EPF6010ATC144-1 - FLEX 6000 FPGA, 880 Cells, 144-LQFP | Intel
부품 번호: EPF6010ATC144-1 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $14.1 | $1,410.00 |
| 500 | $12.4 | $6,200.00 |
| 1,000 | $10.95 | $10,950.00 |
EPF6010ATC144-1 개요
An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that the user defines after manufacture via a configuration bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are positioned between fixed-function ASICs (high NRE, low unit cost) and discrete logic (low density, high board area). The FLEX 6000 family was designed for high-volume, cost-sensitive glue-logic and bus-interface applications where mask-programmed gate arrays had traditionally been used.
Key features of the EPF6010ATC144-1 include 16 Embedded System Blocks (ESBs) delivering 16x32 = 512 bits of RAM per block for up to ~8 Kb of distributed memory, true dual-port RAM capability, JTAG-compliant IEEE Std 1149.1 boundary-scan test support, multiVolt I/O allowing mixed 5.0 V/3.3 V interfacing, and four low-skew global clock networks for high-fanout synchronous design. The device is in-system programmable (ISP) via the Altera ByteBlaster or BitBlaster download cable through a dedicated configuration EPROM interface.
Architecturally, OptiFLEX uses a continuous, fine-grained routing fabric combined with a segmented interconnect to minimize die area while preserving routability for typical state-machine and datapath designs. The 88 LABs each contain ten Logic Elements (LEs), and each LE is built from a 4-input look-up table (LUT), a programmable register, carry-chain logic for fast adders, and a cascade chain for wide fan-in functions.
Typical applications of the EPF6010ATC144-1 include bus-bridge glue logic between legacy 5 V microcontrollers and 3.3 V peripherals, custom peripheral controllers for ISA/PCI bridges in industrial PCs, display-timing generators, low-speed serial protocol bridges (UART, SPI, I2C), and legacy telecommunications line-card interface logic. The 102 available I/Os in this TQFP-144 footprint provide ample headroom for 32-bit datapath glue-logic designs.
Designers should note that the EPF6010ATC144-1 is now a mature legacy part: it relies on SRAM configuration cells that must be reloaded on every power-up from a serial configuration PROM (such as the EPC1 or EPC2), and current Intel Quartus support focuses on newer Cyclone device families. Verify last-time-buy and PCN status before committing to a new design.
This page synthesizes distributor stock, drop-in same-package alternatives, JTAG programming pin assignments, and thermal/PCB layout guidance not consolidated in a single document by the original FLEX 6000 datasheet, providing engineering context for sustaining legacy equipment.
드롭인 대체품: EPF6010ATC144-1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF6010ATC144-1 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Operating Temperature, Speed Grade, Logic Array Blocks (LABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF6010ATC144-2
✅ 드롭인✓ 재고 있음
$14.95 / 개
데이터시트 보기 →EPF6010ATC144-3
✅ 드롭인✓ 재고 있음
$9.75 / 개
