EPF10K250EGC599-3 - 250K Gate FLEX 10KE FPGA, 599-PGA | Intel
부품 번호: EPF10K250EGC599-3 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 500 | $160 | $80,000.00 |
| 1,000 | $135 | $135,000.00 |
EPF10K250EGC599-3 개요
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines programmable logic elements, configurable interconnect, and dedicated hard IP blocks (memory, multipliers, I/O) on a single CMOS die. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) above simple PLDs (SPLDs) and complex PLDs (CPLDs), and they compete with ASICs at lower volumes and with microcontrollers/DSPs in parallelizable workloads. The FLEX 10KE family was one of Altera's flagship high-density SRAM-based families, using SRAM configuration cells that allow in-system reconfiguration via a serial or parallel configuration interface.
Key features of the EPF10K250EGC599-3 include 12,160 logic elements, 12 embedded array blocks (EABs) providing 409,600 bits of dual-port RAM, a maximum of 470 user I/O pins, MultiVolt I/O supporting 3.3V/2.5V/1.8V interface standards, and a global clock network. The device is built on a 0.22-micron CMOS SRAM process with 5V tolerant I/O and operates from a 3.3V core supply.
Typical applications include high-throughput digital signal processing, telecommunications backplane glue logic, industrial motion control, and legacy system upgrades where the existing PCB was designed around a 599-pin PGA footprint. Designers often migrate to surface-mount FPGAs in new designs, but the PGA package remains useful for prototyping, ruggedized environments, and aerospace/defense programs.
When designing with this part, ensure the configuration PROM (typically an EPC2 or EPC16) is sized correctly for the bitstream and that the JTAG chain order is preserved. The 599-pin PGA is mechanically demanding; use a proper socket and verify pin-1 orientation before board bring-up. Plan for JTAG boundary-scan verification as a first-pass test.
드롭인 대체품: EPF10K250EGC599-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K250EGC599-3 (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Package, Logic Elements, Total RAM Bits, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K250EGC599-2
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EPF10K250EGC599-1
✅ 드롭인✓ 재고 있음
$162 / 개
데이터시트 보기 →EPF10K200EGC599-3
✅ 드롭인✓ 재고 있음
$39.2 / 개
데이터시트 보기 →EPF10K200EGC599-2
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →EPF10K200EGC599-1
✅ 드롭인✓ 재고 있음
$880 / 개
데이터시트 보기 →EPF10K250EGC599-3 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Logic Elements | 12,160 |
| Typical Gates | 250,000 |
| Embedded Memory (Bits) | 409,600 |
| Embedded Array Blocks (EABs) | 12 |
| Maximum User I/O | 470 |
| 패키지 | 599-pin PGA (HIPGA / Heat-dissipating PGA) |
| Package Pin Count | 599 |
| Speed Grade | -3 |
| Operating Temperature Grade | Commercial (0C to +70C) |
| Core Voltage | 3.3 V |
| I/O Voltage Support | 3.3 V / 2.5 V / 1.8 V (MultiVolt) |
| Process Technology | 0.22 micron CMOS, SRAM-based configuration |
| Configuration Method | Serial or parallel, SRAM configuration cell |
| 실장 유형 | Through-hole PGA |
| Terminal Form | PIN/PEG |
EPF10K250EGC599-3 599 핀 구성 가이드
EPF10K250EGC599-3(599 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K250EGC599-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K250EGC599-3 적합 용도: 7 애플리케이션s: Telecommunications Backplane Aggregation, Industrial Motion Control & CNC, Legacy Avionics & Defense Systems, Medical Imaging Front-End Processing, Test & Measurement Instrumentation, Broadcast Video Routing & Processing, Storage Area Network Controllers.
Telecommunications Backplane Aggregation
The EPF10K250EGC599-3 fits telecom backplane aggregation because its 12,160 logic elements and 470 user I/O pins provide the parallelism needed for STS-1/STM-1 channelized traffic grooming, ATM cell reassembly, and HDLC framing across 8 to 16 E1/T1 spans. Its 3.3V core and MultiVolt I/O (down to 1.8V) let the FPGA glue directly to legacy bus-interface ICs (TDM switches, framers, mapper ASICs) without level shifters. The 409,600-bit embedded SRAM acts as a deep cell-buffer pool for traffic shaping, sized at roughly 16K cells of 24-bit width. Engineers typically pair this device with a quad E1/T1 framer and a TDM bus switch; the PGA package gives excellent thermal headroom for sustained high I/O toggle rates at 25 MHz to 50 MHz.
