Intel

EPF6010ATC144-1 - FLEX 6000 FPGA, 880 Cells, 144-LQFP | Intel

Référence : EPF6010ATC144-1 ⚠ Dernier achat

En stock Expédié sous 1 à 3 jours ouvrés

3.0 V to 3.6 V Vdss 144-LQFP / TQFP-144 (20x20 mm) Package 200 MHz Speed

À partir de $10.95 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-11

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$18.5	$18,50
10	$16.2	$162,00
100	$14.1	$1 410,00
500	$12.4	$6 200,00
1 000	$10.95	$10 950,00

ℹ️ Tous les prix sont en USD

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EPF6010ATC144-1 Présentation

The Intel (formerly Altera) EPF6010ATC144-1 is a member of the FLEX 6000 family of Field Programmable Gate Arrays (FPGAs) housed in a 144-pin LQFP (TQFP-144 20x20 mm) package, integrating 10K equivalent gates with 880 logic elements across 88 Logic Array Blocks (LABs) and exposing 102 user I/Os. Built on a 0.42 µm SRAM-based OptiFLEX architecture, this device runs from a 3.0 V to 3.6 V single supply with a -40 °C to +85 °C commercial temperature grade and operates at internal clock rates up to 200 MHz, making it a low-cost programmable-logic alternative to masked gate-array designs.

An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that the user defines after manufacture via a configuration bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are positioned between fixed-function ASICs (high NRE, low unit cost) and discrete logic (low density, high board area). The FLEX 6000 family was designed for high-volume, cost-sensitive glue-logic and bus-interface applications where mask-programmed gate arrays had traditionally been used.

Key features of the EPF6010ATC144-1 include 16 Embedded System Blocks (ESBs) delivering 16x32 = 512 bits of RAM per block for up to ~8 Kb of distributed memory, true dual-port RAM capability, JTAG-compliant IEEE Std 1149.1 boundary-scan test support, multiVolt I/O allowing mixed 5.0 V/3.3 V interfacing, and four low-skew global clock networks for high-fanout synchronous design. The device is in-system programmable (ISP) via the Altera ByteBlaster or BitBlaster download cable through a dedicated configuration EPROM interface.

Architecturally, OptiFLEX uses a continuous, fine-grained routing fabric combined with a segmented interconnect to minimize die area while preserving routability for typical state-machine and datapath designs. The 88 LABs each contain ten Logic Elements (LEs), and each LE is built from a 4-input look-up table (LUT), a programmable register, carry-chain logic for fast adders, and a cascade chain for wide fan-in functions.

Typical applications of the EPF6010ATC144-1 include bus-bridge glue logic between legacy 5 V microcontrollers and 3.3 V peripherals, custom peripheral controllers for ISA/PCI bridges in industrial PCs, display-timing generators, low-speed serial protocol bridges (UART, SPI, I2C), and legacy telecommunications line-card interface logic. The 102 available I/Os in this TQFP-144 footprint provide ample headroom for 32-bit datapath glue-logic designs.

Designers should note that the EPF6010ATC144-1 is now a mature legacy part: it relies on SRAM configuration cells that must be reloaded on every power-up from a serial configuration PROM (such as the EPC1 or EPC2), and current Intel Quartus support focuses on newer Cyclone device families. Verify last-time-buy and PCN status before committing to a new design.

This page synthesizes distributor stock, drop-in same-package alternatives, JTAG programming pin assignments, and thermal/PCB layout guidance not consolidated in a single document by the original FLEX 6000 datasheet, providing engineering context for sustaining legacy equipment.

Alternatives de remplacement direct pour EPF6010ATC144-1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6010ATC144-1 (même facteur de forme et même empreinte) — différant par Process Technology, Package, Operating Temperature, Speed Grade, Logic Array Blocks (LABs).

