EPF10K250EFC672-1 - 250K Gates FPGA, 470 I/O, 672-BGA | Intel
부품 번호: EPF10K250EFC672-1 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 250 | $128 | $32,000.00 |
| 500 | $115 | $57,500.00 |
EPF10K250EFC672-1 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing engineers to implement custom digital logic that can be re-programmed multiple times. FPGAs sit within the broader programmable logic device (PLD) hierarchy - between simple PAL/GAL devices and full ASICs - and belong to the FLEX 10KE sub-family which Intel (originally Altera) launched in the late 1990s as a cost-optimized variant with embedded array blocks (EABs) for distributed SRAM. The FLEX 10KE family bridged the gap between the original FLEX 10K and the APEX 20K, offering improved logic capacity and routing architecture.
Key specifications of the EPF10K250EFC672-1 include 250,000 typical gates, 12,160 logic elements, 470 maximum user I/Os, 672 balls in a 45 x 45 mm BGA package at 1.27 mm pitch, and an embedded array block architecture supporting distributed synchronous SRAM. The device supports in-system programmability via a serial configuration interface and operates from a 3.3 V core supply with multi-voltage I/O support. CMOS technology and a propagation delay figure of approximately 0.4 ns per logic element underpin the device's logic performance envelope.
Architecturally, the FLEX 10KE combines a sea-of-logic fabric of look-up-table-based logic elements (LEs) with embedded array blocks (EABs) that can implement dual-port RAM, ROM, or large finite state machines. Each EAB provides up to 4 Kbits of memory, and the dedicated high-speed interconnect provides four-level hierarchy routing for predictable timing closure.
Typical applications of the EPF10K250EFC672-1 include telecom line cards, industrial control logic, glue logic replacement, custom peripheral controllers, prototyping for ASICs, and DSP pre/post-processing. With 470 I/Os it can interface directly to wide parallel buses, memory subsystems, and backplane connectors without external bus drivers.
When designing with this part, ensure signal integrity simulation on the 1.27 mm pitch BGA escapes is performed early, since the 672-ball package requires careful PCB stackup and via-in-pad or microvia technology for fan-out. Power sequencing of the 3.3 V core and I/O banks must follow the datasheet to avoid latch-up.
This page synthesizes distributor stock, BGA-package alternatives, and practical PCB layout guidance for engineers maintaining legacy FLEX 10KE designs where the original Altera tooling chain (MAX+PLUS II or Quartus) remains in use.
드롭인 대체품: EPF10K250EFC672-1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K250EFC672-1 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Process Technology, Package, Logic Array Blocks (LABs), RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K250EFC672-2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$108 / 개
데이터시트 보기 →EPF10K250EFC672-3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$99.5 / 개
데이터시트 보기 →EPF10K200EFC672-3
✅ 드롭인✓ 재고 있음
$115 / 개
데이터시트 보기 →EPF10K200EFC672-2
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EPF10K200EFC672-1
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EPF10K200SFC672-1
✅ 드롭인✓ 재고 있음
$138.75 / 개
데이터시트 보기 →EPF10K130EFC672-2
✅ 드롭인✓ 재고 있음
$61.75 / 개
데이터시트 보기 →EPF10K250EFC672-1 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Logic Family | CMOS |
| Typical System Gates | 250,000 |
| Maximum User I/Os | 470 |
| Total Pins | 672 |
| Package Type | BGA-672 |
| Package Size | 45 x 45 mm |
| Ball Pitch | 1.27 mm |
| Package Shape | Square |
| Terminal Form | Ball |
| 동작 온도 | 0C to +70C (Commercial) |
| Propagation Delay | 0.4 ns |
| Programming Technology | In-system, SRAM-based |
| 실장 유형 | Surface Mount |
| Configuration Interface | Serial (passive/active) |
| Speed Grade | -1 |
EPF10K250EFC672-1 square 핀 구성 가이드
EPF10K250EFC672-1(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K250EFC672-1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K250EFC672-1 적합 용도: 6 애플리케이션s: Telecom Line Card Glue Logic, Industrial Control and Machine Automation, ASIC Prototyping and Emulation, Legacy DSP Pre/Post-Processing, Custom Peripheral Controller, Test and Measurement Backplane.
Telecom Line Card Glue Logic
The EPF10K250EFC672-1 is well-suited to telecom line card applications where high gate count is needed to implement protocol conversion, framer interfacing, and bus arbitration. Its 470 user I/Os allow direct connection to UTOPIA, POS-PHY, and HMI bus interfaces without external glue. The FLEX 10KE EABs provide dual-port RAM for cell buffering at line rates up to STS-12. The 672-BGA footprint supports controlled-impedance routing required for telecom backplane signaling, while SRAM-based programmability enables field firmware updates for protocol upgrades.
