A3P250L-1PQG208I - ProASIC3L FPGA 250K Gates | Microsemi
부품 번호: A3P250L-1PQG208I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.1 | $621.00 |
| 100 | $55.8 | $5,580.00 |
| 500 | $49.9 | $24,950.00 |
| 1,000 | $44.6 | $44,600.00 |
A3P250L-1PQG208I 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field, sitting in the programmable-logic hierarchy between CPLDs and high-density SoC FPGAs. The ProASIC3L subfamily distinguishes itself by using nonvolatile flash-based configuration storage, eliminating the external configuration PROM required by SRAM FPGAs and dramatically reducing boot time and system bill-of-materials cost.
Key features of the A3P250L include 1.2V core operation for low static power, single-chip flash-based configuration with inherent SECDED-protected design security, 130nm process technology, support for up to 892.86 MHz internal performance figures reported by distributor parametric data, and industrial temperature grading denoted by the -I suffix. The flash fabric retains configuration through power cycles and is resistant to single-event upsets compared to SRAM-based alternatives, which is valuable in harsh environments.
Architecturally, the device combines Versatile logic tiles, embedded SRAM blocks totaling 36 Kbits, and flexible I/O banks supporting multiple single-ended and differential standards. Microsemi Libero SoC design software supports synthesis, place-and-route, and simulation for the ProASIC3L family.
Typical applications include industrial control and automation, aerospace and defense subsystems, medical instrumentation, communications bridging, and secure embedded controllers where instant-on operation and low power are required.
Design consideration: because the core runs at 1.2V and I/O banks are separately powered, careful power-plane planning and decoupling are essential; also verify I/O bank voltage assignments early in Libero to avoid pin conflicts.
This page synthesizes distributor inventory data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3P250L-1PQG208I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P250L-1PQG208I (동일 폼 팩터 및 풋프린트) — 차이점: Package, System Gates, Operating Temperature, Speed Grade, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600L-1PQG208I
✅ 드롭인✓ 재고 있음
$29 / 개
데이터시트 보기 →A3P1000L-1PQG208I
✅ 드롭인✓ 재고 있음
$28.9 / 개
데이터시트 보기 →A3P600-2PQG208I
✅ 드롭인✓ 재고 있음
$71.3 / 개
데이터시트 보기 →A3P600-1PQG208
✅ 드롭인✓ 재고 있음
$49.94 / 개
데이터시트 보기 →A3P1000-2PQG208
✅ 드롭인✓ 재고 있음
$65.67 / 개
데이터시트 보기 →A3P250-PQG208I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P250L-1PQG208I 최대 정격 & 전기적 특성
| Family | ProASIC3L |
| System Gates | 250,000 |
| Embedded RAM | 36,864 bits |
| User I/O | 151 |
| Core Voltage | 1.2 V |
| Process Technology | 130 nm |
| 패키지 | 208-PQFP (28x28 mm) |
| 동작 온도 | -40C to +100C (TJ) |
| Configuration Type | Flash-based, nonvolatile |
| Speed Grade | 1 |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| RoHS 상태 | Compliant (G suffix, lead-free) |
| Temperature Grade | Industrial (-I suffix) |
| Design Software | Microsemi Libero SoC |
A3P250L-1PQG208I 208-pqfp (28x28 mm) 핀 구성 가이드
A3P250L-1PQG208I(208-pqfp (28x28 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P250L-1PQG208I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P250L-1PQG208I 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Aerospace and Defense Subsystems, Medical Instrumentation, Communications Bridging and Line-Card Logic, Secure Embedded Controllers, Battery-Powered Portable Instruments.
Industrial Control and Automation
The A3P250L-1PQG208I fits industrial control and automation subsystems because its flash fabric powers up instantly with pre-loaded logic, its industrial -40C to +100C temperature grade survives factory-floor conditions, and the 1.2V core minimizes wasted power in always-on panels. With 151 configurable I/Os in the 208-PQFP, it glues together PLC backplanes, parallel sensor buses, encoder interfaces, and actuator drivers. Unlike SRAM FPGAs, it needs no external configuration device, improving mean time between failures in vibration-prone cabinets. Place 100nF ceramic decoupling at each power pin pair; the design is captured in Microsemi Libero SoC using the ProASIC3L macro library for counters, state machines, and bus bridges.
추천
Aerospace and Defense Subsystems
The A3P250L-1PQG208I is well suited to aerospace and defense boards because Microsemi's flash-based ProASIC3L fabric is inherently more resistant to configuration single-event upsets than SRAM-based FPGAs, a decisive factor in radiation-exposed environments. The nonvolatile cells remove boot PROMs that are themselves SEU-sensitive, and the 250K-gate density handles telemetry formatting, redundant-sensor voting, and interface bridging without a processor. The industrial temperature rating covers extended mission profiles, and design security features protect firmware from readout. Designers implement triple-module redundancy on critical registers in Libero SoC; the 151 user I/Os support RS-422/423-style differential signaling through external line transceivers for avionics buses.
