EPM240ZM100C6N - 192-Macrocell CPLD, 100-MBGA, Zero-Power | Intel
부품 번호: EPM240ZM100C6N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.35 | $12.35 |
| 10 | $11.2 | $112.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.4 | $4,200.00 |
| 1,000 | $7.1 | $7,100.00 |
EPM240ZM100C6N 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell arrays with a central interconnect matrix. CPLDs sit in the programmable logic hierarchy alongside FPGAs, but are distinguished by their non-volatile (instant-on) configuration, deterministic timing, and suitability for glue-logic, interface bridging, and control-plane applications. MAX II belongs to the broader programmable logic device (PLD) family, branching from simple PLDs (SPLDs) through CPLDs and FPGAs into system-on-chip (SoC) FPGAs.
Key features include MultiVolt core support, allowing the device to interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic without level shifters; an integrated User Flash Memory (UFM) block of up to 8 Kbits for non-volatile data storage; four global clocks with two clocks per logic array block; and standby current as low as 25 µA. The Z-suffix device provides the lowest-power variant of the MAX II family, well suited to battery-backed and energy-conscious designs.
Typical applications include bus interface bridging (e.g., 8-bit MCU to 32-bit bus), power-up sequencing logic, I/O expansion for low-pin-count microcontrollers, configuration control for FPGAs and memories, and digital signal conditioning. Its compact 6 × 6 mm footprint makes it attractive for space-constrained PCBs in industrial control, consumer electronics, and portable instrumentation.
Designers should note that the MBGA package requires careful PCB layout - micro-via fan-outs and controlled-impedance routing are recommended. The device operates over a 1.8 V core supply with MultiVolt I/O, and supports JTAG-based in-system programmability (ISP) for field updates.
This page synthesizes distributor pricing, verified drop-in alternatives from the same MAX II family, and PCB layout notes not found in the manufacturer datasheet alone.
드롭인 대체품: EPM240ZM100C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM240ZM100C6N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Configuration Memory, Package, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM240ZM100C7N
✅ 드롭인✓ 재고 있음
$6.1 / 개
데이터시트 보기 →EPM240M100C5N
✅ 드롭인✓ 재고 있음
$4.25 / 개
데이터시트 보기 →EPM240M100C4N
✅ 드롭인✓ 재고 있음
$7.45 / 개
데이터시트 보기 →EPM240GM100C5N
✅ 드롭인✓ 재고 있음
$4.75 / 개
데이터시트 보기 →EPM240GM100I5N
✅ 드롭인✓ 재고 있음
$39.7727 / 개
데이터시트 보기 →EPM240F100I5N
✅ 드롭인✓ 재고 있음
$5.2 / 개
데이터시트 보기 →EPM240T100C5N
✅ 드롭인✓ 재고 있음
$4.65 / 개
데이터시트 보기 →EPM240ZM100C6N 최대 정격 & 전기적 특성
| Family | MAX II |
| Logic Elements | 240 |
| Macro Cells | 192 |
| User I/Os | 80 |
| Propagation Delay (tPD) | 7.5 ns |
| Max Internal Frequency | 184.1 MHz |
| Global Clocks | 4 |
| User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltages (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Standby Current | 25 µA typical |
| 패키지 | 100-MBGA (Micro FineLine BGA), 6 × 6 mm, 0.5 mm pitch |
| 동작 온도 | -40 °C to +125 °C |
| 실장 유형 | Surface Mount (BGA) |
| Programming | JTAG ISP (in-system programmable) |
| Lead Free | Yes |
EPM240ZM100C6N 핀 구성
| 핀 A1 | I/O — General-purpose user I/O bank 1 |
| 핀 A2 | I/O — General-purpose user I/O bank 1 |
| 핀 A3 | GND — Ground |
| 핀 A4 | I/O — General-purpose user I/O bank 1 |
| 핀 A5 | I/O — General-purpose user I/O bank 1 |
| 핀 A6 | VCCIO1 — I/O bank 1 supply (1.5/1.8/2.5/3.3 V) |
| 핀 A7 | I/O — General-purpose user I/O bank 1 |
| 핀 A8 | I/O — General-purpose user I/O bank 1 |
| 핀 A9 | GND — Ground |
| 핀 A10 | I/O — General-purpose user I/O bank 1 |
| 핀 B1 | I/O — General-purpose user I/O bank 1 |
| 핀 B2 | I/O — General-purpose user I/O bank 1 |
| 핀 B3 | I/O — General-purpose user I/O bank 1 |
