EPF6016TI144-3 - FLEX 6000 FPGA, 1320 Cells, 117 I/O | Intel
部品番号: EPF6016TI144-3 ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $39.37 | $39.37 |
| 10 | $35.43 | $354.30 |
| 100 | $31.5 | $3,150.00 |
| 500 | $27.56 | $13,780.00 |
| 1,000 | $23.62 | $23,620.00 |
EPF6016TI144-3 概要
An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacture. FPGAs sit hierarchically under programmable logic devices (PLDs) within the broader digital IC family and are used to implement custom digital circuits without the cost or lead time of an ASIC. The FLEX 6000 series specifically targets low-cost, high-volume glue logic and gate-array replacement applications with SRAM-based configuration.
Key features of the EPF6016TI144-3 include 16,000 typical gates, 1,320 logic elements, fast continuous interconnect, JTAG-based in-system programmability via the ByteBlaster or BitBlaster port, and a JTAG boundary-scan test interface compliant with IEEE Std 1149.1. The -3 speed grade designation places this part in the faster commercial tier of the FLEX 6000 family. With 117 user I/Os and a 144-pin TQFP footprint, the device provides ample connectivity for medium-complexity control, bridging, and bus-interface designs.
The EPF6016TI144-3 uses a 4-input look-up table (LUT)-based logic element, fast row and column interconnect channels, and embedded memory cells distributed throughout the array. The SRAM configuration memory allows unlimited re-programmability in-system, and the FLEX 6000 architecture supports hot-socketing for field upgrades. The Quartus II and legacy MAX+PLUS II design software provide VHDL, Verilog HDL, and EDIF 2 0 0 / 3 0 0 interfaces with full timing simulation and synthesis flows.
Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, peripheral bus interfacing (PCI bridge, microcontroller expansion), and prototyping for gate-array or ASIC designs. The 5 V core and 3.3 V tolerant I/O make it well suited for legacy 5 V systems and 3.3 V mixed-voltage designs.
When designing with this device, pay close attention to the VCCINT/VCCIO separation: VCCIO must be at least 4.75 V for tOD1 timing, otherwise tOD2 (nominally slower) applies. Decoupling must follow the reference design's capacitor count and placement to maintain signal integrity on the 117 I/O pins.
This page synthesizes distributor inventory, drop-in alternatives within the FLEX 6000 family, and practical design considerations not found in a single distributor listing.
ドロップイン代替品: EPF6016TI144-3 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF6016TI144-3 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Speed Grade, Process Technology, Configuration Method.
クイック比較ツール — 並列比較する代替部品を選択:
EPF6016TI144-3N
✅ ドロップイン✓ 在庫あり
$9.85 / 個
データシートを見る →EPF6016TI144-2N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EPF6016TI144-2
✅ ドロップイン✓ 在庫あり
$20.15 / 個
データシートを見る →EPF6016ATI144-3N
✅ ドロップイン✓ 在庫あり
$22.1 / 個
データシートを見る →EPF6016ATI144-3
✅ ドロップイン✓ 在庫あり
$15.9 / 個
データシートを見る →EPF6016ATI144-2N
✅ ドロップイン✓ 在庫あり
$17.3 / 個
データシートを見る →EPF6016TI144-3 最大定格＆電気的特性
| Family | FLEX 6000 |
| Logic Elements / Cells | 1320 |
| Typical Gates | 16,000 |
| User I/Os | 117 |
| Internal Frequency (max) | 125 MHz |
| Supply Voltage VCCINT | 5 V |
| I/O Supply Voltage VCCIO | 3.3 V or 5 V |
| Process Technology | 0.42 µm CMOS SRAM |
| パッケージ | 144-LQFP (TQFP) |
| 実装タイプ | Surface Mount |
| 動作温度 | 0 C to 85 C (commercial) |
| Speed Grade | -3 |
| Configuration Memory | SRAM (volatile, in-system reconfigurable) |
| Programming Interface | JTAG (IEEE 1149.1) via ByteBlaster / BitBlaster |
| RoHS ステータス | Compliant |
EPF6016TI144-3 144-lqfp (tqfp) ピン配置ガイド
EPF6016TI144-3 (144-lqfp (tqfp) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPF6016TI144-3.
