EPF10K200SFC484-2 - FLEX 10KS FPGA 200K Gates | Altera / Intel
부품 번호: EPF10K200SFC484-2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $115 | $11,500.00 |
| 500 | $99.75 | $49,875.00 |
| 1,000 | $88.4 | $88,400.00 |
EPF10K200SFC484-2 개요
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines the architectural flexibility of gate arrays with the design-turnaround advantage of in-system programmability. FPGAs sit hierarchically as: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The FLEX 10KS family specifically introduced embedded array blocks (EABs) for on-chip memory and DSP-like functions, bridging the gap between classic PLDs and modern SRAM-based FPGAs.
Key features include 369 LABs (Logic Array Blocks), 4 EABs of 2,048 bits each for embedded memory, 4 embedded PLLs for clock management, multiVolt I/O supporting 2.5V/3.3V/5V interfacing, and JTAG-based IEEE 1149.1 boundary-scan testing. Core supply is 2.5V with separate VCCIO banks for I/O voltage flexibility.
Architecturally, the FLEX 10K uses a CMOS SRAM cell with continuous, routable interconnect. Look-up tables (LUTs) drive combinational logic while EABs implement RAM, ROM, or multiplier functions. This hybrid architecture enabled designers to integrate logic and memory on a single die, foreshadowing modern system-on-chip FPGA concepts.
Typical applications include telecommunications infrastructure (line cards, bridges), industrial control systems, high-performance computing accelerators, and ASIC prototyping. The 484-pin FineLine BGA also supports migration across the FLEX 10K family using SameFrame pin-out compatibility.
When designing with this part, ensure proper decoupling (100 nF + 10 uF per supply pin group), JTAG chain integrity, and configuration source selection (EPC configuration device or microcontroller). Operating temperature is commercial 0C to 70C. Lead-free BGA soldering requires peak reflow profiles per JEDEC J-STD-020.
This page synthesizes distributor pricing, drop-in FPGA alternatives within the FLEX 10KS family, and practical design notes not found in the original datasheet.
드롭인 대체품: EPF10K200SFC484-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K200SFC484-2 (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, Speed Grade, Operating Temperature, Propagation Delay.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K200SFC484-2X
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EPF10K200SFC484-1
✅ 드롭인✓ 재고 있음
$162 / 개
데이터시트 보기 →EPF10K200SFC484-1N
✅ 드롭인✓ 재고 있음
$185.25 / 개
데이터시트 보기 →EPF10K200SFC484-1X
✅ 드롭인✓ 재고 있음
$142 / 개
데이터시트 보기 →EPF10K130EFC484-3
✅ 드롭인✓ 재고 있음
$178.92 / 개
데이터시트 보기 →EPF10K130EFC484-3N
✅ 드롭인✓ 재고 있음
$109.25 / 개
데이터시트 보기 →EPF10K130EFC484-2
✅ 드롭인✓ 재고 있음
$105 / 개
데이터시트 보기 →EPF10K130EFC484-2N
✅ 드롭인✓ 재고 있음
$799 / 개
데이터시트 보기 →EPF10K200SFC484-2 최대 정격 & 전기적 특성
| Series | FLEX 10KS |
| Family | FLEX 10K (FLEX-10KS subfamily) |
| Logic Elements / Cells | 9,984 |
| System Gates | 200,000 |
| Embedded Memory (RAM bits) | 98,304 |
| Embedded Array Blocks (EAB) | 4 EABs x 2,048 bits |
| Logic Array Blocks (LAB) | 369 |
| User I/Os | 369 |
| Propagation Delay | 0.4 ns (max) |
| 핀 수 | 484 |
| Package Type | FineLine BGA-484 (23 x 23 mm, 1.0 mm pitch) |
| Technology | 0.22 um CMOS, SRAM-based |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | 2.5 V / 3.3 V / 5 V (multiVolt I/O) |
| 동작 온도 | 0 C to +70 C (commercial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (lead-free) |
| Configuration Method | EPC configuration device, JTAG, or microcontroller |
| Speed Grade | -2 (faster than -3) |
| PLL Count | 4 |
EPF10K200SFC484-2 fineline bga-484 (23 x 23 mm, 1.0 mm pitch) 핀 구성 가이드
EPF10K200SFC484-2(fineline bga-484 (23 x 23 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K200SFC484-2.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K200SFC484-2 적합 용도: 7 애플리케이션s: Telecommunications Line Card Interface, Industrial Control and Factory Automation, ASIC Prototyping and Emulation, High-Performance Computing Accelerator, Legacy Medical Imaging Signal Chain, Military/Aerospace Test Equipment (COTS-based), Educational FPGA Training Platforms.