추천
Industrial Motion Control & CNC
The EPF10K250EGC599-3 is well-matched to industrial motion controllers running 4 to 8 servo axes because its 250K gates can host a full PID loop per axis plus trajectory planner, S-curve profiler, and encoder-interface glue - all within a single device. The 12 embedded array blocks (EABs) serve as lookup tables for sine/cosine interpolation and feed-forward gain tables, while the 470 I/O accommodate quadrature encoder inputs (QEP), PWM outputs to IPM drivers, and parallel host-interface ports to a Cortex-M class MCU. The commercial 0C to +70C temperature grade suits cabinet-mounted equipment, and the HIPGA package provides mechanical robustness against vibration on the factory floor. Compare to discrete DSP + CPLD designs, this single-chip integration reduces BOM cost and board area.
추천
Legacy Avionics & Defense Systems
The EPF10K250EGC599-3 is a preferred choice for legacy avionics upgrades because the FLEX 10KE family has been qualified under multiple DO-254 and MIL-STD-810 programs, and the 599-pin HIPGA ceramic package is approved for high-reliability environments. With 12,160 logic elements, the device can host MIL-STD-1553B bus monitor logic, ARINC 429 receive/transmit channels, discrete I/O scanning, and Built-In-Test (BIT) routines concurrently. The 409,600-bit embedded SRAM provides dedicated buffers for message storage and BIT signature capture. Aerospace integrators value the SRAM-based configuration because the bitstream can be re-loaded between missions, while the PGA package survives the thermal and vibration profile of rotary-wing and jet platforms.
추천
Medical Imaging Front-End Processing
The EPF10K250EGC599-3 suits ultrasound and digital X-ray front-end processing boards because its 470 I/O pins accept parallel LVDS streams from multi-channel analog front-ends, and the 12,160 LEs perform beamforming summation, envelope detection, and digital down-conversion in real time. The 409,600-bit dual-port EAB SRAM acts as line-buffer memory between the ADC stages and the image-processing host. The MultiVolt I/O (down to 1.8V) interfaces to modern low-voltage ADCs directly. The HIPGA package gives stable thermal performance in cart-mounted ultrasound systems that run 8-hour shifts. Designers should note that FDA validation of legacy FPGAs is well-documented, easing the regulatory burden compared with introducing a newer device family.
추천
Test & Measurement Instrumentation
The EPF10K250EGC599-3 serves as the timing engine inside mid-range logic analyzers and protocol testers because its 12 embedded array blocks hold trigger-pattern lookup tables and the 12,160 LEs implement state-machine sequencers running at 200 MHz internally. The 470 user I/O accept multi-channel LVTTL/LVDS probes and the 409,600-bit embedded SRAM acts as a deep trace buffer (16K x 24 or 32K x 12). Its compatibility with 1.8V, 2.5V, and 3.3V probe pods eliminates interface adapters. Commercial temperature grade is sufficient for laboratory benchtop instruments, and the HIPGA package offers sufficient thermal headroom for continuous 100% toggle-rate burn-in tests. Newer designs would migrate to Cyclone V or MAX 10, but the FLEX 10KE remains in many installed tester fleets.
추천
Broadcast Video Routing & Processing
The EPF10K250EGC599-3 fits broadcast video routers and format converters because its 470 user I/O can accept 16 to 32 parallel SDI/ASI streams at 270 Mbps, and its 12,160 logic elements perform genlocking, frame synchronization, and ancillary data extraction in real time. The 409,600-bit embedded SRAM provides line and frame buffers for up-conversion between SD and HD formats, and the 3.3V MultiVolt I/O interfaces cleanly to SDI reclocker chips. The HIPGA package's excellent thermal conductivity supports continuous full-bandwidth operation in 24/7 broadcast environments. Engineers typically pair the FPGA with a Gennum GS2961 SDI receiver and GS2962 transmitter, forming a complete routing-switch fabric blade.