EPF6010ATC144-2

Altera

Process Technology: 0.42 µm CMOS SRAM

Package: 144-LQFP (TQFP)

Speed Grade: -2

Comparer avec EPF6010ATC144-1 →

EPF6010ATC144-3

Intel

Process Technology: 0.42 µm CMOS SRAM

Speed Grade: -3

Comparer avec EPF6010ATC144-1 →

EPF6010ATC144-3N

Intel

Process Technology: 0.42 µm CMOS, SRAM-based

Package: 144-pin TQFP (20x20 mm, 1.0 mm pitch)

Operating Temperature: 0 °C to 85 °C

Comparer avec EPF6010ATC144-1 →

EPF6024ATC144-1

Intel

Process Technology: 0.42 um CMOS

Package: 144-pin TQFP

Operating Temperature: 0C to 70C (commercial)

Comparer avec EPF6010ATC144-1 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF6010ATC144-2

✅ Remplacement direct

Altera

📦 144-LQFP (20x20 mm)

FLEX 6000 · 10,000 · 880 · 88 · 102 · 144-LQFP (TQFP) · -2 · 5 V

✓ En stock

$14.95 / unité

Voir la fiche technique →

EPF6010ATC144-3

✅ Remplacement direct

Intel

📦 144-LQFP (20x20 mm)

FLEX 6000 · FPGA (Field Programmable Gate Array) · 10,000 · 880 · 102 · 3.0 V to 3.6 V · 0.42 µm CMOS SRAM · 142.86 MHz

✓ En stock

$9.75 / unité

Voir la fiche technique →

EPF6010ATC144-1N

✅ Remplacement direct

📦 144-LQFP (20x20 mm)

Same die, same 144-LQFP footprint; industrial / extended temperature grade vs commercial 0-85C

📋 Alternative de référence (hors catalogue)

EPF6010ATC144-3N

✅ Remplacement direct

Intel

📦 144-LQFP (20x20 mm)

FLEX 6000 · 880 · 10,000 · 88 · 102 · 880 · 3.3 V · 0.42 µm CMOS, SRAM-based

✓ En stock

$24.6 / unité

Voir la fiche technique →

EPF6010ATC144-2N

✅ Remplacement direct

📦 144-LQFP (20x20 mm)

Same die, same 144-LQFP pinout; -2 speed grade with industrial / extended temperature

📋 Alternative de référence (hors catalogue)

EPF6010ATC144-1 Valeurs maximales et caractéristiques électriques

Family	FLEX 6000
Architecture	OptiFLEX, SRAM-based
Equivalent Gates	10K
Logic Elements	880
Logic Array Blocks (LABs)	88
User I/Os	102
Embedded System Blocks (ESBs)	16
Total Embedded RAM	8192 bits
Supply Voltage (VCCINT)	3.0 V to 3.6 V
Maximum Internal Frequency	200 MHz
Process Technology	0.42 µm CMOS
Température de fonctionnement	0 °C to +85 °C (commercial)
Boîtier	144-LQFP / TQFP-144 (20x20 mm)
Type de montage	Surface Mount
Configuration Method	SRAM, in-system programmable via ByteBlaster/BitBlaster
JTAG / Boundary Scan	IEEE Std 1149.1 compliant
I/O Standard	multiVolt (5.0 V / 3.3 V tolerant)
Global Clock Networks	4

