EPF8282ALC84-2 - FLEX 8000 FPGA, 2.5K Gates, 84-PLCC | Intel / Altera
부품 번호: EPF8282ALC84-2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $15.2 | $152.00 |
| 100 | $12.8 | $1,280.00 |
| 500 | $10.5 | $5,250.00 |
| 1,000 | $8.95 | $8,950.00 |
EPF8282ALC84-2 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the user can define after manufacture via a configuration bitstream. The FLEX 8000 family sits within the programmable-logic hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs differ from CPLDs in offering register-rich, SRAM-based logic optimized for higher density and finer-grained arithmetic, whereas CPLDs are typically non-volatile and better suited to wide combinatorial decode logic. Within the broader PLD market, FPGAs occupy the high-density, high-register-count tier between small CPLDs and ASICs.
Key features of the EPF8282ALC84-2 include 26 Logic Array Blocks (LABs), 208 flip-flops, 68 I/O pins, in-circuit reconfigurability (ICR) via external configuration devices (such as the EPC1 or EPC1441), and built-in JTAG (IEEE 1149.1) boundary-scan support. The device operates from a 5.0 V core supply and is offered in a commercial temperature grade. Its SRAM-based fabric requires configuration on every power-up but enables unlimited re-programmability, making it suitable for prototyping and field-upgradable systems.
The FLEX 8000 architecture uses a hierarchical interconnect structure with fast row and column channels, providing predictable timing for registered designs. Each LAB contains 8 logic elements, and the 26-LAB array is well suited to 16-bit datapath designs, address decoding, and FIFO controllers. The 84-pin PLCC package with J-leads is a through-hole-friendly surface-mount format that simplifies prototyping on socketed carriers while still supporting reflow assembly.
Typical applications include industrial control glue logic, telecommunications line-card glue, military/aerospace retrofit boards (where long-life FLEX 8000 stocks are still maintained), legacy ASIC replacement, bus-bridge logic between microprocessors and peripherals, and state-machine consolidation on multi-board systems. Designers value the FLEX 8000 series for its deterministic timing, JTAG-driven in-system programmability, and abundant third-party toolchain support (MAX+PLUS II, Quartus II legacy support).
When designing with this part, note that the FLEX 8000 family is mature and recommended for new designs only when second-source supply and pin-compatible alternatives are required. For new greenfield designs, Intel recommends the MAX 10 or Cyclone IV series. Always include a configuration PROM (EPC1/EPC1441) in the reference schematic, and follow the JTAG chain recommendations in the FLEX 8000 datasheet for multi-device boards.
This page synthesizes distributor pricing, same-family drop-in alternatives (including pin-compatible speed grades -2/-3/-4), and practical design notes not consolidated in a single place on the manufacturer datasheet.
드롭인 대체품: EPF8282ALC84-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF8282ALC84-2 (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Method, Mounting Type, Speed Grade, Package, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF8282ALC84-3
✅ 드롭인✓ 재고 있음
$9.85 / 개
데이터시트 보기 →EPF8282ALC84-4
✅ 드롭인✓ 재고 있음
$9.75 / 개
데이터시트 보기 →EPF8282ATC144-3