Telecommunications Line Card Interface
The EPF10K200SFC484-2's 200K system gates and 369 user I/Os map directly to T1/E1 framer interfaces, Utopia backplanes, and HDLC controllers in legacy telecom line cards. Its 4 embedded PLLs handle multi-rate clock synthesis for 1.544 MHz and 2.048 MHz traffic streams without external clock buffers. The FineLine BGA-484 footprint integrates cleanly onto 6-layer telecom backplane PCBs while the 2.5V core keeps board power below 5W typical. Engineers value this part for TDM switching fabrics and ATM segmentation-and-reassembly blocks where embedded EAB RAM eliminates the need for external FIFOs.
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Industrial Control and Factory Automation
With 200K gates and 369 I/Os, the EPF10K200SFC484-2 supports multi-axis motor controllers, PLC scan engines, and fieldbus protocol bridges (Profibus, DeviceNet, Modbus) in a single chip. The commercial 0C to 70C operating range suits factory-floor enclosures with forced-air cooling. EAB blocks enable deterministic message buffering for real-time industrial Ethernet protocols, while multiVolt I/O banks drive both 5V and 3.3V sensors from the same device. Designers choose this FPGA for legacy plant upgrades where firmware-defined logic reduces component count versus discrete microcontrollers plus ASICs.
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ASIC Prototyping and Emulation
ASIC design teams historically used the EPF10K200SFC484-2 as a cost-effective ASIC prototype substrate because its 200K gates could absorb entire sub-blocks of multi-million-gate SoCs. The SRAM-based configuration supports in-system reprogramming via JTAG, enabling rapid design iteration. MultiVolt I/O allows direct connection to ASIC pad libraries at 2.5V/3.3V/5V. Internal EABs emulate ASIC RAM macros for timing-accurate system validation. Note: for new ASIC prototyping today, modern Cyclone V or Stratix 10 FPGAs offer far higher density, but the FLEX 10KS remains in service for legacy ASIC regression racks.
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High-Performance Computing Accelerator
The EPF10K200SFC484-2 served as a coprocessor in 1990s HPC clusters for bit-level parallelism in DSP, encryption, and signal processing workloads. Its 4 PLLs deliver multiple clock domains needed for pipeline stages, while 98 Kbits of internal RAM supports local coefficient storage for FIR filters. Latency-critical applications such as forward-error-correction (FEC) decoders exploited the 0.4 ns propagation delay of speed grade -2. Today, equivalent functions are served by Stratix V or Arria 10 FPGAs, but the FLEX 10KS remains in legacy Cray-style HPC mainframes for backward compatibility.
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Legacy Medical Imaging Signal Chain
Ultrasound beamformers and CT scanner front-end boards used the EPF10K200SFC484-2 to implement beam-steering FIR filters and channel-multiplex logic in the early 2000s. The 200K gate capacity handles 16-channel beamforming per FPGA, and the 369 user I/Os connect directly to A/D converters without external bus drivers. Embedded EABs store steering coefficients for dynamic focal-point adjustment during real-time scan. Today, medical OEMs retain this FPGA for certified legacy equipment that requires FDA 510(k) trace continuity - substitution to a newer FPGA would force re-certification, so the obsolete part remains in service via franchised distributor stock.
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Military/Aerospace Test Equipment (COTS-based)
Defense prime contractors historically built COTS-based (commercial off-the-shelf) avionics test racks around the EPF10K200SFC484-2 because its 200K gates could emulate MIL-STD-1553 buses, ARINC 429 interfaces, and FibreChannel arbitrated loops. The 484-ball FineLine BGA survives MIL-STD-810 shock and vibration tests when board-stacked with appropriate underfill. Multiple JTAG chains allowed parallel testing of redundant channels. Because the part is obsolete, defense sustainment programs now source through franchised distributors with C-of-C documentation. For new designs, modern radiation-tolerant FPGAs from Microchip RTG4 or Xilinx XQR Kintex are preferred.
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Educational FPGA Training Platforms
University electronics laboratories use the EPF10K200SFC484-2 on legacy Altera development kits (such as the Nios development board classic edition) to teach VHDL/Verilog hardware description, JTAG-based configuration flows, and FLEX 10K architecture fundamentals. The 200K gate capacity supports meaningful student projects such as CPU cores, peripheral controllers, and image-processing pipelines. Courseware still references FLEX 10K because Altera's QUARTUS MAX+PLUS II legacy design flow remains pedagogically simple. For new university procurement, modern Cyclone IV or Cyclone 10 LP kits are recommended, but FLEX 10K boards persist in second-hand laboratory inventories.
