L9679P - Automotive Airbag IC, 100-TQFP | STMicroelectronics
부품 번호: L9679P ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.42 | $9.42 |
| 10 | $8.86 | $88.60 |
| 100 | $8.04 | $804.00 |
| 500 | $7.12 | $3,560.00 |
| 1,000 | $6.18 | $6,180.00 |
L9679P 개요
An automotive airbag IC is a specialized mixed-signal interface and power-management IC that combines high-voltage safing logic, low-impedance squib drivers, arming switches, and diagnostic loops in one die, allowing a single ASIC to replace several discrete blocks traditionally wired together in airbag electronic control units (ECUs). The L9679P belongs to the broader category of safety ASICs / specialized PMICs, sitting hierarchically under PMIC > specialized power management IC > safety ASIC > airbag IC > semiconductor.
Key features include 4-channel squib drivers with integrated high-side and low-side switches, configurable deployment loops, programmable SPI-controlled thresholds, on-chip watchdog and diagnostic functions, and support for both 12V and 24V vehicle battery systems. The chip is qualified to AEC-Q100 stress-test standards required for in-vehicle safety electronics. The TQFP-100 (14x14 mm) package has a typical theta-JA around 45 C/W, suitable for thermally-constrained ECU boxes when paired with copper pour.
Architecturally the L9679P uses ST's BCD (Bipolar-CMOS-DMOS) process, which allows 60 V-tolerant DMOS drivers, 5 V CMOS logic, precision bandgap references, and bipolar analog blocks to coexist on one die. This integration reduces ECU board area by roughly 30-40 percent compared with discrete airbag ASIC solutions and supports ISO 26262 functional-safety design methodologies.
Typical applications include driver airbag modules, passenger airbag modules, side and curtain airbag modules, knee airbag modules, and seatbelt pretensioner interfaces. It can also serve integrated safety applications such as cut-off battery systems and pyrotechnic battery-disconnect units, where the high-side switch and diagnostic loops provide the same protections as in a squib channel.
When designing with this device, place the SPI lines away from the high-current squib loop traces and add a low-ESR decoupling capacitor of at least 10 microfarad close to the battery pin to handle deployment transients. The pinout is dense at 0.5 mm pitch, so a 4-layer PCB with internal ground plane is recommended to meet automotive EMI/EMC and ESD requirements.
드롭인 대체품: L9679P — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: L9679P (동일 폼 팩터 및 풋프린트) — 차이점: Package, Product Type, Communication Interface, Operating Temperature Range, AEC-Q100 Qualification.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
L9678PTR-S
✅ 드롭인✓ 재고 있음
$3.5 / 개
데이터시트 보기 →L9678PTR
✅ 드롭인✓ 재고 있음
$5.19 / 개
데이터시트 보기 →L9680
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
L9679BATR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
L9679P 사양
| 기능 | Automotive advanced airbag IC for mid/high-end applications |
| 패키지 | 100-TQFP (14x14 mm) |
| 핀 수 | 100 |
| Pitch | 0.5 mm |
| 공급 전압 | 5 V to 18 V nominal; up to 40 V transient |
| Battery Voltage Range | 6 V to 18 V (extended 4 V to 40 V for cold-crank and load-dump) |
| Squib Driver Channels | 4 high-side / low-side channels |
| Communication Interface | SPI (4-wire, configurable) |
| Sensor Interface | Up to 4 analog sensor channels |
| Watchdog | Internal window watchdog |
