KMPC8313CVRAGDB - PowerQUICC II Pro 400MHz MPU, 516-TEPBGA | NXP
부품 번호: KMPC8313CVRAGDB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.85 | $6,485.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $52.75 | $52,750.00 |
KMPC8313CVRAGDB 개요
A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computer system, executing instructions fetched from memory and orchestrating peripherals through on-chip controllers. Within the broader semiconductor taxonomy, MPUs sit alongside microcontrollers (MCUs), DSPs, and FPGAs as programmable logic devices, and the PowerQUICC II Pro family specifically targets communications infrastructure where integrated Ethernet and DMA offload reduce bill-of-materials cost.
Key differentiating features of the KMPC8313CVRAGDB include the non-encryption variant of the MPC8313E (the 'A' designator denotes absence of the security engine), integrated PHY interfaces, hardware packet handling acceleration, and 16-bit DDR2 memory support up to 266 MHz. The 400 MHz core combined with dual Gigabit Ethernet MACs delivers wire-speed forwarding for entry-level routers, switches, and network appliances.
The device uses a 32-bit PowerPC e300c3 superscalar core with separate 16 KB instruction and data caches, dual integer units, and a hardware MMU supporting Linux, VxWorks, and other embedded operating systems. The integrated system bus and DMA controller offload data movement from the CPU, leaving more headroom for protocol processing in networking workloads.
Typical applications include SOHO routers, residential gateways, industrial Ethernet switches, networked printers, and embedded Linux appliances. Designers choose this part when they need mature PowerPC software support, integrated Gigabit Ethernet, and a long-life-cycle component for industrial designs.
When designing with the KMPC8313CVRAGDB, ensure the PCB has a thermal dissipation path through the exposed pad and that the 1.0 mm pitch BGA is assembled by an experienced contract manufacturer. Programmable clocking and configurable SerDes modes require careful reference-clock jitter analysis to meet Ethernet PHY compliance.
This page synthesizes distributor stock data, parametric drop-in alternatives, and practical design notes that complement but do not replace the official NXP MPC8313 hardware specifications reference manual for the part.
드롭인 대체품: KMPC8313CVRAGDB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8313ECVRAGDB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313CVRAGDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313CVRAFDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313EZQAJDB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
KMPC8313CVRAGDB 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e300c3, 32-bit, single core |
| Maximum Core Frequency | 400 MHz |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| 패키지 | 516-TEPBGA, 27x27 mm, 1.0 mm pitch |
| Memory Controller | DDR1/DDR2, 16/32-bit, up to 266 MHz |
| Ethernet MACs | 2x 10/100/1000 Mbps (non-encryption variant) |
| USB | USB 2.0 Host/Device |
| DMA Channels | 4 |
| Security Engine | Not included (A designator, no encryption) |
| 동작 온도 | -40C to +105C (industrial) |
| 실장 유형 | Surface Mount, BGA with exposed thermal pad |
| RoHS 상태 | Compliant (Pb-free, NOPB marking per Mouser listing) |
KMPC8313CVRAGDB 516-tepbga, 27x27 mm, 1.0 mm pitch 핀 구성 가이드
KMPC8313CVRAGDB(516-tepbga, 27x27 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: KMPC8313CVRAGDB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
KMPC8313CVRAGDB 적합 용도: 6 애플리케이션s: SOHO Routers and Residential Gateways, Industrial Ethernet Switches, Networked Printers and Multifunction Devices, Embedded Linux Network Appliances, Industrial Protocol Gateways, Network-Attached Storage Entry-Level Controllers.
SOHO Routers and Residential Gateways
The KMPC8313CVRAGDB's 400 MHz PowerPC e300c3 core combined with dual 10/100/1000 Ethernet MACs and integrated USB 2.0 controller makes it well matched to SOHO router and residential gateway platforms. Engineers typically place the MPU between the DSL/cable modem PHY and the LAN/WAN switch fabric, where wire-speed NAT and firewall throughput depend on the dual-GbE MACs and four DMA channels offloading packet movement from the CPU. Unlike ARM Cortex-A designs that require external PHYs, the integrated MACs and PHY interfaces reduce BOM cost by approximately $3-5 per board. Power consumption at 2 W typical keeps the design within passive thermal envelopes, while the industrial -40C to +105C temperature range supports outdoor enclosures.
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Industrial Ethernet Switches
For Layer-2 industrial Ethernet switches with management plane processing, the KMPC8313CVRAGDB provides the 400 MHz compute headroom and dual GbE MACs needed for protocol-aware forwarding. The integrated DMA controller moves port statistics and management frames without CPU intervention, leaving cycles for SNMP, RSTP, and IEC 61850 stack processing. Placed as the management CPU alongside an external Layer-2 switch ASIC, the MPU's industrial temperature grade supports factory-floor deployment without conformal coating. The 516-TEPBGA exposed thermal pad allows direct PCB heatsinking through via stitching.