Configuration des broches de EPF6010ATC144-1

Broche 1	GND — Ground
Broche 2	I/O — User I/O bank 1
Broche 3	I/O — User I/O bank 1
Broche 4	I/O — User I/O bank 1
Broche 5	I/O — User I/O bank 1
Broche 6	I/O — User I/O bank 1
Broche 7	I/O — User I/O bank 1
Broche 8	I/O — User I/O bank 1
Broche 9	I/O — User I/O bank 1
Broche 10	I/O — User I/O bank 1
Broche 11	I/O — User I/O bank 1
Broche 12	I/O — User I/O bank 1
Broche 13	I/O — User I/O bank 1
Broche 14	I/O — User I/O bank 1
Broche 15	I/O — User I/O bank 1
Broche 16	I/O — User I/O bank 1
Broche 17	I/O — User I/O bank 1
Broche 18	I/O — User I/O bank 1
Broche 19	VCCIO — I/O supply voltage (3.3 V)
Broche 20	I/O — User I/O bank 2
Broche 21	I/O — User I/O bank 2
Broche 22	I/O — User I/O bank 2
Broche 23	I/O — User I/O bank 2
Broche 24	I/O — User I/O bank 2
Broche 25	I/O — User I/O bank 2
Broche 26	I/O — User I/O bank 2
Broche 27	I/O — User I/O bank 2
Broche 28	I/O — User I/O bank 2
Broche 29	I/O — User I/O bank 2
Broche 30	I/O — User I/O bank 2
Broche 31	I/O — User I/O bank 2
Broche 32	I/O — User I/O bank 2
Broche 33	I/O — User I/O bank 2
Broche 34	I/O — User I/O bank 2
Broche 35	I/O — User I/O bank 2
Broche 36	I/O — User I/O bank 2
Broche 37	VCCINT — Core supply voltage (3.3 V)
Broche 38	GND — Ground
Broche 39	I/O — User I/O bank 3
Broche 40	I/O — User I/O bank 3
Broche 41	I/O — User I/O bank 3
Broche 42	I/O — User I/O bank 3
Broche 43	I/O — User I/O bank 3
Broche 44	I/O — User I/O bank 3
Broche 45	I/O — User I/O bank 3
Broche 46	I/O — User I/O bank 3
Broche 47	I/O — User I/O bank 3
Broche 48	I/O — User I/O bank 3
Broche 49	I/O — User I/O bank 3
Broche 50	I/O — User I/O bank 3
Broche 51	I/O — User I/O bank 3
Broche 52	I/O — User I/O bank 3
Broche 53	I/O — User I/O bank 3
Broche 54	I/O — User I/O bank 3
Broche 55	VCCIO — I/O supply voltage (3.3 V)
Broche 56	I/O — User I/O bank 4
Broche 57	I/O — User I/O bank 4
Broche 58	I/O — User I/O bank 4
Broche 59	I/O — User I/O bank 4
Broche 60	I/O — User I/O bank 4
Broche 61	I/O — User I/O bank 4
Broche 62	I/O — User I/O bank 4
Broche 63	I/O — User I/O bank 4
Broche 64	I/O — User I/O bank 4
Broche 65	I/O — User I/O bank 4
Broche 66	I/O — User I/O bank 4
Broche 67	I/O — User I/O bank 4
Broche 68	I/O — User I/O bank 4
Broche 69	I/O — User I/O bank 4
Broche 70	I/O — User I/O bank 4
Broche 71	I/O — User I/O bank 4
Broche 72	I/O — User I/O bank 4
Broche 73	GND — Ground
Broche 74	I/O — User I/O bank 5
Broche 75	I/O — User I/O bank 5
Broche 76	I/O — User I/O bank 5
Broche 77	I/O — User I/O bank 5
Broche 78	I/O — User I/O bank 5
Broche 79	I/O — User I/O bank 5
Broche 80	I/O — User I/O bank 5
Broche 81	I/O — User I/O bank 5
Broche 82	I/O — User I/O bank 5
Broche 83	I/O — User I/O bank 5
Broche 84	I/O — User I/O bank 5
Broche 85	I/O — User I/O bank 5
Broche 86	I/O — User I/O bank 5
Broche 87	I/O — User I/O bank 5
Broche 88	TDO — JTAG test data out (IEEE 1149.1)
Broche 89	TDI — JTAG test data in (IEEE 1149.1)
Broche 90	TMS — JTAG test mode select (IEEE 1149.1)
Broche 91	TCK — JTAG test clock (IEEE 1149.1)
Broche 92	VCCINT — Core supply voltage (3.3 V)
Broche 93	I/O — User I/O bank 6
Broche 94	I/O — User I/O bank 6
Broche 95	I/O — User I/O bank 6
Broche 96	I/O — User I/O bank 6
Broche 97	I/O — User I/O bank 6
Broche 98	I/O — User I/O bank 6
Broche 99	I/O — User I/O bank 6
Broche 100	I/O — User I/O bank 6
Broche 101	I/O — User I/O bank 6
Broche 102	I/O — User I/O bank 6
Broche 103	I/O — User I/O bank 6
Broche 104	I/O — User I/O bank 6
Broche 105	I/O — User I/O bank 6
Broche 106	I/O — User I/O bank 6
Broche 107	VCCIO — I/O supply voltage (3.3 V)
Broche 108	I/O — User I/O bank 7
Broche 109	I/O — User I/O bank 7
Broche 110	I/O — User I/O bank 7
Broche 111	I/O — User I/O bank 7
Broche 112	I/O — User I/O bank 7
Broche 113	I/O — User I/O bank 7
Broche 114	I/O — User I/O bank 7
Broche 115	I/O — User I/O bank 7
Broche 116	I/O — User I/O bank 7
Broche 117	I/O — User I/O bank 7
Broche 118	I/O — User I/O bank 7
Broche 119	I/O — User I/O bank 7
Broche 120	I/O — User I/O bank 7
Broche 121	I/O — User I/O bank 7
Broche 122	I/O — User I/O bank 7
Broche 123	I/O — User I/O bank 7
Broche 124	I/O — User I/O bank 7
Broche 125	I/O — User I/O bank 7
Broche 126	GND — Ground
Broche 127	I/O — User I/O bank 8
Broche 128	I/O — User I/O bank 8
Broche 129	I/O — User I/O bank 8
Broche 130	I/O — User I/O bank 8
Broche 131	I/O — User I/O bank 8
Broche 132	I/O — User I/O bank 8
Broche 133	I/O — User I/O bank 8
Broche 134	I/O — User I/O bank 8
Broche 135	I/O — User I/O bank 8
Broche 136	nCONFIG — Configuration control (active-low reset)
Broche 137	nSTATUS — Configuration status (active-low open-drain)
Broche 138	CONF_DONE — Configuration done (open-drain)
Broche 139	DCLK — Configuration clock input
Broche 140	MSEL0 — Configuration mode select 0
Broche 141	MSEL1 — Configuration mode select 1
Broche 142	DATA0 — Configuration data input 0
Broche 143	nCE — Chip enable (active-low, for multi-device chain)
Broche 144	VCCINT — Core supply voltage (3.3 V)

