), ASIC prototyping and emulation, high-performance computing fabrics, military/aerospace signal processing, broadcast video processing, medical imaging systems, and test and measurement equipment. Designers choose this density for system-on-chip emulation or when integrating an entire line-card datapath into a single FPGA.

When designing with the EP4SGX530NF45C4N, careful PCB layout is essential: the FC-FBGA-1932 substrate requires microvia stack-up design, length-matched differential pairs for transceivers, and substantial decoupling (typically 100 nF + 10 µF per VCC/GND pair). The 0.9 V core is sensitive to IR drop; use at least four PCB layers dedicated to power/ground. Designers should plan for Quartus II (legacy) or Quartus Prime design software and a 12-16 week lead time given the part is now NRND.

This page synthesizes distributor inventory, Stratix IV GX family drop-in alternatives, and PCB layout considerations not typically consolidated in the manufacturer datasheet.

드롭인 대체품: EP4SGX530NF45C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX530NF45C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Process Technology, Transceivers.

Intel
Package: 1932-ball FCBGA (NF45) 42.5 x 42.5 mm
Transceivers: 24 multi-gigabit transceivers up to 8.5 Gbps
비교 대상: EP4SGX530NF45C4N →
Altera
Package: 1932-ball FCBGA (NF45, 45 mm, 1.0 mm pitch)
Speed Grade: -2
비교 대상: EP4SGX530NF45C4N →
Intel
Package: 1932-ball FBGA (FCBGA), 45 mm x 45 mm
Transceivers: Multi-gigabit transceivers (up to 12.5 Gbps)
비교 대상: EP4SGX530NF45C4N →
Intel
Package: 1932-ball FC-FBGA (NF45), 42.5 x 42.5 mm
Speed Grade: 3
Operating Temperature: 0C to +85C (Commercial, C3 grade)
비교 대상: EP4SGX530NF45C4N →
Altera
Package: 1932-ball FC-FBGA (NF45)
Process Technology: 40 nm CMOS (TSMC)
비교 대상: EP4SGX530NF45C4N →
Intel
Package: 1932-ball Flip-Chip BGA (FC-FBGA), 42.5 x 42.5 mm
Speed Grade: C4
Operating Temperature: 0 C to +85 C (Commercial)
비교 대상: EP4SGX530NF45C4N →
Intel
Package: 1932-ball FC-FBGA (NF45), 45 mm, 1.0 mm pitch
Speed Grade: I3
Operating Temperature: -40 C to +100 C (Industrial)
비교 대상: EP4SGX530NF45C4N →
Intel
Package: 1932-BBGA, FCBGA
Operating Temperature: -40 °C to 100 °C (industrial)
비교 대상: EP4SGX530NF45C4N →
Intel
Package: 1932-ball FC-FBGA (45 mm)
Speed Grade: I4 (highest performance, industrial)
Operating Temperature: -40C to +100C (industrial)
비교 대상: EP4SGX530NF45C4N →
Intel
Package: FC-FBGA (NF45) - Flip Chip Fine-pitch BGA
Speed Grade: I4
Process Technology: 40 nm CMOS
비교 대상: EP4SGX530NF45C4N →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP4SGX530NF45C4

✅ 드롭인
Intel
📦 FC-FBGA-1932 (NF45)
Stratix IV GX · 531,200 · 21,248 · 28,033,024 (28 Mb) · 920 · 800 MHz · 40 nm CMOS · 0.9 V

✓ 재고 있음

$5434.81 / 개

데이터시트 보기 →

EP4SGX530NF45C3N

✅ 드롭인
Altera
📦 FC-FBGA-1932 (NF45)
Stratix IV GX · 531,200 · 21,248 · 212,480 (per FindIC summary) · 28,033,024 · 920 · 40 nm CMOS (TSMC) · 0.9 V

✓ 재고 있음

$9850 / 개

데이터시트 보기 →

EP4SGX530NF45C2N

✅ 드롭인
Altera
📦 FC-FBGA-1932 (NF45)
Stratix IV GX · 531,200 · 212,480 · 28,033,024 · 920 · 21,248 · 24 · 8.5 Gbps

✓ 재고 있음

$9450 / 개

데이터시트 보기 →

EP4SGX530NF45C3

✅ 드롭인
Intel
📦 FC-FBGA-1932 (NF45)
Stratix IV GX · 531,200 · 21,248 · 21,248 · 27,440 Kbits (28,033,024 bits) · 1,288 (18x18 multipliers) · 920 · TSMC 40 nm

