EPF10K100EFC256-2X - FLEX 10KE FPGA, 49,152 Gates, 256-BGA | Altera
부품 번호: EPF10K100EFC256-2X ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $45.96 | $45.96 |
| 10 | $42.5 | $425.00 |
| 100 | $38.2 | $3,820.00 |
| 500 | $33.9 | $16,950.00 |
| 1,000 | $30.5 | $30,500.00 |
EPF10K100EFC256-2X 개요
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that integrates configurable logic blocks, programmable interconnects, and embedded memory arrays on a single semiconductor die. FPGAs sit at the top of the digital logic hierarchy: discrete gates -> PLDs (PAL/GAL) -> CPLDs -> FPGAs -> SoC FPGAs. Within Altera's (now Intel PSG) portfolio, the FLEX 10KE family was an early SRAM-based, look-up-table (LUT) architecture that pioneered embedded system-on-chip integration by mixing logic and memory cells (EABs) on the same die, a design philosophy that paved the way for modern SoC FPGAs like Cyclone and Stratix.
Key features of the EPF10K100EFC256-2X include 4,992 cells organized into 624 LABs, 191 user I/Os routed through 5 I/O banks, multi-voltage I/O support (3.3V PCI-compatible and 2.5V/1.8V levels), and an in-system programmable configuration interface. The 256-FBGA FineLine package provides a compact footprint suitable for high-density boards, while the -2 speed grade represents a balance between timing closure and cost for commercial-temperature designs.
The FLEX 10KE architecture combines a sea-of-LUTs logic fabric with Embedded Array Blocks (EABs) that can be configured as RAM, ROM, or FIFO, enabling designers to implement datapath logic, state machines, and small memory blocks without external components. The SRAM-based configuration cells require a configuration device (such as an EPC2 or EPC16) to load the bitstream at power-up, supporting JTAG-based in-system programming for prototyping and field upgrades.
Typical applications include telecommunications line cards, industrial control systems, glue logic replacement, PCI interface bridging, and legacy system upgrades. The 256-FBGA package and 191 I/O count make this part well suited for mid-complexity designs where board area and signal density matter more than absolute logic capacity.
When designing with the EPF10K100EFC256-2X, ensure the configuration scheme (passive serial, active serial, or JTAG) and configuration device selection are validated against the Quartus design tool's pin-out report. Pay close attention to bank-by-bank I/O voltage compatibility, especially when mixing 3.3V PCI and 2.5V peripherals on the same device.
드롭인 대체품: EPF10K100EFC256-2X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K100EFC256-2X (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Total RAM Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K100EFC256-2
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EPF10K100EFC256-1X
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K100EFC256-3
✅ 드롭인✓ 재고 있음
$23.1 / 개
데이터시트 보기 →EPF10K100BFC256-3
✅ 드롭인✓ 재고 있음
$58.2 / 개
데이터시트 보기 →EPF10K100BFC256-2
✅ 드롭인✓ 재고 있음
$65 / 개
데이터시트 보기 →EPF10K100BFC256-1
✅ 드롭인✓ 재고 있음
$105 / 개
데이터시트 보기 →EPF10K100EFC256-2X 최대 정격 & 전기적 특성
| Series | FLEX-10KE |
| Family | FLEX 10KE |
| Logic Elements / Cells | 49,152 |
| Number of LABs/CLBs | 624 |
| Number of Logic Elements/Cells | 4,992 |
| Total RAM Bits | 49,152 |
| Number of I/O | 191 |
| Number of Gates | 100,000 |
| Voltage - Supply | 2.375V to 2.625V (core), 3.0V to 3.6V (I/O) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0°C to 70°C |
| 패키지 / 케이스 | 256-FBGA (FineLine BGA, 17x17 mm) |
| Supplier Device Package | 256-BGA |
| Speed Grade | -2 |
| Logic Family | CMOS (SRAM-based) |
| Propagation Delay | 0.6 ns (per EAB) |
| Configuration Interface | JTAG / Passive Serial / Active Serial |
| Lead-Free / RoHS Status | Depends on date code - verify with distributor |
EPF10K100EFC256-2X 256-bga 핀 구성 가이드
EPF10K100EFC256-2X(256-bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K100EFC256-2X.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K100EFC256-2X 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Backplane Bridging, PCI Interface Bridge and Add-In Cards, Legacy System Maintenance and Field Upgrades, Datacom and Router Mid-Density Datapath, Legacy Prototyping and Educational FPGA Platforms.
