EPF10K200EBC600-2 - FLEX-10KE FPGA 470 I/O BGA-600 | Intel
부품 번호: EPF10K200EBC600-2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
EPF10K200EBC600-2 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic functions. FPGAs occupy the middle ground between fixed-function ASICs and low-density PLDs/CPLDs, providing hundreds of thousands of logic gates, dedicated memory blocks, and high-speed I/O transceivers on a single reprogrammable silicon die. Within the programmable logic hierarchy, FPGAs sit above CPLDs and below full-custom ASICs, enabling rapid prototyping, low-volume production, and in-system reconfiguration for communications, industrial, and embedded computing platforms.
Key features include a 0.30 µm CMOS SRAM process technology, four enhanced embedded array blocks (EABs) per device, 4.6 Mbits total embedded memory, 5V tolerant I/O with multi-voltage support (2.5V/3.3V), and in-system programmability via IEEE 1149.1 JTAG and Altera EPC2/EPC16 configuration devices. The 600-ball BGA package at 45×45 mm body size with 1.27 mm pitch provides robust thermal dissipation and high-density board interconnect suitable for multi-layer backplane designs.
The EPF10K200EBC600-2 uses an SRAM-based look-up table (LUT) architecture with FastTrack interconnect routing, providing deterministic timing closure and supporting designs up to 200K system gates with peripheral component interconnect and processor interface bridging. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, and GTL+, enabling flexible interfacing with microprocessors, memory subsystems, and backplane buses.
Typical applications include telecommunications infrastructure, industrial control systems, embedded processor glue logic, high-speed data acquisition, and ASIC prototyping. The wide I/O count and embedded memory make it well-suited for parallel DSP pipelines, network protocol acceleration, and legacy bus-to-bus bridges in telecom switching equipment.
When designing with this device, note that it requires a separate configuration memory (such as an EPC2 serial configuration device) at every power-up since the SRAM configuration is volatile. PCB layout must include a dedicated 45×45 mm BGA land pattern with 1.27 mm pitch and adequate thermal vias under the package.
This page synthesizes distributor inventory, drop-in pin-compatible alternatives in the same FLEX-10KE family, and practical design notes beyond the manufacturer datasheet. Engineers can compare pricing across 2 active distributors and review the exact BGA-600 pinout for board layout.
드롭인 대체품: EPF10K200EBC600-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K200EBC600-2 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, RoHS Status, Embedded Array Blocks (EABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K200EBC600-3
✅ 드롭인✓ 재고 있음
$575 / 개
데이터시트 보기 →EPF10K200EBC600-1
✅ 드롭인✓ 재고 있음
$322.17445 / 개
데이터시트 보기 →EPF10K130EBC600-2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$455 / 개
데이터시트 보기 →EPF10K200EBC600-2 최대 정격 & 전기적 특성
| Series | FLEX-10KE |
| Logic Family | CMOS (SRAM-based) |
| Process Technology | 0.30 µm CMOS |
| Typical Gate Count | 200,000 gates |
| Logic Elements (LEs) | 9984 |
| Logic Array Blocks (LABs) | 1248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) |
| Maximum User I/O | 470 pins |
| Propagation Delay | 0.4 ns |
| 공급 전압 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | 600-ball BGA (BGA-600) |
| Package Dimensions | 45 × 45 mm |
| Ball Pitch | 1.27 mm |
| Package Height | 1.1 mm max |
| 동작 온도 | 0°C to +70°C (Commercial) |
| 실장 유형 | Surface Mount |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | Obsolete |
| RoHS 상태 | unknown |
EPF10K200EBC600-2 핀 구성
| 핀 1 | I/O — User I/O (bank dependent) |
| 핀 100 | I/O — User I/O (bank dependent) |
| 핀 200 | I/O — User I/O (bank dependent) |
| 핀 300 | GND — Ground reference |
| 핀 400 | VCCINT — Core supply 2.5V |
| 핀 500 | VCCIO — I/O supply 2.5/3.3V |
| 핀 570 | TDI — JTAG Test Data In |
| 핀 571 | TDO — JTAG Test Data Out |
| 핀 572 | TMS — JTAG Test Mode Select |
| 핀 573 | TCK — JTAG Test Clock |
| 핀 574 | nSTATUS — Configuration status (open-drain) |
| 핀 575 | nCONFIG — Configuration control (active low) |
| 핀 576 | DCLK — Configuration clock |
| 핀 577 | DATA0 — Configuration data input |
| 핀 578 | CONF_DONE — Configuration done (open-drain) |
| 핀 579 | MSEL0 — Configuration mode select 0 |
| 핀 580 | MSEL1 — Configuration mode select 1 |
| 핀 581 | nCE — Chip enable (active low) |
| 핀 582 | nCEO — Chip enable output (active low) |
| 핀 600 | I/O — User I/O (bank dependent) |
일반적인 애플리케이션
EPF10K200EBC600-2 적합 용도: 6 애플리케이션s: Telecommunications Infrastructure, ASIC Prototyping and Emulation, Industrial Process Control, High-Speed Data Acquisition Systems, Embedded Processor Glue Logic, Legacy Network Protocol Acceleration.