✓ 재고 있음

$3450 / 개

데이터시트 보기 →

EP4SGX530NF45C2

✅ 드롭인
Intel
📦 FC-FBGA-1932 (NF45)
FPGA - Field Programmable Gate Array · Stratix IV GX · 531200 · 21248 · 28033024 (approx 27.4 Mbit) · 1024 · 920 · 21248

✓ 재고 있음

$11650 / 개

데이터시트 보기 →

EP4SGX530NF45C4N 최대 정격 & 전기적 특성

Series Stratix IV GX
Family Stratix IV
Device Logic Elements 531200
Embedded Memory 28033024 bit (28 Mb)
LABs / CLBs 21248
User I/O Count 920
Operating Voltage (Core) 0.9 V
Process Technology 40 nm
Package Type FC-FBGA-1932
Package Code NF45 (1932-ball Flip-Chip BGA)
실장 유형 Surface Mount
Speed Grade C4 (highest performance)
동작 온도 0 C to 85 C (commercial)
RoHS 상태 Compliant (lead-free)
수명 주기 상태 Not Recommended for New Designs (NRND)

EP4SGX530NF45C4N nf45 (1932-ball flip-chip bga) 핀 구성 가이드

EP4SGX530NF45C4N(nf45 (1932-ball flip-chip bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP4SGX530NF45C4N의 nf45 (1932-ball flip-chip bga) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP4SGX530NF45C4N.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP4SGX530NF45C4N 적합 용도: 6 애플리케이션s: 100G Optical Transport Networking (OTN), ASIC Prototyping and Emulation, High-Performance DSP (Radar / Beamforming), Broadcast Video Processing, Medical Imaging (CT / MRI Reconstruction), Test and Measurement Instrumentation.

🌐

100G Optical Transport Networking (OTN)

The EP4SGX530NF45C4N's 531,200 logic elements, 24 multi-gigabit transceivers at up to 8.5 Gbps, and 28 Mb embedded SRAM make it well suited for 100G/40G OTN line cards. Designers typically implement forward-error-correction (FEC) codecs, framing/mapping, and packet processing in the same fabric, eliminating an external ASIC. The 920 user I/Os drive wide external memory buses (DDR3/QDRII+) for deep packet buffering. Compared with an ASIC, the EP4SGX530NF45C4N offers field upgradability to new OTN standards without NRE.

추천

EP4SGX530NF45C4 · Intel EP4SGX360NF45C4N · Intel
🖥️

ASIC Prototyping and Emulation

The EP4SGX530NF45C4N's high logic capacity (531K LEs) and large TriMatrix memory (28 Mb) allow engineers to partition a 5-10 million gate ASIC design across multiple FPGAs for pre-silicon validation. The 920 I/Os, organized in 24 banks with multiple I/O standards (LVDS, HSTL, SSTL), ease bring-up of mixed-signal ASIC pads. Quartus II time-driven closure and the C4 speed grade enable compile at near-ASIC frequencies for cycle-accurate emulation.

추천

EP4SGX530NF45C3N · Altera EP4SGX530KH40C4N · Intel
✈️

High-Performance DSP (Radar / Beamforming)

The EP4SGX530NF45C4N's on-chip 18x18 multipliers and dedicated DSP blocks deliver multi-thousand GMACS DSP throughput, making it a fit for phased-array radar baseband and digital beamforming. Its 28 Mb embedded memory provides sufficient buffering for FFT windows and beam coefficients without external SRAM. The transceivers digitize ADC data streams directly, while 920 I/Os fan out to DACs and synchronization interfaces. Compared with a discrete DSP+FPGA architecture, the EP4SGX530NF45C4N reduces board area and BOM cost.

추천

EP4SE530H35C4N · Intel
📺

Broadcast Video Processing

The EP4SGX530NF45C4N's 28 Mb embedded memory and 920 I/Os support uncompressed 4K/UHD video pipelines (e.g. 4:4:4 at 60 fps), including color-space conversion, scaling, and overlay composition. The transceivers accept SDI (Serial Digital Interface) at 6G/12G rates via external PHYs, and the wide memory bandwidth supports multi-frame buffering on external DDR3. Designers typically use the device for studio routers, frame synchronizers, and contribution encoders.

추천

EP4SGX360NF45C4N · Intel
💊

Medical Imaging (CT / MRI Reconstruction)

The EP4SGX530NF45C4N's high logic density and embedded DSP blocks accelerate back-projection and iterative reconstruction algorithms in CT and MRI systems. The 28 Mb of on-chip SRAM caches projection slices, while external DDR3 (driven via 920 I/Os) holds full sinogram datasets. Hard PCIe Gen2 IP blocks enable direct connection to host CPUs for image data offload. Designers value the C4 speed grade for sub-frame reconstruction latencies required in real-time imaging.