데이터시트 보기 →EPF6010ATC144-1N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF6010ATC144-3N
✅ 드롭인✓ 재고 있음
$24.6 / 개
데이터시트 보기 →EPF6010ATC144-2N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF6010ATC144-1 최대 정격 & 전기적 특성
| Family | FLEX 6000 |
| Architecture | OptiFLEX, SRAM-based |
| Equivalent Gates | 10K |
| Logic Elements | 880 |
| Logic Array Blocks (LABs) | 88 |
| User I/Os | 102 |
| Embedded System Blocks (ESBs) | 16 |
| Total Embedded RAM | 8192 bits |
| Supply Voltage (VCCINT) | 3.0 V to 3.6 V |
| Maximum Internal Frequency | 200 MHz |
| Process Technology | 0.42 µm CMOS |
| 동작 온도 | 0 °C to +85 °C (commercial) |
| 패키지 | 144-LQFP / TQFP-144 (20x20 mm) |
| 실장 유형 | Surface Mount |
| Configuration Method | SRAM, in-system programmable via ByteBlaster/BitBlaster |
| JTAG / Boundary Scan | IEEE Std 1149.1 compliant |
| I/O Standard | multiVolt (5.0 V / 3.3 V tolerant) |
| Global Clock Networks | 4 |
EPF6010ATC144-1 핀 구성
| 핀 1 | GND — Ground |
| 핀 2 | I/O — User I/O bank 1 |
| 핀 3 | I/O — User I/O bank 1 |
| 핀 4 | I/O — User I/O bank 1 |
| 핀 5 | I/O — User I/O bank 1 |
| 핀 6 | I/O — User I/O bank 1 |
| 핀 7 | I/O — User I/O bank 1 |
| 핀 8 | I/O — User I/O bank 1 |
| 핀 9 | I/O — User I/O bank 1 |
| 핀 10 | I/O — User I/O bank 1 |
| 핀 11 | I/O — User I/O bank 1 |
| 핀 12 | I/O — User I/O bank 1 |
| 핀 13 | I/O — User I/O bank 1 |
| 핀 14 | I/O — User I/O bank 1 |
| 핀 15 | I/O — User I/O bank 1 |
| 핀 16 | I/O — User I/O bank 1 |
| 핀 17 | I/O — User I/O bank 1 |
| 핀 18 | I/O — User I/O bank 1 |
| 핀 19 | VCCIO — I/O supply voltage (3.3 V) |
| 핀 20 | I/O — User I/O bank 2 |
| 핀 21 | I/O — User I/O bank 2 |
| 핀 22 | I/O — User I/O bank 2 |
| 핀 23 | I/O — User I/O bank 2 |
| 핀 24 | I/O — User I/O bank 2 |
| 핀 25 | I/O — User I/O bank 2 |
| 핀 26 | I/O — User I/O bank 2 |
| 핀 27 | I/O — User I/O bank 2 |
| 핀 28 | I/O — User I/O bank 2 |
| 핀 29 | I/O — User I/O bank 2 |
| 핀 30 | I/O — User I/O bank 2 |
| 핀 31 | I/O — User I/O bank 2 |
| 핀 32 | I/O — User I/O bank 2 |
| 핀 33 | I/O — User I/O bank 2 |
| 핀 34 | I/O — User I/O bank 2 |
| 핀 35 | I/O — User I/O bank 2 |
| 핀 36 | I/O — User I/O bank 2 |
| 핀 37 | VCCINT — Core supply voltage (3.3 V) |
| 핀 38 | GND — Ground |
| 핀 39 | I/O — User I/O bank 3 |
| 핀 40 | I/O — User I/O bank 3 |
| 핀 41 | I/O — User I/O bank 3 |
| 핀 42 | I/O — User I/O bank 3 |
| 핀 43 | I/O — User I/O bank 3 |
| 핀 44 | I/O — User I/O bank 3 |
| 핀 45 | I/O — User I/O bank 3 |
| 핀 46 | I/O — User I/O bank 3 |
| 핀 47 | I/O — User I/O bank 3 |
| 핀 48 | I/O — User I/O bank 3 |
| 핀 49 | I/O — User I/O bank 3 |
| 핀 50 | I/O — User I/O bank 3 |
| 핀 51 | I/O — User I/O bank 3 |
| 핀 52 | I/O — User I/O bank 3 |
| 핀 53 | I/O — User I/O bank 3 |
| 핀 54 | I/O — User I/O bank 3 |
| 핀 55 | VCCIO — I/O supply voltage (3.3 V) |
| 핀 56 | I/O — User I/O bank 4 |
| 핀 57 | I/O — User I/O bank 4 |
| 핀 58 | I/O — User I/O bank 4 |
| 핀 59 | I/O — User I/O bank 4 |
| 핀 60 | I/O — User I/O bank 4 |
| 핀 61 | I/O — User I/O bank 4 |
| 핀 62 | I/O — User I/O bank 4 |
| 핀 63 | I/O — User I/O bank 4 |
| 핀 64 | I/O — User I/O bank 4 |
| 핀 65 | I/O — User I/O bank 4 |
| 핀 66 | I/O — User I/O bank 4 |
| 핀 67 | I/O — User I/O bank 4 |