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Networked Printers and Multifunction Devices
Networked printers and MFPs benefit from the KMPC8313CVRAGDB's combination of USB 2.0 host/device ports, dual Gigabit Ethernet for high-speed image transfer, and Linux-friendly architecture for CUPS and IPP stack support. The 400 MHz core is sufficient to drive 600 dpi rendering pipelines while sustaining gigabit network throughput to the print server. Designers typically connect the MPU to a separate scanner ASIC over PCI, while the on-chip DDR2 controller feeds the print engine buffer. The non-encryption variant (A designator) keeps cost low since encryption is rarely required in office printing.
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Embedded Linux Network Appliances
The KMPC8313CVRAGDB's mature mainline Linux kernel support and U-Boot bootloader integration make it a natural fit for custom Linux-based network appliances such as firewalls, VPN concentrators, and protocol bridges. The PowerPC e300c3 core runs Debian, Yocto, or Buildroot-based distributions with verified device-tree bindings for Ethernet, USB, and DDR2 controllers. The integrated memory controller supports up to 1 GB of DDR2, sufficient for caching, packet inspection, and embedded web servers. Compared to newer ARM Layerscape parts, the PowerQUICC II Pro offers faster time-to-market for teams with existing PowerPC firmware.
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Industrial Protocol Gateways
Protocol gateways that translate between Modbus TCP, EtherNet/IP, PROFINET, and serial fieldbus benefit from the KMPC8313CVRAGDB's mix of Ethernet MACs, USB, and the PowerPC architecture for deterministic real-time scheduling. The MPU can run a real-time Linux kernel (PREEMPT_RT) or VxWorks for hard real-time translation latency. The four DMA channels handle bulk protocol data without CPU involvement, while the industrial temperature grade supports deployment in control cabinets without active cooling.
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Network-Attached Storage Entry-Level Controllers
Entry-level NAS controllers can use the KMPC8313CVRAGDB to manage SATA disks, provide SMB/NFS/iSCSI file services, and run a lightweight Linux NAS distribution. The 400 MHz core handles typical home/small-office NAS workloads (RAID-1 mirroring, file serving for 4-8 clients), while the dual GbE MACs support link aggregation. The DDR2 memory controller can address up to 1 GB for filesystem caching, and the USB 2.0 host ports support external backup drives. The 516-TEPBGA package's exposed thermal pad simplifies chassis heatsinking.
추천
추천 제품 요약
엔지니어링 참조 데이터: KMPC8313CVRAGDB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8313ECVRAGDB | MPC8313CVRAGDA | MPC8313CVRAFDA | MPC8313EZQAJDB |
|---|---|---|---|---|---|
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC e300c3, single core | PowerPC e300c3, single core - same | PowerPC e300c3, single core - same | PowerPC e300c3, single core - same | PowerPC e300c3, single core - same |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 333 MHz (-17%) |
| Security Engine (SEC 2.0) | No | Yes | No | No | Yes |
| Ethernet MACs | 2x 10/100/1000 Mbps | 2x 10/100/1000 Mbps | 2x 10/100/1000 Mbps | 2x 10/100/1000 Mbps | 2x 10/100/1000 Mbps |
| DDR2 Memory Controller | 16/32-bit, up to 266 MHz | 16/32-bit, up to 266 MHz | 16/32-bit, up to 266 MHz | 16/32-bit, up to 266 MHz | 16/32-bit, up to 266 MHz |
| USB 2.0 | Yes (Host/Device) | Yes (Host/Device) | Yes (Host/Device) | Yes (Host/Device) | Yes (Host/Device) |
주요 차별점
- Lower cost without SEC 2.0 engine (vs MPC8313ECVRAGDB)
- Mature PowerPC software ecosystem (vs MPC8308CVMAGDA (different package))
- Dual Gigabit Ethernet MACs integrated (vs MPC8308CVMAGDA (different package))
설계 노트
Estimated: at 400 MHz core frequency with both Gigabit Ethernet MACs active, the KMPC8313CVRAGDB dissipates approximately 1.8-2.2 W. The 516-TEPBGA package uses an exposed thermal pad (TEP) that MUST be soldered to the ground plane with a 6x6 via stitch array (0.3 mm via diameter, 1.0 mm pitch) to achieve the datasheet theta_JA of approximately 15 C/W. Without the thermal pad soldered, junction temperature can exceed 105C under sustained load.
The 516-TEPBGA uses a 1.0 mm ball pitch on a 27x27 mm body - well beyond the capability of DIY reflow. Use a contract manufacturer with BGA assembly experience (e.g., Jabil, Flex, or regional EMS partners). DDR2 trace lengths must be matched within 25 mils per byte lane; Ethernet RGMII traces require 50 ohm controlled impedance with length matching to within 150 mils.
Do not confuse the KMPC8313CVRAGDB (non-encryption, A designator) with the MPC8313ECVRAGDB (encryption, E designator). Software written to use SEC 2.0 crypto acceleration will fail to load on the A variant. Verify ordering code carefully against the BOM. Also note that the 1.0 mm pitch BGA requires X-ray inspection post-reflow - optical inspection alone cannot verify BGA joint integrity.
규정 준수 정보
Pb-free (NOPB marking) per Mouser listing. Industrial temperature grade -40C to +105C. Not AEC-Q100 qualified; this is an industrial/commercial networking MPU, not an automotive part.