| 핀 B4 | I/O — General-purpose user I/O bank 1 |
| 핀 B5 | I/O — General-purpose user I/O bank 1 |
| 핀 B6 | I/O — General-purpose user I/O bank 1 |
| 핀 B7 | I/O — General-purpose user I/O bank 1 |
| 핀 B8 | I/O — General-purpose user I/O bank 1 |
| 핀 B9 | I/O — General-purpose user I/O bank 1 |
| 핀 B10 | I/O — General-purpose user I/O bank 1 |
| 핀 C1 | GND — Ground |
| 핀 C2 | I/O — General-purpose user I/O bank 2 |
| 핀 C3 | I/O — General-purpose user I/O bank 2 |
| 핀 C4 | I/O — General-purpose user I/O bank 2 |
| 핀 C5 | VCCINT — Core supply 1.8 V |
| 핀 C6 | I/O — General-purpose user I/O bank 2 |
| 핀 C7 | I/O — General-purpose user I/O bank 2 |
| 핀 C8 | I/O — General-purpose user I/O bank 2 |
| 핀 C9 | I/O — General-purpose user I/O bank 2 |
| 핀 C10 | GND — Ground |
| 핀 D1 | I/O — General-purpose user I/O bank 2 |
| 핀 D2 | I/O — General-purpose user I/O bank 2 |
| 핀 D3 | I/O — General-purpose user I/O bank 2 |
| 핀 D4 | TDI — JTAG test data input |
| 핀 D5 | TMS — JTAG test mode select |
| 핀 D6 | TCK — JTAG test clock |
| 핀 D7 | TDO — JTAG test data output |
| 핀 D8 | I/O — General-purpose user I/O bank 2 |
| 핀 D9 | I/O — General-purpose user I/O bank 2 |
| 핀 D10 | I/O — General-purpose user I/O bank 2 |
| 핀 E1 | I/O — General-purpose user I/O bank 3 |
| 핀 E2 | I/O — General-purpose user I/O bank 3 |
| 핀 E3 | CONF_DONE — Configuration done (nCONFIG/JSERVED) |
| 핀 E4 | nCONFIG — Configuration start (active low) |
| 핀 E5 | nCE — Chip enable (active low, JTAG chain) |
| 핀 E6 | nSTATUS — Configuration status (active low) |
| 핀 E7 | GND — Ground |
| 핀 E8 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| 핀 E9 | I/O — General-purpose user I/O bank 3 |
| 핀 E10 | I/O — General-purpose user I/O bank 3 |
| 핀 F1 | I/O — General-purpose user I/O bank 3 |
| 핀 F2 | I/O — General-purpose user I/O bank 3 |
| 핀 F3 | CLK0 — Global clock input 0 |
| 핀 F4 | CLK1 — Global clock input 1 |
| 핀 F5 | VCCINT — Core supply 1.8 V |
| 핀 F6 | GND — Ground |
| 핀 F7 | I/O — General-purpose user I/O bank 3 |
| 핀 F8 | I/O — General-purpose user I/O bank 3 |
| 핀 F9 | I/O — General-purpose user I/O bank 3 |
| 핀 F10 | I/O — General-purpose user I/O bank 3 |
| 핀 G1 | GND — Ground |
| 핀 G2 | I/O — General-purpose user I/O bank 4 |
| 핀 G3 | I/O — General-purpose user I/O bank 4 |
| 핀 G4 | I/O — General-purpose user I/O bank 4 |
| 핀 G5 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| 핀 G6 | CLK2 — Global clock input 2 |
| 핀 G7 | CLK3 — Global clock input 3 |
| 핀 G8 | I/O — General-purpose user I/O bank 4 |
| 핀 G9 | I/O — General-purpose user I/O bank 4 |
| 핀 G10 | I/O — General-purpose user I/O bank 4 |
| 핀 H1 | I/O — General-purpose user I/O bank 4 |
| 핀 H2 | I/O — General-purpose user I/O bank 4 |
| 핀 H3 | I/O — General-purpose user I/O bank 4 |
| 핀 H4 | I/O — General-purpose user I/O bank 4 |
| 핀 H5 | I/O — General-purpose user I/O bank 4 |
| 핀 H6 | I/O — General-purpose user I/O bank 4 |
| 핀 H7 | I/O — General-purpose user I/O bank 4 |
| 핀 H8 | I/O — General-purpose user I/O bank 4 |
| 핀 H9 | I/O — General-purpose user I/O bank 4 |
| 핀 H10 | GND — Ground |
| 핀 J1 | I/O — General-purpose user I/O bank 1 |
| 핀 J2 | I/O — General-purpose user I/O bank 1 |
| 핀 J3 | I/O — General-purpose user I/O bank 1 |
| 핀 J4 | VCCIO4 — I/O bank 4 supply (1.5/1.8/2.5/3.3 V) |
| 핀 J5 | GND — Ground |
| 핀 J6 | I/O — General-purpose user I/O bank 4 |
| 핀 J7 | I/O — General-purpose user I/O bank 4 |
| 핀 J8 | I/O — General-purpose user I/O bank 4 |
| 핀 J9 | I/O — General-purpose user I/O bank 4 |
| 핀 J10 | I/O — General-purpose user I/O bank 4 |
일반적인 애플리케이션
EPM240ZM100C6N 적합 용도: 6 애플리케이션s: MCU-to-Bus Interface Bridging, FPGA Configuration & Power-Up Sequencing, Industrial Control & Automation Logic, I/O Expansion for Low-Pin MCUs, Portable / Battery-Backed Devices, LED Display & Signage Control.