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EPF8282ATC100-3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10.25 / 개
데이터시트 보기 →EPF8282ALC84-2 최대 정격 & 전기적 특성
| Family | FLEX 8000 |
| Device Logic Elements / FFs | 208 |
| Usable Gates | 2,500 |
| Logic Array Blocks (LABs) | 26 |
| Maximum User I/Os | 68 |
| Process Technology | 0.42 micrometer CMOS, SRAM-based |
| 패키지 | 84-pin LCC (J-Lead), PLCC-84 |
| Core Supply Voltage | 5.0 V |
| Configuration Method | External configuration device (EPC1/EPC1441) or JTAG |
| In-Circuit Reconfigurability | Yes (ICR) |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Temperature Grade (this part) | Commercial (suffix 'C' in package code) |
| Speed Grade | -2 |
| RoHS 상태 | Unknown (legacy Altera part, pre-RoHS transition) |
| Lead-Free | Unknown |
| 실장 유형 | Surface Mount (J-Lead) |
EPF8282ALC84-2 핀 구성
| 핀 1 | I/O — User I/O pin (bank A) |
| 핀 2 | I/O — User I/O pin (bank A) |
| 핀 3 | I/O — User I/O pin (bank A) |
| 핀 4 | I/O — User I/O pin (bank A) |
| 핀 5 | I/O — User I/O pin (bank A) |
| 핀 6 | I/O — User I/O pin (bank A) |
| 핀 7 | VCC — 5.0 V core supply |
| 핀 8 | I/O — User I/O pin (bank A) |
| 핀 9 | I/O — User I/O pin (bank A) |
| 핀 10 | I/O — User I/O pin (bank A) |
| 핀 11 | I/O — User I/O pin (bank A) |
| 핀 12 | GND — Ground |
| 핀 13 | I/O — User I/O pin (bank B) |
| 핀 14 | I/O — User I/O pin (bank B) |
| 핀 15 | I/O — User I/O pin (bank B) |
| 핀 16 | I/O — User I/O pin (bank B) |
| 핀 17 | I/O — User I/O pin (bank B) |
| 핀 18 | I/O — User I/O pin (bank B) |
| 핀 19 | I/O — User I/O pin (bank B) |
| 핀 20 | I/O — User I/O pin (bank B) |
| 핀 21 | VCC — 5.0 V core supply |
| 핀 22 | I/O — User I/O pin (bank B) |
| 핀 23 | I/O — User I/O pin (bank B) |
| 핀 24 | I/O — User I/O pin (bank B) |
| 핀 25 | I/O — User I/O pin (bank B) |
| 핀 26 | GND — Ground |
| 핀 27 | I/O — User I/O pin (bank C) |
| 핀 28 | I/O — User I/O pin (bank C) |
| 핀 29 | I/O — User I/O pin (bank C) |
| 핀 30 | I/O — User I/O pin (bank C) |
| 핀 31 | I/O — User I/O pin (bank C) |
| 핀 32 | I/O — User I/O pin (bank C) |
| 핀 33 | I/O — User I/O pin (bank C) |
| 핀 34 | I/O — User I/O pin (bank C) |
| 핀 35 | VCC — 5.0 V core supply |
| 핀 36 | I/O — User I/O pin (bank C) |
| 핀 37 | I/O — User I/O pin (bank C) |
| 핀 38 | I/O — User I/O pin (bank C) |
| 핀 39 | I/O — User I/O pin (bank C) |
| 핀 40 | GND — Ground |
| 핀 41 | I/O — User I/O pin (bank D) |
| 핀 42 | I/O — User I/O pin (bank D) |
| 핀 43 | I/O — User I/O pin (bank D) |
| 핀 44 | I/O — User I/O pin (bank D) |
| 핀 45 | I/O — User I/O pin (bank D) |
| 핀 46 | I/O — User I/O pin (bank D) |
| 핀 47 | I/O — User I/O pin (bank D) |
| 핀 48 | I/O — User I/O pin (bank D) |
| 핀 49 | VCC — 5.0 V core supply |
| 핀 50 | I/O — User I/O pin (bank D) |
| 핀 51 | I/O — User I/O pin (bank D) |
| 핀 52 | I/O — User I/O pin (bank D) |
| 핀 53 | I/O — User I/O pin (bank D) |
| 핀 54 | GND — Ground |
| 핀 55 | I/O — User I/O pin (bank A) |
| 핀 56 | I/O — User I/O pin (bank A) |
| 핀 57 | I/O — User I/O pin (bank A) |
| 핀 58 | I/O — User I/O pin (bank A) |
| 핀 59 | I/O — User I/O pin (bank A) |
| 핀 60 | I/O — User I/O pin (bank A) |
| 핀 61 | I/O — User I/O pin (bank A) |
| 핀 62 | VCC — 5.0 V core supply |
| 핀 63 | nCONFIG — Configuration control (active-low) |
| 핀 64 | nSTATUS — Configuration status (active-low) |
| 핀 65 | CONFIG_DONE — Configuration complete status |