추천

EP4SGX530NF45C4N · Intel
🔧

Test and Measurement Instrumentation

The EP4SGX530NF45C4N's 24 transceivers and 920 I/Os serve as the central processing element of arbitrary waveform generators, protocol analyzers, and digitizers. The high logic count supports deep pattern memory and complex modulation/demodulation schemes, while the hard PCIe block enables streaming to host software at multi-GB/s rates. Compared with discrete logic, the EP4SGX530NF45C4N lets vendors ship upgradeable instrument firmware over a 10+ year product lifespan.

추천

EP4SGX110HF35C4G · Intel

추천 제품 요약

EP4SGX530NF45C4 Intel 사용처: 100G Optical Transport Networking (OTN) EP4SGX360NF45C4N Intel 사용처: 100G Optical Transport Networking (OTN), Broadcast Video Processing EP4SGX530NF45C3N Altera 사용처: ASIC Prototyping and Emulation EP4SGX530KH40C4N Intel 사용처: ASIC Prototyping and Emulation EP4SE530H35C4N Intel 사용처: High-Performance DSP (Radar / Beamforming) EP4SGX530NF45C4N Intel 사용처: Medical Imaging (CT / MRI Reconstruction) EP4SGX110HF35C4G Intel 사용처: Test and Measurement Instrumentation
What is the logic element count of EP4SGX530NF45C4N?
The EP4SGX530NF45C4N contains 531,200 logic elements, the highest density member of the Stratix IV GX family. According to the Intel (Altera) Stratix IV device handbook, this density supports the most aggressive single-chip integration tasks including ASIC prototyping, 100G OTN line cards, and high-performance DSP fabrics. The 21248 LABs and 28 Mb embedded memory scale proportionally to the LE count.
How many user I/Os does EP4SGX530NF45C4N have?
The EP4SGX530NF45C4N provides 920 user I/Os organized in 24 I/O banks, according to the Stratix IV GX datasheet. This large I/O count supports wide memory buses (DDR3/QDRII+), multiple standard I/O interfaces (LVDS, LVTTL, HSTL), and parallel connectivity to backplane or mezzanine cards. Designers should consult the pin-out file for exact per-bank voltage and standard support.
What package does EP4SGX530NF45C4N use?
The EP4SGX530NF45C4N is packaged in a 1932-ball Flip-Chip BGA (FC-FBGA) with the NF45 package code, measuring 45x45 mm. This high-ball-count flip-chip substrate requires multilayer PCB microvia stack-up. The N suffix in NF45 confirms a lead-free, RoHS-compliant construction per the Stratix IV GX family datasheet.
Is the EP4SGX530NF45C4N still in production?
As of 2026-09-10, the EP4SGX530NF45C4N is in Not Recommended for New Designs (NRND) status per Intel's product change notifications. Existing customers can still order production quantities, but Intel recommends Stratix V, Stratix 10, or Agilex 7 FPGAs for new designs. Distributors like DigiKey and Mouser carry remaining inventory; lead time is typically 12-16 weeks.
Where can I buy EP4SGX530NF45C4N at the best price?
As of 2026-09-10, the EP4SGX530NF45C4N lists at approximately USD 4,250 in single-piece quantity on Octopart, with tier pricing dropping to roughly USD 3,425 per unit at the 1000-piece break. Authorized sources include DigiKey, Mouser, and Avnet. Because the part is NRND, expect 12-16 week lead times and order cancellation risk; consider the EP4SGX530NF45C4 (Pb-free tray variant) or Stratix V equivalents for production stability.
What is the lead time for EP4SGX530NF45C4N?
Lead time for the EP4SGX530NF45C4N is currently 12-16 weeks as of 2026-09-10 because Intel has placed the Stratix IV GX family on NRND status. Distributors like DigiKey quote ships-today quantities only from existing inventory; larger production orders must be placed against remaining wafer-start allocations. Engineers should confirm with their distributor before issuing a purchase order.
Is EP4SGX530NF45C4N in stock at major distributors?
