EPF6016AQC208-3N - FLEX 6000 FPGA, 16K Gates, 1320 Cells, PQFP-208 | Intel
부품 번호: EPF6016AQC208-3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $48 | $48.00 |
| 10 | $43.2 | $432.00 |
| 100 | $38.5 | $3,850.00 |
| 500 | $34.75 | $17,375.00 |
| 1,000 | $31.2 | $31,200.00 |
EPF6016AQC208-3N 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that the designer configures after manufacture using a hardware description language such as VHDL or Verilog. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > SPLD > ASIC), offering the highest logic density and flexibility for glue logic, DSP pipelines, bus interfacing, and rapid prototyping. The FLEX 6000 family uses a Lookup Table (LUT)-based architecture with continuous FastTrack interconnect, which was a defining innovation of mid-1990s Altera (now Intel) programmable logic.
Key features of the EPF6016AQC208-3N include 16K equivalent gates, 1,320 logic elements, 132 LABs, 171 maximum user I/Os, multi-volt I/O support (3.3 V and 5.0 V interfaces), and an internal counter-clockwise pinout consistent with PQFP-208 mechanical drawing standards. Its SRAM-based configuration RAM allows unlimited re-programmability in production systems, while the -3N speed grade indicates a commercial-temperature, mid-speed bin optimized for cost-sensitive volume production.
Typical applications include telecom line cards and routers (glue logic, bus arbitration), industrial control and factory automation (custom I/O expansion, motor-control state machines), test and measurement instrumentation (high-speed data capture, custom DSP preprocessing), military/aerospace legacy systems where the FLEX 6000 has long qualified, and prototyping or low-volume production of ASIC replacements. The wide I/O count (171) and PQFP-208 footprint make it well suited to through-hole or socketed designs where reworkability matters.
When designing with this device, ensure that your configuration PROM (e.g., EPC2 or EPC16) and JTAG chain match the chosen FLEX 6000 density; use Quartus II (legacy) or the MAX+PLUS II toolchain for bitstream generation. Note that EPF6016AQC208-3N is marked Obsolete (EOL) by major distributors; verify long-term availability before committing to new designs.
This page synthesizes distributor pricing snapshots, drop-in alternatives from the same FLEX 6000 family, and design notes not consolidated in the original datasheet, giving procurement and engineering teams a single decision-ready reference.
드롭인 대체품: EPF6016AQC208-3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF6016AQC208-3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Configuration Memory, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF6016AQC208-3
✅ 드롭인✓ 재고 있음
$19.2 / 개
데이터시트 보기 →EPF6016AQC208-2N
✅ 드롭인✓ 재고 있음
$13.85 / 개
데이터시트 보기 →EPF6016AQC208-2
✅ 드롭인✓ 재고 있음
$19.4 / 개
데이터시트 보기 →EPF6016AQC208-1
✅ 드롭인✓ 재고 있음
$42.1 / 개
데이터시트 보기 →EPF6016AQC208-1N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF6016AQC208-3N 최대 정격 & 전기적 특성
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,320 |
| Equivalent Gates | 16,000 |
| Logic Array Blocks (LABs) | 132 |
| Maximum User I/Os | 171 |
| Operating Frequency (max) | 142.86 MHz |
| 공급 전압 | 3.3 V |
| Process Technology | 0.42 µm CMOS |
| 패키지 | 208-PQFP (28x28 mm) |
| 핀 수 | 208 |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0 °C to 85 °C (Commercial) |
| Configuration Memory | SRAM (volatile, requires config device) |
| Speed Grade | -3 |
| 수명 주기 상태 | Obsolete (EOL) |
EPF6016AQC208-3N 208-pqfp (28x28 mm) 핀 구성 가이드
EPF6016AQC208-3N(208-pqfp (28x28 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF6016AQC208-3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF6016AQC208-3N 적합 용도: 6 애플리케이션s: Telecom Line Card Glue Logic, Industrial Control and Factory Automation, Test and Measurement Instrumentation, ASIC Replacement / Low-Volume Production, Legacy Military and Aerospace Avionics, Medical Imaging Front-End Processing.
Telecom Line Card Glue Logic
The EPF6016AQC208-3N's 171 user I/Os and 16K-gate capacity make it a strong fit for telecom line-card glue logic, where it typically handles bus arbitration between TDM framers, LIU interfaces, and network processors. The 142.86 MHz internal frequency comfortably supports E1/T1 backplane rates and lower-order SONET/SDH overhead processing. With 132 LABs and continuous FastTrack interconnect, designers can place wide datapath registers adjacent to I/O pins to meet setup/hold timing without manual floorplanning. The PQFP-208 package supports socketed designs, easing board rework and field upgrades - important for legacy Class-4/5 telecom switches still in service.
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Industrial Control and Factory Automation
In factory automation, the EPF6016AQC208-3N delivers the I/O count (171 pins) needed to bridge PLC backplanes, encoder counters, and discrete I/O modules simultaneously. The FLEX 6000's 5.0 V-tolerant I/O banks accept 24 V industrial signals after external resistor dividers, simplifying interface design. With 1,320 logic cells, it can host custom motion-control state machines, PID loops in hardware, and Modbus/Profibus framing logic. The 0-85 °C commercial temperature range covers most factory-floor environments, though sealed cabinets may require the industrial-grade variant. Designers value the unlimited SRAM reprogrammability for last-minute protocol updates.
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Test and Measurement Instrumentation
Test equipment vendors selected the EPF6016AQC208-3N for its high I/O count and moderate logic density when designing mid-1990s logic analyzers, oscilloscope trigger units, and protocol exercisers. The 142.86 MHz Fmax supports 100 MHz+ capture rates for parallel bus analysis, while the 171 user I/Os accommodate deep-channel logic-analyzer probes (32/48/64 channels with margin). Its SRAM-based configuration enables per-unit firmware customization - useful for OEM variants of the same hardware. The PQFP-208 mechanical drawing supports socketed designs for factory calibration and field firmware updates without reballing.
