LFE2-20E-6F672C - 21K LUT ECP2 FPGA, 402 I/O, 672-BBGA | Lattice
부품 번호: LFE2-20E-6F672C ✓ 활성LFE2-20E-6F672C 개요
An FPGA is a programmable logic device: instead of a fixed circuit, the chip contains a matrix of look-up tables (LUTs), programmable interconnect and dedicated hard blocks that engineers configure at runtime to implement any digital function from a single register-transfer level (RTL) design. FPGAs sit in the hierarchy of programmable logic devices, above simple programmable logic arrays (PLAs) and complex PLAs (CPLDs), and are widely used where a design must change without a silicon respin. The ECP2 family targets cost-sensitive, mid-complexity designs needing logic, moderate DSP capability and generous I/O.
Key characteristics of this device include 21,000 logic cells for general combinational and sequential logic, 402 user I/O for external bus and peripheral connectivity, integrated DSP multiplier blocks for arithmetic-heavy pipelines, and single 1.2 V core operation with separate I/O supply domains. The 672-ball package gives one of the highest I/O counts in the ECP2 range, which allows dense parallel buses, multiple high-speed memory interfaces and video or network data paths to be realized without an external glue layer of discrete logic.
Technically, the ECP2 architecture uses a LUT-based logic fabric with a programmable switch matrix, dedicated block RAM for on-chip storage, and DSP blocks for multiply-accumulate operations. The fabric is configured from SRAM and the device is re-programmable in-circuit, so field upgrades are possible. Because the die is built on 90 nm CMOS, the core voltage of 1.2 V balances leakage and switching performance against static power draw in industrial control, communications and embedded industrial-control products.
Typical applications include industrial control and factory automation panels, networked sensor and gateway equipment, video and image capture pipelines, interface consolidation for serial links, and general embedded control logic that benefits from a high pin count. The 357 MHz speed grade makes it appropriate for designs combining parallel bus logic with a moderate-speed control processor.
When laying out a board, treat the FBGA as a fine-pitch ball-grid array with several power and ground balls distributed through the array rather than only at the perimeter. Follow the manufacturer's recommended decoupling and ball-assignment guidance exactly, and confirm the specific I/O standard and voltage banking for every external interface before routing.
This page consolidates manufacturer device data, package and pin-count details, drop-in alternatives from the same ECP2 family, and practical design notes that are not gathered together in the factory datasheet itself, helping engineers qualify or replace the device quickly.
드롭인 대체품: LFE2-20E-6F672C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: LFE2-20E-6F672C (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Package Type, Mounting Type, Package, Speed Grade.
LFE2-20E-6FN672C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-20SE-7F672C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-20SE-5FN672I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-20E-5F672C
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →LFE2-20E-6F672I
✅ 드롭인 ⚠️ 사양 미검증가격 문의
LFE2-20E-6F672C 최대 정격 & 전기적 특성
| Device Type | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Cells | 21,000 cells |
| Look-Up Tables (LUT) | 21K LUTs |
| User I/O Count | 402 I/O |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -6 |
| Maximum System Frequency | 357 MHz |
| Process Technology | 90 nm CMOS |
| Package Type | FBGA-672 (BBGA-672) surface-mount ball grid array |
| Package Body Size | 27 x 27 mm |
| Number of Terminals | 672 balls |
| Package Shape | Square |
| Terminal / Ball Form | Ball |
| Shipping Form | Tray |
| Lead-Free Status | Lead free |
| 실장 유형 | Surface Mount |
LFE2-20E-6F672C square 핀 구성 가이드
LFE2-20E-6F672C(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: LFE2-20E-6F672C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
LFE2-20E-6F672C 적합 용도: 6 애플리케이션s: Industrial Control and Factory Automation, Networked Sensor and Edge Gateway Equipment, Video and Image Capture Pipelines, Interface Consolidation and Protocol Bridging, Aerospace, Defence and High-Reliability Systems, Test, Measurement and Instrumentation.
Industrial Control and Factory Automation
The LFE2-20E-6F672C suits machine controllers and I/O-dense automation nodes because it presents 402 user I/O, enough to land several field buses, encoder inputs and discrete output banks directly on the FPGA while a supervisory processor handles motion profiles. At a 357 MHz maximum system frequency the fabric can host protocol engines, safety interlocks and timing-critical state machines without offloading to external logic. The 1.2 V core draws little power for a 21,000-cell device, which matters in sealed cabinets where convection cooling is limited, and the 27 x 27 mm FBGA-672 footprint keeps the controller board compact. Designers normally instantiate a soft processor core for supervisory logic and use the remaining fabric for parallel I/O handling, giving deterministic response with no external CPLD. The same-footprint industrial-grade ordering code in this family is used when the enclosure must survive extended temperature swings on the factory floor.
