LFE2-12E-6F484C - 12K-Cell ECP2 FPGA | Lattice Semiconductor
부품 번호: LFE2-12E-6F484C ✗ 단종LFE2-12E-6F484C 개요
An FPGA is a programmable logic semiconductor that can be configured after manufacture to implement digital control, interface, signal-processing, and embedded systems functions. In the product hierarchy, the LFE2-12E-6F484C is an FPGA, a member of the ECP2 family, and a surface-mounted integrated circuit combining configurable logic blocks with embedded memory and programmable I/O.
The device provides 12,000 logic cells organized as 6,000 adaptive logic modules, along with 221 kbit of embedded memory. Its 297 I/O offer substantial connectivity for parallel data buses, control signals, and external interfaces. The -6 designation identifies the device speed grade, while the 484 suffix identifies the high-ball-count package used to support this relatively large I/O count.
The 90 nm ECP2 process combines programmable logic with block RAM and dedicated interface resources. Distributed verification data identifies 12,000 logic elements, 6,000 ALMs, 221 kbit of embedded memory, and 297 I/O for closely related ECP2 members. These resources make the part useful for consolidating multiple fixed-function programmable logic functions onto one device while avoiding the development cycle of a custom ASIC.
Typical uses include industrial automation and control, embedded communications, data acquisition, instrument interfaces, video and display control, and general-purpose digital signal handling. Its 297 available I/O are particularly valuable when a design must retain many external buses or board-level control signals while performing parallel logic operations internally.
PCB design should treat the 1.2 V core rail as a dedicated, carefully decoupled supply and should follow the manufacturer's package ball map, power-plane, and thermal recommendations. Because the available source data does not provide the complete 484-ball assignment, designers should not infer pin functions from the package name and should instead verify every connection against the official device documentation before layout release.
드롭인 대체품: LFE2-12E-6F484C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: LFE2-12E-6F484C (동일 폼 팩터 및 풋프린트) — 차이점: Logic Cells, Speed Grade.
LFE2-12E-6FN484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-12E-7F484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-12E-5F484C
✅ 드롭인가격 문의
데이터시트 보기 →LFE2-12SE-6F484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-12SE-5FN484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-12E-6F484C 최대 정격 & 전기적 특성
| Device Type | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Cells | 12,000 cells |
| Adaptive Logic Modules | 6,000 ALMs |
| Embedded Memory | 221 kbit |
| Number of I/O | 297 I/O |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm |
| 패키지 | 484-pin FBGA |
| Number of Terminals | 484 terminals |
| Terminal Form | Ball |
| Package Shape | Square |
| Product Family | ECP2 |
| Programmable Logic Type | SRAM-based programmable logic |
| Speed Grade | -6 |
| Manufacturer | Lattice Semiconductor Corporation |
| 실장 유형 | Surface mount |
| RoHS 상태 | Details not stated in supplied product data |
LFE2-12E-6F484C square 핀 구성 가이드
LFE2-12E-6F484C(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: LFE2-12E-6F484C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
LFE2-12E-6F484C 적합 용도: 6 애플리케이션s: Industrial Automation and PLC Control, Embedded Communications Interface, Data Acquisition and Instrumentation, Video Timing and Display Control, Medical and Diagnostic Equipment, Programmable Logic Consolidation.
Industrial Automation and PLC Control
The LFE2-12E-6F484C fits industrial control logic because its 12,000 logic cells, 6,000 adaptive logic modules, and 297 I/O can consolidate machine sequencing, interlocks, counters, and parallel sensor interfaces in one FPGA. The 221 kbit of embedded memory provides local storage for operating parameters, diagnostics, and data buffers without requiring an external memory device for every control function. Designers can assign deterministic logic to motion-control, condition-monitoring, or safety-adjacent supervisory functions while keeping the implementation programmable. The main engineering check is the operating-temperature grade, which is not stated in the supplied data and must be matched to the enclosure environment before production release.
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Embedded Communications Interface
The LFE2-12E-6F484C is suitable for protocol adaptation, packet formatting, test-pattern generation, and other communications glue logic because its 297 I/O provide abundant parallel connectivity. The 6,000 adaptive logic modules and 221 kbit of embedded memory can support concurrent data paths, frame buffers, and state machines, while the 12,000-cell capacity allows multiple interface blocks to share one device. A typical implementation places the FPGA between a communications processor and a board-level transceiver or connector. Engineers should use registered I/O where timing requires it and budget the 1.2 V core rail separately from external interface supplies.
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Data Acquisition and Instrumentation
The LFE2-12E-6F484C can implement parallel data acquisition, sensor conditioning, filtering, and digital signal processing because 12,000 logic cells provide programmable datapaths and 221 kbit of embedded memory can hold samples or intermediate results. Its 297 I/O simplify connections among multiplexers, converters, memory, and a host interface by reducing the need for external glue logic. A practical design could use internal logic for sampling control, filtering, and data packing while a microcontroller or DSP handles calibration and user interaction. Timing closure remains critical because the available -6 speed grade must be validated against converter latency and clock requirements in the official ECP2 documentation.
