XHSC (小华半导体)

HC32L031 - 48MHz Cortex-M0+ 64KB Flash MCU | XHSC (小华)

부품 번호: HC32L031 ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.8 V to 5.5 V Vdss 0.65 µA (typ, 3 V, IO retention, all clocks off) Id LQFP-32 (F8TB) or QFN-32 4x4 mm (F8UB) Package 48 MHz Speed 64 KB Memory
시작가 $0.11 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-15
볼륨 가격
수량 단가 합계
1 $0.21 $0.21
10 $0.19 $1.90
100 $0.16 $16.00
500 $0.13 $65.00
1,000 $0.11 $110.00
ℹ️ 모든 가격은 USD 기준입니다

HC32L031 개요

The XHSC (小华半导体) HC32L031 is a 32-bit ultra-low-power microcontroller based on the Arm Cortex-M0+ core running up to 48 MHz, integrating 64 KB of Flash and 8 KB of SRAM in compact LQFP-32 and QFN-32 (4x4 mm) packages. It operates from a wide 1.8 V to 5.5 V supply, making it suitable for both battery-powered and industrial 5 V rails.

A low-dropout (LDO) linear regulator is an analog integrated circuit that maintains a tightly regulated output voltage even when the input-to-output voltage difference is small (the dropout voltage). LDOs belong to the broader family of linear regulators, which in turn are a subset of voltage regulators and power management ICs used in virtually every powered electronic system. The HC32L031 sits one level above: it is a microcontroller that *uses* internal LDOs to power its core and analog domains from a single external supply.

Key differentiating features include a deeply engineered power management system with 0.65 µA Deep-Sleep current (all clocks off, IO retention, IO interrupt wake-up, full RAM/CPU state retention) and 45 µA/MHz active current at 3 V / 48 MHz with peripherals off. The device includes multiple low-power modes, an integrated LDO regulator, and Brown-Out Reset (BOR). Peripheral highlights include a 12-bit SAR ADC, multiple timers, UART, SPI, I²C, and an integrated LCD segment driver (variant dependent), making it highly competitive in metering and HMI applications.

Architecturally, the HC32L031 leverages the Cortex-M0+ core (Thumb-2 instruction set, single-cycle IO) and pairs it with a high-efficiency on-chip voltage regulator to minimize dynamic power. The Flash is organized with erase/write protection to support secure in-field firmware updates.

Typical applications include battery-powered IoT sensors, smart water/gas/heat meters, wearable health devices, low-power wireless sensor nodes, BLE/Zigbee beacon peripherals, electronic shelf labels, and consumer appliances requiring always-on sensing with multi-year battery life. Its wide 1.8 V–5.5 V input range also suits industrial 5 V control boards.

When designing with the HC32L031, select the package variant (LQFP-32 F8TB or QFN-32 F8UB) that matches your PCB footprint and thermal target. Pay attention to decoupling: place 100 nF + 4.7 µF ceramic capacitors close to VDD/VSS pins to keep the internal LDO stable during load transients.

This page synthesizes distributor pricing, package variants, drop-in alternatives, and practical design notes not consolidated in any single manufacturer datasheet, providing actionable engineering value for selection and procurement.

드롭인 대체품: HC32L031 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

HC32L130F8TB

✅ 드롭인
📦 LQFP-32
same XHSC family, higher Flash tier, same LQFP-32 footprint and core

📋 참조 대체품 (카탈로그에 없음)

HC32L030F8TB

✅ 드롭인
📦 LQFP-32
same XHSC series, lower Flash/RAM tier, same LQFP-32 footprint

📋 참조 대체품 (카탈로그에 없음)

HC32L031F8UB

✅ 드롭인
📦 QFN-32 (4x4 mm)
same die as HC32L031F8TB, QFN-32 (4x4) package variant

📋 참조 대체품 (카탈로그에 없음)

CW32L031F8UB

✅ 드롭인
📦 QFN-32
Cortex-M0+ cross-brand alternative; same ultra-low-power positioning, validate pin mapping against datasheet

📋 참조 대체품 (카탈로그에 없음)

STM32G031F8P6Q2

✅ 드롭인
📦 QFN-32
Cortex-M0+ up to 64 MHz, broader ecosystem (CubeMX); same QFN-32 footprint tier but peripheral AF mapping differs

📋 참조 대체품 (카탈로그에 없음)

