EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
부품 번호: EPF10K200EBC600-1 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $322.17445 | $322.17 |
| 10 | $322.17445 | $3,221.74 |
| 100 | $322.17445 | $32,217.45 |
| 500 | $322.17445 | $161,087.23 |
| 1,000 | $322.17445 | $322,174.45 |
EPF10K200EBC600-1 개요
A field-programmable gate array is a programmable logic device containing configurable logic blocks, routing resources, and programmable I/O that implement digital functions. In the system hierarchy, the FPGA sits between fixed-function application-specific integrated circuits and software-driven processors: it provides hardware parallelism and timing control without requiring a custom silicon mask. Embedded memory, logic, and I/O resources let a system combine control logic, interface adaptation, and datapath functions in one programmable device.
The EPF10K200EBC600-1 provides 9,984 logic elements, 1,248 LABs, 470 I/O, and 98,304 bits of embedded memory according to the verified distributor listings. These resources support moderate-to-large digital designs, including glue logic, bus controllers, protocol bridges, and custom peripherals. The 600-BGA package is a high-density surface-mount package, but its ball map and package dimensions are not included in the supplied data.
The FLEX-10KE architecture combines programmable logic with embedded array functions. The supplied description references system-on-a-programmable-chip integration, enhanced embedded arrays, dual-port memory, and specialized logic functions. These features make the part suitable for designs needing configurable datapaths and memory, although exact memory organization, operating-current limits, propagation-delay grades, and supported configuration modes are not available in the provided snippets.
Typical applications include industrial control equipment, communications-interface hardware, test equipment, and legacy digital systems. Its 470 I/O make it useful where a design must connect many parallel or serialized external signals, while 9,984 logic elements provide capacity for glue logic, state machines, protocol handling, and custom arithmetic. The 98,304-bit embedded-memory figure also supports buffering and state-storage functions when the design is compiled for the FLEX-10KE architecture.
A critical design step is to verify the exact package ball map, power sequencing, configuration interface, and timing specification before layout or production release. The verified data provides the 600-BGA package name and 470-I/O count, but not a ball-by-ball pinout. Designers should also confirm whether the target design requires the -1 speed grade, a different temperature grade, or a specific revision-compatible source.
This page combines verified distributor specifications, package-level information, pricing references, and engineering-focused context to support component selection. Where the supplied data does not expose a parameter, the value is marked as needed rather than estimated.
드롭인 대체품: EPF10K200EBC600-1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K200EBC600-1 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K200EBC600-2
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EPF10K200SFC484-1
✅ 드롭인✓ 재고 있음
$162 / 개
데이터시트 보기 →EPF10K200EBC600-1 최대 정격 & 전기적 특성
| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | FLEX-10KE |
| Logic Elements | 9,984 |
| Embedded Memory | 98,304 bits |
| Logic Array Blocks | 1,248 LABs |
| I/O Count | 470 I/O |
| 공급 전압 | 2.5 V |
| 패키지 | 600-BGA |
| Technology | Mixed CMOS |
| Commercial Temperature | 85 C |
| Propagation Delay | 0.4 ns |
| Embedded Array | Enhanced embedded array |
| Memory Feature | Dual-port memory |
| RoHS 상태 | unknown |
EPF10K200EBC600-1 600-bga 핀 구성 가이드
EPF10K200EBC600-1(600-bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K200EBC600-1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K200EBC600-1 적합 용도: 6 애플리케이션s: Industrial Control Logic, Communications Interface Bridge, Legacy Test and Measurement Equipment, Embedded System-on-a-Programmable-Chip Platform, Digital Signal and Data-Path Conditioning, Legacy Peripheral and Bus Controller.
Industrial Control Logic
The EPF10K200EBC600-1 fits industrial-control systems that need substantial programmable logic and many external interfaces. Its verified capacity includes 9,984 logic elements, 1,248 LABs, and 470 I/O, allowing the FPGA to consolidate state machines, sequencing logic, alarm handling, and machine-control functions. The 98,304 bits of embedded memory can support buffers and control state when configured through the FLEX-10KE design flow. Use the device between sensors, actuators, communication controllers, and a supervisory processor. Confirm industrial temperature requirements, I/O electrical limits, and the exact configuration interface before production.
추천
Communications Interface Bridge
The EPF10K200EBC600-1 is suitable for communications-interface bridging because its 470 I/O and 9,984 logic elements can implement parallel-to-serial conversion, protocol framing, timing recovery support, and device-control logic. The FLEX-10KE architecture combines programmable logic with embedded-array functions, while the verified data identifies 98,304 bits of embedded memory for buffering and control storage. In a system, the FPGA can sit between a processor bus and one or more external communications devices. Validate I/O voltage compatibility, clocking constraints, propagation timing, and the configuration method, because the supplied data does not provide complete AC or pin-level specifications.
추천
Legacy Test and Measurement Equipment
The EPF10K200EBC600-1 can support legacy test and measurement equipment that requires deterministic hardware control, many instrument signals, and configurable timing logic. The verified 1,248 LAB count and 470 I/O provide capacity for trigger distribution, signal routing, instrument sequencing, and custom measurement functions. Its 98,304 bits of embedded memory can be used for capture buffers or control tables when the selected architecture supports the required implementation. Place the FPGA close to the controlled measurement path and preserve controlled-clock timing. Because the part is obsolete, existing boards should document the exact ordering code, package revision, and bitstream before any repair or redesign.
