EPM240ZM100C6N - 192-Macrocell CPLD, 100-MBGA, Zero-Power | Intel
MPN: EPM240ZM100C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.35 | $12.35 |
| 10 | $11.2 | $112.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.4 | $4,200.00 |
| 1,000 | $7.1 | $7,100.00 |
Drop-in alternatives for EPM240ZM100C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM240ZM100C7N
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →EPM240M100C5N
✅ Drop-In✓ In Stock
$4.25 / Unit
View Datasheet →EPM240M100C4N
✅ Drop-In✓ In Stock
$7.45 / Unit
View Datasheet →EPM240GM100C5N
✅ Drop-In✓ In Stock
$4.75 / Unit
View Datasheet →EPM240GM100I5N
✅ Drop-In✓ In Stock
$9.2 / Unit
View Datasheet →EPM240F100I5N
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →EPM240T100C5N
✅ Drop-In✓ In Stock
$4.32 / Unit
View Datasheet →EPM240ZM100C6N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Logic Elements | 240 |
| Macro Cells | 192 |
| User I/Os | 80 |
| Propagation Delay (tPD) | 7.5 ns |
| Max Internal Frequency | 184.1 MHz |
| Global Clocks | 4 |
| User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltages (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Standby Current | 25 µA typical |
| Package | 100-MBGA (Micro FineLine BGA), 6 × 6 mm, 0.5 mm pitch |
| Operating Temperature | -40 °C to +125 °C |
| Mounting Type | Surface Mount (BGA) |
| Programming | JTAG ISP (in-system programmable) |
| Lead Free | Yes |
EPM240ZM100C6N Pin Configuration
| Pin A1 | I/O — General-purpose user I/O bank 1 |
| Pin A2 | I/O — General-purpose user I/O bank 1 |
| Pin A3 | GND — Ground |
| Pin A4 | I/O — General-purpose user I/O bank 1 |
| Pin A5 | I/O — General-purpose user I/O bank 1 |
| Pin A6 | VCCIO1 — I/O bank 1 supply (1.5/1.8/2.5/3.3 V) |
| Pin A7 | I/O — General-purpose user I/O bank 1 |
| Pin A8 | I/O — General-purpose user I/O bank 1 |
| Pin A9 | GND — Ground |
| Pin A10 | I/O — General-purpose user I/O bank 1 |
| Pin B1 | I/O — General-purpose user I/O bank 1 |
| Pin B2 | I/O — General-purpose user I/O bank 1 |
| Pin B3 | I/O — General-purpose user I/O bank 1 |
| Pin B4 | I/O — General-purpose user I/O bank 1 |
| Pin B5 | I/O — General-purpose user I/O bank 1 |
| Pin B6 | I/O — General-purpose user I/O bank 1 |
| Pin B7 | I/O — General-purpose user I/O bank 1 |
| Pin B8 | I/O — General-purpose user I/O bank 1 |
| Pin B9 | I/O — General-purpose user I/O bank 1 |
| Pin B10 | I/O — General-purpose user I/O bank 1 |
| Pin C1 | GND — Ground |
| Pin C2 | I/O — General-purpose user I/O bank 2 |
| Pin C3 | I/O — General-purpose user I/O bank 2 |
| Pin C4 | I/O — General-purpose user I/O bank 2 |
| Pin C5 | VCCINT — Core supply 1.8 V |
| Pin C6 | I/O — General-purpose user I/O bank 2 |
| Pin C7 | I/O — General-purpose user I/O bank 2 |
| Pin C8 | I/O — General-purpose user I/O bank 2 |
| Pin C9 | I/O — General-purpose user I/O bank 2 |
| Pin C10 | GND — Ground |
| Pin D1 | I/O — General-purpose user I/O bank 2 |
| Pin D2 | I/O — General-purpose user I/O bank 2 |
| Pin D3 | I/O — General-purpose user I/O bank 2 |