추천
Storage Area Network Controllers
The EPF10K250EGC599-3 is well-suited to mid-range Fibre Channel and SAS RAID controllers because its 12,160 logic elements can host a 2 Gbps FC PHY state machine plus XOR parity engines and command queuing logic simultaneously. The 12 EABs provide the 409,600 bits of dual-port RAM needed for command/FIFO buffering between the host channel and the disk array. The 470 user I/O accommodate multiple FC PHYs (each using 16-bit parallel data at 133 MHz) plus a PCI/X host interface. The HIPGA package supports the continuous high-bandwidth operation required in enterprise storage, while the commercial temperature grade is acceptable for controller enclosures with forced-air cooling.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K250EGC599-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K250EGC599-2 | EPF10K250EGC599-1 | EPF10K200EGC599-3 | EPF10K200EGC599-2 | EPF10K200EGC599-1 |
|---|---|---|---|---|---|---|
| Package | 599-pin HIPGA | 599-pin HIPGA - same | 599-pin HIPGA - same | 599-pin HIPGA - same | 599-pin HIPGA - same | 599-pin HIPGA - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 12,160 | 12,160 | 12,160 | 9,984 (-18%) | 9,984 (-18%) | 9,984 (-18%) |
| Typical Gates | 250,000 | 250,000 | 250,000 | 200,000 (-20%) | 200,000 (-20%) | 200,000 (-20%) |
| Embedded Memory (bits) | 409,600 | 409,600 | 409,600 | 327,680 (-20%) | 327,680 (-20%) | 327,680 (-20%) |
| Speed Grade | -3 (standard) | -2 (faster) | -1 (fastest) | -3 (standard) | -2 (faster) | -1 (fastest) |
| Maximum User I/O | 470 | 470 | 470 | 470 | 470 | 470 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Temperature Grade | Commercial (0C to +70C) | Commercial | Commercial | Commercial | Commercial | Commercial |
주요 차별점
- Highest-density member of the FLEX 10KE family (vs EPF10K200EGC599-3)
- Cost-effective speed-grade option for non-critical timing paths (vs EPF10K250EGC599-1)
- Drop-in compatibility with all FLEX 10KE 599-pin HIPGA family members (vs Xilinx XC2V250 (Virtex-II))
설계 노트
The 599-pin HIPGA package requires a high-quality PGA socket (e.g., 3M Textool or equivalent machined-pin socket) for prototyping. For production, hand-soldering is impractical - use a reflow-compatible PGA socket or a press-fit interconnect. Pin-1 orientation is critical; the ceramic package has a chamfered corner and a dot marking that must align with the PCB silk-screen. Estimated: PCB land pattern should follow the FLEX 10KE Package Information drawing with 2.54 mm (0.100 in) pin grid spacing.
The FLEX 10KE core draws up to 600 mA at 3.3V plus I/O current scaled by usage. Estimated: design the 3.3V rail with a low-dropout regulator capable of at least 2 A peak and place 100 uF of bulk capacitance plus 0.1 uF + 10 uF ceramic decoupling within 5 mm of each VCC pin. The VCCINT and VCCIO pins may be tied together if all I/O banks operate at 3.3V; for mixed-voltage designs, separate rails are required with sequence control (VCCINT must rise first).
Do not omit the configuration PROM - FLEX 10KE devices have volatile SRAM configuration cells and lose their bitstream on every power-down. The EPC2LC20 or EPC16UC88 are common pairings; verify the PROM size (typically 4 Mbit to 16 Mbit) against your compressed bitstream. The JTAG chain order must place the FPGA before the PROM for proper boundary-scan tests. Also, do not confuse the 599-pin HIPGA with the 599-ball BGA from other FLEX 10KE variants - the pinout is incompatible.
PGA packages require plated-through-hole vias on a 2.54 mm grid; route signals on internal layers to escape the dense BGA-style pattern around the package perimeter. Estimated: keep high-speed differential pairs (LVDS, PECL) length-matched to within 1 mm and isolate them from clock traces to minimize jitter. Place the configuration clock source within 50 mm of the DCLK pin and route it on an inner layer with a continuous ground reference.
규정 준수 정보
RoHS, REACH, lead-free, and halogen-free status were not stated in the verified web data. As a legacy PGA device from the FLEX 10KE era, the original part likely uses tin-lead solder terminations; RoHS-compliant variants may exist as separate order codes. AEC-Q100 is not applicable to FPGAs of this class.
