J3455E - Intel Celeron Quad-Core SoC 2.3 GHz 10W Embedded | Intel
부품 번호: J3455E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $30.1 | $301.00 |
| 100 | $27.8 | $2,780.00 |
| 500 | $25.4 | $12,700.00 |
| 1,000 | $22.95 | $22,950.00 |
J3455E 개요
The term SoC (System-on-Chip) refers to a single silicon die that integrates the CPU cores, GPU, memory controller, and platform I/O (PCIe, SATA, USB) into one package. Apollo Lake SoCs like the J3455E belong to the Atom/Celeron/Pentium Silver hierarchy, which itself sits within Intel's broader embedded and entry-level desktop x86 product stack. By collapsing chipset functions into the same package, Apollo Lake platforms reduce board area, BOM cost, and power envelope compared to discrete CPU-plus-chipset designs of prior generations.
Key features of the J3455E include 4 physical cores without Hyper-Threading, a 2 MB shared L2 cache, dual-channel DDR3L/LPDDR3 up to 1866 MT/s and LPDDR4 up to 2400 MT/s memory support, and Intel HD Graphics 500 running up to 750 MHz. I/O includes PCIe 2.0 lanes, SATA 3.0, USB 3.0, and integrated audio. The 10 W scenario design power enables fanless thermal designs, while the 14 nm lithography keeps leakage low for always-on embedded workloads.
Architecturally, the J3455E uses Intel's Goldmont CPU microarchitecture, which delivers significantly higher IPC than the prior Braswell/Airmont generation while maintaining the same low-TDP envelope. The integrated HD Graphics 500 (Gen9 LP architecture) supports hardware-accelerated decode for H.265/HEVC and VP9, making the part suitable for digital signage and media playback. The SoC is firmware-configurable for either 6 W or 10 W TDP modes, letting OEMs trade sustained performance against power budget.
Typical applications for the J3455E include digital signage players, thin-client terminals, entry-level POS systems, industrial HMI panels, retail kiosks, and fanless embedded boxes. Its low TDP and integrated I/O make it a strong fit where a full desktop CPU is over-spec but ARM-based SoCs lack x86 software compatibility. The part's 10-year embedded lifecycle support also suits long-life industrial designs.
When designing with the J3455E, ensure the carrier board implements both PCIe x1 and x2 reference clock routing per Intel's Apollo Lake Platform Design Guide, and use wide copper pours under the SoC package to spread the 10 W dissipation across the PCB. For thermal margin in sealed enclosures, derate the TDP to 6 W via the platform firmware if the chassis cannot sustain 10 W continuously.
This page consolidates distributor pricing, embedded lifecycle context, drop-in alternatives, and design notes that supplement the official Intel product page and datasheet references.
드롭인 대체품: J3455E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
J3455
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
J3455E
✅ 드롭인✓ 재고 있음
$22.95 / 개
데이터시트 보기 →N3450
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
J5040
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
J4025
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
J3455E 최대 정격 & 전기적 특성
| Product Family | Intel Celeron Processor (J Series, Embedded) |
| Code Name | Apollo Lake |
| Total Cores | 4 |
| Total Threads | 4 |
| Processor Base Frequency | 1.50 GHz |
| Burst Frequency | 2.30 GHz |
| Cache | 2 MB L2 |
| Instruction Set | 64-bit |
| Lithography | 14 nm |
| Scenario Design Power (SDP) | 10 W |
| Configurable TDP | 6 W to 10 W |
| Memory Types | DDR3L/LPDDR3 up to 1866 MT/s, LPDDR4 up to 2400 MT/s |
| Max Memory Channels | 2 |
| Integrated Graphics | Intel HD Graphics 500 |
| Graphics Base Frequency | 250 MHz |
| Graphics Burst Frequency | 750 MHz |
| Graphics Execution Units | 12 |
| PCIe Revision | PCIe 2.0 |
| Package / Socket | BGA (embedded, soldered) |
| Embedded Lifecycle | Extended 15-year supply (Intel embedded roadmap) |
| RoHS Compliance | Compliant |
| Launch Date | Q3 2019 (per third-party databases) |
J3455E bga (embedded, soldered) 핀 구성 가이드
J3455E(bga (embedded, soldered) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: J3455E.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
J3455E 적합 용도: 6 애플리케이션s: Digital Signage Player, Industrial HMI Panel, Thin Client / VDI Endpoint, Point-of-Sale (POS) Terminal, Edge Gateway / IoT Appliance, Interactive Kiosk / Self-Service Terminal.