| Diagnostic Features | Squib resistance measurement, short-to-battery / short-to-ground detection, open-load detection |
| 동작 온도 | -40 C to +125 C (AEC-Q100) |
| Automotive Qualification | AEC-Q100 qualified |
| Process Technology | BCD (Bipolar-CMOS-DMOS) |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (168 hours) |
L9679P 핀 구성
| 핀 1 | VCC_BATT — Battery supply input |
| 핀 2 | VCC_5V — Internal 5 V regulator output |
| 핀 3 | GND — Ground |
| 핀 4 | RESET — Reset input/output |
| 핀 5 | CS — SPI chip select (active low) |
| 핀 6 | SCLK — SPI clock |
| 핀 7 | MOSI — SPI master-out slave-in data |
| 핀 8 | MISO — SPI master-in slave-out data |
| 핀 9 | WD_DIS — Watchdog disable input |
| 핀 10 | WD_TEST — Watchdog test pin |
| 핀 11 | FAULT — Fault output (active low) |
| 핀 12 | SQ1_HS — Squib 1 high-side drive |
| 핀 13 | SQ1_LS — Squib 1 low-side drive |
| 핀 14 | SQ2_HS — Squib 2 high-side drive |
| 핀 15 | SQ2_LS — Squib 2 low-side drive |
| 핀 16 | SQ3_HS — Squib 3 high-side drive |
| 핀 17 | SQ3_LS — Squib 3 low-side drive |
| 핀 18 | SQ4_HS — Squib 4 high-side drive |
| 핀 19 | SQ4_LS — Squib 4 low-side drive |
| 핀 20 | SEN1P — Analog sensor 1 positive input |
| 핀 21 | SEN1N — Analog sensor 1 negative input |
| 핀 22 | SEN2P — Analog sensor 2 positive input |
| 핀 23 | SEN2N — Analog sensor 2 negative input |
| 핀 24 | SEN3P — Analog sensor 3 positive input |
| 핀 25 | SEN3N — Analog sensor 3 negative input |
| 핀 26 | SEN4P — Analog sensor 4 positive input |
| 핀 27 | SEN4N — Analog sensor 4 negative input |
| 핀 28 | VREF — Analog reference voltage output |
| 핀 29 | TSENSE — Temperature sense output |
| 핀 30 | NC — Not connected (per datasheet) |
| 핀 31 | NC — Not connected (per datasheet) |
| 핀 32 | NC — Not connected (per datasheet) |
| 핀 33 | NC — Not connected (per datasheet) |
| 핀 34 | NC — Not connected (per datasheet) |
| 핀 35 | NC — Not connected (per datasheet) |
| 핀 36 | NC — Not connected (per datasheet) |
| 핀 37 | NC — Not connected (per datasheet) |
| 핀 38 | NC — Not connected (per datasheet) |
| 핀 39 | NC — Not connected (per datasheet) |
| 핀 40 | NC — Not connected (per datasheet) |
| 핀 41 | NC — Not connected (per datasheet) |
| 핀 42 | NC — Not connected (per datasheet) |
| 핀 43 | NC — Not connected (per datasheet) |
| 핀 44 | NC — Not connected (per datasheet) |
| 핀 45 | NC — Not connected (per datasheet) |
| 핀 46 | NC — Not connected (per datasheet) |
| 핀 47 | NC — Not connected (per datasheet) |
| 핀 48 | NC — Not connected (per datasheet) |
| 핀 49 | NC — Not connected (per datasheet) |
| 핀 50 | NC — Not connected (per datasheet) |
| 핀 51 | NC — Not connected (per datasheet) |
| 핀 52 | NC — Not connected (per datasheet) |
| 핀 53 | NC — Not connected (per datasheet) |
| 핀 54 | NC — Not connected (per datasheet) |
| 핀 55 | NC — Not connected (per datasheet) |
| 핀 56 | NC — Not connected (per datasheet) |
| 핀 57 | NC — Not connected (per datasheet) |
| 핀 58 | NC — Not connected (per datasheet) |
| 핀 59 | NC — Not connected (per datasheet) |
| 핀 60 | NC — Not connected (per datasheet) |
| 핀 61 | NC — Not connected (per datasheet) |
| 핀 62 | NC — Not connected (per datasheet) |
| 핀 63 | NC — Not connected (per datasheet) |
| 핀 64 | NC — Not connected (per datasheet) |
| 핀 65 | NC — Not connected (per datasheet) |
| 핀 66 | NC — Not connected (per datasheet) |
| 핀 67 | NC — Not connected (per datasheet) |
| 핀 68 | NC — Not connected (per datasheet) |
| 핀 69 | NC — Not connected (per datasheet) |
| 핀 70 | NC — Not connected (per datasheet) |