| 핀 66 | DCLK — Configuration clock input |
| 핀 67 | DATA0 — Configuration data input (serial) |
| 핀 68 | TDI — JTAG Test Data In |
| 핀 69 | TDO — JTAG Test Data Out |
| 핀 70 | TMS — JTAG Test Mode Select |
| 핀 71 | TCK — JTAG Test Clock |
| 핀 72 | GND — Ground |
| 핀 73 | DEV_CLRn — Device-wide clear (active-low) |
| 핀 74 | DEV_OE — Device-wide output enable |
| 핀 75 | I/O — User I/O pin (bank B) |
| 핀 76 | I/O — User I/O pin (bank B) |
| 핀 77 | I/O — User I/O pin (bank B) |
| 핀 78 | I/O — User I/O pin (bank B) |
| 핀 79 | I/O — User I/O pin (bank B) |
| 핀 80 | I/O — User I/O pin (bank B) |
| 핀 81 | I/O — User I/O pin (bank B) |
| 핀 82 | I/O — User I/O pin (bank B) |
| 핀 83 | GND — Ground |
| 핀 84 | VCC — 5.0 V core supply |
일반적인 애플리케이션
EPF8282ALC84-2 적합 용도: 6 애플리케이션s: Industrial Glue Logic Replacement, Legacy Telecom Line-Card Interface, Military / Aerospace Retrofit Logic, Bus-Bridge and Protocol Converter, State Machine Consolidation, ASIC Replacement for Low-Volume Production.
Industrial Glue Logic Replacement
The EPF8282ALC84-2 fits industrial glue-logic replacement because its 2,500 usable gates and 208 flip-flops consolidate dozens of 74-series TTL parts (decoders, muxes, latches) onto a single 5.0 V SRAM-based device. The 68 user I/Os handle address/data bus buffering, chip-select decoding, and handshake logic between microprocessors and peripherals. FLEX 8000 ICR (in-circuit reconfigurability) lets field engineers update logic via JTAG without desoldering, critical for installed industrial PLCs and machine controllers where downtime is expensive.
추천
Legacy Telecom Line-Card Interface
Telecom line cards built in the late 1990s and early 2000s frequently use the EPF8282ALC84-2 to bridge TDM backplanes to framers and codecs. The 68 I/Os comfortably handle 8-bit parallel TDM buses plus framing, alarm, and clock-distribution signals. Its 5.0 V TTL I/O matches legacy line-card bus voltages directly, eliminating level-shifters. For long-life telecom platforms, FLEX 8000 is preferred over newer families because it preserves the original BOM and avoids requalification cycles on carrier-grade equipment.
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Military / Aerospace Retrofit Logic
The EPF8282ALC84-2 is widely used in military and aerospace retrofit programs where long-life-cycle support (15-25 years) outweighs the benefits of modern families. Its mature 0.42 micrometer CMOS process has well-characterized radiation and temperature behavior, and its 5.0 V core is robust against supply transients. The 84-pin PLCC with J-leads is also accepted on legacy avionics boards designed for through-hole-friendly sockets. Designers maintain FLEX 8000 designs to avoid re-qualifying flight hardware, and distributors stock inventory for defense maintenance channels.
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Bus-Bridge and Protocol Converter
The EPF8282ALC84-2 is well suited as a bus-bridge between microprocessors and peripherals using mismatched protocols (e.g., ISA-to-PC/104, VME-to-local bus, custom backplane-to-DSP). The 208 flip-flops handle FIFOs and handshaking registers, while 26 LABs implement the state machines and address-mapping logic. Its SRAM-based fabric allows late-stage bug fixes via in-system JTAG reprogramming, a key advantage over mask-programmed ASIC bridges that require respin for any logic change.
