EPF6016QC240-3 - FLEX 6000 FPGA, 16K Gates, 132 LABs | Altera
부품 번호: EPF6016QC240-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $37.85 | $37.85 |
| 10 | $34.07 | $340.70 |
| 100 | $30.28 | $3,028.00 |
| 500 | $26.5 | $13,250.00 |
| 1,000 | $22.71 | $22,710.00 |
EPF6016QC240-3 개요
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and programmable I/O cells that engineers can customize after manufacture using a hardware description language (HDL) such as VHDL or Verilog. Within the broader hierarchy, an FPGA is a type of programmable logic device (PLD) -> logic IC -> integrated circuit. The FLEX 6000 series is positioned at the low-density end of Altera's FPGA portfolio, providing an inexpensive alternative to gate arrays and standard-cell ASICs for glue logic, bus interfacing, and state-machine implementation.
Key features of the EPF6016QC240-3 include a maximum internal operating frequency of approximately 172 MHz, on-chip SRAM configuration memory, in-system programmability via the IEEE 1149.1 (JTAG) interface, and 5V-tolerant I/O. The 'QC240' suffix designates the 240-pin Power QFP package with 199 usable I/O pins, while the '-3' speed grade represents a commercial-temperature (0C to 85C) mid-tier performance bin. The part supports multiple I/O standards including LVTTL, LVCMOS, and PCI for interfacing with common logic families.
Architecturally, the device uses a row-and-column interconnect structure with carry and cascade chains spanning LABs in the same row half, enabling high-speed arithmetic functions such as counters, adders, and wide-input comparators with minimal delay. Each LAB contains 10 Logic Elements (LEs), and configuration is loaded from a serial PROM or via JTAG boundary-scan.
Typical applications include bus interfacing (PCI, ISA, and processor bus bridges), glue-logic replacement, peripheral controllers, and prototype ASIC emulation. It is well-suited to industrial control, telecommunications line cards, and educational platforms where low-cost, quick-turn programmability outweighs the need for high gate count or high performance. This part is widely available on the secondary market because the FLEX 6000 family has been EOL'd by Intel; the EPF6016QC240-3 is now classified as obsolete (EOL).
When designing with this device, note that the FLEX 6000 family uses 5V core and I/O supply, so level shifting is required when interfacing with modern 3.3V or 1.8V logic. Designers should also provision JTAG access for in-system reconfiguration during prototype bring-up. The MaxPlus+ II or Quartus II (legacy support) toolchains provide EDIF 2.0/3.0, VHDL, Verilog HDL, and LPM entry, making it compatible with mainstream synthesis flows.
This page synthesizes distributor pricing, parametric specs, drop-in FLEX 6000 family alternatives, and practical design notes not consolidated in the original Altera datasheet.
드롭인 대체품: EPF6016QC240-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF6016QC240-3 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, Speed Grade, Internal Frequency (max).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF6016QC240
✅ 드롭인✓ 재고 있음
$18.2 / 개
데이터시트 보기 →EPF6016QC240-2
✅ 드롭인✓ 재고 있음
$18.9 / 개
데이터시트 보기 →EPF6016QC240-2N
✅ 드롭인✓ 재고 있음
$18.95 / 개
데이터시트 보기 →EPF6016AQC208-3
✅ 드롭인✓ 재고 있음
$19.2 / 개
데이터시트 보기 →EPF6010ATC100-3
✅ 드롭인✓ 재고 있음
$18.9 / 개
데이터시트 보기 →EPF6016QC240-3 최대 정격 & 전기적 특성
| Series | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements / Cells | 1,320 |
| Number of LABs/CLBs | 132 |
| Typical Gates | 16,000 |
| Number of User I/O | 199 |
| Internal Frequency (max) | 172 MHz |
| 패키지 | 240-BQFP (PQFP, 32x32 mm) |
| 실장 유형 | Surface Mount (SMD/SMT) |
| 동작 온도 | 0C to 85C (Commercial, TJ) |
| Speed Grade | -3 |
| 공급 전압 | 5 V (core and I/O) |
| Configuration Memory | SRAM (volatile, requires boot PROM or JTAG) |
| Programming Interface | IEEE 1149.1 (JTAG) boundary-scan |
| Supported I/O Standards | LVTTL, LVCMOS, PCI |
| Toolchain Support | MaxPlus+ II, Quartus II (legacy) |
| Status | Obsolete (EOL) |
| RoHS 상태 | unknown |
EPF6016QC240-3 240-bqfp (pqfp, 32x32 mm) 핀 구성 가이드
EPF6016QC240-3(240-bqfp (pqfp, 32x32 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF6016QC240-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF6016QC240-3 적합 용도: 6 애플리케이션s: PCI Bus Interface Bridge, Legacy Glue-Logic Replacement, ASIC Prototype and Emulation, Industrial Control and Factory Automation, Telecommunications Line-Card Glue Logic, Educational FPGA Platform and University Labs.