| Pin D4 | TDI — JTAG test data input |
| Pin D5 | TMS — JTAG test mode select |
| Pin D6 | TCK — JTAG test clock |
| Pin D7 | TDO — JTAG test data output |
| Pin D8 | I/O — General-purpose user I/O bank 2 |
| Pin D9 | I/O — General-purpose user I/O bank 2 |
| Pin D10 | I/O — General-purpose user I/O bank 2 |
| Pin E1 | I/O — General-purpose user I/O bank 3 |
| Pin E2 | I/O — General-purpose user I/O bank 3 |
| Pin E3 | CONF_DONE — Configuration done (nCONFIG/JSERVED) |
| Pin E4 | nCONFIG — Configuration start (active low) |
| Pin E5 | nCE — Chip enable (active low, JTAG chain) |
| Pin E6 | nSTATUS — Configuration status (active low) |
| Pin E7 | GND — Ground |
| Pin E8 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| Pin E9 | I/O — General-purpose user I/O bank 3 |
| Pin E10 | I/O — General-purpose user I/O bank 3 |
| Pin F1 | I/O — General-purpose user I/O bank 3 |
| Pin F2 | I/O — General-purpose user I/O bank 3 |
| Pin F3 | CLK0 — Global clock input 0 |
| Pin F4 | CLK1 — Global clock input 1 |
| Pin F5 | VCCINT — Core supply 1.8 V |
| Pin F6 | GND — Ground |
| Pin F7 | I/O — General-purpose user I/O bank 3 |
| Pin F8 | I/O — General-purpose user I/O bank 3 |
| Pin F9 | I/O — General-purpose user I/O bank 3 |
| Pin F10 | I/O — General-purpose user I/O bank 3 |
| Pin G1 | GND — Ground |
| Pin G2 | I/O — General-purpose user I/O bank 4 |
| Pin G3 | I/O — General-purpose user I/O bank 4 |
| Pin G4 | I/O — General-purpose user I/O bank 4 |
| Pin G5 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| Pin G6 | CLK2 — Global clock input 2 |
| Pin G7 | CLK3 — Global clock input 3 |
| Pin G8 | I/O — General-purpose user I/O bank 4 |
| Pin G9 | I/O — General-purpose user I/O bank 4 |
| Pin G10 | I/O — General-purpose user I/O bank 4 |
| Pin H1 | I/O — General-purpose user I/O bank 4 |
| Pin H2 | I/O — General-purpose user I/O bank 4 |
| Pin H3 | I/O — General-purpose user I/O bank 4 |
| Pin H4 | I/O — General-purpose user I/O bank 4 |
| Pin H5 | I/O — General-purpose user I/O bank 4 |
| Pin H6 | I/O — General-purpose user I/O bank 4 |
| Pin H7 | I/O — General-purpose user I/O bank 4 |
| Pin H8 | I/O — General-purpose user I/O bank 4 |
| Pin H9 | I/O — General-purpose user I/O bank 4 |
| Pin H10 | GND — Ground |
| Pin J1 | I/O — General-purpose user I/O bank 1 |
| Pin J2 | I/O — General-purpose user I/O bank 1 |
| Pin J3 | I/O — General-purpose user I/O bank 1 |
| Pin J4 | VCCIO4 — I/O bank 4 supply (1.5/1.8/2.5/3.3 V) |
| Pin J5 | GND — Ground |
| Pin J6 | I/O — General-purpose user I/O bank 4 |
| Pin J7 | I/O — General-purpose user I/O bank 4 |
| Pin J8 | I/O — General-purpose user I/O bank 4 |
| Pin J9 | I/O — General-purpose user I/O bank 4 |
| Pin J10 | I/O — General-purpose user I/O bank 4 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM240ZM100C6N is suitable for 6 applications: MCU-to-Bus Interface Bridging, FPGA Configuration & Power-Up Sequencing, Industrial Control & Automation Logic, I/O Expansion for Low-Pin MCUs, Portable / Battery-Backed Devices, LED Display & Signage Control.