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Networked Sensor and Edge Gateway Equipment
Edge gateways that aggregate many sensor lines benefit from the LFE2-20E-6F672C's combination of 402 I/O and 21,000 logic cells: raw sensor streams can be framed, filtered and time-stamped in parallel logic before being handed to a network processor. The large I/O count allows multiple QSPI/parallel flash and DDR memory interfaces to be implemented in the FPGA itself, which shortens the data path between acquisition and packetisation. At 357 MHz, the fabric can absorb packet framing, CRC generation and filtering for several ports simultaneously, offloading the host processor. The 1.2 V core supply means the logic core can be generated on an efficient intermediate rail with separate I/O voltages for 1.8 V and 2.5 V peripherals, keeping the design within common single-board industrial temperature envelopes while the -6 speed grade leaves headroom above the traffic rate of typical industrial Ethernet or serial sensor links.
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Video and Image Capture Pipelines
Video acquisition boards commonly need wide parallel pixel buses, and the LFE2-20E-6F672C can absorb a multi-channel parallel sensor interface plus colour-space conversion and de-noise stages in one device. Its 402 user I/O are enough to land several 10-bit or 12-bit parallel sensor ports alongside a control bus, while the integrated DSP multiplier blocks handle the multiply-accumulate stages typical of filtering pipelines. Operating up to 357 MHz, the fabric can sustain continuous pixel throughput for multiple megapixel streams without an external frame buffer controller, leaving only the final compressed stream to the host processor. Because the device is SRAM-configurable, field reconfiguration allows different sensor formats to be supported from the same board. Designers typically pair it with dedicated video serialiser/deserialiser devices and an image-processing DSP, with the FPGA handling the deterministic timing and lane-alignment work.
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Interface Consolidation and Protocol Bridging
Legacy product lines often accumulate mismatched serial and parallel interfaces that are awkward to route to a single host processor. The LFE2-20E-6F672C acts as a consolidation engine: with 402 I/O it can host several legacy parallel buses alongside modern serial links, and with 21,000 logic cells it can implement protocol converters, FIFOs and arbitration logic simultaneously. The 357 MHz -6 speed grade is comfortable for UART, SPI, I2C, parallel-to-serial bridging and DMA-style data movement, all of which are far slower than the fabric capability. Because ECP2 devices are re-programmable, one board can serve multiple product variants by changing the bitstream rather than the hardware. Typical implementations pair the FPGA with transceivers such as RS-485 and multi-channel UART parts, keeping the host processor free for application-level work while the FPGA handles deterministic, latency-sensitive traffic.
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Aerospace, Defence and High-Reliability Systems
Programmable logic is attractive in aerospace and defence electronics because mission-specific bitstreams can be updated in the field while keeping a single qualified device platform. The ECP2 architecture behind the LFE2-20E-6F672C gives 21,000 logic cells and 402 I/O in a single 27 x 27 mm FBGA, allowing redundant signal paths, monitoring logic and interface adaptation to be built into one part. The -6 speed grade supports 357 MHz operation for telemetry framing, data scrubbing and bus arbitration functions. Because the 672-ball package concentrates a large number of power and ground connections through the array, designers can create low-impedance supply distribution for single-event and transient resilience work. Industrial-temperature ordering options within the same family are typically selected for extended-temperature installations, while the FPGA handles housekeeping logic and the adjacent processor handles the mission-critical application software.
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Test, Measurement and Instrumentation
Instrumentation products need flexible, high-pin-count logic to manage front-panel connectors, acquisition channels and calibration paths. The LFE2-20E-6F672C fits the role because 402 I/O allows dense analog and digital front-end wiring to reach the FPGA directly, while 21,000 logic cells can host sequencers, timing generators and instrument-control state machines running alongside a measurement microcontroller. At 357 MHz, digital pattern generation and capture functions have ample headroom for multi-channel multiplexing. The 1.2 V core allows the logic to run from a clean low-noise rail, which helps preserve measurement accuracy in sensitive analog sections. Because the bitstream is reconfigurable, a single instrument platform can support different measurement modes and interface standards, and the same family includes temperature grades suited to laboratory and industrial instrument enclosures.