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추천 제품 요약
엔지니어링 참조 데이터: EPF10K200SFC484-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K200SFC484-2X | EPF10K200SFC484-1 | EPF10K130EFC484-3 | EPF10K130EFC484-2 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-FBGA FineLine BGA (23x23 mm) | 484-FBGA FineLine BGA (same) | 484-FBGA FineLine BGA (same) | 484-FBGA FineLine BGA (same) | 484-FBGA FineLine BGA (same) |
| Family | FLEX 10KS | FLEX 10KS | FLEX 10KS | FLEX 10KE (enhanced) | FLEX 10KE (enhanced) |
| System Gates | 200,000 | 200,000 | 200,000 | 130,000 | 130,000 |
| Speed Grade | -2 | -2 | -1 (slower) | -3 (slower) | -2 |
| Lead-Free / RoHS | Yes (RoHS compliant) | Yes (RoHS compliant) | Non-RoHS | Non-RoHS | Non-RoHS |
| Logic Density vs Target | 100% | 100% | 100% | 65% | 65% |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- 200K gates (vs 130K) at the same 484-ball FineLine BGA footprint (vs EPF10K130EFC484-3)
- RoHS/lead-free compliance for EU export markets (vs EPF10K200SFC484-1)
- Speed grade -2 propagation delay of 0.4 ns enables 200 MHz internal Fmax (vs EPF10K200SFC484-1)
설계 노트
The EPF10K200SFC484-2 requires a 2.5V core supply (VCCINT) with tight regulation (2.375V to 2.625V); use an LDO or DC-DC converter with at least 2A capacity for the core alone. Each VCCIO bank is independently powered at 2.5V/3.3V or 5V; budget 500 mA per active bank under heavy I/O switching. Decoupling follows Altera's reference: 100 nF X7R ceramic on every VCCINT and VCCIO pin plus 10 uF bulk tantalum per supply plane. Inrush during configuration peaks at approximately 1.5A; ensure the regulator maintains monotonic ramp-up.
The 484-ball FineLine BGA uses a 1.0 mm pitch on a 23 x 23 mm footprint, requiring HDI PCB stack-up with microvias for signal escape. Recommended: 6-layer board with 4 routing layers, 4 mil trace/space, and laser-drilled microvias on inner pads. Matched-length routing for clock pairs is mandatory - skew should be <50 ps for any single clock domain. Provide a continuous ground pour beneath the BGA for thermal dissipation and return-current continuity. JTAG chain signal integrity requires series-damping resistors on TMS/TDI/TCK within 25 mm of the FPGA.
Although the FLEX 10KS is not high-power, sustained toggling of all 369 I/Os at 50 MHz can dissipate 1.5-2.0 W. With theta_JA around 18 C/W on a JEDEC 4-layer test board, this yields a junction temperature rise of 27-36 C above ambient. Mount within a chassis that maintains ambient below 50 C so the junction remains under the 85 C commercial limit. Thermal vias under the center balls (within the depopulated grid region) improve heat transfer; at least 9 thermal vias on a 1.2 mm pitch are recommended per Altera thermal management guidelines.
Configure the EPF10K200SFC484-2 via the EPC2 or EPC8 configuration device, JTAG (IEEE 1149.1), or microcontroller-driven PS (Passive Serial) mode. For production boards, place the EPC configuration flash within 50 mm of the FPGA to keep the DCLK trace length manageable. JTAG chain: TMS, TDI, TDO, TCK all require 10 kohm pull-ups to VCCIO_3V3 for reliable operation; TDO is high-impedance during configuration and must be buffered if observed by a tester. Use the nCONFIG pin to delay configuration during power-rail sequencing.
Common pitfalls: (1) Using FLEX 10KE (E-suffix) libraries instead of FLEX 10KS (S-suffix) - the E family removes some EABs and changes interconnect; verify timing closure. (2) Mixing 5V and 3.3V on the same I/O bank - each VCCIO pin supports only one voltage per bank. (3) Driving JTAG signals from 5V logic without level shifters - VCCIO of the JTAG bank must match the driver voltage. (4) Confusing FLEX 10K FPGAs with FLEX 10KA/10KE die variants - SameFrame pin migration is only guaranteed between certain density steps (verify against the Altera SameFrame Pin Migration Table).
규정 준수 정보
EPF10K200SFC484-2 is RoHS compliant and lead-free per Altera (Intel) product marking. Not AEC-Q100 qualified (commercial grade only, 0C to 70C). REACH compliance inferred from manufacturer declaration; verify with Intel PSG for current SVHC list status. Halogen-free status not published in datasheet excerpts provided.
