LFE2-12E-6F256C - 12K LUT ECP2 FPGA, 193 I/O, 256-BGA | Lattice
부품 번호: LFE2-12E-6F256C ✗ 단종LFE2-12E-6F256C 개요
드롭인 대체품: LFE2-12E-6F256C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: LFE2-12E-6F256C (동일 폼 팩터 및 풋프린트) — 차이점: Programmable Logic, Speed Grade.
LFE2-12E-6FN256C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-12SE-6FN256C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-12E-7F256C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-12E-5F256C
✅ 드롭인가격 문의
데이터시트 보기 →LFE2-12E-6Q208I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-12E-6F256C 최대 정격 & 전기적 특성
| Product Type | ECP2 Field-Programmable Gate Array (FPGA) |
| Logic Capacity | 12,000 LUTs |
| I/O Count | 193 I/O |
| Internal Configuration Bits | 226,304 bits |
| 공급 전압 | 1.2 V |
| Speed Grade | -6 |
| 패키지 | 256-BGA |
| Ball Count | 256 balls |
| Package Shape | Square |
| Terminal Form | Ball |
| Device Family | ECP2 |
| Programmable Logic | FPGA |
LFE2-12E-6F256C square 핀 구성 가이드
LFE2-12E-6F256C(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: LFE2-12E-6F256C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
LFE2-12E-6F256C 적합 용도: 6 애플리케이션s: Industrial PLC and Automation Control, Industrial and Automotive Networking, Embedded Signal Processing, Data Acquisition and Test Equipment, Interface Conversion and Protocol Bridging, Consumer and Communication Equipment.
Industrial PLC and Automation Control
The LFE2-12E-6F256C fits programmable automation logic where parallel I/O, deterministic control, and flexible hardware behavior are more valuable than a fixed instruction set. Its 12,000 LUTs and 193 I/O provide substantial configurable logic for sequencing machinery, coordinating sensors and actuators, and implementing communication or safety-adjacent control blocks. The -6 speed grade can support timing-critical control paths, while the 256-BGA package keeps the design compact. Because the supplied data does not identify the temperature grade or qualification status, industrial deployments should verify those specifications and the complete pinout before release.
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Industrial and Automotive Networking
The LFE2-12E-6F256C is suitable for protocol bridging, traffic aggregation, and embedded network-interface logic in industrial communication equipment. With 12,000 LUTs and 193 I/O, it can combine multiple packet-processing or framing functions while retaining parallel interface capacity for external transceivers and processors. The 1.2 V supply indication identifies a low-voltage FPGA platform, so power sequencing and decoupling must follow the manufacturer's recommendations. The verified information does not confirm AEC-Q100 qualification; use this part in automotive designs only after reviewing the exact quality documentation and temperature grade.
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Embedded Signal Processing
The ECP2 architecture allows designers to implement parallel filtering, data acquisition conditioning, and fixed-function signal processing directly in programmable logic. The LFE2-12E-6F256C provides 12,000 LUTs for control, arithmetic, and interface logic, while its 193 I/O can expose parallel sensor inputs and accelerator outputs. Using an FPGA instead of a DSP or microcontroller allows the datapath to be updated in the field. Engineers should validate timing closure, embedded-memory usage, and accelerator throughput in Lattice development tools; those implementation details are not specified by the supplied distributor snippets.
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Data Acquisition and Test Equipment
The LFE2-12E-6F256C can implement parallel data capture, timing generation, trigger logic, and instrument-control functions in programmable test systems. Its 193 I/O supports connections among ADC or DAC devices, memory, and host interfaces, while 12,000 LUTs allow several channels of logic to operate concurrently. The 256-BGA package supports dense routing but requires careful layer planning and high-speed escape-routing techniques. Exact supported I/O standards, voltage ranges, and performance are not stated in the supplied sources and must be confirmed in the package-specific manufacturer documentation.
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Interface Conversion and Protocol Bridging
The LFE2-12E-6F256C is well suited to bridging legacy parallel interfaces with newer serial or packet-based links. Its 12,000 LUTs can accommodate state machines, width converters, and protocol engines, while 193 I/O provides parallel device connections. The -6 grade is appropriate where control logic must meet defined timing margins, and the BGA package reduces board area compared with many leaded packages. During implementation, constrain all interfaces according to the selected bank voltage and validate timing, clocking, and I/O standards using the Lattice project flow and the exact package pinout.
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Consumer and Communication Equipment
The programmable logic density of the LFE2-12E-6F256C supports compact multi-function implementations in communication and consumer equipment, such as display-control helpers, protocol converters, or configurable interface blocks. Its 12,000 LUTs provide more parallel flexibility than a small microcontroller while avoiding the complexity of a larger FPGA. The 193 I/O can connect directly to multiple external devices, and the 256-BGA package supports compact board layouts. Before a consumer release, verify the exact commercial or extended-temperature option, lifecycle status, and production availability because these details are not confirmed by the supplied search results.
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추천 제품 요약
엔지니어링 참조 데이터: LFE2-12E-6F256C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | LFE2-12E-6FN256C | LFE2-12SE-6FN256C | LFE2-12E-7F256C | LFE2-12E-5F256C | LFE2-12E-6Q208I |
|---|---|---|---|---|---|---|
| Package | 256-BGA | 256-BGA - same package | 256-BGA - same package | 256-BGA - same package | 256-BGA - same package | 208-BGA - different package |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Speed Grade | -6 | -6 | -6 | -7 | -5 | -6 |
| Device Series | ECP2 E-Series | ECP2 E-Series | ECP2 S-Series with DSP | ECP2 E-Series | ECP2 E-Series | ECP2 E-Series |
주요 차별점
- Confirmed 193-I/O resource count (vs LFE2-12E-6Q208I)
- -6 performance option (vs LFE2-12E-5F256C)
- General ECP2 configuration (vs LFE2-12SE-6FN256C)
- Same verified core resource class (vs LFE2-12E-6FN256C)
설계 노트
The LFE2-12E-6F256C uses a 256-BGA package, so the layout should be planned around via-in-pad or via-under-ball escape routing, multilayer fanout, and assembly access for inspection and rework. Do not infer ball assignments from distributor listings. Use the exact Lattice package drawing, define all power and ground balls in the constraints file, and run signal- and power-integrity checks before fabrication.
Power planning must begin with the exact Lattice power-supply requirements and I/O bank configuration for the selected suffix. The confirmed 1.2 V indication should not be treated as the only rail requirement because auxiliary and I/O supplies may differ. Place local bulk and high-frequency decoupling close to the relevant supply balls, provide clean power sequencing, and verify startup, current limit, and load-transient behavior in the manufacturer's simulation guidance.
The 193 available I/O and the -6 speed grade require disciplined interface design. Assign each external interface to a compatible voltage bank, apply the device's recommended I/O standards, and use source-synchronous routing or controlled-impedance traces where applicable. Keep clocks away from noisy power and data paths, add matched-length treatment where the architecture requires it, and validate the final implementation through post-route timing analysis rather than relying on distributor timing summaries.
The verified sources identify the ECP2 family and package but do not establish the exact temperature suffix, lifecycle state, or all pin functions for LFE2-12E-6F256C. A design that substitutes a similarly named -5, -7, FN, SE, or Q208 variant without checking the ordering table can introduce temperature, timing, resource, or package errors. Confirm the complete MPN, package drawing, datasheet, and device-status statement before schematic sign-off.
규정 준수 정보
The supplied distributor and search snippets do not explicitly state compliance for the exact LFE2-12E-6F256C ordering code. Compliance must be confirmed from current Lattice documentation.