추천
State Machine Consolidation
Designers use the EPF8282ALC84-2 to consolidate multiple discrete PAL/GAL state machines into a single 5.0 V device, reducing board area and improving timing predictability. With 208 flip-flops and 26 LABs, it can host 8-12 independent Moore or Mealy state machines with up to 16 states each, alongside combinational glue. This is a common refactoring task on legacy boards where discrete PLDs have proliferated; consolidating into one FLEX 8000 part simplifies inventory, reduces power, and enables JTAG-driven in-system updates.
추천
ASIC Replacement for Low-Volume Production
For low-volume production (typically under 5,000 units annually), the EPF8282ALC84-2 replaces obsolete or end-of-life ASICs without NRE charges. Its 2,500-gate capacity maps to many mid-complexity ASIC designs, and the SRAM-based fabric allows per-unit personality changes (different configuration bitstreams for product variants). The 84-pin PLCC package supports both socketed prototyping and reflow assembly, simplifying transition from engineering to manufacturing. This use case is common in industrial instrumentation and specialty test equipment.
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추천 제품 요약
엔지니어링 참조 데이터: EPF8282ALC84-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF8282ALC84-3 | EPF8282ALC84-4 |
|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 84-pin LCC (J-Lead), PLCC-84 | 84-pin LCC (J-Lead), PLCC-84 - same | 84-pin LCC (J-Lead), PLCC-84 - same |
| Usable Gates | 2,500 | 2,500 | 2,500 |
| Logic Elements / FFs | 208 | 208 | 208 |
| LABs | 26 | 26 | 26 |
| User I/Os | 68 | 68 | 68 |
| Speed Grade | -2 (fastest) | -3 (~85% of -2 speed) | -4 (~70-80% of -2 speed) |
| Core Voltage | 5.0 V | 5.0 V | 5.0 V |
| Configuration | EPC1 / EPC1441 / JTAG | EPC1 / EPC1441 / JTAG | EPC1 / EPC1441 / JTAG |
| Lifecycle | Obsolete | Obsolete | Obsolete |
주요 차별점
- Pin-compatible speed-grade flexibility within FLEX 8000 family (vs EPF8282ALC84-3)
- Mature 0.42 micrometer CMOS process with long-term support channels (vs MAX 10 (modern replacement))
- JTAG-driven in-circuit reconfigurability via EPC1/EPC1441 (vs Discrete PAL/GAL state machines)
설계 노트
The EPF8282ALC84-2 requires a clean 5.0 V +/- 5% supply; per the FLEX 8000 datasheet, bulk decoupling of at least 22 uF tantalum plus 0.1 uF ceramic per VCC pin is recommended, plus a ferrite bead on the supply feed. In-circuit reconfigurability means the device draws surge currents during configuration; allow at least 100 mA headroom on the 5 V rail. Add a power-on reset supervisor (e.g., MAX811) tied to nCONFIG to ensure clean startup.
The 84-pin PLCC with J-leads has a 1.27 mm pitch; per Altera layout guidelines, keep all signal traces short, use a continuous ground plane on layer 2, and place the EPC1/EPC1441 configuration PROM within 50 mm of the FPGA's DCLK/DATA0 pins. JTAG chain integrity requires 10 kohm pull-ups on TMS and TDI to VCC, and a 10 kohm pull-down on TCK to GND, per the IEEE 1149.1 specification. The PLCC socket should be a low-profile through-hole type (e.g., 3M 8434) for field-replaceable assemblies.
Three common pitfalls with the EPF8282ALC84-2: (1) Forgetting the configuration PROM - the SRAM-based fabric has no on-chip non-volatile storage, so without an EPC1/EPC1441 the device will not function on power-up; (2) Mixing 5 V and 3.3 V signals without level-shifters - FLEX 8000 I/O is 5 V TTL-only; (3) Ignoring ICR timing - in-system JTAG reconfiguration requires nCONFIG held low during programming; failing to control nCONFIG can cause partial configuration and undefined behavior.
규정 준수 정보
Legacy Altera part pre-dating RoHS transition. RoHS/REACH compliance status not stated in distributor listings or the FLEX 8000 datasheet; original parts may be SnPb finish. AEC-Q100 not applicable (FPGA not automotive-qualified).