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Medical Instrumentation
Medical diagnostic equipment benefits from the A3P250L-1PQG208I's deterministic instant-on behavior: flash configuration means acquisition front-ends are ready before a patient interaction completes, with no boot sequence. The 1.2V core reduces heat inside enclosed benchtop housings, and 151 I/Os connect ADCs, amplifiers, display drivers, and control panels in a single programmable device. Quiet, low-static-power operation simplifies thermal design in patient-contact equipment where fan noise is unacceptable. Typical implementations use the FPGA for timing generation, digital filtering, and protocol conversion between USB/Ethernet modules and analog front ends; design security features help protect proprietary measurement algorithms embodied in the configuration bitstream.
추천
Communications Bridging and Line-Card Logic
In communications equipment, the A3P250L-1PQG208I serves as protocol-bridging logic between backplane interfaces, line cards, and system controllers. The distributor-listed 892.86 MHz family performance figure reflects internal toggle capability of the 130nm fabric, sufficient for counters and serial shifts in the hundreds of megahertz range, while the 36,864-bit embedded RAM buffers packet fragments. Flash configuration lets line cards return to service instantly after hot-swap power events without a host reprogramming cycle. The 208-PQFP provides enough I/O for parallel PHY interfaces; keep bank voltages consistent with the connected PHY standards and use Libero to verify I/O timing against the AC tables in the ProASIC3L datasheet.
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Secure Embedded Controllers
Designs that must protect intellectual property choose the A3P250L-1PQG208I because Microsemi's flash FPGA cells store configuration nonvoluntarily and are substantially harder to probe than SRAM bitstreams read from external PROMs. There is no external configuration flash to dump, closing the most common attack vector. A 250K-gate fabric implements custom encryption wrappers, authentication state machines, and anti-tamper sequencing alongside control logic. The instant-on property also eliminates the reconfiguration window during which SRAM systems are vulnerable. Combine with a secure MCU over SPI/JTAG-disabled operation; lock JTAG ports in production using Libero security settings documented in the ProASIC3L handbook.
추천
Battery-Powered Portable Instruments
Portable and battery-powered instruments exploit the L (low-power) grade of the A3P250L-1PQG208I: its 1.2V core draws low static current, extending sleep-state battery life in handheld testers and field measurement gear. Flash configuration removes the boot energy and latency of SRAM FPGAs, so the instrument is measurement-ready the moment it is switched on. The 151 I/Os interface displays, keypads, sensor bridges, and radios without a companion CPLD. Designers gate unused banks and use Libero power-analysis to confirm the static budget; estimate total power with the Microsemi power calculator using your actual toggle rates before finalizing the battery specification.
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추천 제품 요약
엔지니어링 참조 데이터: A3P250L-1PQG208I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600L-1PQG208I | A3P1000L-1PQG208I | A3P600-2PQG208I | A3P250-PQG208I |
|---|---|---|---|---|---|
| Package | 208-PQFP (28x28 mm) | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) |
| System Gates | 250,000 | 600,000 | 1,000,000 | 600,000 | 250,000 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.5 V (standard core) | 1.5 V (standard core) |
| Low-Power L Grade | Yes | Yes | Yes | No | No |
| Configuration Type | Flash-based, nonvolatile | Flash-based, nonvolatile | Flash-based, nonvolatile | Flash-based, nonvolatile | Flash-based, nonvolatile |
주요 차별점
- Lowest static power in the PQFP-208 ProASIC3 lineup (vs A3P250-PQG208I)
- Instant-on single-chip configuration (vs SRAM FPGAs (Xilinx/Altera equivalents))
- Same-footprint capacity upgrades available (vs A3P600L-1PQG208I)
설계 노트
The ProASIC3L core runs at 1.2V while I/O banks are powered separately (typically 3.3V or 2.5V). Sequence VMODE/bank supplies per the datasheet power-up requirements and place 100nF ceramic decoupling capacitors within 2 mm of each supply pin pair, plus bulk 10uF per rail. Estimated: static power scales with the L-grade advantage - if your design tolerates the higher static current, standard A3P250-PQG208I parts are more available, but never exceed absolute maximum core ratings when substituting.
The 208-PQFP (28x28 mm) has 0.5 mm-pitch leads requiring careful footprint design: use the IPC-recommended land pattern from the Microchip/Microsemi package drawing and inspect solder joints with X-ray or angled microscopy for bridging on the fine pitch. Provide thermal relief through ground planes - PQFP packages dissipate through leads, so tie all GND pins to a solid plane. Keep the 208-pin fanout symmetric to ease routing of the 151 user I/Os.
In Libero SoC, assign I/O bank voltages before finalizing schematic pinouts - mixing 3.3V and 2.5V standards on one bank causes drive-strength violations. Also lock the JTAG pins for programming access even in production; teams that repurpose TDI/TDO for user logic lose field-update capability. When substituting the larger A3P600L/A3P1000L drop-in upgrades, re-run timing closure: routing delays differ across densities even in the same speed grade.
규정 준수 정보
G suffix in A3P250L-1PQG208I denotes lead-free/RoHS-compliant packaging. REACH, halogen-free, and conflict-minerals declarations not present in provided data - request from supplier.