EPF6016TI144-3 - FLEX 6000 FPGA, 1320 Cells, 117 I/O | Intel
부품 번호: EPF6016TI144-3 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $39.37 | $39.37 |
| 10 | $35.43 | $354.30 |
| 100 | $31.5 | $3,150.00 |
| 500 | $27.56 | $13,780.00 |
| 1,000 | $23.62 | $23,620.00 |
EPF6016TI144-3 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacture. FPGAs sit hierarchically under programmable logic devices (PLDs) within the broader digital IC family and are used to implement custom digital circuits without the cost or lead time of an ASIC. The FLEX 6000 series specifically targets low-cost, high-volume glue logic and gate-array replacement applications with SRAM-based configuration.
Key features of the EPF6016TI144-3 include 16,000 typical gates, 1,320 logic elements, fast continuous interconnect, JTAG-based in-system programmability via the ByteBlaster or BitBlaster port, and a JTAG boundary-scan test interface compliant with IEEE Std 1149.1. The -3 speed grade designation places this part in the faster commercial tier of the FLEX 6000 family. With 117 user I/Os and a 144-pin TQFP footprint, the device provides ample connectivity for medium-complexity control, bridging, and bus-interface designs.
The EPF6016TI144-3 uses a 4-input look-up table (LUT)-based logic element, fast row and column interconnect channels, and embedded memory cells distributed throughout the array. The SRAM configuration memory allows unlimited re-programmability in-system, and the FLEX 6000 architecture supports hot-socketing for field upgrades. The Quartus II and legacy MAX+PLUS II design software provide VHDL, Verilog HDL, and EDIF 2 0 0 / 3 0 0 interfaces with full timing simulation and synthesis flows.
Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, peripheral bus interfacing (PCI bridge, microcontroller expansion), and prototyping for gate-array or ASIC designs. The 5 V core and 3.3 V tolerant I/O make it well suited for legacy 5 V systems and 3.3 V mixed-voltage designs.
When designing with this device, pay close attention to the VCCINT/VCCIO separation: VCCIO must be at least 4.75 V for tOD1 timing, otherwise tOD2 (nominally slower) applies. Decoupling must follow the reference design's capacitor count and placement to maintain signal integrity on the 117 I/O pins.
This page synthesizes distributor inventory, drop-in alternatives within the FLEX 6000 family, and practical design considerations not found in a single distributor listing.
드롭인 대체품: EPF6016TI144-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF6016TI144-3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Process Technology, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF6016TI144-3N
✅ 드롭인✓ 재고 있음
$9.85 / 개
데이터시트 보기 →EPF6016TI144-2N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF6016TI144-2
✅ 드롭인✓ 재고 있음
$20.15 / 개
데이터시트 보기 →EPF6016ATI144-3N
✅ 드롭인✓ 재고 있음
$22.1 / 개
데이터시트 보기 →EPF6016ATI144-3
✅ 드롭인✓ 재고 있음
$15.9 / 개
데이터시트 보기 →EPF6016ATI144-2N
✅ 드롭인✓ 재고 있음
$17.3 / 개
데이터시트 보기 →EPF6016TI144-3 최대 정격 & 전기적 특성
| Family | FLEX 6000 |
| Logic Elements / Cells | 1320 |
| Typical Gates | 16,000 |
| User I/Os | 117 |
| Internal Frequency (max) | 125 MHz |
| Supply Voltage VCCINT | 5 V |
| I/O Supply Voltage VCCIO | 3.3 V or 5 V |
| Process Technology | 0.42 µm CMOS SRAM |
| 패키지 | 144-LQFP (TQFP) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0 C to 85 C (commercial) |
| Speed Grade | -3 |
| Configuration Memory | SRAM (volatile, in-system reconfigurable) |
| Programming Interface | JTAG (IEEE 1149.1) via ByteBlaster / BitBlaster |
| RoHS 상태 | Compliant |
EPF6016TI144-3 144-lqfp (tqfp) 핀 구성 가이드
EPF6016TI144-3(144-lqfp (tqfp) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF6016TI144-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF6016TI144-3 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Glue Logic, Industrial Control and Instrumentation, Peripheral Bus Interfacing / Bridge, ASIC Prototyping and Gate-Array Replacement, Legacy 5 V Mixed-Voltage System Integration, Test Equipment and JTAG-Based Board Diagnostics.
Telecommunications Line-Card Glue Logic
The EPF6016TI144-3 fits telecom line-card glue-logic roles because its 1320 logic cells and 117 user I/Os comfortably handle bus-isolation, address decoding, and protocol-bridging tasks between ASICs and backplane connectors. Its 125 MHz -3 speed grade easily meets typical 77.76 MHz telecom backplane timing margins, and the 5 V VCCINT with 3.3 V VCCIO support enables direct interface to legacy 5 V TDM chips alongside modern 3.3 V framers. Designers typically place the FPGA between the framer and a network processor, using its SRAM-based in-system reconfigurability to field-upgrade glue logic without board rework.
추천
Industrial Control and Instrumentation
For industrial control PLCs and instrumentation front-ends, the EPF6016TI144-3 provides flexible state-machine, encoder, and PWM generation logic in a single chip, replacing multiple 74-series glue packages. Its 117 I/Os accommodate the typical mix of digital inputs, opto-isolated outputs, and serial buses (RS-232/RS-485) found on a PLC backplane. The industrial-temperature EPF6016TI144-3 variant (0 C to +85 C, with -40 C to +100 C option via the 'A' revision) handles factory-floor thermal ranges. Designers benefit from JTAG boundary-scan for board-level test and SRAM reconfigurability for late-stage firmware fixes.