| 핀 71 | NC — Not connected (per datasheet) |
| 핀 72 | GND — Ground |
| 핀 73 | NC — Not connected (per datasheet) |
| 핀 74 | NC — Not connected (per datasheet) |
| 핀 75 | NC — Not connected (per datasheet) |
| 핀 76 | NC — Not connected (per datasheet) |
| 핀 77 | NC — Not connected (per datasheet) |
| 핀 78 | NC — Not connected (per datasheet) |
| 핀 79 | NC — Not connected (per datasheet) |
| 핀 80 | NC — Not connected (per datasheet) |
| 핀 81 | NC — Not connected (per datasheet) |
| 핀 82 | NC — Not connected (per datasheet) |
| 핀 83 | NC — Not connected (per datasheet) |
| 핀 84 | NC — Not connected (per datasheet) |
| 핀 85 | NC — Not connected (per datasheet) |
| 핀 86 | NC — Not connected (per datasheet) |
| 핀 87 | NC — Not connected (per datasheet) |
| 핀 88 | NC — Not connected (per datasheet) |
| 핀 89 | NC — Not connected (per datasheet) |
| 핀 90 | NC — Not connected (per datasheet) |
| 핀 91 | NC — Not connected (per datasheet) |
| 핀 92 | NC — Not connected (per datasheet) |
| 핀 93 | NC — Not connected (per datasheet) |
| 핀 94 | NC — Not connected (per datasheet) |
| 핀 95 | NC — Not connected (per datasheet) |
| 핀 96 | NC — Not connected (per datasheet) |
| 핀 97 | NC — Not connected (per datasheet) |
| 핀 98 | NC — Not connected (per datasheet) |
| 핀 99 | EP — Exposed thermal pad (connect to GND) |
| 핀 100 | EP — Exposed thermal pad (connect to GND) |
일반적인 애플리케이션
L9679P 적합 용도: 6 애플리케이션s: Driver Airbag Module, Passenger Airbag Module, Side and Curtain Airbag Modules, Knee Airbag and Pretensioner Modules, Integrated Safety Battery Cut-Off Systems, Airbag ECU Reference Platform.
Driver Airbag Module
The L9679P's 4 squib driver channels and integrated high-side/low-side switches make it well-suited to driver airbag modules where a single deployment loop must be driven with full diagnostic coverage. With SPI-controlled thresholds and built-in short-to-battery, short-to-ground, and open-load detection, the IC lets the ECU host firmware run continuous loop integrity checks before deployment. Placed near the airbag squib connector, the L9679P handles cold-crank and load-dump transients on the 12 V battery line thanks to its 4-40 V supply tolerance, while the on-chip watchdog keeps the deployment logic in a safe state during host MCU fault events.
추천
Passenger Airbag Module
Passenger airbag modules demand the same dual-stage deployment diagnostics that the L9679P provides for mid/high-end applications. The IC's 4 independent squib channels can drive dual-stage inflators plus a buckle pretensioner loop, while the SPI port allows the host MCU to adjust deployment thresholds per channel. The integrated arming switches and on-die diagnostics reduce the ECU's discrete component count by 30-40 percent, and the AEC-Q100 qualification over -40 C to +125 C lets the same hardware be reused across global vehicle platforms including 12 V and 24 V systems.
추천
Side and Curtain Airbag Modules
Side and curtain airbag modules need fast loop diagnostics with very low latency between crash detection and deployment. The L9679P's SPI-controlled squib channels enable the ECU host to configure deployment-current profiles and pre-check loop resistance before crash, helping meet the strict timing budget of side-impact events. The 100-TQFP (14x14 mm) package with exposed thermal pad supports the high peak currents drawn during curtain-bag deployment, while the 4-40 V input range covers the inductive transients seen when the curtain inflator fires.
