XC7A50T-2FG484I - 52,160-L Logic Artix-7 FPGA | AMD
부품 번호: XC7A50T-2FG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $250 | $250.00 |
| 10 | $225 | $2,250.00 |
| 100 | $195 | $19,500.00 |
| 500 | $170 | $85,000.00 |
| 1,000 | $150 | $150,000.00 |
XC7A50T-2FG484I 개요
A field-programmable gate array is a programmable-logic semiconductor: configurable logic blocks, digital signal processing resources, block RAM, and programmable I/O are combined on one integrated circuit. An FPGA sits within the broader semiconductor and programmable-logic hierarchy, allowing parallel hardware functions to be implemented and revised without changing the PCB. This makes the Artix-7 family suitable for control, signal processing, communications, and embedded systems where parallel throughput and reconfigurability matter.
The XC7A50T-2FG484I combines 52,160 logic elements with 2.64 Mbit embedded memory in the supplied comparison data. Its 484-pin FBGA package provides extensive board connectivity for high-speed interfaces and external memory. The “-2” speed designation and “I” temperature suffix are family ordering codes, but the verified excerpt does not provide complete timing, temperature, or power values; those parameters should be checked in the AMD datasheet before design release.
The device is appropriate for industrial automation, robotics, embedded control, communications, instrumentation, and signal-processing designs. Its large I/O count is useful when a design combines multiple parallel buses, high-speed transceivers, DDR memory, clocks, and management signals. Compared with smaller FPGAs, the XC7A50T provides more parallel resources, but its 484-BBGA package requires careful PCB escape routing, thermal planning, and manufacturing control.
A key design consideration is package complexity: the dense FBGA footprint demands via-in-pad or via-under-bump considerations, precise ball assignment, and validated manufacturing rules. Power, decoupling, clocking, configuration, and high-speed signal-integrity requirements also depend on the selected board stack-up and the exact I/O standards enabled.
This page consolidates verified distributor specifications, package information, source links, and engineering-oriented selection guidance. It distinguishes confirmed values from parameters that require the manufacturer datasheet, avoiding invented electrical or lifecycle claims.
드롭인 대체품: XC7A50T-2FG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7A50T-2FG484I (동일 폼 팩터 및 풋프린트) — 차이점: Block RAM, Configuration, Package, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7A50T-2FGG484I
✅ 드롭인✓ 재고 있음
$27.5 / 개
데이터시트 보기 →XC7A50T-1FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A50T-2FGG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A50T-2FGG484I
✅ 드롭인✓ 재고 있음
$27.5 / 개
데이터시트 보기 →XC7A50T-1FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A50T-2FG484I 최대 정격 & 전기적 특성
| FPGA Family | Artix-7 |
| Logic Elements | 52,160 logic elements |
| Adaptive Logic Modules | 8,150 ALM |
| Embedded Memory | 2.64 Mbit |
| I/O Count | 250 I/O |
| 패키지 | 484-pin FBGA |
| 실장 유형 | Surface mount |
| Process Technology | 28 nm CMOS |
| 공급 전압 | 1 V |
| Series | XC7A50 |
| Product Type | Field-programmable gate array (FPGA) |
| Configuration | Configurable programmable logic device |
| Temperature Suffix | I |
| Speed Suffix | 2 |
| RoHS 상태 | Compliant |
| Block RAM | 2.64 Mbit total embedded memory |
XC7A50T-2FG484I 484-pin fbga 핀 구성 가이드
XC7A50T-2FG484I(484-pin fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC7A50T-2FG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC7A50T-2FG484I 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Robotics and Motor Control, Communications and Protocol Conversion, Embedded Signal Processing, Data Acquisition and Instrumentation, Secure Embedded Systems.
Industrial Automation Controller
The XC7A50T-2FG484I fits industrial automation controllers that combine parallel machine-control logic, sensor conditioning, communications, and local storage. Its 52,160 logic elements and 8,150 ALMs provide substantial programmable capacity, while 250 I/O support multiple buses, discrete inputs, outputs, counters, and interface signals. The 484-pin FBGA also leaves room for external memory and high-speed control peripherals when they are required. In a factory controller, the FPGA could implement timing-critical sequencing, encoder capture, interlocks, and protocol conversion. Before release, verify the I voltage, temperature grade, clocking scheme, EMC constraints, and long-term supply using AMD documentation.
추천
Robotics and Motor Control
The Artix-7 FPGA is well suited to robotic control because parallel programmable logic can coordinate motion profiles, encoder feedback, sensor fusion, and safety interlocks. The 52,160 logic-element device can host multiple control channels and timing-critical state machines, while its 250 I/O count supports encoder, pulse-width, analog-control, communications, and discrete signaling paths. The 2.64 Mbit embedded memory can hold trajectory, calibration, or diagnostic data, although memory bandwidth and resource mapping must be checked against the AMD device data. For motor systems, place power conversion and isolation outside the FPGA domain and validate grounding, isolation, timing, and thermal performance in the complete system.