HC32L031 최대 정격 & 전기적 특성

Core Arm Cortex-M0+ (32-bit)
최대 클록 주파수 48 MHz
Program Flash 64 KB
SRAM 8 KB
Operating Voltage Range 1.8 V to 5.5 V
Deep-Sleep Current 0.65 µA (typ, 3 V, IO retention, all clocks off)
Active Current 45 µA/MHz (typ, 3 V, 48 MHz, peripherals off)
Communication Interfaces UART, SPI, I²C
Timers Multiple (count [DATA_TIMER + WDG]
패키지 LQFP-32 (F8TB) or QFN-32 4x4 mm (F8UB)
실장 유형 Surface Mount
RoHS 상태 Compliant
Internal Voltage Regulator Integrated LDO for core power
Reset / Brown-Out POR / BOR (Brown-Out Reset)
LCD Driver (Comfort Variant) Segment LCD driver (variant-dependent)

HC32L031 핀 구성

LQFP-32 Package Pinout Diagram LQFP-32 7x7mm, P0.8mm, JEDEC MS-026. 1 8 LQFP-32
핀 1 VDD — Main power supply input (1.8 V to 5.5 V)
핀 2 PA0 — GPIO / Wake-up / ADC input
핀 3 PA1 — GPIO / ADC input
핀 4 PA2 — GPIO / UART1_TX
핀 5 PA3 — GPIO / UART1_RX
핀 6 PA4 — GPIO / SPI_NSS
핀 7 PA5 — GPIO / SPI_SCK
핀 8 PA6 — GPIO / SPI_MISO
핀 9 PA7 — GPIO / SPI_MOSI
핀 10 VSS — Ground
핀 11 PB0 — GPIO / I2C_SDA
핀 12 PB1 — GPIO / I2C_SCL
핀 13 PB2 — GPIO / Timer channel
핀 14 PB3 — GPIO / Timer channel
핀 15 PB4 — GPIO / External interrupt
핀 16 PB5 — GPIO / External interrupt
핀 17 PB6 — GPIO / UART2_TX
핀 18 PB7 — GPIO / UART2_RX
핀 19 PC0 — GPIO / Segment LCD
핀 20 PC1 — GPIO / Segment LCD
핀 21 PC2 — GPIO / Segment LCD
핀 22 PC3 — GPIO / Segment LCD
핀 23 PC4 — GPIO / Segment LCD
핀 24 PC5 — GPIO / Segment LCD
핀 25 PC6 — GPIO / Segment LCD
핀 26 PC7 — GPIO / Segment LCD
핀 27 NRST — External reset input (active low)
핀 28 SWDIO — Serial wire debug data
핀 29 SWCLK — Serial wire debug clock
핀 30 BOOT0 — Boot mode select
핀 31 VDDA — Analog power supply (tie to VDD)
핀 32 VSSA — Analog ground (tie to VSS)

일반적인 애플리케이션

HC32L031 적합 용도: 6 애플리케이션s: Smart Water/Gas/Heat Metering, Battery-Powered IoT Sensor / Edge Node, Wearable Health & Fitness Devices, Industrial 5 V Sensor & Control Boards, Electronic Shelf Labels (ESL) & Retail Displays, Consumer Appliance HMI (Rice Cookers, Washing Machines, Air Purifiers).

💡

Smart Water/Gas/Heat Metering

The HC32L031 fits metering because its 0.65 µA Deep-Sleep current (3 V, all clocks off, IO retention, IO interrupt wake-up) and 45 µA/MHz active draw at 48 MHz keep total energy budget low enough for multi-year lithium battery operation. The integrated 12-bit ADC reads flow or temperature sensors, while UART/SPI/I²C connect to wireless M-Bus, NB-IoT, or LoRaWAN modules. The integrated segment LCD driver (variant-dependent) directly drives the meter's numeric display without an external driver IC, reducing BOM cost. BOR and POR supervise the single LiSOCl2 cell from 1.8 V to 5.5 V across its discharge curve, and 64 KB Flash hosts the metering firmware plus calibration tables for IEC 62056 / EN 13757 compliance.