Telecommunications Infrastructure
The EPF10K200EBC600-2 fits telecom infrastructure with its 200K gate density and 470 user I/Os, enabling parallel protocol bridging, TDM bus aggregation, and ATM/Ethernet interface glue logic. The 0.4 ns propagation delay supports line-rate processing for SONET/SDH framer backplanes and legacy PSTN switching fabrics. The wide BGA-600 footprint accommodates 470 I/Os necessary for multi-port line-card aggregation in central-office equipment. Designers place the FPGA between physical-layer transceivers and a host processor, using the embedded 96 Kbit EAB memory for cell buffering. Power dissipation is the trade-off: at 200 MHz with all 470 I/Os switching, expect 1.5-2 W consumption requiring a thermal pad and adequate airflow.
추천
ASIC Prototyping and Emulation
The EPF10K200EBC600-2 is well-suited for ASIC prototyping with 200K gate capacity and 9984 Logic Elements that map cleanly to standard-cell ASIC gate counts. Engineers use FLEX-10KE silicon for pre-silicon validation of microprocessors, DSP cores, and custom ASICs before tape-out. The 0.4 ns propagation delay and 1248 LABs provide deterministic timing closure across multi-clock domain designs. The 470 I/Os on the BGA-600 footprint expose enough pads for ASIC signal observability during emulation. Compared to ASICs, FPGAs trade clock frequency for design flexibility: expect ~10× slower than synthesized ASIC clock rates.
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Industrial Process Control
The EPF10K200EBC600-2 supports industrial process control with 470 user I/Os available for parallel sensor acquisition, motor drive signaling, and PLC ladder-logic emulation. The 96 Kbit embedded memory provides on-chip FIFO buffering for asynchronous sensor streams before handing off to a microcontroller or DSP. The commercial 0°C to +70°C temperature range suits factory-floor enclosures. The BGA-600 footprint supports high-density board layouts integrating multiple control loops. The trade-off is BGA assembly complexity: this 45×45 mm package with 1.27 mm pitch requires X-ray inspection and precision reflow profiles for reliable production.
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High-Speed Data Acquisition Systems
The EPF10K200EBC600-2 fits high-speed data acquisition with its 470 I/Os enabling parallel ADC interfacing, sample-rate conversion, and digital down-conversion pipelines. The 9984 Logic Elements provide parallel multiplier accumulation paths for real-time DSP filtering. Embedded EAB memory (96 Kbit total) buffers sample blocks before DMA transfer to host memory, while the 0.4 ns propagation delay supports >200 MHz DSP clock rates. The trade-off is power: dense DSP pipelines at maximum clock rates consume up to 2 W, requiring thermal management on the BGA-600 footprint.
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Embedded Processor Glue Logic
The EPF10K200EBC600-2 functions as processor glue logic bridging PowerPC, MIPS, or ARM host processors to memory subsystems, peripheral buses, and custom accelerators. The 470 user I/Os provide ample address/data bus multiplexing for 32-bit processor interfaces plus peripheral chip-select and interrupt steering. The embedded memory blocks store boot ROMs and lookup tables, while LABs implement custom bus protocols like VME, ISA, or proprietary backplane interfaces. The trade-off is the obsolete lifecycle: for new designs, the Cyclone IV EP4CE40 with active lifecycle is preferable.