Digital Signage Player
The J3455E's Intel HD Graphics 500 with hardware-accelerated H.265/HEVC and VP9 decode, combined with its quad-core 1.50/2.30 GHz Goldmont cores, make it a strong fit for driving dual-display 4K signage content at retail, transit, and QSR locations. Placed on an Apollo Lake carrier board with dual-channel LPDDR4 up to 2400 MT/s and an SSD over SATA 3.0, the SoC handles 1080p/4K media loops with sub-10 W board power. Unlike ARM signage SoCs that require ARM-tuned CMS software, the J3455E runs standard x86 Windows IoT or Linux signage stacks, accelerating content pipeline integration. The 14 nm process and 10 W TDP also enable a fully sealed fanless chassis rated for 24/7 kiosk duty, with junction temperatures mapped via on-die thermal sensors.
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Industrial HMI Panel
For factory-floor human-machine interface panels, the J3455E delivers quad-core compute headroom for SCADA visualization, OPC UA tag polling, and touch UI rendering within a 10 W envelope that supports fanless IP65-sealed enclosures. The Apollo Lake SoC's hardware AES-NI accelerates VPN tunnels back to MES servers, while the integrated HD Graphics 500 drives 4K HMI canvases with smooth gesture response. Compared to ARM Cortex-A72 panels, the x86 ISA lets OEMs ship the same SCADA runtime (WinCC, Ignition, or Codesys) used on plant-floor PCs, eliminating porting effort. The 15-year embedded supply guarantee from Intel protects against end-of-life surprises on long-deployed industrial lines.
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Thin Client / VDI Endpoint
The J3455E is well-matched to VDI endpoints running Citrix HDX, VMware Horizon, or Microsoft RDP, where its quad-core Goldmont cores and HD Graphics 500 deliver smooth 1080p desktop remoting at sub-10 W board power. Apollo Lake's hardware decode offloads H.264/HEVC video streams to the GPU, freeing CPU cores for protocol encryption and USB redirection of peripherals. The SoC's x86 compatibility means IT shops can deploy the same management agents and BIOS update tools used on enterprise thin clients. Compared to Raspberry Pi-class thin clients, the J3455E offers more reliable Citrix performance and full Microsoft OS support.
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Point-of-Sale (POS) Terminal
Retail POS terminals benefit from the J3455E's combination of quad-core compute, hardware-accelerated graphics for touchscreen UI, and 10 W TDP enabling sealed countertop enclosures. The integrated Intel HD Graphics 500 renders receipts, loyalty screens, and barcode-scanner overlays fluidly. Apollo Lake's PCIe 2.0 and USB 3.0 interfaces accept standard POS peripherals - magnetic-stripe readers, cash drawers, receipt printers, and customer-facing displays - without external controllers. The x86 ISA supports Windows IoT and mainstream Linux POS distributions (including Ubuntu-based and Yocto-based stacks) commonly used in retail back-office environments.
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Edge Gateway / IoT Appliance
The J3455E serves as the compute heart of edge gateways aggregating sensor data over RS-485, CAN, or Modbus TCP, then publishing to cloud brokers via MQTT or OPC UA. Its quad-core Goldmont cores can simultaneously run a containerized edge analytics workload (e.g., Node-RED, AWS IoT Greengrass, or Azure IoT Edge) while the HD Graphics 500 remains idle. The 14 nm Apollo Lake silicon's hardware AES-NI accelerates TLS sessions to cloud endpoints at line rate. Compared to ARM Cortex-A class gateways, the J3455E removes software-porting friction for OPC UA stacks and Linux container runtimes tuned for x86.