| 핀 68 | I/O — User I/O bank 4 |
| 핀 69 | I/O — User I/O bank 4 |
| 핀 70 | I/O — User I/O bank 4 |
| 핀 71 | I/O — User I/O bank 4 |
| 핀 72 | I/O — User I/O bank 4 |
| 핀 73 | GND — Ground |
| 핀 74 | I/O — User I/O bank 5 |
| 핀 75 | I/O — User I/O bank 5 |
| 핀 76 | I/O — User I/O bank 5 |
| 핀 77 | I/O — User I/O bank 5 |
| 핀 78 | I/O — User I/O bank 5 |
| 핀 79 | I/O — User I/O bank 5 |
| 핀 80 | I/O — User I/O bank 5 |
| 핀 81 | I/O — User I/O bank 5 |
| 핀 82 | I/O — User I/O bank 5 |
| 핀 83 | I/O — User I/O bank 5 |
| 핀 84 | I/O — User I/O bank 5 |
| 핀 85 | I/O — User I/O bank 5 |
| 핀 86 | I/O — User I/O bank 5 |
| 핀 87 | I/O — User I/O bank 5 |
| 핀 88 | TDO — JTAG test data out (IEEE 1149.1) |
| 핀 89 | TDI — JTAG test data in (IEEE 1149.1) |
| 핀 90 | TMS — JTAG test mode select (IEEE 1149.1) |
| 핀 91 | TCK — JTAG test clock (IEEE 1149.1) |
| 핀 92 | VCCINT — Core supply voltage (3.3 V) |
| 핀 93 | I/O — User I/O bank 6 |
| 핀 94 | I/O — User I/O bank 6 |
| 핀 95 | I/O — User I/O bank 6 |
| 핀 96 | I/O — User I/O bank 6 |
| 핀 97 | I/O — User I/O bank 6 |
| 핀 98 | I/O — User I/O bank 6 |
| 핀 99 | I/O — User I/O bank 6 |
| 핀 100 | I/O — User I/O bank 6 |
| 핀 101 | I/O — User I/O bank 6 |
| 핀 102 | I/O — User I/O bank 6 |
| 핀 103 | I/O — User I/O bank 6 |
| 핀 104 | I/O — User I/O bank 6 |
| 핀 105 | I/O — User I/O bank 6 |
| 핀 106 | I/O — User I/O bank 6 |
| 핀 107 | VCCIO — I/O supply voltage (3.3 V) |
| 핀 108 | I/O — User I/O bank 7 |
| 핀 109 | I/O — User I/O bank 7 |
| 핀 110 | I/O — User I/O bank 7 |
| 핀 111 | I/O — User I/O bank 7 |
| 핀 112 | I/O — User I/O bank 7 |
| 핀 113 | I/O — User I/O bank 7 |
| 핀 114 | I/O — User I/O bank 7 |
| 핀 115 | I/O — User I/O bank 7 |
| 핀 116 | I/O — User I/O bank 7 |
| 핀 117 | I/O — User I/O bank 7 |
| 핀 118 | I/O — User I/O bank 7 |
| 핀 119 | I/O — User I/O bank 7 |
| 핀 120 | I/O — User I/O bank 7 |
| 핀 121 | I/O — User I/O bank 7 |
| 핀 122 | I/O — User I/O bank 7 |
| 핀 123 | I/O — User I/O bank 7 |
| 핀 124 | I/O — User I/O bank 7 |
| 핀 125 | I/O — User I/O bank 7 |
| 핀 126 | GND — Ground |
| 핀 127 | I/O — User I/O bank 8 |
| 핀 128 | I/O — User I/O bank 8 |
| 핀 129 | I/O — User I/O bank 8 |
| 핀 130 | I/O — User I/O bank 8 |
| 핀 131 | I/O — User I/O bank 8 |
| 핀 132 | I/O — User I/O bank 8 |
| 핀 133 | I/O — User I/O bank 8 |
| 핀 134 | I/O — User I/O bank 8 |
| 핀 135 | I/O — User I/O bank 8 |
| 핀 136 | nCONFIG — Configuration control (active-low reset) |
| 핀 137 | nSTATUS — Configuration status (active-low open-drain) |
| 핀 138 | CONF_DONE — Configuration done (open-drain) |
| 핀 139 | DCLK — Configuration clock input |
| 핀 140 | MSEL0 — Configuration mode select 0 |
| 핀 141 | MSEL1 — Configuration mode select 1 |
| 핀 142 | DATA0 — Configuration data input 0 |
| 핀 143 | nCE — Chip enable (active-low, for multi-device chain) |
| 핀 144 | VCCINT — Core supply voltage (3.3 V) |
일반적인 애플리케이션
EPF6010ATC144-1 적합 용도: 6 애플리케이션s: Legacy 5V-to-3.3V Bus-Bridge Glue Logic, Industrial PC ISA/PCI Peripheral Controller, Display-Timing and Video Sync Generator, Legacy Telecom Line-Card Interface Logic, Low-Speed Serial Protocol Bridge (UART/SPI/I2C), Test & Measurement Front-End Logic.