PCI Bus Interface Bridge
The EPF6016QC240-3 is well-suited to PCI 2.2 bus-interface bridging in legacy add-in cards and embedded motherboards. Its 199 user I/O pins provide ample headroom for a 32-bit/33 MHz PCI target or master interface plus glue logic to a local 8/16-bit microcontroller or DSP. The 5V-tolerant I/O meets the PCI 5V signaling spec directly without external transceivers, and 132 LABs are sufficient to implement the full PCI state machine plus interrupt and arbitration logic. Engineers typically pair this FPGA with a peripheral controller such as the MACH 210 or a discrete CPLD for address decoding; existing layouts can be reused 1:1 when migrating to the -2 or Pb-free -2N speed grades.
추천
Legacy Glue-Logic Replacement
Designers use the EPF6016QC240-3 to replace dozens of 74-series TTL or HCT logic gates on legacy PCBs, consolidating address decoding, wait-state generation, and bus-multiplexing into a single programmable device. The FLEX 6000 architecture with 132 LABs and 1,320 LEs maps comfortably to 500-1500 equivalent TTL gates, while the JTAG interface enables in-system reprogramming during prototype bring-up. 5V I/O is compatible with existing TTL signal levels, avoiding the need for level shifters. Compared with discrete logic, this part reduces board area by 50-70% and improves EMC by shortening interconnect traces; existing schematics can be migrated to HDL with minimal hardware changes.
추천
ASIC Prototype and Emulation
The EPF6016QC240-3 is widely deployed as an ASIC prototype or in-circuit emulator for gate-array designs in the 5K-15K gate range. Designers can map the entire ASIC netlist into the FLEX 6000 fabric and iterate RTL or gate-level changes in hours rather than weeks, dramatically accelerating pre-tapeout validation. The 172 MHz internal Fmax supports testing of CPU, DSP, and bus-interface ASICs at near-real-time speeds. The JTAG interface allows real-time stimulus and observation, and the 240-pin PQFP footprint fits standard prototyping adapter boards. The part is especially valued in industrial and telecom ASIC developments where pre-silicon verification reduces respin risk.
추천
Industrial Control and Factory Automation
The EPF6016QC240-3 is used in industrial PLCs, motor controllers, and factory-automation line cards where its 5V I/O tolerates the long cable runs and noisy switchgear typical of factory floors. The commercial 0C-85C temperature range suits enclosure-controlled environments, while the PQFP package withstands standard SMT reflow profiles. With 132 LABs available, designers can implement encoder quadrature decoding, PWM generation, Modbus or PROFIBUS framing, and safety interlocks in a single device. The FLEX 6000 family's mature MaxPlus+ II toolchain ensures continued design-tool availability for long-lifecycle industrial products; engineers should pair the FPGA with isolation barriers and TVS protection on all field-side I/Os.
추천
Telecommunications Line-Card Glue Logic
In TDM/PDH and early-SDH telecom line cards, the EPF6016QC240-3 serves as flexible glue logic between framers, LIUs, and network processors. Its 5V I/O interfaces directly with classic telecom ICs, while the 132 LABs accommodate HDLC controllers, BERT engines, and alarm-collection state machines. The 199 user I/Os are sufficient to terminate HDB3/AMI line interfaces plus parallel backplane connections. Because the FLEX 6000 SRAM is volatile, designers typically use a small EPC configuration PROM for fast standalone boot after power-up. The part's 172 MHz Fmax supports 8.192 Mbps E1 and 4.096 Mbps PCM highway framing without timing closure issues.