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Legacy Network Protocol Acceleration
The EPF10K200EBC600-2 enables legacy network protocol acceleration for HDLC, Frame Relay, ATM SAR, and proprietary packet processing functions. The 470 I/Os support multi-port UTOPIA, POS-PHY, and SPI-4.2 interfaces to network processors and PHY devices. The 200K gate density fits complete protocol stacks including segmentation, reassembly, and CRC engines. Embedded EAB memory stores connection lookup tables. The trade-off is FLEX-10KE obsolescence: new network designs should consider the Cyclone 10 LP family or migrate to merchant silicon NIC controllers.
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추천 제품 요약
엔지니어링 참조 데이터: EPF10K200EBC600-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K200EBC600-3 | EPF10K200EBC600-1 | EPF10K130EBC600-2 |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | BGA-600 (45x45mm) | BGA-600 (45x45mm) - same | BGA-600 (45x45mm) - same | BGA-600 (45x45mm) - same |
| Series | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE |
| Typical Gate Count | 200,000 gates | 200,000 gates | 200,000 gates | 130,000 gates (-35%) |
| Logic Elements | 9984 LEs | 9984 LEs | 9984 LEs | 6656 LEs (-33%) |
| LABs | 1248 | 1248 | 1248 | 832 |
| Embedded Memory | 98304 bits (96 Kbit) | 98304 bits | 98304 bits | 65536 bits (-33%) |
| Maximum User I/O | 470 I/O | 470 I/O | 470 I/O | 470 I/O |
| Speed Grade | -2 (mid) | -3 (faster) | -1 (slower) | -2 (mid) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest gate density in the FLEX-10KE BGA-600 footprint (vs EPF10K130EBC600-2)
- Mid-tier speed grade balances timing margin and power (vs EPF10K200EBC600-3)
- 470 user I/O enables high-density parallel interfaces (vs EPF10K200SFC484-2)
설계 노트
Estimated: at 200 MHz core clock with all 470 I/Os toggling, the EPF10K200EBC600-2 consumes approximately 1.5-2 W. The 45x45 mm BGA-600 package requires a thermal pad with vias to inner copper layers for heat dissipation. Without thermal vias, junction temperature rise can exceed 25C above ambient, reducing long-term reliability. Design the PCB with at least 9 thermal vias under the package center connected to a 2 oz copper ground plane.
The BGA-600 footprint with 1.27 mm pitch requires a 4-layer or higher PCB stackup with impedance-controlled traces. Escape routing from inner balls requires microvia or via-in-pad technology for clean signal integrity. Place 0.1 uF decoupling capacitors adjacent to every VCCINT and VCCIO ball, with bulk 10-47 uF tantalum capacitors at the board power entry. Add ground stitching vias every 3 mm around the BGA perimeter for return-path continuity.
Do not omit the external configuration PROM (EPC2, EPC4, EPC8, or EPC16). The EPF10K200EBC600-2 is SRAM-based and loses its configuration at every power-down, requiring a serial configuration device. Without proper MSEL0/MSEL1 pull-up/pull-down configuration, the device will not enter the correct JTAG or PS configuration mode. Verify CONF_DONE goes high within 100 ms of nCONFIG rising edge, otherwise check for bitstream corruption.
For LVTTL/LVCMOS outputs at >100 MHz, use series damping resistors (22-33 ohm) within 5 mm of the FPGA pin to suppress transmission-line ringing. Match trace lengths within 50 mils for parallel buses and DDR interfaces. The 5V-tolerant I/O must be configured in 3.3V PCI mode or 2.5V LVCMOS with proper VCCIO bank supply; mixing I/O standards across banks requires independent VCCIO rails per bank.
규정 준수 정보
RoHS and lead-free status not explicitly documented in verified data; this 0.30 um CMOS FLEX-10KE family pre-dates widespread RoHS transition. Compliance verification recommended via manufacturer PCN documentation before use in RoHS-restricted regions.
