LFE2-20E-5F672C - 21K LUT ECP2 FPGA | Lattice Semiconductor
부품 번호: LFE2-20E-5F672C ✓ 활성LFE2-20E-5F672C 개요
An FPGA is a programmable semiconductor whose internal lookup tables, registers, memory blocks, and programmable I/O can be configured after manufacture. Within the product hierarchy, this device belongs to the ECP2 FPGA family, a low-power programmable-logic platform that can implement control logic, parallel data paths, communications interfaces, and DSP-assisted functions. The LFE2-20E-5F672C combines approximately 21K LUTs with 402 I/Os, providing high connectivity for modules and systems with many external buses, sensors, converters, and display links.
The most prominent specifications are 21K LUTs, 402 I/Os, and a 1.2 V operating supply. These headline figures distinguish it from smaller ECP2 devices that offer fewer logic cells and I/O resources. The -5 suffix identifies the performance grade, while 672C denotes the large ball-grid-array package used for this ordering option. The package provides substantial interconnect capacity but requires careful ball assignment, escape routing, and multilayer-PCB planning.
ECP2 devices support programmable logic architecture in which multiple parallel data channels can be routed through LUTs, flip-flops, block RAM, multipliers, and DSP resources. The large I/O count is particularly valuable for designs that must adapt to several external bus widths or aggregate many sensor inputs. Because FPGA timing depends on the selected clocking, I/O standards, routing, and design implementation, system performance should be evaluated with the Lattice Semiconductor development tools and timing constraints used for the production design.
Typical applications include industrial control and automation, test and measurement, communications equipment, video and image processing, embedded instrumentation, and high-speed interface consolidation. The device is also appropriate for prototype platforms and production systems that need configurable logic, substantial I/O, and deterministic parallel processing without the development cycle of a custom ASIC. A lower-pin-count ECP2 device may be preferable when only a small number of external connections is required.
PCB implementation should reserve the FPGA power rails as a dedicated power-management structure, follow the manufacturer’s ball-assignment and decoupling guidance, and route high-speed interfaces with controlled impedance. Designers should also verify the selected I/O standard against the board connector and external clock source before committing the pinout.
This product page combines the exact ECP2 ordering information with practical guidance for pin planning, performance grading, interface selection, and family alternatives. It helps engineers determine whether the 21K-LUT device, 402-I/O density, -5 grade, and 672-BBGA footprint match the mechanical and functional requirements of a new programmable-logic design.
드롭인 대체품: LFE2-20E-5F672C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: LFE2-20E-5F672C (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Package, Package Type, Process Technology, Speed Grade.
LFE2-20E-6F672C
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →LFE2-20E-7F672C
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →LFE2-20E-8F672C
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
LFE2-20E-5FN672C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-20SE-7F672C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-20E-5F672C 최대 정격 & 전기적 특성
| Device Type | ECP2 Field-Programmable Gate Array (FPGA) |
| Logic Capacity | 21K LUTs |
| I/O Count | 402 I/Os |
| DSP Capability | DSP |
| 공급 전압 | 1.2 V |
| Speed Grade | -5 |
| 패키지 | 672-BBGA |
| 실장 유형 | Surface Mount |
LFE2-20E-5F672C 672-bbga 핀 구성 가이드
LFE2-20E-5F672C(672-bbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: LFE2-20E-5F672C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
LFE2-20E-5F672C 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Test and Measurement Instrumentation, Communications Interface Consolidation, Embedded Signal Processing, Video and Image Processing, Aerospace Ground-Support Equipment.
Industrial Automation and Control
The LFE2-20E-5F672C fits centralized industrial controllers that combine sequencing logic with many sensor, actuator, encoder, and communications connections. Its 21K LUTs can implement control state machines and parallel processing logic, while 402 I/Os provide substantially more board-level connectivity than a small ECP2 device. A practical implementation places acquisition and control logic in parallel channels, then uses dedicated clocking and I/O resources for deterministic operation. The 672-BBGA package is appropriate when the product is built on a dense multilayer PCB, but its fine-pitch footprint requires careful ball assignment, escape routing, and assembly planning.
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Test and Measurement Instrumentation
High-channel-count instrumentation can use the LFE2-20E-5F672C to coordinate parallel converters, trigger logic, pattern generation, and data capture. Its 21K LUTs support control sequences and timing state machines, while 402 I/Os provide enough external connections for multiple data buses and control signals. The DSP capability is useful for suitable arithmetic operations, although maximum data rate must be established through device timing analysis and board-level signal-integrity work. A dense instrument board benefits from a multilayer PCB with short power connections, carefully controlled impedance, and separate clock and data routing.
