EPM3512AFC256C - MAX 3000A CPLD, 512 Macrocells, 208 I/O | Altera
부품 번호: EPM3512AFC256C ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $33.75 | $3,375.00 |
| 250 | $30.1 | $7,525.00 |
| 500 | $27.95 | $13,975.00 |
EPM3512AFC256C 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like logic blocks on a single chip with a programmable interconnect matrix. In the broader taxonomy, the EPM3512AFC256C sits at: CPLD -> programmable logic device -> logic IC -> semiconductor. MAX 3000A devices use EEPROM-based configuration cells, providing instant-on operation without external boot memory, and offer MultiVolt I/O support so 5.0V, 3.3V, and 2.5V interfaces can coexist on a single device.
Key features of the EPM3512AFC256C include 512 macrocells organized into 16 Logic Array Blocks (LABs), 12 dedicated input pins, a JTAG-based IEEE 1149.1 boundary-scan test interface, and bus-friendly architecture with programmable slew-rate control. Speed grades -4, -5, -6, -7, and -10 are PCI SIG Revision 2.2 compliant, which is critical for embedded designs interfacing to PCI buses.
The MAX 3000A architecture uses a uniform interconnect matrix that delivers predictable, pin-to-pin propagation delays independent of routing complexity. Each macrocell contains a programmable AND/OR array, a flip-flop with clock-enable, and a configurable I/O architecture supporting registered, combinatorial, tri-state, and open-drain output modes.
Typical applications include PCI bus interface glue logic, industrial control and factory automation, telecommunications backplane bridging, decoder/encoder functions for legacy bus protocols, and power-up sequencing controllers in distributed systems. The instant-on, non-volatile nature of the EEPROM configuration makes the EPM3512AFC256C especially attractive in safety-critical or deterministic-startup designs.
When designing with this device, the JTAG chain must be properly terminated according to IEEE 1149.1 specifications. The MultiVolt core requires that VCCIO pins be properly configured to match the I/O bank voltage of the connected logic; mixing 5V and 3.3V signals without proper VCCIO planning can cause latch-up or permanent damage.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same MAX 3000A family, and practical design notes that extend the information found in the manufacturer datasheet alone.
드롭인 대체품: EPM3512AFC256C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM3512AFC256C (동일 폼 팩터 및 풋프린트) — 차이점: Package, Usable Gates, Operating Temperature, In-System Programmability, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM3512AFC256-10
✅ 드롭인✓ 재고 있음
$17.5 / 개
데이터시트 보기 →EPM3512AFC256-10N
✅ 드롭인✓ 재고 있음
$43.22 / 개
데이터시트 보기 →EPM3512AFC256-7
✅ 드롭인✓ 재고 있음
$58.4 / 개
데이터시트 보기 →EPM3512AFC256-7N
✅ 드롭인✓ 재고 있음
$61 / 개
데이터시트 보기 →EPM3512AFC256-5C
✅ 드롭인✓ 재고 있음
$28.95 / 개
데이터시트 보기 →EPM3256AFC256-10
✅ 드롭인✓ 재고 있음
$19.95 / 개
데이터시트 보기 →EPM3256AFC256-10N
✅ 드롭인✓ 재고 있음
$25.95 / 개
데이터시트 보기 →EPM3256AFI256-10
✅ 드롭인✓ 재고 있음
$12.4 / 개
데이터시트 보기 →EPM3512AFC256C 최대 정격 & 전기적 특성
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/Os | 208 |
| Dedicated Input Pins | 12 |
| 패키지 | 256-ball FineLine BGA (FC) |
| 동작 온도 | 0C to +70C (Commercial) |
| Speed Grade | C (per datasheet ordering code) |
| Configuration Technology | EEPROM (non-volatile, instant-on) |
| Core Voltage | 3.3 V |
| I/O Standards Supported | MultiVolt: 5.0 V, 3.3 V, 2.5 V |
| JTAG Support | IEEE 1149.1 Boundary Scan |
| PCI Compliance | PCI SIG Local Bus Specification Revision 2.2 |
| Programming | In-system programmable via JTAG |
| 실장 유형 | Surface Mount |
EPM3512AFC256C 256-ball fineline bga (fc) 핀 구성 가이드
EPM3512AFC256C(256-ball fineline bga (fc) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM3512AFC256C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM3512AFC256C 적합 용도: 6 애플리케이션s: PCI Bus Interface Glue Logic, Industrial Control and Factory Automation, Telecommunications Backplane Bridging, Power-Up Sequencing Controllers, Legacy Bus Decoder and Encoder, Test and Measurement Instrumentation.
PCI Bus Interface Glue Logic
The EPM3512AFC256C is purpose-built for PCI Local Bus Specification Revision 2.2 compliant glue logic, with speed grades -4, -5, -6, -7, and -10 all PCI SIG timing-verified. Its 512 macrocells and 208 user I/Os can decode PCI address and command signals, generate chip-select logic for multiple downstream peripherals, and buffer bus cycles between a PCI host bridge and legacy ISA-style devices. MultiVolt I/O support allows 5V PCI signaling and 3.3V peripheral logic to coexist on the same die without external level shifters, simplifying board layout in legacy industrial backplanes.
추천
Industrial Control and Factory Automation
In factory automation systems, the EPM3512AFC256C functions as deterministic glue logic between PLC backplanes, motor controllers, and sensor I/O boards. Its EEPROM-based instant-on configuration ensures the control system starts in a known state within microseconds of power-up, critical for safety interlocks and emergency-stop circuits. The 16 LABs and 12 dedicated input pins can be partitioned into independent safety, motion, and communication islands, while JTAG-based in-system programmability lets engineers update logic without removing the board from the chassis.