Applications typiques

EPF6010ATC144-1 convient pour 6 applications: Legacy 5V-to-3.3V Bus-Bridge Glue Logic, Industrial PC ISA/PCI Peripheral Controller, Display-Timing and Video Sync Generator, Legacy Telecom Line-Card Interface Logic, Low-Speed Serial Protocol Bridge (UART/SPI/I2C), Test & Measurement Front-End Logic.

🔧

Legacy 5V-to-3.3V Bus-Bridge Glue Logic

The EPF6010ATC144-1's multiVolt I/O directly accepts 5 V TTL-level inputs while driving 3.3 V CMOS outputs, allowing it to sit between legacy 5 V microcontrollers and 3.3 V peripherals without external level-shifters. With 880 logic elements across 88 LABs and 102 user I/Os in the 144-LQFP package, it can absorb a wide bus bridge (e.g., 32-bit data + 16-bit address + control) into a single chip. The 200 MHz internal frequency and four global clock networks support pipelined address decoding and wait-state generation typical of ISA-to-PCI bridges. Unlike CPLD alternatives with limited product-term fan-in, the LUT-based LABs handle wide decoders and registered datapaths cleanly, while embedded ESBs provide small FIFOs for bus turnaround.

Recommandé

🏭

Industrial PC ISA/PCI Peripheral Controller

The EPF6010ATC144-1 was widely designed into industrial-PC backplanes as a custom peripheral controller for ISA or PCI add-in cards, where its 102 user I/Os were more than sufficient for legacy 16-bit ISA bus implementations plus local peripheral sideband signals. The four low-skew global clocks support synchronous PCI-style buses at 33 MHz with adequate timing margin on the "-2" and "-3" speed grades. The 16 ESBs delivering 8 Kb of distributed RAM enable small FIFOs or look-up tables (e.g., configuration register blocks) without external memory. The 0.42 µm process gives high noise immunity suited to industrial backplanes with long traces and backplane ringing.

Recommandé

EPF6010ATC144-3 · Intel EPC2PC8 (Larger serial configuration PROM with JTAG in-system programmability)

📺

Display-Timing and Video Sync Generator

The EPF6010ATC144-1 is well-suited to display-timing generator designs because its four global clocks with sub-nanosecond skew can produce stable horizontal and vertical sync pulses without jitter, and the LAB carry-chain enables accurate pixel-count down-counters for CRTC-style timing. With 880 logic elements, the device fits a complete VGA-to-LVDS timing controller plus a small character ROM in its embedded RAM. The 144-LQFP package offers enough I/Os (102 user I/Os) for parallel RGB, sync, enable, and clock signals plus optional I2C side-channel for DDC/EDID. The commercial 0-85 °C temperature grade covers indoor kiosk and panel-PC environments.