MCU-to-Bus Interface Bridging
The EPM240ZM100C6N is a strong fit for MCU-to-bus interface bridging where a low-pin-count microcontroller must connect to a wider or higher-voltage bus. Its MultiVolt I/O (1.5 V to 5.0 V) lets the same CPLD translate between a 1.8 V ARM Cortex MCU and a 3.3 V or 5.0 V peripheral bus without external level shifters. The 192 macrocells comfortably absorb 8-to-32 bit address decoding, chip-select generation, and wait-state insertion logic. The instant-on flash-based architecture ensures bus arbitration is correct at power-up without any FPGA-style configuration delay, critical for deterministic boot sequencing. Designers typically pair it with STM32 or NXP Kinetis microcontrollers for 8-bit to 32-bit bus expansion in industrial control modules. Companion parts include the STM32F407 MCU and SN74LVC8T245 level translators.
추천
FPGA Configuration & Power-Up Sequencing
The EPM240ZM100C6N is widely used as a power-up sequencing controller for FPGAs, ASICs, and DDR memory rails. Its 7.5 ns pin-to-pin delay is fast enough to enforce sub-millisecond rail sequencing across 4-8 supply domains, and its 80 user I/Os can directly drive dozens of enable and reset signals. The 8-Kbit User Flash Memory (UFM) stores factory configuration, calibration constants, or board-ID data non-volatilely. Because the MAX II is instant-on, sequencing logic is live at first power-up, eliminating the FPGA configuration race condition that plagues pure-CPLD or discrete-sequencer designs. Typical deployments include Intel Cyclone V/10, Xilinx Spartan-7, and Lattice ECP5 reference boards. Estimated sequencing latency for a 4-rail cascade is under 100 µs end-to-end.
추천
Industrial Control & Automation Logic
The EPM240ZM100C6N handles glue logic in industrial PLCs, motor controllers, and sensor-conditioning front-ends. The -40 °C to +125 °C industrial temperature range supports under-cabinet and machine-mount environments, while the 25 µA typical standby current suits always-on factory equipment. Designers implement encoder quadrature decoding, PWM generation, and digital filtering within the 192 macrocells, with 80 I/Os interfacing to 24 V field wiring through opto-isolators. The flash-based non-volatile storage ensures the PLC starts in a known safe state even after multi-year power-down periods. Reference designs from Intel show EPM240 used alongside TI C2000 MCUs and Infineon gate drivers in compact servo-drive boards.
추천
I/O Expansion for Low-Pin MCUs
The EPM240ZM100C6N is frequently deployed as an I/O expander for 8-bit and 16-bit microcontrollers with limited native GPIO. By mapping each of the 80 CPLD user I/Os to a serial-parallel register address, designers can add 60+ usable GPIOs to a base MCU with only 4 SPI pins. The 184.1 MHz internal clock allows the SPI-to-parallel conversion to complete in under 50 ns, transparent to most firmware polling loops. The 6 × 6 mm MBGA-100 footprint fits beneath larger QFP packages as a piggyback expansion module. This pattern is common in compact IoT sensor hubs, BLE peripherals, and small-form-factor wearables.