추천
Communications and Protocol Conversion
The XC7A50T-2FG484I can be used in communications equipment where parallel FPGA logic improves throughput and makes protocol handling flexible. The available 250 I/O and 2.64 Mbit embedded memory can support packet buffers, parallel-to-serial conversion, framing logic, and multiple interface domains. Its 52,160 logic elements also allow substantial concurrent datapath implementation compared with a small microcontroller. Designers should allocate pins according to the device’s supported I/O standards, review AC timing for the selected speed grade, and implement clocking and equalization according to the AMD board-design guidance. The part’s role in a communications product does not itself establish protocol certification or compliance.
추천
Embedded Signal Processing
The Artix-7 device is suitable for embedded signal-processing functions that benefit from deterministic parallel execution, such as filtering, modulation, data reduction, or interface pre-processing. Its 52,160 logic elements provide substantial combinational and sequential capacity, while the embedded memory total of 2.64 Mbit can support buffering and coefficient storage where the required architecture permits. The 484-pin package exposes many I/O for ADC, DAC, digital sensor, and memory connections. Actual throughput depends on DSP resources, memory interfaces, clock frequency, and I/O timing values that are not included in the supplied excerpts. Engineers should obtain the device resource tables and timing data before committing to throughput targets.
추천
Data Acquisition and Instrumentation
The XC7A50T-2FG484I can serve as the digital control core in a data-acquisition or instrumentation system that must gather multiple channels and perform deterministic processing. The 250 I/O count can accommodate parallel sensor interfaces, trigger signals, clock distribution, status indicators, and communications ports. The 2.64 Mbit embedded memory can assist with sample buffering, while the programmable logic can implement filtering, calibration tables, timing control, and protocol conversion. For laboratory or test equipment, supply rails must be quiet and stable, clocks must be carefully routed, and the 484-BBGA assembly process must be qualified. Confirm analog, isolation, and safety requirements separately from the FPGA specification.
추천
Secure Embedded Systems
The XC7A50T-2FG484I is suitable as the programmable control fabric in an embedded system requiring hardware-assisted logic, protocol handling, or secure I/O partitioning. A 52,160-logic-element FPGA can implement multiple control paths in parallel, and the 250 I/O count provides flexibility for sensors, memory, communications, and external accelerators. FPGA configuration security and system-level authentication still require appropriate design measures; those protections are not established by the supplied distributor excerpts. Use a reproducible configuration process, protect the configuration interface, validate boot behavior, and review the device’s security capabilities in the official AMD documentation before treating it as a secure component.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7A50T-2FG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7A50T-2FGG484I | XC7A50T-1FGG484I | XC7A50T-2FGG484C | XC7A50T-2FGG484I | XC7A50T-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Process Technology | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS |
| Supply Voltage | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| Temperature Grade | I suffix; exact range not supplied | I suffix; exact range not supplied | I suffix; exact range not supplied | C suffix; exact range not supplied | I suffix; exact range not supplied | I suffix; exact range not supplied |
| Speed Grade | 2 | 2 | 1 | 2 | 2 | 1 |
주요 차별점
- High logic density in the same Artix-7 family (vs XC7A50T-2FGG484I)
- Same 484-pin package family (vs XC7A50T-1FGG484I)
- Industrial-oriented I suffix (vs XC7A50T-2FGG484C)
- Parallel programmable-logic capacity (vs XC7A50T-1FGG484I)
설계 노트
The 484-pin FBGA package requires a controlled escape-routing strategy. Use the AMD Artix-7 package pinout files and the selected board stack-up as the source of truth for every ball assignment. Check whether the assembly process uses via-in-pad, via-under-bump, or another interconnect method, and validate solder-mask, paste, and land-pattern rules with the package drawing and assembler capability.
Plan the power tree around the device’s 1 V supply description and the specific I/O rails required by the selected interfaces. Separate core and I/O noise paths, place bulk and high-frequency decoupling near the relevant power balls, and verify steady-state and transient current against the AMD power-estimation tools. Do not infer allowable I/O voltage levels from the distributor excerpts; use the device pinout and electrical tables for each bank.
Use the 52,160 logic elements and 250 I/O only after assigning interfaces according to supported standards and bank constraints. For memory, clocks, serial links, or parallel buses, use controlled-impedance routing, return paths, source-synchronous layout rules, and the AMD timing constraints. The large I/O count does not mean every ball is freely usable; configuration, clocks, power, and dedicated functions must be reserved first.
Thermal design should begin with the actual utilization of programmable logic, I/O activity, clocking, and attached memory. A 484-BBGA package can be thermally challenging in compact systems because heat must leave the device through the board and its copper structure. Use the manufacturer thermal models and power reports, maintain a qualified solder-joint and via pattern, and verify temperature rise in the assembled mechanical design rather than relying only on component specifications.
규정 준수 정보
The supplied distributor result states RoHS Compliant. REACH, lead-free, halogen-free, conflict-minerals, and automotive qualification information are not provided. The I suffix is an ordering designation, but the supplied data does not state the exact operating-temperature range.