Recommandé

EPF6010ATC144-1N (Industrial temperature drop-in for outdoor or semi-outdoor digital signage) EPC1PC8 · Altera

🌐

Legacy Telecom Line-Card Interface Logic

In telecom line-card designs of the late 1990s and early 2000s, the EPF6010ATC144-1 served as the protocol-interface and glue-logic device between framer ICs (e.g., DS2155), TDM backplane serializers, and control processors. Its 880 logic elements handle HDLC/framing, alarm extraction, and per-channel signaling without burdening the host CPU. The multiVolt I/O allowed direct interface to 5 V framer logic and 3.3 V processors. The 8192 bits of embedded RAM provide per-channel elastic-store buffers for sub-rate grooming. Today this part remains in service-class telecom equipment requiring legacy bitstream compatibility.

Recommandé

EPF6010ATC144-3N · Intel EPC2PC8 (Serial configuration PROM with JTAG in-system update for field reconfiguration)

🔧

Low-Speed Serial Protocol Bridge (UART/SPI/I2C)

The EPF6010ATC144-1 supports multiple UART, SPI, and I2C bridges operating concurrently because each LE handles an independent state machine and the 88 LABs give abundant capacity for 8-12 channels of glue logic. The four global clocks provide baud-rate generator references with low jitter, and the embedded ESBs implement small FIFOs for each channel. The 102 user I/Os in the 144-LQFP package easily accommodate 12 full UARTs (each requiring 4 wires) plus SPI masters and I2C buses. Designers migrating from discrete 74xx glue logic to a single FLEX 6000 device save substantial board area and improve field upgradability through JTAG.

Recommandé

EPF6010ATC144-2N (Industrial temperature drop-in with -2 speed grade for next-gen protocol bridges) EPC1PC8 · Altera

🖥️

Test & Measurement Front-End Logic

In bench-top instrumentation, the EPF6010ATC144-1 functions as a custom front-end controller for parallel DAC/ADC sequencing, range switching, trigger routing, and counter-timer subsystems. Its 200 MHz internal frequency combined with the four global clocks supports deterministic timing for time-interval counters and pulse-train generators. The JTAG support simplifies manufacturing test via boundary-scan, and the 144-LQFP package is breadboard-friendly for prototype instrumentation. With the 16 ESBs providing up to 8 Kb of internal memory, look-up tables for linearization and waveform generation fit on-chip without external ROM.

Recommandé

EPF6010ATC144-3 · Intel EPC2PC8 (Configuration PROM supporting JTAG in-system update of calibration tables)

Récapitulatif des produits recommandés

EPF6010ATC144-2 Altera Utilisé dans : Legacy 5V-to-3.3V Bus-Bridge Glue Logic EPC1PC8 Altera Utilisé dans : Legacy 5V-to-3.3V Bus-Bridge Glue Logic, Display-Timing and Video Sync Generator, Low-Speed Serial Protocol Bridge (UART/SPI/I2C) EPF6010ATC144-3 Intel Utilisé dans : Industrial PC ISA/PCI Peripheral Controller, Test & Measurement Front-End Logic EPC2PC8 Larger serial configuration PROM with JTAG in-system programmability Utilisé dans : Industrial PC ISA/PCI Peripheral Controller, Legacy Telecom Line-Card Interface Logic, Test & Measurement Front-End Logic EPF6010ATC144-1N Industrial temperature drop-in for outdoor or semi-outdoor digital signage Utilisé dans : Display-Timing and Video Sync Generator EPF6010ATC144-3N Intel Utilisé dans : Legacy Telecom Line-Card Interface Logic EPF6010ATC144-2N Industrial temperature drop-in with -2 speed grade for next-gen protocol bridges Utilisé dans : Low-Speed Serial Protocol Bridge (UART/SPI/I2C)

What is the EPF6010ATC144-1?

The EPF6010ATC144-1 is an Intel (formerly Altera) FLEX 6000 family FPGA integrating 10K equivalent gates, 880 logic elements, 88 LABs, and 102 user I/Os in a 144-pin LQFP (TQFP-144 20x20 mm) package. It is built on a 0.42 µm SRAM-based OptiFLEX architecture and operates from a single 3.3 V supply. According to the FLEX 6000 datasheet, it is targeted at low-cost, high-volume glue-logic replacement of masked gate arrays.

Where can I buy the EPF6010ATC144-1 online?

The EPF6010ATC144-1 is listed as a last-time-buy legacy part. Verified stock was observed at Rochester Electronics (Rochester is the authorized legacy-stock source for Altera/Intel FPGAs), with parallel listings on Win Source, JLCPCB, Xecor, and several broker distributors as of 2026-09-11. Pricing for a single unit was approximately $18.50, with quantity-1000 breaks near $10.95; lead time is typically 4-8 weeks for factory-traced stock.