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Peripheral Bus Interfacing / Bridge
The EPF6016TI144-3 excels as a peripheral bus bridge, translating between legacy ISA/PCI, I2C, SPI, and proprietary microcontroller expansion buses. Its 1320 cells are sufficient for a full 32-bit PCI target state machine plus FIFO control, and the 117 I/Os support multiple bus interfaces simultaneously. The 125 MHz -3 speed grade comfortably meets 33 MHz PCI timing with margin, and the 5 V VCCINT allows direct interface to legacy 5 V microcontrollers. In-system SRAM configuration enables late-stage bus-protocol updates without board respins.
추천
ASIC Prototyping and Gate-Array Replacement
The EPF6016TI144-3 is specifically designed as a low-cost, high-volume alternative to masked gate arrays and small ASICs. With 16,000 typical gates and unlimited in-system reprogramming via SRAM, engineers can prototype full custom logic and ship the FPGA in low-volume products, avoiding the $50K-$500K NRE of an ASIC. The 144-LQFP package is hand-solderable for prototypes and reworkable in production, unlike fine-pitch BGAs. Quartus II and MAX+PLUS II flows provide synthesis, place-and-route, and timing simulation against the same constraints as the eventual ASIC implementation.
추천
Legacy 5 V Mixed-Voltage System Integration
The EPF6016TI144-3's split VCCINT (5 V) and VCCIO (3.3 V or 5 V) supplies make it ideal for mixed-voltage designs that bridge legacy 5 V TTL/CMOS logic with newer 3.3 V peripherals. With 117 user I/Os, designers can partition 5 V-tolerant I/O banks for legacy devices and 3.3 V banks for modern microcontrollers or memories on the same FPGA. According to the FLEX 6000 datasheet, VCCIO above 4.75 V selects tOD1 timing (faster); below 4.75 V selects tOD2 (nominally slower). This dual-voltage flexibility simplifies board design in industrial upgrade and retrofit products.
추천
Test Equipment and JTAG-Based Board Diagnostics
The EPF6016TI144-3's built-in IEEE 1149.1 JTAG boundary-scan interface makes it ideal for test equipment and board-level diagnostics designs. The same JTAG port used for configuration can drive boundary-scan tests of the surrounding board, allowing the FPGA to act as both logic and test controller. With 117 user I/Os available for boundary-scan chains, the device can test dozens of surrounding ICs without external scan muxes. The SRAM configuration also allows in-field test-vector updates via JTAG, useful for deployed test fixtures and production ATE.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF6016TI144-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF6016TI144-3N | EPF6016TI144-2N | EPF6016ATI144-3N | EPF6016ATI144-2N |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Speed Grade | -3 (125 MHz) | -3 (125 MHz) | -2 (slower, ~95 MHz) | -3 (125 MHz), 'A' silicon | -2 (slower, ~95 MHz), 'A' silicon |
| Logic Cells | 1320 | 1320 (same die) | 1320 (same die) | 1320 (same die) | 1320 (same die) |
| User I/Os | 117 | 117 (same) | 117 (same) | 117 (same) | 117 (same) |
| VCCINT / VCCIO | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V |
| RoHS Status | Non-RoHS (SnPb finish) | RoHS-compliant (lead-free) | RoHS-compliant (lead-free) | RoHS-compliant (lead-free) | RoHS-compliant (lead-free) |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C (A rev may include industrial) | 0 C to +85 C (A rev may include industrial) |
주요 차별점
- RoHS-compliant lead-free finish for modern environmental standards (vs EPF6016TI144-3 (base part))
- Faster -3 speed grade for high-margin timing closure (vs EPF6016TI144-2N)
- Improved 'A' silicon revision for tighter timing and lower power (vs EPF6016TI144-3N (non-A base part))
설계 노트
Estimated: The EPF6016TI144-3 requires separate VCCINT (5 V core) and VCCIO (3.3 V or 5 V I/O) rails. Decoupling must include at least 8-10 ceramic capacitors (0.1 µF + 10 µF bulk) within 5 mm of each power pin per the FLEX 6000 reference design. When VCCIO is below 4.75 V, the device switches to tOD2 (slower) timing - budget timing closure accordingly.
The 144-LQFP package has a 0.5 mm pitch and a 22 mm × 22 mm body with an exposed thermal pad. Per the FLEX 6000 datasheet, all 117 user I/O pins should be length-matched within ±2 mm for SDR-type interfaces, and the JTAG chain (TDI, TDO, TMS, TCK) should be isolated from switching I/O with a ground guard to prevent configuration corruption during programming.
Do not confuse the EPF6016TI144-3 (legacy SnPb finish) with the EPF6016TI144-3N (RoHS lead-free) - they share the same datasheet and pinout but differ in termination finish. For new designs requiring RoHS, order the -3N variant. Also note the FLEX 6000 family is SRAM-based: configuration is volatile and must be reloaded at every power-up via a configuration PROM (e.g., EPC1) or JTAG.
For designs using the EPF6016TI144-3 at 33 MHz PCI frequencies, place 22-33 Ω series damping resistors near the FPGA driver pins on PCI bus traces to control ringing. The 117 user I/Os are split into multiple I/O banks with independent VCCIO supplies - keep high-speed buses within a single bank to avoid skew across bank boundaries.
규정 준수 정보
Base EPF6016TI144-3 (without 'N' suffix) uses SnPb finish and is NOT RoHS compliant. Order EPF6016TI144-3N for RoHS-compliant lead-free finish. AEC-Q100 not applicable (FPGA is not an automotive-qualified part). REACH and halogen-free status not explicitly stated in the verified distributor data.