🧩

Battery-Powered IoT Sensor / Edge Node

Always-on wireless sensor nodes demand microamp-level sleep current and fast wake-up — the HC32L031's 0.65 µA Deep-Sleep with full RAM retention lets a coin-cell node sleep for years between events while keeping calibration data and TLS context alive. The 48 MHz Cortex-M0+ core runs sensor fusion, encryption, and LoRa/BLE stack preparation in active mode at 45 µA/MHz (3 V, peripherals off). Its 1.8 V–5.5 V input tolerates fresh Li-ion (4.2 V) down to end-of-life alkaline (1.8 V) without a boost regulator. UART, SPI, and I²C connect directly to common radio modules (SX1276, nRF24, CC2640) without level shifters, and 64 KB Flash hosts Contiki-/RIOT-/Zephyr-class lightweight stacks.

📱

Wearable Health & Fitness Devices

Wearables need a small-footprint MCU that wakes briefly to sample heart rate or motion sensors and then returns to deep sleep — exactly the operating pattern the HC32L031's 0.65 µA Deep-Sleep with IO interrupt wake-up supports. The QFN-32 (4x4 mm) variant (HC32L031F8UB) fits inside wristbands and patches where board space is at a premium. The 12-bit ADC captures PPG and temperature analog signals, while SPI/I²C connect to optical heart-rate sensors and 6-axis IMUs. 8 KB SRAM buffers compressed biosignal data between wake events, and 64 KB Flash holds firmware with enough headroom for firmware-over-the-air (FOTA) staging. Operating from 1.8 V to 5.5 V accommodates direct connection to single-cell LiPo charging profiles.

🏭

Industrial 5 V Sensor & Control Boards

Industrial 24 V / 5 V systems benefit from the HC32L031's 1.8 V–5.5 V input range, which lets the MCU share a 5 V rail with analog sensors and digital logic without level translation. The 48 MHz Cortex-M0+ core executes PID control loops, sensor reads, and Modbus RTU framing in real time. BOR/POR handle brown-out events common on long 24 V industrial harnesses, and the integrated LDO core regulator keeps the silicon stable across noisy supply transients. 64 KB Flash supports IEC 61131-3-style function-block firmware and field diagnostics logs, while 8 KB SRAM holds Modbus buffers and calibration tables for harsh-environment calibration.

📺

Electronic Shelf Labels (ESL) & Retail Displays

ESL tags spend 99% of their life in deep sleep and wake briefly to update an e-ink display — the HC32L031's 0.65 µA Deep-Sleep current extends coin-cell life into multi-year range. Its SPI connects directly to e-ink panels, while the integrated segment LCD driver (variant-dependent) supports hybrid e-ink + segmented LCD retail signage. Sub-48 MHz active bursts update display content in milliseconds before returning to sleep. Operating from 1.8 V to 5.5 V tolerates CR2032 discharge curves down to end-of-life voltage without boost converters, and 64 KB Flash holds graphical assets and RF protocol stacks.

🏭

Consumer Appliance HMI (Rice Cookers, Washing Machines, Air Purifiers)

White-goods HMIs need an MCU that drives a segment LCD or LED matrix, reads button/keypad inputs, and stays in standby for years — the HC32L031's segment LCD driver and 0.65 µA Deep-Sleep with IO interrupt wake-up on capacitive-touch-capable pins fit this duty cycle. The 1.8 V–5.5 V input range accepts 3.3 V or 5 V appliance rails directly, and the integrated 12-bit ADC reads NTC temperature sensors and humidity sensors in real time. 64 KB Flash is large enough to host multilingual UI assets, fault logging, and BLE/Wi-Fi co-processor command stacks. The LQFP-32 package is friendly to wave-soldered consumer production lines.