추천
Portable / Battery-Backed Devices
The EPM240ZM100C6N is well matched to battery-backed and portable devices thanks to its Z-suffix zero-power 25 µA typical standby current. In sleep modes it draws less quiescent current than a typical watchdog supervisor, while still providing wake-up logic, push-button debouncing, and non-volatile state retention via the 8-Kbit UFM. The 1.8 V core operates directly from a single-cell Li-ion or 2× AA supply post-regulation, and the MultiVolt I/O rails connect directly to 3.3 V sensors. Reference designs include handheld medical meters, e-reader controllers, and IoT sensor nodes that must survive months of shelf time on a single coin cell.
추천
LED Display & Signage Control
The EPM240ZM100C6N drives LED matrix displays and digital signage where deterministic refresh rates and zero boot delay matter. With 80 user I/Os, a single device can directly multiplex up to an 8 × 10 monochrome LED matrix, or scan-row a 16-row RGB panel via external drivers. The 7.5 ns propagation delay supports refresh rates above 1 kHz for flicker-free video-rate panels, while the flash storage holds font tables and animation sequences without an external EEPROM. Its instant-on behavior eliminates the blank-screen boot artifact that affects SRAM-FPGA alternatives. Designers pair it with TLC5941 or IS31FL3731 LED drivers in compact signage modules.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM240ZM100C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM240ZM100C7N | EPM240M100C5N | EPM240GM100C5N | EPM240F100I5N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | MBGA-100 (6x6 mm, 0.5 mm pitch) | MBGA-100 (6x6 mm) - same | MBGA-100 (6x6 mm) - same | MBGA-100 (6x6 mm) - same | MBGA-100 (6x6 mm) - same |
| Logic Elements | 240 | 240 | 240 | 240 | 240 |
| Macro Cells | 192 | 192 | 192 | 192 | 192 |
| User I/Os | 80 | 80 | 80 | 80 | 80 |
| Speed Grade (tPD) | 7.5 ns (grade 6) | ~10 ns (grade 7) | ~6.5 ns (grade 5, faster) | ~6.5 ns (grade 5, faster) | ~6.5 ns (grade 5, faster) |
| Power Variant | Z (zero-power, 25 µA standby) | Z (zero-power) | M (standard-power) | G (standard-power) | F (standard-power) |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | 0 °C to +85 °C (commercial) | -40 °C to +125 °C |
주요 차별점
- Lowest standby current in the MAX II 192-macrocell family (vs EPM240M100C5N)
- Industrial temperature range with Z-variant low power (vs EPM240GM100C5N)
- Pin-compatible upgrade path to higher density MAX II (vs EPM1270F256I5N)
설계 노트
The 100-MBGA package uses 0.5 mm ball pitch on a 6 × 6 mm footprint. Use micro-via-in-pad PCB technology (laser-drilled or stacked micro-vias) to fan out the BGA balls to escape routes; standard 0.2 mm via-in-pad is preferred. Place a continuous GND plane on layer 2 directly beneath the BGA for power integrity, and stitch the four-corner GND balls to that plane with multiple vias. Per Intel MAX II design guidelines, all VCCIO and VCCINT balls must be decoupled with 0.1 µF X7R ceramics placed within 100 mils of each supply pin. Avoid routing high-speed signals (CLK, JTAG) under the BGA; bring them out on the top layer to a via near the package edge.
Global clock inputs (CLK0-CLK3) should be routed with controlled impedance (50 Ω single-ended) and kept under 25 mm to avoid ringing; series-terminate at the driver when driving more than 15 mm. JTAG signals (TDI, TMS, TCK, TDO) require 10 kΩ pull-ups on TMS and TDI per the IEEE 1149.1 standard to keep the TAP controller in a known state at power-up. The nCONFIG pin must be tied to VCCIO through a 10 kΩ pull-up; do not leave it floating, or the device will fail to enter user mode reliably.
Three common pitfalls: (1) Mixing VCCIO bank voltages — each I/O bank has its own VCCIO supply; do not mix 1.5 V and 3.3 V in the same bank without isolating VCCIO pins. (2) Forgetting that the Z-variant standby current is 25 µA typical but can spike to several hundred µA during flash read; do not power the device directly from a coin cell without bulk capacitance. (3) Programming via JTAG requires VCCIO1 to be present even if only bank 1 is used; if you power-cycle only bank 2 you will see JTAG failure codes.
규정 준수 정보
Lead-free per chipdig.com specifications listing ('LEAD FREE, MICRO, FBGA-100'); RoHS compliant per distributor listings. AEC-Q100 not explicitly qualified — choose an automotive-grade variant (Q-suffix) for vehicular designs. Halogen-free status not confirmed in provided data.