추천
Industrial Control and Machine Automation
In industrial automation, the EPF10K250EFC672-1 functions as a programmable logic controller front-end with custom timing, encoder interfacing, and safety logic. Its 470 I/Os accept large numbers of digital inputs from limit switches, photoelectric sensors, and motor encoders simultaneously. The commercial 0C-70C temperature range covers most factory-floor enclosures. The device's embedded array blocks implement deterministic state machines for motion control loops with predictable propagation delays.
추천
ASIC Prototyping and Emulation
Engineers use the EPF10K250EFC672-1 as an ASIC prototype vehicle because its 250K gate capacity can hold moderate-complexity ASIC designs running at near-ASIC clock rates. The 470 I/Os expose wide buses for direct ASIC pin mapping. In-system programmability allows iterative design changes during RTL bring-up. The FLEX 10KE timing model correlates closely with ASIC synthesis results, providing early signal-integrity feedback.
추천
Legacy DSP Pre/Post-Processing
The EPF10K250EFC672-1 implements pre/post-processing logic around a dedicated DSP chip, including FFT windowing, FIR filter coefficient loading, and DMA channel management. Its EABs store coefficient tables enabling programmable FIR taps without external memory. The 470 I/Os accept wide parallel data streams from the DSP host port. SRAM configuration allows coefficient updates in the field for algorithm refinement.
추천
Custom Peripheral Controller
Designers integrate legacy ISA, VME, or proprietary peripheral buses by mapping control registers and timing logic into the EPF10K250EFC672-1's logic fabric. The 470 I/Os handle parallel bus signals and interrupt lines simultaneously. EABs implement bus-master DMA engines without external logic. The BGA-672 footprint supports compact add-in card form factors.
추천
Test and Measurement Backplane
ATE platforms use the EPF10K250EFC672-1 to implement pattern generators, comparator logic, and timing calibration across hundreds of test channels. The 470 I/Os are sufficient for parallel test access to multiple DUTs. EABs implement deep pattern FIFOs. The commercial temperature range matches laboratory environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K250EFC672-1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K250EFC672-2 | EPF10K250EFC672-3 | EPF10K200EFC672-1 | EPF10K130EFC672-2 |
|---|---|---|---|---|---|
| Package | BGA-672 (672-ball) | BGA-672 (same) | BGA-672 (same) | BGA-672 (same) | BGA-672 (same) |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Typical System Gates | 250,000 | 250,000 | 250,000 | 200,000 | 130,000 |
| Speed Grade | -1 (fastest) | -2 | -3 | -1 | -2 |
| Maximum User I/Os | 470 | 470 | 470 | 470 | 470 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Operating Temperature | 0C to 70C (Commercial) | 0C to 70C | 0C to 70C | 0C to 70C | 0C to 70C |
주요 차별점
- Highest capacity member of the FLEX 10KE family with -1 speed grade (vs EPF10K200EFC672-1)
- Pin-to-pin drop-in across the FLEX 10KE 672-BGA family (vs EPF10K250EBC600-3)
- Maximizes timing margins versus slower grades (vs EPF10K250EFC672-3)
설계 노트
The 672-ball BGA at 1.27 mm pitch requires at least a 6-layer PCB with 0.4 mm via diameter and either microvia (laser-drilled) or via-in-pad technology for the inner rows. A standard 1.6 mm FR-4 stackup with 0.2 mm dielectric cores can escape a 1.27 mm pitch BGA only with HDI microvia processes. Designers should perform signal-integrity simulation on the breakout and avoid routing signals between BGA balls to maintain manufacturing yield above 95 percent.
FLEX 10KE devices require careful power sequencing: the 3.3 V core supply must rise within 100 ms of the 2.5 V auxiliary supply to avoid latch-up. Bulk decoupling needs at least 100 uF of low-ESR tantalum or polymer caps plus 0.1 uF and 0.01 uF ceramic decoupling per VCC pin group. Estimated: a fully utilized EPF10K250EFC672-1 at 100 MHz internal clock can draw up to 800 mA from the 3.3 V rail, requiring thermal relief copper pours of at least 4 square inches.
Configuration data is volatile - SRAM-based FLEX 10KE FPGAs lose their configuration on power-down and must be reconfigured from a serial configuration EPROM (EPC2, EPC8, EPC16) or a microcontroller at every power-up. Designers should plan for a configuration controller and consider dual-boot images for field-recoverable systems. JTAG boundary-scan (IEEE 1149.1) is supported but requires careful handling of the TRST and TCK pins per the FLEX 10KE handbook.
규정 준수 정보
Compliance data was not available in the verified web sources; legacy Altera FLEX 10KE parts were typically Pb-free and RoHS-compliant by mid-2000s. AEC-Q100 is not applicable for commercial-grade FPGAs.