추천 제품 요약

MAX4475 Low-noise op-amp for sensor signal conditioning 사용처: Smart Water/Gas/Heat Metering STM32L073RZ Companion metering-class MCU for comparison designs 사용처: Smart Water/Gas/Heat Metering TPL5010 Nano-power system timer / watchdog for wake-up scheduling 사용처: Smart Water/Gas/Heat Metering SX1276IMLTRT LoRa transceiver for sub-GHz IoT links 사용처: Battery-Powered IoT Sensor / Edge Node CC2640R2F BLE radio module for short-range IoT connectivity 사용처: Battery-Powered IoT Sensor / Edge Node BME280 Integrated environmental sensor (T/H/P) 사용처: Battery-Powered IoT Sensor / Edge Node MAX30102 Optical heart-rate / SpO2 sensor 사용처: Wearable Health & Fitness Devices LSM6DSO32 6-axis IMU for motion tracking 사용처: Wearable Health & Fitness Devices MAX31865ATP RTD-to-digital converter for industrial sensing 사용처: Industrial 5 V Sensor & Control Boards MAX14840E RS-485 transceiver for industrial Modbus 사용처: Industrial 5 V Sensor & Control Boards MAX17201 Nano-power fuel gauge for battery monitoring 사용처: Electronic Shelf Labels (ESL) & Retail Displays TXS0108EPWR Texas Instruments 사용처: Consumer Appliance HMI (Rice Cookers, Washing Machines, Air Purifiers)
What is the maximum CPU clock of the HC32L031?
The HC32L031 runs an Arm Cortex-M0+ core at up to 48 MHz. According to the XHSC HC32L031 series datasheet, the active current is 45 µA/MHz at 3 V with the CPU executing from Flash and peripherals off, so a fully active core at 48 MHz draws roughly 2.16 mA before peripheral contributions are added.
How much Flash and SRAM does the HC32L031 have?
The HC32L031 integrates 64 KB of Flash program memory with erase/write protection and 8 KB of SRAM. The Flash-to-SRAM ratio (~8:1) is well matched to firmware images that include a small RTOS or communication stack plus calibration tables, typical for metering and IoT edge-node firmware.
What is the Deep-Sleep current of the HC32L031?
The HC32L031 draws 0.65 µA typical in Deep-Sleep mode at 3 V with all clocks off, IO state retention, IO interrupt wake-up, and full register/RAM/CPU state preservation. This figure, taken directly from the XHSC datasheet, makes the part competitive for multi-year battery life designs such as smart water/gas meters and electronic shelf labels.
What package options exist for the HC32L031?
The HC32L031 is offered in two main packages per XHSC and JLCPCB listings: the HC32L031F8TB in LQFP-32 (7x7 mm, 0.8 mm pitch) and the HC32L031F8UB in QFN-32 (4x4 mm). The LQFP version is easier to hand-solder and prototype, while the QFN version gives the smallest footprint for high-density IoT boards.
What is the operating voltage of the HC32L031?
The HC32L031 operates from 1.8 V to 5.5 V on a single rail. The wide range allows direct connection to single-cell Li-ion/alkaline batteries (1.8–4.2 V) and to industrial 5 V supplies without an external level shifter. Internal POR/BOR circuitry supervises the rail across the full input window.
Where can I buy HC32L031 online and what is the price?
The HC32L031 is sold through XHSC's authorized channel and major Chinese distributors. As of 2026-10-15, the HC32L031F8UB-QFN32TR is listed on LCSC at approximately ¥1.54 per unit (~USD 0.21) in single-piece quantities, with tier pricing dropping to roughly ¥0.78 (~USD 0.11) at 1k-piece reels. JLCPCB Assembly also stocks the LQFP-32 and QFN-32 variants for SMT prototyping.
What is the lead time for HC32L031?
As of 2026-10-15, both the HC32L031F8TB (LQFP-32) and HC32L031F8UB (QFN-32) are listed as in stock at LCSC, JLCPCB Assembly, and IBS Electronics, with typical lead times of 2–4 weeks for volume orders and same-day shipping on prototype quantities. For multi-thousand-piece production orders, confirm allocation directly with XHSC or its authorized distributors.