추천
Telecommunications Backplane Bridging
Telecommunications backplanes mix legacy TTL, LVCMOS, and LVTTL buses that must be translated and bridged without latency variation. The EPM3512AFC256C's deterministic propagation delay (independent of routing) and MultiVolt I/O make it ideal for protocol bridging between 5V and 3.3V bus segments, with 208 I/Os handling wide address/data buses plus parity and interrupt signals. The device is commonly used in ATCA and CompactPCI bridging applications where the bus-friendly architecture with programmable slew-rate control reduces EMI on long backplane traces.
추천
Power-Up Sequencing Controllers
The EPM3512AFC256C excels as a multi-rail power-up sequencing controller in distributed power systems. Its non-volatile EEPROM configuration boots in microseconds, allowing it to drive ENABLE and PGOOD signals to DC-DC converters before the rest of the system powers up, eliminating race conditions and inrush spikes. With 16 LABs and 208 I/Os, a single device can sequence 8-12 rails independently with programmable delay chains, while JTAG-based in-system programmability allows late-stage BOM changes without board rework. This is especially valuable in FPGA-based systems where core, I/O, and auxiliary voltages must come up in a specific order.
추천
Legacy Bus Decoder and Encoder
Many embedded designs still require address decoding for ISA, VME, or custom parallel buses. The EPM3512AFC256C's 512 macrocells provide ample capacity to decode 24-32 address lines plus chip-select logic for 8-16 peripherals, with the deterministic propagation delay ensuring no address-setup violations. Each macrocell's configurable flip-flop with clock-enable simplifies state-machine implementation for handshaking protocols, and the programmable slew-rate control adapts the output edge rate to the bus length, reducing reflections on legacy backplanes.
추천
Test and Measurement Instrumentation
In test and measurement equipment, the EPM3512AFC256C is used to implement custom stimulus generators, pattern matchers, and timing-critical trigger logic. Its deterministic propagation delay makes it ideal for aligning high-speed ADC sampling clocks with trigger events, and the 512-macrocell capacity supports state-machine designs with 16-32 states plus parallel datapath logic. JTAG boundary scan allows bed-of-nails PCB test coverage without external test points, and the FC256 BGA package supports dense routing required for high-channel-count instrumentation front ends.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM3512AFC256C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM3512AFC256-10 | EPM3512AFC256-10N | EPM3512AFC256-7 | EPM3512AFC256-5C | EPM3256AFC256-10 |
|---|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (FC) | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 256 (-50%) |
| Maximum User I/Os | 208 | 208 | 208 | 208 | 208 | 158 (-24%) |
| Speed Grade | C (base) | -10 (slower) | -10 (slower) | -7 (faster) | -5 (faster) | -10 (slower) |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Configuration Technology | EEPROM (non-volatile) | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| PCI SIG 2.2 Compliance | Yes (C grade supports PCI timing) | Yes | Yes | Yes (with margin) | Yes (with margin) | Yes |
| Approximate Unit Price (qty 1) | $42.50 | $35-40 (lower) | $36-42 (similar) | $45-52 (higher) | $50-58 (higher) | $20-25 (lower) |
주요 차별점
- Largest I/O count in MAX 3000A family (vs EPM3256AFC256-10)
- Balanced speed/power C speed grade (vs EPM3512AFC256-10)
- Non-volatile instant-on configuration (vs EPM240GT100C5N (MAX II))
설계 노트
The EPM3512AFC256C core operates from a 3.3V supply while the I/O banks can be independently powered at 2.5V, 3.3V, or 5V via the VCCIO pins. Each VCCIO bank must be properly decoupled with 0.1uF and 10uF capacitors placed within 5mm of the BGA balls. Estimated: at 100 MHz operation across 208 I/Os with 10pF loads, dynamic current draw is approximately 200-300 mA from the 3.3V core and 150-250 mA from VCCIO. Power sequencing requires VCCINT (3.3V) to ramp before or simultaneously with VCCIO to prevent I/O buffer latch-up.
The 256-ball FineLine BGA has a 1.0mm ball pitch, requiring 4-layer or 6-layer PCB stackup with microvia or via-in-pad technology for reliable assembly. All VCC and GND balls must be connected to internal power planes using short, low-inductance vias. Signal escape routing on the top layer should be limited to fan-out only; route all signals on inner layers to avoid BGA field congestion. Estimated: 6-layer stackup with 0.5oz copper on outer layers and 1oz on inner planes is recommended for thermal dissipation.
Do not assume the C, -7, and -10 speed grades are interchangeable in timing-critical designs. The C grade offers balanced speed/power, -7 is ~25% faster, and -10 is ~30% slower. Mixing speed grades between prototype and production builds can cause setup/hold violations on the slower grade. Also note that JTAG TCK frequencies above 16 MHz require special timing configuration; default Quartus II programming files assume 10 MHz TCK. Always validate the BSDL file against your specific speed grade before bed-of-nails test fixture design.
규정 준수 정보
MAX 3000A family was launched before widespread RoHS mandates. The N-suffix variants (e.g., EPM3512AFC256-10N) typically indicate lead-free reflow-compatible packaging, but specific RoHS/REACH compliance documentation was not found in the verified web data and is marked unknown.