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추천 제품 요약
엔지니어링 참조 데이터: LFE2-20E-6F672C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | LFE2-20E-6FN672C | LFE2-20SE-7F672C | LFE2-20SE-5FN672I | LFE2-20E-5F672C | LFE2-20E-6F672I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | FBGA-672 (BBGA-672) | FBGA-672 (BBGA-672) - same | FBGA-672 (BBGA-672) - same | FBGA-672 (BBGA-672) - same | FBGA-672 (BBGA-672) - same | FBGA-672 (BBGA-672) - same |
| Logic Cells | 21,000 cells (21K LUTs) | 21,000 cells (21K LUTs) | 21,000 cells (21K LUTs) | 21,000 cells (21K LUTs) | 21,000 cells (21K LUTs) | 21,000 cells (21K LUTs) |
| User I/O | 402 I/O | 402 I/O | 402 I/O | 402 I/O | 402 I/O | 402 I/O |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -6 | -6 | -7 (faster) | -5 (slower) | -5 (slower) | -6 |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Package Body Size | 27 x 27 mm | 27 x 27 mm | 27 x 27 mm | 27 x 27 mm | 27 x 27 mm | 27 x 27 mm |
주요 차별점
- Highest I/O density in the ECP2 672-ball option (vs LFE2-12E-5F484I)
- Industry-standard -6 speed grade with 357 MHz system clock (vs LFE2-20SE-5FN672I)
- Direct industrial-grade upgrade path with identical pinout (vs LFE2-20E-6F672C)
- Cost-optimised grade for designs that do not need -6 timing (vs LFE2-20E-6F672C)
설계 노트
A 672-ball FBGA at 27 x 27 mm is a fine-pitch BGA and its layout is governed by the package drawing, not by generic BGA rules. Take the ball-pitch, solder-mask-defined and via-fanout geometry directly from the Lattice package drawing and replicate the recommended via-in-pad or dog-bone pattern. Because the ECP2 device presents 402 user I/O, plan layer count and length matching early: high-speed pairs should be routed on an inner layer with continuous reference planes, and the routing escape from the ball field is the point where most signal-integrity problems on this package originate.
The 1.2 V core supply must be delivered with low impedance and local decoupling at every supply ball pair rather than through a single point of entry. Split the core rail and the I/O bank rails so that switching current on an I/O bank does not couple into the core, and place bulk and ceramic decoupling close to the array on the same layer as the ball field. Validate the delivered rail at the ball with an oscilloscope under worst-case toggle activity, because an FBGA of this size concentrates a large number of simultaneously switching I/O into a 27 x 27 mm area.
Estimated: with a 21,000-cell device running at high utilisation, the switching activity inside a 27 x 27 mm FBGA creates a concentrated heat source that must spread through the package bottom and board stack-up. Provide a full copper pour under the device with a thermal-relief pattern matching the package drawing, bond the board to a heat sink or chassis where the enclosure allows, and verify junction temperature with a thermal camera at worst-case ambient. Fanning out a dense power plane without adequate copper under the array is the most common cause of unexpected temperature rise on this class of package.
Two substitution mistakes are common with this ordering code. First, the 'N' and 'I' suffix characters change the temperature grade and must be matched to the enclosure requirement rather than swapped blindly, even though the pinout is identical. Second, speed grade changes (-5, -6, -7) do not change the footprint but do change achievable timing, so a design that closed timing on the -6 grade may fail on a -5 grade while a -7 grade is a safe upgrade. Always re-run static timing analysis when changing the ordering code, and keep the bitstream version matched to the exact device fitted.
With 402 user I/O available, resist the temptation to use every ball. Leaving a spread of unused balls free for future expansion simplifies respins and often provides cleaner escape routing for high-speed groups. Group high-speed or differential pairs contiguously along one edge of the ball field so that clock and data lanes reach the fabric with matched, short transitions, and keep any configuration or clock-management pins that the design depends on away from noisy switch-node-adjacent balls.
규정 준수 정보
The device is described as lead free in the manufacturer comparison data. RoHS, REACH, halogen-free and conflict-minerals declarations are not stated for this ordering code in the available documentation and should be confirmed with the manufacturer before a regulated shipment.