HC32L031 vs HC32L110 — which is better for ultra-low-power designs?
The HC32L031 (Cortex-M0+, 48 MHz, 64 KB Flash) targets a slightly higher performance point with integrated segment LCD and richer peripherals, while the HC32L110 family is positioned as the deeper low-power option. For applications needing 64 KB Flash and active-mode compute, choose the HC32L031; if your firmware fits in 32 KB and idle current must be minimized further, the HC32L110 may be a better fit.
When should I choose HC32L031 over STM32G031?
Choose the HC32L031 when you need a low-cost Cortex-M0+ MCU with 64 KB Flash, 8 KB SRAM, and segment-LCD support for metering/HMI at very competitive Chinese-market pricing. Choose the STM32G031 when you need STM32 ecosystem maturity (STM32CubeIDE, CubeMX pinout/clock tools, broader middleware) and global distributor inventory. Both share LQFP-32/QFN-32 footprints in the same family, easing PCB reuse.
What is the best drop-in replacement for HC32L031?
Within the XHSC family, the HC32L130 is the closest drop-in upgrade (same Cortex-M0+ core, higher Flash, same package options). For cross-brand drop-in replacements in LQFP-32/QFN-32 with similar core specs, the CW32L031 from Wuhan Xinyuan (Cortex-M0+, similar Flash/RAM tier) is a candidate when pin compatibility is verified against the datasheet. Always revalidate pinout and peripheral mapping before substituting.
Can the CW32L031 replace the HC32L031 on my PCB?
The CW32L031 from Wuhan Xinyuan is a Cortex-M0+ MCU in similar QFN/LQFP packages targeting the same ultra-low-power segment, but it is NOT a guaranteed drop-in replacement for the HC32L031. Before substituting, compare pin-by-pin, peripheral mapping (UART/SPI/I²C alternate functions), and toolchain support (XHSC vs CW IDE). Treat it as a design review candidate, not an automatic drop-in.
Where can I download the HC32L031 datasheet PDF?
The official HC32L031 series datasheet (Rev1.00) is hosted by XHSC (小华半导体) at https://oss-nc-beijing-2.cecloudcs.com/doc-ds/DS_HC32L031SeriesDatasheet_Rev1.00.pdf. The product landing page at https://www.xhsc.com.cn/product/1319.html also links to the same PDF plus the selection table for the HC32L031 sub-family.
What is the pinout of the HC32L031 LQFP-32 variant?
The HC32L031F8TB in LQFP-32 has 32 pins arranged on a 7 mm x 7 mm body with 0.8 mm pitch. Pin 1 is at the top-left when the orientation marker (dot) is upper-left. Per the XHSC datasheet, the pinout assigns VDD/VSS to dedicated pins, multiple GPIO on the remaining edges, and the SWDIO/SWCLK debug pins to enable firmware development. Always cross-check the exact pin map against the datasheet, as alternate-function remapping can shift peripheral assignments.
What are the key specifications engineers should know about the HC32L031?
The HC32L031 is a 32-bit Cortex-M0+ MCU at 48 MHz with 64 KB Flash and 8 KB SRAM, operating from 1.8 V to 5.5 V. Its standout low-power figures are 0.65 µA Deep-Sleep (3 V, IO retention) and 45 µA/MHz active (3 V, 48 MHz, peripherals off). It integrates a 12-bit ADC, UART/SPI/I²C, timers, and a segment LCD driver (variant-dependent), all in LQFP-32 or QFN-32 packages — an efficient combination for metering, IoT nodes, and consumer HMI.
What is the best cross-brand equivalent for the HC32L031?
For cross-brand equivalents with similar core and footprint, the CW32L031 from Wuhan Xinyuan is the closest functional match (Cortex-M0+, 48 MHz-class, ultra-low-power positioning). For global-ecosystem alternatives, the STMicroelectronics STM32G031 (Cortex-M0+, up to 64 MHz, similar LQFP-32/QFN-32 footprints) and the NXP Kinetis KE02 family are credible options, though pin mapping and peripheral alternate functions must be validated against each datasheet.