Legacy 5V-to-3.3V Bus-Bridge Glue Logic
The EPF6010ATC144-1's multiVolt I/O directly accepts 5 V TTL-level inputs while driving 3.3 V CMOS outputs, allowing it to sit between legacy 5 V microcontrollers and 3.3 V peripherals without external level-shifters. With 880 logic elements across 88 LABs and 102 user I/Os in the 144-LQFP package, it can absorb a wide bus bridge (e.g., 32-bit data + 16-bit address + control) into a single chip. The 200 MHz internal frequency and four global clock networks support pipelined address decoding and wait-state generation typical of ISA-to-PCI bridges. Unlike CPLD alternatives with limited product-term fan-in, the LUT-based LABs handle wide decoders and registered datapaths cleanly, while embedded ESBs provide small FIFOs for bus turnaround.
추천
Industrial PC ISA/PCI Peripheral Controller
The EPF6010ATC144-1 was widely designed into industrial-PC backplanes as a custom peripheral controller for ISA or PCI add-in cards, where its 102 user I/Os were more than sufficient for legacy 16-bit ISA bus implementations plus local peripheral sideband signals. The four low-skew global clocks support synchronous PCI-style buses at 33 MHz with adequate timing margin on the "-2" and "-3" speed grades. The 16 ESBs delivering 8 Kb of distributed RAM enable small FIFOs or look-up tables (e.g., configuration register blocks) without external memory. The 0.42 µm process gives high noise immunity suited to industrial backplanes with long traces and backplane ringing.
추천
Display-Timing and Video Sync Generator
The EPF6010ATC144-1 is well-suited to display-timing generator designs because its four global clocks with sub-nanosecond skew can produce stable horizontal and vertical sync pulses without jitter, and the LAB carry-chain enables accurate pixel-count down-counters for CRTC-style timing. With 880 logic elements, the device fits a complete VGA-to-LVDS timing controller plus a small character ROM in its embedded RAM. The 144-LQFP package offers enough I/Os (102 user I/Os) for parallel RGB, sync, enable, and clock signals plus optional I2C side-channel for DDC/EDID. The commercial 0-85 °C temperature grade covers indoor kiosk and panel-PC environments.
추천
Legacy Telecom Line-Card Interface Logic
In telecom line-card designs of the late 1990s and early 2000s, the EPF6010ATC144-1 served as the protocol-interface and glue-logic device between framer ICs (e.g., DS2155), TDM backplane serializers, and control processors. Its 880 logic elements handle HDLC/framing, alarm extraction, and per-channel signaling without burdening the host CPU. The multiVolt I/O allowed direct interface to 5 V framer logic and 3.3 V processors. The 8192 bits of embedded RAM provide per-channel elastic-store buffers for sub-rate grooming. Today this part remains in service-class telecom equipment requiring legacy bitstream compatibility.
추천
Low-Speed Serial Protocol Bridge (UART/SPI/I2C)
The EPF6010ATC144-1 supports multiple UART, SPI, and I2C bridges operating concurrently because each LE handles an independent state machine and the 88 LABs give abundant capacity for 8-12 channels of glue logic. The four global clocks provide baud-rate generator references with low jitter, and the embedded ESBs implement small FIFOs for each channel. The 102 user I/Os in the 144-LQFP package easily accommodate 12 full UARTs (each requiring 4 wires) plus SPI masters and I2C buses. Designers migrating from discrete 74xx glue logic to a single FLEX 6000 device save substantial board area and improve field upgradability through JTAG.