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Interactive Kiosk / Self-Service Terminal
Self-service kiosks in airports, hotels, and hospitals benefit from the J3455E's quad-core compute, hardware video decode, and 10 W fanless thermal envelope - ideal for sealed public-facing enclosures. The SoC drives touchscreen UI, barcode/QR scanners, receipt printers, and payment-terminal peripherals via integrated USB 3.0 and PCIe 2.0. Apollo Lake's x86 compatibility lets OEMs deploy Windows IoT or Linux kiosk images directly, and Intel's 15-year embedded supply commitment supports long field deployments. Per third-party benchmarks, the J3455E delivers roughly 2x the multi-thread throughput of dual-core Celeron predecessors in the same thermal class.
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추천 제품 요약
엔지니어링 참조 데이터: J3455E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | J3455 | N3450 | J5040 | J4025 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | BGA (Apollo Lake embedded) | BGA (Apollo Lake) | BGA (Apollo Lake mobile) | BGA (Gemini Lake Refresh) | BGA (Gemini Lake Refresh) |
| Architecture / Family | Apollo Lake (Goldmont) / Celeron J | Apollo Lake (Goldmont) / Celeron J | Apollo Lake (Goldmont) / Celeron N | Gemini Lake Refresh / Pentium Silver | Gemini Lake Refresh / Celeron J |
| Cores / Threads | 4 / 4 | 4 / 4 | 4 / 4 | 4 / 4 | 2 / 2 |
| Base / Burst Frequency | 1.50 / 2.30 GHz | 1.50 / 2.30 GHz | 1.10 / 2.20 GHz | 2.00 / 3.20 GHz | 2.00 / 2.90 GHz |
| L2 Cache | 2 MB | 2 MB | 2 MB | 4 MB | 4 MB |
| TDP (SDP) | 10 W | 10 W | 6 W | 10 W | 10 W |
| Integrated Graphics | HD Graphics 500 (12 EU) | HD Graphics 500 (12 EU) | HD Graphics 500 (12 EU) | UHD Graphics 605 (18 EU) | UHD Graphics 600 (12 EU) |
| Memory Support | DDR3L/LPDDR3 1866, LPDDR4 2400 | DDR3L/LPDDR3 1866, LPDDR4 2400 | DDR3L/LPDDR3 1866, LPDDR4 2400 | DDR4/LPDDR4 up to 2400 | DDR4/LPDDR4 up to 2400 |
| Embedded Lifecycle | 15-year supply | Consumer (no embedded guarantee) | Mobile (no embedded guarantee) | Embedded (15-year supply) | Embedded (15-year supply) |
주요 차별점
- 15-year embedded supply guarantee (vs J3455 (consumer SKU))
- Lower TDP envelope for fanless mobile/embedded chassis (vs N3450 (mobile Celeron))
- Newer microarchitecture and higher burst frequency (vs J5040 (Pentium Silver Gemini Lake Refresh))
설계 노트
At a 10 W scenario design power on the J3455E, a fanless chassis requires a minimum of 1 square inch of copper pour under the BGA package, plus a thermal interface material rated for at least 5 W/mK. The SoC's on-die DTS (Digital Thermal Sensor) reports junction temperature via PECI or PECI over PCIe, enabling firmware-based throttling. Derate to 6 W SDP via platform firmware if the chassis cannot sustain 10 W continuously. Always validate junction temperature under worst-case workload (e.g., 4-core AVX2 stress) before sealing the enclosure.
Route Apollo Lake PCIe 2.0 lanes as 85 ohm differential with reference clock per Intel's Apollo Lake Platform Design Guide; keep total length under 6 inches and avoid splitting references between layers. The DDR3L/LPDDR4 channels require matched-length routing within +/- 25 mil across each byte lane and 100 ohm differential for SO-DIMM implementations. Provide a 4-layer stackup with continuous ground planes under the BGA break-out region to minimize crosstalk on USB 3.0 SuperSpeed pairs.
Do not assume BIOS/firmware images transfer between J3455 and J3455E without re-validation - while the silicon is identical, Intel's embedded firmware roadmap signs and validates images separately for the embedded SKU. Also note that Apollo Lake SoCs do not expose an external socket; any rework requires BGA reball equipment. For systems that may later migrate to Gemini Lake Refresh (e.g., J5040), verify BIOS, drivers, and board dimensions are forward-compatible before committing the carrier PCB layout.
규정 준수 정보
RoHS and REACH compliance per Intel ARK product page. Not AEC-Q100 qualified (industrial/embedded, not automotive). Lead-free BGA package per Intel embedded product specifications.