MCU-to-Bus Interface Bridging
The EPM240ZM100C6N is a strong fit for MCU-to-bus interface bridging where a low-pin-count microcontroller must connect to a wider or higher-voltage bus. Its MultiVolt I/O (1.5 V to 5.0 V) lets the same CPLD translate between a 1.8 V ARM Cortex MCU and a 3.3 V or 5.0 V peripheral bus without external level shifters. The 192 macrocells comfortably absorb 8-to-32 bit address decoding, chip-select generation, and wait-state insertion logic. The instant-on flash-based architecture ensures bus arbitration is correct at power-up without any FPGA-style configuration delay, critical for deterministic boot sequencing. Designers typically pair it with STM32 or NXP Kinetis microcontrollers for 8-bit to 32-bit bus expansion in industrial control modules. Companion parts include the STM32F407 MCU and SN74LVC8T245 level translators.
Recommended
FPGA Configuration & Power-Up Sequencing
The EPM240ZM100C6N is widely used as a power-up sequencing controller for FPGAs, ASICs, and DDR memory rails. Its 7.5 ns pin-to-pin delay is fast enough to enforce sub-millisecond rail sequencing across 4-8 supply domains, and its 80 user I/Os can directly drive dozens of enable and reset signals. The 8-Kbit User Flash Memory (UFM) stores factory configuration, calibration constants, or board-ID data non-volatilely. Because the MAX II is instant-on, sequencing logic is live at first power-up, eliminating the FPGA configuration race condition that plagues pure-CPLD or discrete-sequencer designs. Typical deployments include Intel Cyclone V/10, Xilinx Spartan-7, and Lattice ECP5 reference boards. Estimated sequencing latency for a 4-rail cascade is under 100 µs end-to-end.
Recommended
Industrial Control & Automation Logic
The EPM240ZM100C6N handles glue logic in industrial PLCs, motor controllers, and sensor-conditioning front-ends. The -40 °C to +125 °C industrial temperature range supports under-cabinet and machine-mount environments, while the 25 µA typical standby current suits always-on factory equipment. Designers implement encoder quadrature decoding, PWM generation, and digital filtering within the 192 macrocells, with 80 I/Os interfacing to 24 V field wiring through opto-isolators. The flash-based non-volatile storage ensures the PLC starts in a known safe state even after multi-year power-down periods. Reference designs from Intel show EPM240 used alongside TI C2000 MCUs and Infineon gate drivers in compact servo-drive boards.
Recommended
I/O Expansion for Low-Pin MCUs
The EPM240ZM100C6N is frequently deployed as an I/O expander for 8-bit and 16-bit microcontrollers with limited native GPIO. By mapping each of the 80 CPLD user I/Os to a serial-parallel register address, designers can add 60+ usable GPIOs to a base MCU with only 4 SPI pins. The 184.1 MHz internal clock allows the SPI-to-parallel conversion to complete in under 50 ns, transparent to most firmware polling loops. The 6 × 6 mm MBGA-100 footprint fits beneath larger QFP packages as a piggyback expansion module. This pattern is common in compact IoT sensor hubs, BLE peripherals, and small-form-factor wearables.
Recommended
Portable / Battery-Backed Devices
The EPM240ZM100C6N is well matched to battery-backed and portable devices thanks to its Z-suffix zero-power 25 µA typical standby current. In sleep modes it draws less quiescent current than a typical watchdog supervisor, while still providing wake-up logic, push-button debouncing, and non-volatile state retention via the 8-Kbit UFM. The 1.8 V core operates directly from a single-cell Li-ion or 2× AA supply post-regulation, and the MultiVolt I/O rails connect directly to 3.3 V sensors. Reference designs include handheld medical meters, e-reader controllers, and IoT sensor nodes that must survive months of shelf time on a single coin cell.