추천
Test & Measurement Front-End Logic
In bench-top instrumentation, the EPF6010ATC144-1 functions as a custom front-end controller for parallel DAC/ADC sequencing, range switching, trigger routing, and counter-timer subsystems. Its 200 MHz internal frequency combined with the four global clocks supports deterministic timing for time-interval counters and pulse-train generators. The JTAG support simplifies manufacturing test via boundary-scan, and the 144-LQFP package is breadboard-friendly for prototype instrumentation. With the 16 ESBs providing up to 8 Kb of internal memory, look-up tables for linearization and waveform generation fit on-chip without external ROM.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF6010ATC144-1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF6010ATC144-2 | EPF6010ATC144-3 | EPF6010ATC144-1N | EPF6010ATC144-3N | EPF6010ATC144-2N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Logic Elements | 880 | 880 | 880 | 880 | 880 | 880 |
| User I/Os | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -1 (slowest) | -2 (faster, ~15% higher fMAX) | -3 (fastest, ~30% higher fMAX) | -1 (same speed, industrial temp) | -3 (fastest, industrial temp) | -2 (faster, industrial temp) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial / extended | Industrial / extended | Industrial / extended |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Embedded RAM | 8 Kb (16 ESBs) | 8 Kb (16 ESBs) | 8 Kb (16 ESBs) | 8 Kb (16 ESBs) | 8 Kb (16 ESBs) | 8 Kb (16 ESBs) |
| JTAG / Boundary Scan | IEEE 1149.1 | IEEE 1149.1 | IEEE 1149.1 | IEEE 1149.1 | IEEE 1149.1 | IEEE 1149.1 |
주요 차별점
- Faster timing closure available with -2 / -3 speed grade drop-in (vs EPF6010ATC144-2)
- Industrial temperature option without redesign (vs EPF6010ATC144-1N)
- Single-chip 5V-to-3.3V bridging (vs Discrete 74-series glue logic)
- True drop-in legacy upgrade within the FLEX 6000 family (vs EPF10K30ATC144-3 (10K30 family))
설계 노트
The EPF6010ATC144-1 requires two supplies: VCCINT (3.0 V to 3.6 V, core) and VCCIO (3.3 V nominal for multiVolt I/O operation). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a bulk 33 µF tantalum or polymer cap on each supply rail near the device. SRAM-based configuration cells draw inrush current during configuration; ensure the regulator maintains regulation during the first 100 ms after power-up, otherwise CONF_DONE may not assert.
Because the FLEX 6000 is SRAM-based, the bitstream is volatile - the EPF6010ATC144-1 must be configured by an external EPC1 or EPC2 serial configuration PROM on every power-up. Designs that omit the configuration PROM or use the wrong mode-select (MSEL0/MSEL1) settings will fail to come out of reset. Verify MSEL settings against Table 5 of the FLEX 6000 Device Handbook before committing to PCB layout, and provide a JTAG header (TCK/TMS/TDI/TDO) for factory recovery.
The 144-LQFP (20x20 mm) package has 0.5 mm pitch gull-wing leads - use 4-mil traces with 4-mil spaces exiting the pads, and length-match clock nets (CLK0-CLK3, TCK, DCLK) to within 200 mils for clean global-clock skew. Place all VCCINT and VCCIO pins with their respective decoupling caps on the same layer to minimize inductance. The 102 user I/Os across 8 I/O banks require careful bank-by-bank VCCIO assignment if mixing 3.3 V and 5 V-tolerant signaling.
The 144-LQFP is a plastic package with theta_JA of approximately 35 C/W (still-air, JEDEC 4-layer board). At 200 MHz with all 880 LEs switching and 102 I/Os driving 10 pF loads, dynamic current can approach 200 mA. In enclosed industrial cabinets with limited airflow, derate by at least 30% or add a small clip-on heatsink if sustained junction temperatures above 100 °C are observed. The commercial grade (0-85 °C) is adequate for most indoor deployments.
규정 준수 정보
Compliance certifications not present in the verified distributor snippets for this legacy part. Original FLEX 6000 family products shipped pre-RoHS-6 conversion; many distributor listings carry mixed date-codes with and without lead-free finishes. Confirm RoHS / lead-free status on the specific date-code before placing production orders.