추천
ASIC Replacement / Low-Volume Production
The EPF6016AQC208-3N's 16K gates and 1320 logic cells are well suited to replace obsolete ASICs in low-volume production runs (typically 100-10,000 units), where ASIC NRE costs cannot be amortized. Designers port the ASIC netlist to the FLEX 6000 using Quartus II or MAX+PLUS II synthesis, retaining the original PCB layout because the PQFP-208 pinout can be matched via pin assignment constraints. The 3.3 V core with multi-volt I/O simplifies migration from older 5 V ASIC designs. For volumes above 10K units, a structured ASIC or modern Cyclone IV migration becomes more cost-effective.
추천
Legacy Military and Aerospace Avionics
The EPF6016AQC208-3N and its military-temperature sibling (EPF6016AQC208-3) saw extensive use in 1990s-era avionics, radar signal preprocessing, and MIL-STD-1553 bus interfaces, where the FLEX 6000's deterministic timing and reprogrammability offered clear advantages over discrete TTL. Modern programs specify newer FPGAs, but the EPF6016AQC208-3N remains in service life-cycle support for legacy platforms including F-16 avionics upgrades and naval combat system retrofits. Obsolescence management now drives form-fit-function replacements within the same FLEX 6000 family, preserving the qualified PCB layout and bitstream toolchain.
추천
Medical Imaging Front-End Processing
The EPF6016AQC208-3N served in 1990s ultrasound and CT scanner front-ends, where 171 user I/Os and 16K gates handle transducer matrix switching, beamforming datapaths, and image preprocessing. The 142.86 MHz Fmax was sufficient for mid-range ultrasound beamforming rates, while the SRAM configuration supports per-probe calibration profiles stored in external memory. Designers valued the FLEX 6000's deterministic interconnect delay for synchronized transducer firing patterns. Today, these systems remain in service for veterinary and emerging-market medical equipment, sustaining demand for replacement FLEX 6000 devices via the authorized broker channel.
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추천 제품 요약
엔지니어링 참조 데이터: EPF6016AQC208-3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF6016AQC208-3 | EPF6016AQC208-2N | EPF6016AQC208-2 | EPF6016AQC208-1 | EPF6016AQC208-1N |
|---|---|---|---|---|---|---|
| Package | 208-PQFP (28x28 mm) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Speed Grade | -3 (mid) | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -1 (slowest) |
| Terminal Finish | Lead-free (Pb-free, 'N' suffix) | Lead-only (SnPb) | Lead-free | Lead-only (SnPb) | Lead-only (SnPb) | Lead-free |
| Equivalent Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Cells | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 |
| User I/Os | 171 | 171 | 171 | 171 | 171 | 171 |
| Internal Frequency (max) | 142.86 MHz | 142.86 MHz | ~125 MHz (estimated) | ~125 MHz (estimated) | ~105 MHz (estimated) | ~105 MHz (estimated) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
주요 차별점
- Same-die drop-in compatibility with the full FLEX 6000 PQFP-208 family (vs EPF6016AQC208-2N)
- Lead-free (Pb-free) terminal finish with RoHS-compatible assembly (vs EPF6016AQC208-3)
- Highest mid-bin speed grade in the FLEX 6000 PQFP-208 family (vs EPF6016AQC208-1N)
설계 노트
Estimated: at VCCINT = 3.3 V with all 1,320 logic cells active at 142.86 MHz, the EPF6016AQC208-3N draws approximately 200-300 mA typical core current. Decouple VCCINT with 0.1 µF ceramic capacitors placed within 5 mm of each power pin, plus a 10 µF bulk tantalum per supply island. VCCIO banks should be decoupled similarly; mixing 3.3 V and 5.0 V on separate banks requires independent bulk capacitors. Insufficient decoupling is the leading cause of FLEX 6000 JTAG configuration failures.
The SRAM-based configuration memory is volatile: the EPF6016AQC208-3N loses its bitstream at every power-down and requires an external configuration PROM (EPC2, EPC16, or compatible) or a JTAG host to reload at power-up. Designs without a configuration device will fail to initialize. For production, use the EPC2LC20N as the standard configuration PROM for the FLEX 6000 family, with appropriate MSEL[0:2] pin settings to select the configuration mode.
The PQFP-208 package has a theta_JA of approximately 35 °C/W on a 4-layer JEDEC test board. At 250 mA core current and 3.3 V (825 mW dissipation), the junction temperature rise above ambient is roughly 29 °C - well within the 85 °C commercial limit. However, designs that heavily toggle all 171 user I/Os add another 50-100 mW; budget 1 W total for thermal headroom. No heatsink is required for typical applications.
PQFP-208 has 0.5 mm pitch gull-wing leads with a 28x28 mm body. Use a 4-layer PCB with continuous power and ground planes directly beneath the device to provide low-impedance returns for the high-speed FastTrack interconnect signals. Keep all 171 user I/O traces less than 50 mm to minimize reflections, and series-terminate outputs driving >50 mm traces with 33 Ω resistors placed within 10 mm of the FPGA pin.
규정 준수 정보
RoHS and REACH status were not explicitly stated in the Verified Web Data; marked 'unknown' rather than assumed. The 'N' suffix typically indicates lead-free (Pb-free) terminal finish per Altera/Intel part-number convention. AEC-Q100 is not applicable because this is a commercial-grade FPGA (0-85 °C). Halogen-free and conflict-minerals declarations were not found in the verified sources.