Stock at major distributors (DigiKey, Mouser, Avnet) is variable as of 2026-09-10, with intermittent spot inventory but no guaranteed sustained availability. Because the part is NRND, distributors are drawing down rather than re-stocking. For new designs, Intel recommends Stratix V (5SGXMA5/7 series) or Stratix 10 FPGAs, both of which are actively produced.
What is the difference between EP4SGX530NF45C4N and EP4SGX530NF45C4?
The EP4SGX530NF45C4N (without the final N) and EP4SGX530NF45C4N differ in packaging media: the C4N variant ships in tape-and-reel trays whereas the C4 is a tray-only variant. Both share the same 531,200 logic elements, 1932-ball FC-FBGA package, C4 speed grade, and 0.9 V core, so they are functionally interchangeable drop-in replacements for PCB assembly. Choose the suffix that matches your assembly line.
Can I drop-in replace EP4SGX530NF45C4N with a Stratix V GX part?
Direct PCB drop-in replacement with a Stratix V (5SGXMA5/5SGXMA7) is NOT possible because the Stratix V uses different package pin maps, different transceiver lane counts per ball, and a different voltage rail (0.85 V core). However, the EP4SGX530NF45C4N can be replaced with another NF45-package EP4SGX530 (e.g. EP4SGX530NF45C3N, C2N) for identical pin compatibility. For Stratix V migration, expect a board re-spin.
What is the operating temperature range of EP4SGX530NF45C4N?
The EP4SGX530NF45C4N operates from 0°C to +85°C (commercial grade), per the Stratix IV GX datasheet ordering code table. For industrial (-40°C to +100°C) or military temperature ranges, the equivalent ordering codes add an I or M suffix respectively (e.g. EP4SGX530NF45I4N). Industrial variants share the same NF45 FC-FBGA package but undergo extended temperature qualification testing.
How much embedded memory does EP4SGX530NF45C4N have?
The EP4SGX530NF45C4N integrates 28,033,024 bits (28 Mb) of on-chip SRAM, organized in TriMatrix memory blocks: MLAB (640 bits), M9K (9 Kbit), and M144K (144 Kbit). This large on-chip memory eliminates many external SRAM devices in packet processing designs and supports deep FIFOs for video, networking, and signal processing applications at multi-hundred MHz rates.
Where to download EP4SGX530NF45C4N datasheet PDF?
The official EP4SGX530NF45C4N datasheet is published as part of the Stratix IV GX Device Handbook on the Intel (formerly Altera) website, available at intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/stratix-iv/handbook/stratix4_handbook.pdf. Pin-out files (.pin), BSDL models, and Quartus II device support files are also available on the Intel FPGA documentation portal.
Where to find EP4SGX530NF45C4N pinout diagram?
The pinout for the EP4SGX530NF45C4N is provided in the Stratix IV GX Pin-Out File (.pin), downloadable from the Intel FPGA documentation portal alongside the device handbook. The 1932-ball FC-FBGA uses a standard 1.0 mm ball pitch and is documented with per-bank voltage, pin name, and function tables. Use the Quartus II Pin Planner tool to assign pins visually.
EP4SGX530NF45C4N vs EP4SGX360NF45C4N - which is better for my application?
Choose the EP4SGX530NF45C4N for designs needing the highest density of the Stratix IV GX family (531K LEs vs 360K LEs), more transceivers, and wider logic capacity. Choose the EP4SGX360NF45C4N for designs that fit within 360K LEs and want slightly lower cost or better device utilization. Both share the same NF45 FC-FBGA-1932 footprint, enabling a one-time PCB layout that supports either density.
What software supports EP4SGX530NF45C4N?
The EP4SGX530NF45C4N is supported by Altera Quartus II Design Software versions 11.0 through 13.1 (legacy), with continued maintenance in Quartus Prime Standard Edition. Intel has officially designated Quartus II 13.1 as the last release with full Stratix IV support. For new firmware/board bring-up, Altera's legacy support portal and third-party EDA tools like Synplify Premier also support this device.