詳細は データシート をご参照ください。
主な用途
EPF6016TI144-3 の用途: 6 件s: Telecommunications Line-Card Glue Logic, Industrial Control and Instrumentation, Peripheral Bus Interfacing / Bridge, ASIC Prototyping and Gate-Array Replacement, Legacy 5 V Mixed-Voltage System Integration, Test Equipment and JTAG-Based Board Diagnostics.
Telecommunications Line-Card Glue Logic
The EPF6016TI144-3 fits telecom line-card glue-logic roles because its 1320 logic cells and 117 user I/Os comfortably handle bus-isolation, address decoding, and protocol-bridging tasks between ASICs and backplane connectors. Its 125 MHz -3 speed grade easily meets typical 77.76 MHz telecom backplane timing margins, and the 5 V VCCINT with 3.3 V VCCIO support enables direct interface to legacy 5 V TDM chips alongside modern 3.3 V framers. Designers typically place the FPGA between the framer and a network processor, using its SRAM-based in-system reconfigurability to field-upgrade glue logic without board rework.
おすすめ
Industrial Control and Instrumentation
For industrial control PLCs and instrumentation front-ends, the EPF6016TI144-3 provides flexible state-machine, encoder, and PWM generation logic in a single chip, replacing multiple 74-series glue packages. Its 117 I/Os accommodate the typical mix of digital inputs, opto-isolated outputs, and serial buses (RS-232/RS-485) found on a PLC backplane. The industrial-temperature EPF6016TI144-3 variant (0 C to +85 C, with -40 C to +100 C option via the 'A' revision) handles factory-floor thermal ranges. Designers benefit from JTAG boundary-scan for board-level test and SRAM reconfigurability for late-stage firmware fixes.
おすすめ
Peripheral Bus Interfacing / Bridge
The EPF6016TI144-3 excels as a peripheral bus bridge, translating between legacy ISA/PCI, I2C, SPI, and proprietary microcontroller expansion buses. Its 1320 cells are sufficient for a full 32-bit PCI target state machine plus FIFO control, and the 117 I/Os support multiple bus interfaces simultaneously. The 125 MHz -3 speed grade comfortably meets 33 MHz PCI timing with margin, and the 5 V VCCINT allows direct interface to legacy 5 V microcontrollers. In-system SRAM configuration enables late-stage bus-protocol updates without board respins.
おすすめ
ASIC Prototyping and Gate-Array Replacement
The EPF6016TI144-3 is specifically designed as a low-cost, high-volume alternative to masked gate arrays and small ASICs. With 16,000 typical gates and unlimited in-system reprogramming via SRAM, engineers can prototype full custom logic and ship the FPGA in low-volume products, avoiding the $50K-$500K NRE of an ASIC. The 144-LQFP package is hand-solderable for prototypes and reworkable in production, unlike fine-pitch BGAs. Quartus II and MAX+PLUS II flows provide synthesis, place-and-route, and timing simulation against the same constraints as the eventual ASIC implementation.
おすすめ
Legacy 5 V Mixed-Voltage System Integration
The EPF6016TI144-3's split VCCINT (5 V) and VCCIO (3.3 V or 5 V) supplies make it ideal for mixed-voltage designs that bridge legacy 5 V TTL/CMOS logic with newer 3.3 V peripherals. With 117 user I/Os, designers can partition 5 V-tolerant I/O banks for legacy devices and 3.3 V banks for modern microcontrollers or memories on the same FPGA. According to the FLEX 6000 datasheet, VCCIO above 4.75 V selects tOD1 timing (faster); below 4.75 V selects tOD2 (nominally slower). This dual-voltage flexibility simplifies board design in industrial upgrade and retrofit products.