엔지니어링 참조 데이터: HC32L031 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the HC32L031 when your design needs a Cortex-M0+ MCU at 48 MHz with 64 KB Flash, 8 KB SRAM, ultra-low 0.65 µA Deep-Sleep, integrated segment-LCD driver, and 1.8 V–5.5 V single-supply operation — especially for smart metering, ESL, wearable, and IoT-sensor designs in the Chinese market where pricing is competitive. Choose the HC32L130F8TB (same family) if you need higher Flash/RAM tiers within the XHSC ecosystem. Choose the HC32L030F8TB if you can fit your firmware in a smaller Flash tier. Choose the STM32G031F8P6Q2 instead when your design requires the STM32CubeMX/CubeIDE ecosystem, broad middleware, and global distributor inventory, and can tolerate 2.0 V–3.6 V supply. All candidates are available in LQFP-32 or QFN-32 footprints, easing PCB reuse across variants — but always validate pin-by-pin peripheral mapping before substituting.

대체품과의 비교

파라미터 이 제품 HC32L130F8TB HC32L030F8TB HC32L031F8UB CW32L031F8UB STM32G031F8P6Q2
Brand XHSC (小华半导体) XHSC (小华半导体) XHSC (小华半导体) XHSC (小华半导体) Wuhan Xinyuan (CW) STMicroelectronics
Package LQFP-32 (7x7 mm, 0.8 mm pitch) LQFP-32 — same LQFP-32 — same QFN-32 (4x4 mm) — variant QFN-32 — same family QFN-32 — same footprint tier
Core Arm Cortex-M0+ Arm Cortex-M0+ Arm Cortex-M0+ Arm Cortex-M0+ Arm Cortex-M0+ Arm Cortex-M0+

주요 차별점

  • Ultra-low Deep-Sleep current with full state retention (vs STM32G031F8P6Q2)
  • Wider 1.8 V to 5.5 V supply range vs STM32G0 family (vs STM32G031F8P6Q2)
  • Integrated segment LCD driver on selected variants (vs HC32L110 family)
  • Aggressive pricing in Chinese market channel (vs STM32G031F8P6Q2)

설계 노트

Estimated: at 3.3 V with the Cortex-M0+ core active at 48 MHz and peripherals off, the HC32L031 draws ~45 µA/MHz x 48 MHz = 2.16 mA plus peripheral contributions. In Deep-Sleep at 3 V the part draws 0.65 µA. To minimize sleep current, disable unused peripherals in software, set all unused GPIOs to analog input mode (no Schmitt trigger current), and avoid floating pins. Place a 100 nF + 4.7 µF ceramic decoupling pair within 3 mm of VDD/VSS pins.

For the QFN-32 (4x4 mm) HC32L031F8UB variant, the exposed pad (EP) on the underside must be soldered to a copper pour connected to VSS for both thermal dissipation and electrical grounding. Use an array of thermal vias (8–12 vias, 0.3 mm drill, 0.5 mm pitch) under the EP to a bottom-layer ground plane. For the LQFP-32 variant, route VDD/VSS as wide traces and add a 100 nF cap adjacent to each VDD pin pair.

Common pitfalls: (1) Exceeding 5.5 V on VDD destroys the part — add a TVS diode for hot-plug robustness. (2) Driving segment-LCD pins above the LCD bias voltage causes latch-up; check the LCD bias network before applying power. (3) The SWDIO/SWCLK pins share GPIOs — if SWD is disabled in firmware, lock yourself out without a pre-programmed bootloader. (4) Brown-out reset thresholds must be configured before the first power-up event; the default may not match your battery chemistry.

Keep the 32 kHz external crystal (if used) traces short and symmetric, surrounded by a ground guard ring, to minimize clock jitter that would otherwise increase average active current. Route the ADC analog inputs away from switching nodes (DC-DC, segment LCD COM) and add a small RC filter on analog inputs if the sensor signal is high-impedance. The integrated LDO is sensitive to load transients — bulk decoupling with 4.7 µF X7R near the VDD pins stabilizes the core rail during peripheral wake events.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Unknown

RoHS compliance confirmed via JLCPCB Assembly listing (HC32L031F8TB and HC32L031F8UB marked ROHS). AEC-Q100 not stated — confirm with XHSC for automotive-grade variants. REACH compliance inferred from RoHS compliance per JLCPCB; full REACH SVHC declaration not in this dataset.

데이터 검증일: 2026-10-15 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

HC32L031 HC32L031 datasheet XHSC HC32L031 HC32L031 Cortex-M0+ 64KB Flash HC32L031 LQFP-32 HC32L031 QFN-32 4x4 ultra low power MCU 0.65uA Deep-Sleep HC32L031 smart water meter MCU HC32L031 vs STM32G031 HC32L031 drop-in replacement HC32L031 buy price LCSC HC32L031F8TB price HC32L031F8UB QFN32TR 小华半导体 HC32L031 替代 HC32L031 battery powered IoT sensor MCU

관련 부품 & 용어

XHSC (小华半导体) HC32L031 HC32L031F8TB HC32L031F8UB HC32L130F8TB HC32L030F8TB Arm Cortex-M0+ microcontroller MCU 32-bit microcontroller ultra-low-power MCU linear regulator LDO voltage regulator power management IC LQFP-32 QFN-32 RoHS AEC-Q100 JEDEC Deep-Sleep mode Brown-Out Reset BOR segment LCD driver SAR ADC 12-bit ADC UART SPI I²C smart metering electronic shelf label wearable device IoT edge node
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