추천
Educational FPGA Platform and University Labs
Universities and technical-training labs use the EPF6016QC240-3 on Altera UP2 and similar education boards to teach digital logic, computer architecture, and HDL design. The 16K-gate capacity is large enough for small RISC CPUs (e.g., a multi-cycle MIPS), VGA controllers, and PS/2 or UART peripherals, but small enough that students can place-and-route designs in minutes rather than hours. The 199 user I/Os provide ample access to off-board LEDs, switches, and 7-segment displays for visual feedback. Because the FLEX 6000 family is mature and inexpensive on the secondary market, replacement boards cost a fraction of modern dev kits; Quartus II Web Edition (free) provides a full design flow for student projects.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF6016QC240-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF6016QC240 | EPF6016QC240-2 | EPF6016QC240-2N | EPF6016AQC208-3 | EPF6010ATC100-3 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 240-BQFP (PQFP) | 240-BQFP (PQFP) - same | 240-BQFP (PQFP) - same | 240-BQFP (PQFP) - same | 208-BQFP (PQFP) - different | 100-TQFP - different |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 880 |
| Number of LABs | 132 | 132 | 132 | 132 | 132 | 88 |
| Typical Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 10,000 |
| User I/O | 199 | 199 | 199 | 199 | 171 | 81 |
| Speed Grade | -3 (mid-tier) | baseline | -2 (slower) | -2 + Pb-free | -3 (low-power A die) | -3 |
| RoHS / Pb-free | unknown | Pb-containing (non-RoHS) | Pb-containing | Pb-free (RoHS) | Pb-free (RoHS) | Pb-free (RoHS) |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
주요 차별점
- Mid-tier -3 speed grade offers higher Fmax than baseline and -2 grades for timing-critical paths (vs EPF6016QC240)
- Highest-density FLEX 6000 variant in the 240-pin PQFP package family (vs EPF6010ATC100-3)
- 199 user I/O pins provide ample headroom for wide-bus interfaces and multi-standard bridging (vs EPF6024AQC208-3N)
설계 노트
Estimated: at 5V VCC, 50% logic utilization, and 50 MHz toggle rate, Icore is approximately 100-150 mA (roughly 0.5-0.75 W). Add 20-40 mA per bank for I/O switching depending on load and frequency. Decouple every VCC/GND pair with a 0.1uF X7R ceramic placed within 5 mm of the pin, plus a 10-100 uF tantalum or polymer bulk capacitor on each supply rail. The 240-pin PQFP has 12-16 VCC and 12-16 GND pins; all must be connected for supply integrity.
The 240-pin PQFP has a 0.5 mm pitch and gull-wing leads; reflow profile should follow JEDEC J-STD-020 (peak 245C for SnPb, 260C for Pb-free) with preheat ramp of 1-3C/s. Allow a 5 mm trace-clearance keepout under the package body for probe access during debug. All JTAG pins (TCK, TMS, TDI, TDO, TRST) must be brought to a 2x5 header for ByteBlaster programming; add 10 kohm pull-ups on TMS and TDI per Altera AN 39.
Three common pitfalls: (1) Do not assume non-volatile configuration - the FLEX 6000 is SRAM-based and loses its bitstream at power-down; an external EPC configuration PROM is mandatory for standalone boot. (2) Do not connect 3.3V signals directly to the 5V-tolerant I/O banks without verifying Vih/Vil compatibility; use a level shifter or bus switch when interfacing with modern low-voltage devices. (3) Do not rely on Quartus II for FLEX 6000 timing closure without selecting the legacy device library - newer Quartus versions may have dropped support.
Estimated: at full 199-I/O toggle rate with 50 pF loads, total power can reach 1.5-2.0 W; the 240-pin PQFP theta_JA is approximately 35-45 C/W on a 4-layer JEDEC test board, yielding a 50-90C junction rise above ambient. Provide at least 10 cm^2 of unbroken copper pour on the top layer under the package and thermal vias to inner ground planes. Forced-air cooling is recommended if I/O switching exceeds 25 MHz or ambient temperature exceeds 60C.
규정 준수 정보
RoHS and REACH compliance not stated in the verified data; the -2N and -3N suffix variants of this part are typically Pb-free, but the EPF6016QC240-3 (no N suffix) is likely Pb-containing based on Altera's historical part-numbering convention. AEC-Q100 not applicable - this is a commercial-grade FPGA.