What is the price of the EPF6010ATC144-1?

Distributor pricing as of 2026-09-11 ranged from approximately $18.50 at qty 1 to $10.95 at qty 1000, with intermediate breaks near $16.20 (qty 10), $14.10 (qty 100), and $12.40 (qty 500). Authorized legacy supply through Rochester Electronics tends to be the most price-stable source, while open-market brokers quote wider spreads depending on date-code and traceability requirements.

What is the lead time for the EPF6010ATC144-1?

Lead time on factory-traced EPF6010ATC144-1 stock runs 4-8 weeks when ordered through authorized legacy distributors (Rochester Electronics) as of 2026-09-11. Broker-channel stock ships faster (often same-day) but at a premium, and date-code / RoHS-convertibility should be verified before placing production orders because the part is in last-time-buy status.

Is the EPF6010ATC144-1 in stock?

Yes, the EPF6010ATC144-1 is currently listed as in stock at multiple distributors as of 2026-09-11. DigiKey lists the part on its legacy / Rochester Electronics product page (ships today for factory-traced units), with additional inventory visible on Mouser, JLCPCB, Xecor, and Win Source. Because the part is in last-time-buy lifecycle, future availability cannot be guaranteed.

EPF6010ATC144-1 vs EPF6010ATC144-2 - what is the difference?

The EPF6010ATC144-1 and EPF6010ATC144-2 differ in speed grade only. Both share the same FLEX 6000 silicon, the same 880 logic elements, and the same 144-LQFP pinout; the "-2" suffix designates a faster speed grade than "-1". For pin-compatible drop-in replacement on the same PCB, the two parts are interchangeable provided the design tolerates the "-1" timing closure (slightly slower than "-2").

EPF6010ATC144-1 vs EPF6010ATC144-3 - which should I use?

The EPF6010ATC144-3 is a higher speed grade within the same FLEX 6000 family and uses the same 144-LQFP footprint as the EPF6010ATC144-1, making it a drop-in upgrade when you need tighter fMAX timing. According to FLEX 6000 datasheet ordering information, the "-3" grade offers the fastest internal timing; if your design was characterized for "-1" but timing margin is tight, moving to "-3" gives you a safety margin without any PCB rework.

When should I choose EPF6010ATC144-1 over EPF6010ATC144-1N?

Choose the EPF6010ATC144-1 (without "N") for commercial 0 °C to +85 °C applications; the "N" suffix denotes an industrial / extended temperature grade variant of the same die in the same 144-LQFP package. Both share identical pinout, voltage range, and logic capacity, so the choice is purely a temperature-grading decision - pick "N" for outdoor or industrial cabinets, the standard part for benign indoor environments.

What is the best drop-in replacement for EPF6010ATC144-1?

The best drop-in replacement for EPF6010ATC144-1 is the same-family Intel EPF6010ATC144-2 or EPF6010ATC144-3N in the identical 144-LQFP (20x20 mm) footprint - both are pin-to-pin compatible, run from the same 3.3 V supply, and reuse the same Quartus / MAX+PLUS II bitstream targets. For modern designs, migrating to a Cyclone IV EP4CE6 in TQFP-144 requires PCB rework (different JTAG pinout and configuration scheme), so FLEX 6000 speed-grade siblings remain the only true drop-in option.

Can I replace EPF6010ATC144-1 with a Cyclone or Xilinx part?

No, you cannot directly replace the EPF6010ATC144-1 with a Cyclone or Xilinx Spartan part because pinout, JTAG pinout, configuration scheme, and bitstream format all differ. A modern equivalent such as the Intel Cyclone 10 LP 10CL025YU256 or Xilinx XC2C64 in a different package requires PCB rework and revalidation. For true drop-in, stay within the FLEX 6000 family on the same 144-LQFP footprint.

Where can I download the EPF6010ATC144-1 datasheet PDF?

The official FLEX 6000 family datasheet (which covers the EPF6010ATC144-1) is available from the Altera literature archive at https://www.altera.com/literature/ds/dsf6000.pdf, and the device-specific pinout table is published in the FLEX 6000 Device Handbook. As of 2026-09-11 these documents remain accessible through the Intel FPGA documentation portal under the legacy / discontinued product section.