추천
Embedded System-on-a-Programmable-Chip Platform
The EPF10K200EBC600-1 is appropriate for embedded system-on-a-programmable-chip designs that combine custom logic, memory functions, and peripheral interfaces. The supplied family description specifically references system-on-a-programmable-chip integration, enhanced embedded arrays, dual-port memory, and specialized logic functions. With 9,984 logic elements, 1,248 LABs, and 98,304 bits of embedded memory, the device can implement control blocks and dataflow functions around a host processor. Use the FPGA for deterministic hardware functions rather than general-purpose software replacement. Verify supported memory modes, configuration memory, reset timing, and the exact embedded-array organization in the official family documentation.
추천
Digital Signal and Data-Path Conditioning
The EPF10K200EBC600-1 can serve in digital signal and data-path conditioning systems that need parallel processing, custom timing, and configurable memory structures. Its verified 9,984 logic elements and 470 I/O support datapath control, sample routing, buffering, and interface adaptation. The 98,304-bit embedded-memory figure is useful for temporary data storage, while the programmable logic can implement state-dependent filtering or channel management. The FLEX-10KE family is an older FPGA family, so achievable clock rate and utilization must be confirmed through the supported toolchain and timing analysis. Do not infer real-time performance from the supplied 0.4 ns figure without the datasheet’s test conditions and timing definitions.
추천
Legacy Peripheral and Bus Controller
The EPF10K200EBC600-1 fits a legacy peripheral or bus-controller role when a board needs custom bus timing, address decoding, interrupt aggregation, or adapter logic. The verified 470-I/O count provides broad connectivity, and 9,984 logic elements provide capacity for state machines and protocol handling. The FPGA can be placed between a processor or backplane bus and slower peripheral devices, reducing the need for multiple fixed-function components. Confirm signal-level compatibility, clock-domain behavior, setup and hold margins, and the exact I/O assignments using the official 600-BGA package data. Because the part is obsolete, preserve a validated configuration image and document any replacement impact.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K200EBC600-1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K200EBC600-2 | EPF10K200SFC484-1 |
|---|---|---|---|
| Brand | Intel | Intel | Intel |
| Package | 600-BGA | 600-BGA | 600-BGA |
| Supply Voltage | 2.5 V | 2.5 V family context | 2.5 V family context |
주요 차별점
- Large verified programmable-logic capacity (vs EPF10K200SFC484-1)
- Established FLEX-10KE architecture for embedded logic (vs EPF10K200EBC600-2)
- High verified external-connectivity count (vs EPF10K200SFC484-1)
- Embedded memory and enhanced-array functions (vs EPF10K200SFC484-1)
설계 노트
The supplied data identifies a 2.5 V FLEX-10KE device but does not provide operating-current, power-consumption, power-up sequencing, or auxiliary-rail tables. Before schematic release, obtain the official electrical-characteristics and recommended-operating-condition sections. Use the manufacturer’s power-estimation procedure with the actual design utilization, clock rates, toggle rates, memory usage, and I/O loading. Treat all calculated dissipation and junction-temperature values as estimates until validated on hardware. Include local decoupling according to the reference design, confirm power-good and reset sequencing, and avoid relying on the family voltage label as a substitute for complete rail limits.
The verified package is 600-BGA, but the complete ball map, package dimensions, land pattern, and ball numbering are not present in the supplied data. Obtain the official package drawing and the exact pinout before PCB layout. Check all power and ground balls, configuration pins, clock inputs, differential pairs, and user-I/O banks. Follow the manufacturer footprint recommendations rather than copying a generic 600-ball pattern. Verify solder-paste aperture, escape routing, via-in-pad policy, and high-speed signal transitions with the assembly house. A package label of 600-BGA alone is insufficient evidence that two devices share a drop-in footprint.
The 470-I/O count makes signal-integrity planning important, especially when the device connects buses, clocks, or communications interfaces. Assign I/O standards and directions only after reviewing the official I/O-bank and electrical tables. Use controlled-impedance routing for fast single-ended or differential signals, provide return-path continuity, and keep clock and high-transition signals away from sensitive inputs. Calculate timing with the supported toolchain and verify setup, hold, propagation delay, and clock uncertainty at the receiving device. The supplied 0.4 ns figure is not a substitute for the full timing model, test conditions, and load assumptions.
Do not select a replacement based only on FPGA capacity, I/O count, or a distributor’s generic “equivalent” label. The supplied data does not verify that EPF10K200EBC600-2 or EPF10K200SFC484-1 has the same 600-BGA ball map, electrical limits, timing grade, configuration interface, or software support as EPF10K200EBC600-1. Also do not assume that a distributor listing proves current production, factory-new condition, or a supported lifecycle. For a new design, use an authorized current FPGA or complete a full board and firmware requalification. For legacy maintenance, preserve the original bitstream, document the ordering code, and validate every replacement through a controlled engineering change.
규정 준수 정보
The supplied data identifies mixed CMOS and commercial temperature information but does not provide verified RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements. AEC-Q100 status is not stated and is treated as not applicable to the supplied information, not as a qualified claim.