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Video Timing and Display Control
The LFE2-12E-6F484C fits timing generation, pixel-format conversion, overlay logic, and display-interface bridging because 297 I/O can accommodate parallel pixel and control buses. Its 12,000 logic cells support timing generators, counters, line and pixel pipelines, and control state machines, while the 221 kbit of embedded memory can support line buffers or small frame storage. The FPGA is especially useful when a product needs programmable timing that differs from the defaults supported by a fixed display controller. System-level validation should include signal-integrity analysis, output timing margins, and confirmation that the selected package and temperature grade satisfy the display module environment.
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Medical and Diagnostic Equipment
The LFE2-12E-6F484C can serve as a programmable control or signal-routing device in diagnostic and monitoring equipment that requires deterministic parallel logic and configurable timing. Its 297 I/O can connect sensors, converters, memory, and safety supervisory signals, while 6,000 adaptive logic modules support filtering, state management, and data preparation. The 221 kbit embedded memory is useful for local trace and control storage. This application requires disciplined design controls: engineers must confirm operating temperature, supply tolerances, configuration reliability, and applicable medical product requirements because the supplied data does not establish regulatory or patient-contact safety certification for this device.
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Programmable Logic Consolidation
The LFE2-12E-6F484C is useful when a board contains several fixed-function programmable-logic blocks that can be consolidated into one ECP2 implementation. Its 12,000 cells and 221 kbit of embedded memory support a combination of control, data transformation, buffering, and interface functions, while 297 I/O simplify external connections. Compared with a custom ASIC, a configurable FPGA permits design revisions without fabricating new masks and supports later fixes in the configuration data. Designers should still compare FPGA resource use, timing, power, and unit economics against discrete logic. A formal post-fit timing check and pin-aware design-rule verification are essential before release.
추천
추천 제품 요약
엔지니어링 참조 데이터: LFE2-12E-6F484C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | LFE2-12E-6FN484C | LFE2-12E-7F484C | LFE2-12E-5F484C | LFE2-12SE-6F484C | LFE2-12SE-5FN484C |
|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Logic Cells | 12,000 cells | 12,000 cells | 12,000 cells | 12,000 cells | 12,000 cells | 12,000 cells |
| Adaptive Logic Modules | 6,000 ALMs | 6,000 ALMs | 6,000 ALMs | 6,000 ALMs | 6,000 ALMs | 6,000 ALMs |
| Embedded Memory | 221 kbit | 221 kbit | 221 kbit | 221 kbit | 221 kbit | 221 kbit |
| Number of I/O | 297 I/O | 297 I/O | 297 I/O | 297 I/O | 297 I/O | 297 I/O |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -6 | -6 | -7 | -5 | -6 | -5 |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Price Tier | Request for quote | Request for quote | Request for quote | Request for quote | Request for quote | Request for quote |
주요 차별점
- Balanced logic and interface capacity (vs LFE2-12E-5F484C)
- Pin-compatible configuration of a faster ECP2 grade (vs LFE2-12E-7F484C)
- Closely matched ECP2 resource configuration (vs LFE2-12E-6FN484C)
- High I/O count for parallel embedded designs (vs LFE2-12SE-5FN484C)
설계 노트
The confirmed 1.2 V core requirement should be implemented as a dedicated, low-noise rail with local bypass capacitors placed close to the device power balls. Do not infer the allowable I/O supply range, current limits, or power-sequencing requirements from the core voltage alone; obtain those values from the official ECP2 documentation. Because this 484-pin device has many supply connections, use the manufacturer’s power-plane and ball-assignment guidance to avoid current imbalance between power and ground balls.
A 484-ball FPGA requires deliberate escape routing, and the supplied data does not provide the official ball map or ball-pitch details. Before committing to a PCB stack-up, verify the exact package drawing, pinout, and recommended via-in-pad or fanout geometry. Preserve the distinction between the distributor description “484-BBGA” and the Arrow description “FPBGA-484”; obtain the manufacturer package drawing rather than combining those descriptions into an unverified footprint.
The supplied data does not provide operating temperature, junction temperature, thermal resistance, or FPGA power dissipation. Those values are essential for calculating the temperature rise of a 484-ball device and for deciding whether copper spreading or additional thermal features are required. Engineers should calculate dissipation from the actual design utilization, core voltage, I/O activity, and auxiliary rails, then compare the resulting junction estimate with the manufacturer’s thermal limits.
Do not approve a substitution based only on the visible “12,000 cells” and “297 I/O” fields. LFE2 order codes can encode speed grade, package, temperature class, and other characteristics, and the supplied cross-reference evidence uses both BBGA and FPBGA descriptions. Compare the complete manufacturer ordering guide, timing tables, configuration requirements, and absolute-maximum ratings. This is especially important when replacing the -6 grade with the -5 or -7 variants.
규정 준수 정보
The supplied cross-reference snippet mentions RoHS, but it does not provide an explicit compliance declaration for the target MPN. No verified REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statement was supplied.