おすすめ
Test Equipment and JTAG-Based Board Diagnostics
The EPF6016TI144-3's built-in IEEE 1149.1 JTAG boundary-scan interface makes it ideal for test equipment and board-level diagnostics designs. The same JTAG port used for configuration can drive boundary-scan tests of the surrounding board, allowing the FPGA to act as both logic and test controller. With 117 user I/Os available for boundary-scan chains, the device can test dozens of surrounding ICs without external scan muxes. The SRAM configuration also allows in-field test-vector updates via JTAG, useful for deployed test fixtures and production ATE.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF6016TI144-3 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF6016TI144-3N | EPF6016TI144-2N | EPF6016ATI144-3N | EPF6016ATI144-2N |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Speed Grade | -3 (125 MHz) | -3 (125 MHz) | -2 (slower, ~95 MHz) | -3 (125 MHz), 'A' silicon | -2 (slower, ~95 MHz), 'A' silicon |
| Logic Cells | 1320 | 1320 (same die) | 1320 (same die) | 1320 (same die) | 1320 (same die) |
| User I/Os | 117 | 117 (same) | 117 (same) | 117 (same) | 117 (same) |
| VCCINT / VCCIO | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V |
| RoHS Status | Non-RoHS (SnPb finish) | RoHS-compliant (lead-free) | RoHS-compliant (lead-free) | RoHS-compliant (lead-free) | RoHS-compliant (lead-free) |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C (A rev may include industrial) | 0 C to +85 C (A rev may include industrial) |
主な差別化要因
- RoHS-compliant lead-free finish for modern environmental standards （vs EPF6016TI144-3 (base part))
- Faster -3 speed grade for high-margin timing closure （vs EPF6016TI144-2N)
- Improved 'A' silicon revision for tighter timing and lower power （vs EPF6016TI144-3N (non-A base part))
設計ノート
Estimated: The EPF6016TI144-3 requires separate VCCINT (5 V core) and VCCIO (3.3 V or 5 V I/O) rails. Decoupling must include at least 8-10 ceramic capacitors (0.1 µF + 10 µF bulk) within 5 mm of each power pin per the FLEX 6000 reference design. When VCCIO is below 4.75 V, the device switches to tOD2 (slower) timing - budget timing closure accordingly.
The 144-LQFP package has a 0.5 mm pitch and a 22 mm × 22 mm body with an exposed thermal pad. Per the FLEX 6000 datasheet, all 117 user I/O pins should be length-matched within ±2 mm for SDR-type interfaces, and the JTAG chain (TDI, TDO, TMS, TCK) should be isolated from switching I/O with a ground guard to prevent configuration corruption during programming.
Do not confuse the EPF6016TI144-3 (legacy SnPb finish) with the EPF6016TI144-3N (RoHS lead-free) - they share the same datasheet and pinout but differ in termination finish. For new designs requiring RoHS, order the -3N variant. Also note the FLEX 6000 family is SRAM-based: configuration is volatile and must be reloaded at every power-up via a configuration PROM (e.g., EPC1) or JTAG.
For designs using the EPF6016TI144-3 at 33 MHz PCI frequencies, place 22-33 Ω series damping resistors near the FPGA driver pins on PCI bus traces to control ringing. The 117 user I/Os are split into multiple I/O banks with independent VCCIO supplies - keep high-speed buses within a single bank to avoid skew across bank boundaries.
コンプライアンス情報
Base EPF6016TI144-3 (without 'N' suffix) uses SnPb finish and is NOT RoHS compliant. Order EPF6016TI144-3N for RoHS-compliant lead-free finish. AEC-Q100 not applicable (FPGA is not an automotive-qualified part). REACH and halogen-free status not explicitly stated in the verified distributor data.