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Communications Interface Consolidation
The LFE2-20E-5F672C is suitable for communications equipment that must translate or consolidate several narrow and wide interfaces while adding protocol control logic. Its 21K LUTs can support parallel datapaths and protocol state machines, and its 402 I/Os allow multiple channels to coexist without a large pin count for every function. Designers should assign pins according to bank and voltage constraints, then confirm the supported I/O standards for each external standard. The 672-BBGA package offers high connectivity, although high-speed routing, clock jitter, return paths, and layer transitions become more demanding as interface density increases.
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Embedded Signal Processing
The LFE2-20E-5F672C can implement parallel filtering, data alignment, and sampling pipelines because it combines 21K LUTs with dedicated DSP capability. Its 402 I/Os are useful when multiple converters or sensor channels must feed the processing fabric concurrently. A practical design should use the manufacturer-supported DSP resources for arithmetic-heavy stages and preserve timing margin through pipelining and constraint-based analysis. External memory interface and clock requirements must be confirmed in the exact ECP2 datasheet. The large BGA package also requires deliberate thermal planning because sustained switching activity in a dense system can raise junction temperature.
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Video and Image Processing
Multi-stage image pipelines can use the LFE2-20E-5F672C for pixel alignment, timing generation, interface adaptation, and control logic. The 21K LUTs provide capacity for parallel datapaths, while 402 I/Os can connect image sensors, memory devices, and downstream processors. DSP resources may support selected arithmetic stages, but sustained video throughput must be verified against published internal and I/O timing limits. The 672-BBGA footprint makes the device appropriate for a dense, multilayer video-processing board where careful power distribution and controlled-impedance routing are already part of the board architecture.
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Aerospace Ground-Support Equipment
The LFE2-20E-5F672C can serve as the programmable controller in aerospace ground-support equipment where multiple sensors, relays, displays, and communications links require coordinated operation. Its 21K LUTs support sequencing and fault-handling logic, while 402 I/Os accommodate extensive external connectivity. For flight hardware, the standard ordering option must not be assumed to satisfy aerospace qualification requirements; confirm the appropriate Lattice Semiconductor ordering option, temperature grade, screening, and compliance documentation. On ground equipment, the dense 672-BBGA package is practical when the PCB assembly process supports fine-pitch BGA inspection and rework.
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추천 제품 요약
엔지니어링 참조 데이터: LFE2-20E-5F672C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | LFE2-20E-6F672C | LFE2-20E-7F672C | LFE2-20E-8F672C | LFE2-20E-5FN672C | LFE2-20SE-7F672C |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 672-BBGA | 672-BBGA | 672-BBGA | 672-BBGA | 672-BBGA | 672-BBGA |
| FPGA Family | ECP2 | ECP2 | ECP2 | ECP2 | ECP2 | ECP2 |
| Speed Grade | -5 | -6 | -7 | -8 | -5 | -7 |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- Combines a 21K-LUT ECP2 device with 402 I/Os in one 672-BBGA package (vs LFE2-12E-5Q208C)
- Uses the -5 ECP2 performance grade (vs LFE2-20E-7F672C)
- Combines 21K LUTs, DSP capability, and high I/O density (vs LFE2-20E-5FN672C)
설계 노트
Treat the 672-BBGA footprint as a manufacturer-qualified layout constraint rather than a generic BGA. Use the exact package drawing and land pattern, verify ball-pitch and ball-size values, and provide escape-routing vias without violating assembly design rules. Keep configuration, clock, and high-speed interface escape paths short, and place the power-and-ground structure so that each supply ball has a low-impedance path to its nearest decoupling capacitor.
Plan the core and I/O supplies as a coordinated power tree. The LFE2-20E-5F672C operates from a 1.2 V core supply, while external interface standards may require other I/O voltages. Decouple each supply domain according to the manufacturer reference layout, keep high-current paths independent from sensitive clock distribution, and validate startup sequencing if multiple rails are controlled. Check voltage tolerances and sequencing requirements against the exact datasheet before component selection.
Use the manufacturer-defined clock inputs and I/O standards for high-speed interfaces. Constrain all external timing paths, apply differential-pair geometry where required, and keep return paths continuous across package and PCB transitions. The 402-I/O count can encourage dense routing, so avoid sharing unsuitable planes or vias between clock, configuration, and high-speed data nets. Validate timing and signal integrity with the actual layer stack and component placement.
Estimate activity-dependent dissipation before selecting the system cooling strategy. The 1.2 V operating voltage simplifies core-power calculations, but utilization, I/O activity, and speed grade determine actual power. Estimated: core power equals 1.2 V multiplied by the design’s average core current, while total board heating must also include I/O and external-device losses. Use the resulting margin to decide whether copper planes, forced airflow, or a heat-spreading structure is needed.
규정 준수 정보
The exact LFE2-20E-5F672C compliance statements were not identified. Confirm RoHS, REACH, halogen-free, lead-free, conflict-minerals, and automotive qualification status for the exact ordering option with the manufacturer before procurement.