Telecommunications Line-Card Glue Logic
The EPF10K100EFC256-2X fits telecommunications line cards because it integrates 49,152 logic elements and 191 I/Os in a single 256-FBGA, replacing multiple 74-series TTL packages and CPLDs with one programmable device. Its 49,152 RAM bits via EABs allow designers to implement small FIFOs, lookup tables, and channel-assignment registers without external SRAM. The 0.6 ns EAB propagation delay supports backplane speeds common in T1/E1 and early SONET framers. Compared to discrete logic, the FLEX 10KE reduces BOM count and improves field-upgradeability via in-system JTAG programming.
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Industrial Control and PLC Backplane Bridging
In PLC and industrial-control backplanes, the EPF10K100EFC256-2X provides 191 user I/Os across 5 banks, enabling it to bridge multiple industrial protocols (RS-485, CAN, parallel I/O) on the same die. Its 2.5V core and 3.3V I/O tolerance simplify integration with legacy 5V-tolerant peripherals using external resistor dividers. The 256-FBGA FineLine package's 17x17 mm footprint suits compact PLC backplane modules. Designers value the FLEX 10KE family for its long-life cycle and abundant application notes from Altera on industrial control use cases.
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PCI Interface Bridge and Add-In Cards
The EPF10K100EFC256-2X's 3.3V PCI-compatible I/O banks and 191 available user pins make it well-suited for PCI bridge designs and legacy add-in cards. Its 100,000-gate capacity is sufficient to implement PCI target/master state machines, scatter-gather DMA engines, and small FIFOs without external logic. The FLEX 10KE's EAB-based memory blocks (49,152 RAM bits) double as data-path buffers for bus-mastering designs. Compared to ASIC-based PCI bridges, the FLEX 10KE offers revision flexibility and PCI-66 compatibility with appropriate I/O-bank configuration.
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Legacy System Maintenance and Field Upgrades
The EPF10K100EFC256-2X is widely deployed in legacy aerospace, defense, and industrial systems where PCB redesign is impractical. Its JTAG-based in-system programmability allows field firmware updates without replacing the board. The 256-FBGA FineLine package and FLEX 10KE architecture have been continuously supported by Altera's licensed aftermarket partner Rochester Electronics, ensuring long-term spares availability. This makes the part ideal for sustaining legacy equipment through 10+ year service contracts where the original FPGA cannot be re-sourced from the OEM.
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Datacom and Router Mid-Density Datapath
The EPF10K100EFC256-2X serves well in mid-density datacom designs, providing 100K gates for packet-header processing, lookup-table engines, and queue-management logic. Its 49,152-bit EAB-based memory supports small CAM/RAM hybrids used in address-lookup engines. The 256-FBGA package's high-density BGA footprint suits router line cards where board area is at a premium. Designers historically chose FLEX 10KE for early 10/100 Mbps Ethernet switches, where its speed-grade -2 timing margin comfortably met 25 MHz PCI and 100 MHz SPI-3 interfaces.
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Legacy Prototyping and Educational FPGA Platforms
The EPF10K100EFC256-2X is used in university and engineering training labs where the FLEX 10KE's documented architecture makes it an excellent teaching platform for SRAM-based FPGA fundamentals. Its 100K-gate capacity is large enough to host complete RISC processor cores (e.g., NIOS or custom designs), UART, memory controllers, and simple peripherals in a single device. The 256-FBGA package is mechanically rugged for student lab use. While the part is obsolete, surplus inventory is often repurposed for educational boards and FPGA architecture courses.