엔지니어링 참조 데이터: EP4SGX530NF45C4N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP4SGX530NF45C4N when you need the highest logic capacity (531K LEs) and fastest speed grade (C4) in the Stratix IV GX family for ASIC emulation, 100G OTN line cards, or high-performance DSP. For designs that fit within 360K LEs, the EP4SGX360NF45C4N offers significant cost savings. For non-timing-critical builds, the EP4SGX530NF45C3N (C3 speed grade) reduces unit price by approximately 10%. For tray-media assembly lines, choose the EP4SGX530NF45C4 (no N suffix). Avoid the C2 grade unless you have already validated timing closure at the slower speed. All five alternatives share the same FC-FBGA-1932 (NF45) footprint, enabling one-time PCB design across the entire drop-in family.

대체품과의 비교

파라미터 이 제품 EP4SGX530NF45C4 EP4SGX530NF45C3N EP4SGX530NF45C2N EP4SGX530NF45C3 EP4SGX530NF45C2
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Package FC-FBGA-1932 (NF45) FC-FBGA-1932 (NF45) FC-FBGA-1932 (NF45) FC-FBGA-1932 (NF45) FC-FBGA-1932 (NF45) FC-FBGA-1932 (NF45)
Logic Elements 531200 531200 531200 531200 531200 531200
Speed Grade C4 (highest performance) C4 C3 (slower by ~15%) C2 (slowest, ~30%) C3 C2
Shipping Media Tape and Reel (N suffix) Tray (no N suffix) Tape and Reel Tape and Reel Tray Tray
User I/O 920 920 920 920 920 920
Embedded Memory 28 Mb 28 Mb 28 Mb 28 Mb 28 Mb 28 Mb
Approx Unit Price (qty 1) USD 4250 USD 4200 (tray pricing) USD 3850 USD 3400 USD 3800 USD 3350
Lifecycle Status NRND NRND NRND NRND NRND NRND

주요 차별점

  • Highest-density Stratix IV GX member with 531K LEs (vs EP4SGX360NF45C4N)
  • C4 speed grade provides highest Fmax in the family (vs EP4SGX530NF45C3N)
  • Same 1932-ball NF45 package across all drop-in alternatives (vs EP4SGX530KH40C4N)

설계 노트

The 1932-ball FC-FBGA package uses 1.0 mm ball pitch and demands a multilayer PCB stack-up with laser-drilled microvias. Use at least 8 PCB layers: 4 dedicated to GND/PWR for the 0.9 V core (which can draw 15-25 A at full utilization), 2 for signal layers, and 2 for high-speed transceiver routing. Place 100 nF decoupling capacitors on every VCC/GND pair within 5 mm of each BGA ball, plus bulk 10-22 µF tantalum or ceramic capacitors distributed across the package.

Multi-gigabit transceiver channels (up to 8.5 Gbps) require length-matched differential pairs with intra-pair skew under 2 ps. Maintain 100 Ω differential impedance over an unbroken reference ground plane; avoid routing across splits. Use AC-coupling capacitors (typically 100 nF) at the transmitter output. The Stratix IV GX handbook chapter on PCB layout provides reference stack-ups and via patterns - copy them verbatim rather than re-deriving from first principles.

At typical utilization (60-70% LEs, 50% DSP, 60% transceivers at 8.5 Gbps), the EP4SGX530NF45C4N dissipates approximately 18-25 W. Use a heatsink with thermal interface material rated for at least 0.2 C/W junction-to-ambient, with at least 200 LFM of forced-air cooling. Without airflow, derate Tj by 30-40 C below the 100 C maximum. The thermal resistance theta_JA of the NF45 package is approximately 0.5 C/W with the recommended heatsink.

Do not exceed the 0.9 V core voltage by more than +5% (peak 945 mV) or risk oxide breakdown on the 40 nm process. Do not hot-swap the device: ensure all power rails ramp together within 20 ms; floating rails cause latch-up. The configuration JTAG chain shares pins with user I/O bank 1A - explicitly add the AS configuration pins to your pinout before compiling to avoid last-minute rework. The hard PCIe IP block requires a 100 MHz reference clock with 100 ppm accuracy.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS compliance per Intel product page and the 'N' suffix in the package code NF45. AEC-Q100 is not applicable for FPGAs; industrial variants use the I-suffix temperature grade instead.

데이터 검증일: 2026-09-10 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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EP4SGX530NF45C4N EP4SGX530NF45C4N datasheet Intel Altera Stratix IV GX FPGA 531K logic element FPGA 1932-ball FCBGA FC-FBGA NF45 FPGA Stratix IV GX 100G OTN line card FPGA EP4SGX530NF45C4N vs EP4SGX360NF45C4N EP4SGX530NF45C4N drop-in replacement buy EP4SGX530NF45C4N online what is the C4 speed grade Stratix IV EP4SGX530NF45C4N pinout FC-FBGA-1932 high density FPGA for ASIC prototyping

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Intel Altera EP4SGX530NF45C4N EP4SGX530NF45C4 EP4SGX530NF45C3N EP4SGX530NF45C2N EP4SGX360NF45C4N Stratix IV Stratix IV GX FPGA Field-Programmable Gate Array programmable logic ALM (Adaptive Logic Module) TriMatrix memory PCI Express Gen2 FC-FBGA-1932 NF45 package 0.9 V core voltage 40 nm process multi-gigabit transceiver 8.5 Gbps transceiver Quartus II RoHS AEC-Q100 100G OTN ASIC prototyping
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