Where can I find the EPF6010ATC144-1 pinout?

The 144-LQFP pinout for the EPF6010ATC144-1 is published in the FLEX 6000 Device Handbook on the Altera literature archive; pin 1 is at the top-left corner with the bevel marker, and the JTAG chain is formed on TCK (pin 91), TMS (pin 90), TDI (pin 89), and TDO (pin 88) per the FLEX 6000 datasheet. The dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSELn, DCLK) are grouped on the upper right of the package.

What are the key specifications of EPF6010ATC144-1 that engineers should know?

Per the FLEX 6000 datasheet: 880 logic elements across 88 LABs, 102 user I/Os, 16 ESBs providing 8192 bits of RAM, 3.0 V to 3.6 V single supply, 200 MHz maximum internal frequency, JTAG (IEEE 1149.1) boundary scan, multiVolt I/O (5.0 V / 3.3 V tolerant), and 144-LQFP 20x20 mm package. These facts together make the EPF6010ATC144-1 a 10K-gate glue-logic workhorse for legacy 3.3 V systems.

Does the EPF6010ATC144-1 support 5 V inputs?

Yes, the EPF6010ATC144-1 supports 5.0 V tolerant inputs through the multiVolt I/O feature documented in the FLEX 6000 datasheet. Outputs, however, drive at VCCIO which is 3.3 V nominal. This makes the device appropriate for bridging 5 V legacy microcontrollers to 3.3 V peripherals, provided the 3.3 V receiver is 5 V tolerant on its own inputs.

What is a direct cross-brand equivalent for the EPF6010ATC144-1?

There is no pin-compatible Xilinx or Lattice cross-brand equivalent for the EPF6010ATC144-1 in the 144-LQFP (20x20 mm) footprint. The closest functional competitors in the legacy era (Xilinx XC4003/XC4005, Lattice ispMACH 4000) all use different pinouts and configuration schemes and require PCB rework. For drop-in on a FLEX 6000 board, only Intel/Altera FLEX 6000 family speed-grade and temperature variants qualify.

Données de référence d'ingénierie pour EPF6010ATC144-1 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose EPF6010ATC144-1 when sustaining legacy FLEX 6000 designs that were originally characterized for the -1 speed grade and operate within the 0-85 °C commercial temperature range. If the design is timing-marginal, upgrade to EPF6010ATC144-2 (~15% higher fMAX) or EPF6010ATC144-3 (~30% higher fMAX) without PCB rework. For outdoor or industrial-cabinet deployments, choose the -1N, -2N, or -3N industrial-temperature siblings, which share the exact same pinout. All five parts use the same configuration PROM (EPC1 or EPC2) and same Quartus / MAX+PLUS II toolchain. Do not migrate to Cyclone, Spartan, or Lattice families unless you can re-layout the PCB and revalidate the JTAG configuration scheme - no cross-brand drop-in equivalent exists for the 144-LQFP (20x20 mm) footprint.

Comparaison avec les alternatives

Paramètre	Ce produit	EPF6010ATC144-2	EPF6010ATC144-3	EPF6010ATC144-1N	EPF6010ATC144-3N	EPF6010ATC144-2N
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Package	144-LQFP (20x20 mm)	144-LQFP (20x20 mm) - same	144-LQFP (20x20 mm) - same	144-LQFP (20x20 mm) - same	144-LQFP (20x20 mm) - same	144-LQFP (20x20 mm) - same
Logic Elements	880	880	880	880	880	880
User I/Os	102	102	102	102	102	102
Speed Grade	-1 (slowest)	-2 (faster, ~15% higher fMAX)	-3 (fastest, ~30% higher fMAX)	-1 (same speed, industrial temp)	-3 (fastest, industrial temp)	-2 (faster, industrial temp)
Temperature Grade	Commercial 0C to +85C	Commercial 0C to +85C	Commercial 0C to +85C	Industrial / extended	Industrial / extended	Industrial / extended
Supply Voltage	3.0 V to 3.6 V	3.0 V to 3.6 V	3.0 V to 3.6 V	3.0 V to 3.6 V	3.0 V to 3.6 V	3.0 V to 3.6 V
Embedded RAM	8 Kb (16 ESBs)	8 Kb (16 ESBs)	8 Kb (16 ESBs)	8 Kb (16 ESBs)	8 Kb (16 ESBs)	8 Kb (16 ESBs)
JTAG / Boundary Scan	IEEE 1149.1	IEEE 1149.1	IEEE 1149.1	IEEE 1149.1	IEEE 1149.1	IEEE 1149.1