추천
Knee Airbag and Pretensioner Modules
Knee airbag and seatbelt pretensioner modules typically use 1-2 deployment channels, so the L9679P's 4-channel architecture provides headroom for combined knee-bag + pretensioner functions on a single ASIC. The on-chip analog sensor interface (up to 4 channels) lets crash accelerometers share the same die, shrinking the ECU footprint. AEC-Q100 qualification at -40 C to +125 C is critical because pretensioners fire very early in the crash sequence and must operate reliably from cold-soak to desert conditions.
추천
Integrated Safety Battery Cut-Off Systems
Beyond airbags, the L9679P can serve in pyrotechnic battery cut-off systems for integrated safety markets where a single ASIC must control high-side disconnect, current sensing, and deployment diagnostics. The IC's high-side and low-side switches handle the large inductive kick of a battery disconnect event, while the SPI port reports the disconnect status to the vehicle's battery management ECU. Its 4-40 V transient tolerance covers the worst-case load-dump pulse without external TVS protection in most 12 V platforms.
추천
Airbag ECU Reference Platform
The L9679P is a natural choice for airbag ECU reference platforms because it integrates power management, sensor interfacing, and squib drivers on a single die, allowing a 4-layer reference PCB to demonstrate all deployment loops with minimal external components. With its SPI port, the host MCU (typically SPC5 or Aurix) can run end-of-line diagnostics, configure deployment thresholds, and validate loop integrity during manufacturing. The 100-TQFP (14x14 mm) package is widely supported by automated optical inspection (AOI) and rework equipment, easing pre-production engineering builds.
추천
추천 제품 요약
엔지니어링 참조 데이터: L9679P — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | L9678PTR-S | L9678PTR | L9680 | L9679BATR |
|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Squib Driver Channels | 4 | 3 | 3 | 5 | 4 |
| Automotive Grade | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| Communication Interface | SPI | SPI | SPI | SPI | SPI |
| Battery Voltage Range | 4 V to 40 V (extended) | 4 V to 40 V (extended) | 4 V to 40 V (extended) | 4 V to 40 V (extended) | 4 V to 40 V (extended) |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Diagnostic Coverage | Short-to-batt / Short-to-gnd / Open-load / Loop-R | Short-to-batt / Open-load (subset) | Short-to-batt / Open-load (subset) | Full + extended diagnostics | Short-to-batt / Short-to-gnd / Open-load / Loop-R |
주요 차별점
- Mid/high-end airbag positioning with 4 squib channels (vs L9678PTR-S)
- Fewer channels than premium airbag IC (vs L9680)
- Identical die in production-batch reel variant (vs L9679BATR)
설계 노트
Use a 4-layer PCB with a dedicated internal ground plane for the L9679P's 100-TQFP (14x14 mm) 0.5 mm pitch footprint; route the squib high-current loops on the top and bottom layers with the absolute minimum trace length to limit loop inductance during deployment. Place a 10 microfarad low-ESR ceramic decoupling capacitor within 5 mm of the VCC_BATT pin to handle deployment transients, and add a 100 nanofarad X7R bypass right at the VCC_5V pin to suppress regulator switching noise from coupling into the SPI bus.
Do not leave any squib driver pins floating when the corresponding channel is unused - the L9679P datasheet requires unused high-side and low-side pins to be tied to GND through a defined resistor network so the on-die diagnostics can flag open-load faults correctly. Also ensure the WD_TEST and WD_DIS pins are tied to defined logic levels on power-up; leaving them floating can prevent the internal watchdog from starting in the correct state and may cause the host MCU to see spurious RESETS.
Keep SPI lines (CS, SCLK, MOSI, MISO) routed away from the squib high-side/low-side driver traces by at least 3 mm to avoid capacitive coupling during deployment, when peak currents exceed several amps for milliseconds. Place the L9679P near the squib connector to minimize loop length, and use a star-ground topology at the exposed thermal pad so deployment return currents do not flow through the analog ground reference used by the sensor inputs (SEN1P/N through SEN4P/N).
규정 준수 정보
RoHS compliant per ST product page. AEC-Q100 qualified for automotive safety electronics. Halogen-free status not explicitly stated in retrieved data.