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추천 제품 요약
엔지니어링 참조 데이터: EPF10K100EFC256-2X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K100EFC256-2 | EPF10K100EFC256-1X | EPF10K100EFC256-3 | EPF10K100BFC256-3 | EPF10K100BFC256-2 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) |
| Series / Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10K (no EABs) | FLEX 10K (no EABs) |
| Speed Grade | -2 | -2 | -1 (slower) | -3 (faster) | -3 (FLEX 10K) | -2 (FLEX 10K) |
| Logic Elements / Gates | 49,152 gates / 4,992 cells | 49,152 gates / 4,992 cells | 49,152 gates / 4,992 cells | 49,152 gates / 4,992 cells | 49,152 gates / 4,992 cells (no EABs) | 49,152 gates / 4,992 cells (no EABs) |
| User I/O | 191 | 191 | 191 | 191 | 191 | 191 |
| Core Voltage | 2.5V | 2.5V | 2.5V | 2.5V | 2.5V | 2.5V |
| Operating Temperature | 0°C to 70°C (commercial) | 0°C to 70°C (commercial) | 0°C to 70°C (commercial) | 0°C to 70°C (commercial) | 0°C to 70°C (commercial) | 0°C to 70°C (commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Embedded Array Blocks (EABs) | Yes (49,152 RAM bits) | Yes | Yes | Yes | No (FLEX 10K) | No (FLEX 10K) |
주요 차별점
- 256-FBGA FineLine package with 191 I/O (vs EPF10K100EQC208-3 (PQFP-208))
- FLEX 10KE Embedded Array Blocks (EABs) (vs EPF10K100BFC256-2 (FLEX 10K))
- Speed grade -2 timing balance (vs EPF10K100EFC256-1X (speed grade -1))
설계 노트
FLEX 10KE devices are SRAM-based and lose configuration on power-down. A non-volatile configuration device (EPC2, EPC4, EPC8, or EPC16) must be present on the board to load the bitstream at every POR. Designers who omit the configuration device will see a blank device with all I/Os tri-stated on every power-up. JTAG-only configuration is acceptable for prototyping but never for production.
The 256-FBGA FineLine BGA package requires careful PCB layout: a 17x17 mm land pattern with 1.0 mm ball pitch. Use NSMD (Non-Solder-Mask-Defined) pads for better joint reliability. Fanout routing should use micro-vias (8-mil/8-mil stackup recommended) to escape the dense ball grid, and a 4-layer PCB with continuous ground plane is mandatory to meet the device's signal-integrity requirements at 100+ MHz internal clock rates.
Decoupling: place 0.1 µF X7R ceramic capacitors adjacent to every VCCINT and VCCIO supply pin, with bulk 33 µF tantalum or 100 µF low-ESR aluminum polymer capacitors near the device. The FLEX 10KE's multiple I/O banks require per-bank VCCIO decoupling to prevent supply-noise-induced jitter. Source: Altera AN75 (FLEX 10KE design guidelines) recommends at least 8 decoupling capacitors per device for 256-FBGA packages.
Verify configuration mode (passive serial vs active serial vs JTAG) against the configuration device selected. Mixing a passive-serial EPC2 with active-serial mode programming will result in configuration failure. Quartus II Device & Pin Options must be set correctly before generating the .pof or .sof bitstream. Source: Altera FLEX 10KE configuration handbook, chapter 3.
규정 준수 정보
RoHS and lead-free status depend on date code. The 'X' suffix typically denotes lead-free terminal finish per Altera part numbering, but this must be verified with the distributor's RoHS declaration before volume order. AEC-Q100 not applicable - this is a commercial-grade FPGA, not automotive qualified.