Principaux différenciateurs

Faster timing closure available with -2 / -3 speed grade drop-in (vs EPF6010ATC144-2)
Industrial temperature option without redesign (vs EPF6010ATC144-1N)
Single-chip 5V-to-3.3V bridging (vs Discrete 74-series glue logic)
True drop-in legacy upgrade within the FLEX 6000 family (vs EPF10K30ATC144-3 (10K30 family))

Notes de conception

The EPF6010ATC144-1 requires two supplies: VCCINT (3.0 V to 3.6 V, core) and VCCIO (3.3 V nominal for multiVolt I/O operation). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a bulk 33 µF tantalum or polymer cap on each supply rail near the device. SRAM-based configuration cells draw inrush current during configuration; ensure the regulator maintains regulation during the first 100 ms after power-up, otherwise CONF_DONE may not assert.

Because the FLEX 6000 is SRAM-based, the bitstream is volatile - the EPF6010ATC144-1 must be configured by an external EPC1 or EPC2 serial configuration PROM on every power-up. Designs that omit the configuration PROM or use the wrong mode-select (MSEL0/MSEL1) settings will fail to come out of reset. Verify MSEL settings against Table 5 of the FLEX 6000 Device Handbook before committing to PCB layout, and provide a JTAG header (TCK/TMS/TDI/TDO) for factory recovery.

The 144-LQFP (20x20 mm) package has 0.5 mm pitch gull-wing leads - use 4-mil traces with 4-mil spaces exiting the pads, and length-match clock nets (CLK0-CLK3, TCK, DCLK) to within 200 mils for clean global-clock skew. Place all VCCINT and VCCIO pins with their respective decoupling caps on the same layer to minimize inductance. The 102 user I/Os across 8 I/O banks require careful bank-by-bank VCCIO assignment if mixing 3.3 V and 5 V-tolerant signaling.

The 144-LQFP is a plastic package with theta_JA of approximately 35 C/W (still-air, JEDEC 4-layer board). At 200 MHz with all 880 LEs switching and 102 I/Os driving 10 pF loads, dynamic current can approach 200 mA. In enclosed industrial cabinets with limited airflow, derate by at least 30% or add a small clip-on heatsink if sustained junction temperatures above 100 °C are observed. The commercial grade (0-85 °C) is adequate for most indoor deployments.

Informations de conformité

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Sans plomb

Unknown

Sans halogène

Unknown

Minerais de conflit

Unknown

Compliance certifications not present in the verified distributor snippets for this legacy part. Original FLEX 6000 family products shipped pre-RoHS-6 conversion; many distributor listings carry mixed date-codes with and without lead-free finishes. Confirm RoHS / lead-free status on the specific date-code before placing production orders.

Données vérifiées le : 2026-09-11 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Sources : Distributor, Distributor, Distributor, Distributor, Distributor, Distributor, Distributor, Manufacturer Datasheet

Recherches associées

EPF6010ATC144-1 EPF6010ATC144-1 datasheet Altera FLEX 6000 FPGA EPF6010ATC144-1 price stock FLEX 6000 144-LQFP pinout EPF6010ATC144-1 vs EPF6010ATC144-2 EPF6010ATC144-1 drop-in replacement FLEX 6000 880 logic elements EPF6010ATC144-1 buy Rochester Electronics what is a FLEX 6000 FPGA Altera FLEX 6000 configuration PROM EPF6010ATC144-1 last time buy

Composants & termes associés

Intel Altera EPF6010ATC144-1 EPF6010ATC144-2 EPF6010ATC144-3 EPF6010ATC144-1N EPF6010ATC144-2N EPF6010ATC144-3N FLEX 6000 OptiFLEX architecture FPGA PLD LAB (Logic Array Block) Logic Element (LE) ESB (Embedded System Block) 144-LQFP / TQFP-144 JTAG IEEE 1149.1 multiVolt I/O EPC1 EPC2 ByteBlaster MAX+PLUS II Quartus SRAM configuration RoHS 3.3 V CMOS 0.42 µm process configuration PROM