Recommended
LED Display & Signage Control
The EPM240ZM100C6N drives LED matrix displays and digital signage where deterministic refresh rates and zero boot delay matter. With 80 user I/Os, a single device can directly multiplex up to an 8 × 10 monochrome LED matrix, or scan-row a 16-row RGB panel via external drivers. The 7.5 ns propagation delay supports refresh rates above 1 kHz for flicker-free video-rate panels, while the flash storage holds font tables and animation sequences without an external EEPROM. Its instant-on behavior eliminates the blank-screen boot artifact that affects SRAM-FPGA alternatives. Designers pair it with TLC5941 or IS31FL3731 LED drivers in compact signage modules.
Recommended
Recommended Products Summary
Engineering reference data for EPM240ZM100C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240ZM100C7N | EPM240M100C5N | EPM240GM100C5N | EPM240F100I5N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | MBGA-100 (6x6 mm, 0.5 mm pitch) | MBGA-100 (6x6 mm) - same | MBGA-100 (6x6 mm) - same | MBGA-100 (6x6 mm) - same | MBGA-100 (6x6 mm) - same |
| Logic Elements | 240 | 240 | 240 | 240 | 240 |
| Macro Cells | 192 | 192 | 192 | 192 | 192 |
| User I/Os | 80 | 80 | 80 | 80 | 80 |
| Speed Grade (tPD) | 7.5 ns (grade 6) | ~10 ns (grade 7) | ~6.5 ns (grade 5, faster) | ~6.5 ns (grade 5, faster) | ~6.5 ns (grade 5, faster) |
| Power Variant | Z (zero-power, 25 µA standby) | Z (zero-power) | M (standard-power) | G (standard-power) | F (standard-power) |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | 0 °C to +85 °C (commercial) | -40 °C to +125 °C |
Key Differentiators
- Lowest standby current in the MAX II 192-macrocell family (vs EPM240M100C5N)
- Industrial temperature range with Z-variant low power (vs EPM240GM100C5N)
- Pin-compatible upgrade path to higher density MAX II (vs EPM1270F256I5N)
Design Notes
The 100-MBGA package uses 0.5 mm ball pitch on a 6 × 6 mm footprint. Use micro-via-in-pad PCB technology (laser-drilled or stacked micro-vias) to fan out the BGA balls to escape routes; standard 0.2 mm via-in-pad is preferred. Place a continuous GND plane on layer 2 directly beneath the BGA for power integrity, and stitch the four-corner GND balls to that plane with multiple vias. Per Intel MAX II design guidelines, all VCCIO and VCCINT balls must be decoupled with 0.1 µF X7R ceramics placed within 100 mils of each supply pin. Avoid routing high-speed signals (CLK, JTAG) under the BGA; bring them out on the top layer to a via near the package edge.
Global clock inputs (CLK0-CLK3) should be routed with controlled impedance (50 Ω single-ended) and kept under 25 mm to avoid ringing; series-terminate at the driver when driving more than 15 mm. JTAG signals (TDI, TMS, TCK, TDO) require 10 kΩ pull-ups on TMS and TDI per the IEEE 1149.1 standard to keep the TAP controller in a known state at power-up. The nCONFIG pin must be tied to VCCIO through a 10 kΩ pull-up; do not leave it floating, or the device will fail to enter user mode reliably.
Three common pitfalls: (1) Mixing VCCIO bank voltages — each I/O bank has its own VCCIO supply; do not mix 1.5 V and 3.3 V in the same bank without isolating VCCIO pins. (2) Forgetting that the Z-variant standby current is 25 µA typical but can spike to several hundred µA during flash read; do not power the device directly from a coin cell without bulk capacitance. (3) Programming via JTAG requires VCCIO1 to be present even if only bank 1 is used; if you power-cycle only bank 2 you will see JTAG failure codes.
Compliance Information
Lead-free per chipdig.com specifications listing ('LEAD FREE, MICRO, FBGA-100'); RoHS compliant per distributor listings. AEC-Q100 not explicitly qualified — choose an automotive-grade variant (Q-suffix) for vehicular designs. Halogen-free status not confirmed in provided data.
