LFE2-6E-6TN144I - 6K LUT ECP2 FPGA | Lattice
부품 번호: LFE2-6E-6TN144I ✓ 활성LFE2-6E-6TN144I 개요
An FPGA is a programmable-logic semiconductor whose digital function is defined by loading a configuration bitstream into on-chip memory. Within the semiconductor hierarchy, the LFE2-6E-6TN144I belongs to the ECP2 family of field-programmable gate arrays, placing it below programmable logic devices and above fixed-function logic integrated circuits. This distinction allows one PCB design to support firmware-driven changes in timing, interfaces, control algorithms, or system behavior without replacing the physical device.
The device provides 6,000 logic cells and 90 user I/O in a surface-mount 144-pin LQFP package measuring 20 mm by 20 mm. A 1.2 V core operating voltage supports low-power logic implementation, and the -6 speed grade targets designs requiring more timing margin than slower ECP2 grades. The 90 I/O count is particularly useful for parallel control, data acquisition, industrial interfaces, and board-level integration where a programmable device must directly connect to multiple external signals.
The ECP2 architecture provides programmable logic together with dedicated block RAM and DSP resources, allowing designers to implement control logic, counters, state machines, data pipelines, signal conditioning, and fixed-point processing in one device. The manufacturer classifies the part in the ECP2 family and identifies 6,000 cells, a 144-LQFP package, 90 I/O, and a 90 nm process node. This combination provides a practical platform for moderately complex digital systems where a small microcontroller is insufficient or an application-specific ASIC would not justify the development cost.
Typical uses include industrial automation controllers, sensor and measurement interfaces, communication equipment, embedded data acquisition, motor and machine-control logic, and general-purpose digital signal conditioning. Its 90 I/O can simplify board partitioning when multiple buses, discrete inputs, and outputs must be consolidated. The 20 mm by 20 mm LQFP also remains practical for conventional multilayer PCB assembly methods rather than requiring fine-pitch BGA assembly.
Designers should confirm the exact pin assignments, supported I/O standards, configuration requirements, clocking resources, and recommended power and decoupling networks against the manufacturer ECP2 documentation before layout release. Pay particular attention to the -6 speed designation, 1.2 V core supply, industrial-temperature ordering code, and package pinout. Configuration storage, JTAG access, programming voltage, and unused-pin treatment must also be validated for the selected board architecture.
This product page combines the exact ECP2 ordering information with practical selection guidance, alternative cross-references, parameter comparisons, and design-oriented implementation notes. These resources help engineers identify whether the LFE2-6E-6TN144I fits the required logic density, I/O count, package, speed grade, and environment before beginning a new programmable-logic design.
드롭인 대체품: LFE2-6E-6TN144I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: LFE2-6E-6TN144I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Device Type, Speed Grade, Process Technology, Temperature Grade.
LFE2-6E-6TN144C
✅ 드롭인가격 문의
데이터시트 보기 →LFE2-6E-5TN144I
✅ 드롭인가격 문의
데이터시트 보기 →LFE2-6E-6T144I
✅ 드롭인가격 문의
데이터시트 보기 →LFE2-6SE-6TN144I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE2-12E-6T144I
✅ 드롭인가격 문의
데이터시트 보기 →LFE2-6E-6TN144I 최대 정격 & 전기적 특성
| Device Type | ECP2 Field-Programmable Gate Array (FPGA) |
| Logic Cells | 6,000 cells |
| Equivalent LUT Capacity | 6,000 LUTs |
| User I/O Count | 90 I/O |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -6 |
| 최대 클록 주파수 | 357 MHz |
| Process Technology | 90 nm |
| 패키지 | 144-pin LQFP |
| Package Body Size | 20 mm x 20 mm |
| 실장 유형 | Surface mount |
| Shipping Package | Tray |
| Temperature Grade | Industrial temperature |
| Lead-Free Status | Lead free |
| DSP Resources | Present |
LFE2-6E-6TN144I tray 핀 구성 가이드
LFE2-6E-6TN144I(tray 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: LFE2-6E-6TN144I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
LFE2-6E-6TN144I 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Data Acquisition System, Communications Interface, Motor and Machine Control, Signal Conditioning and DSP, Embedded Test Equipment.
Industrial Automation Controller
The LFE2-6E-6TN144I suits machine-control logic that must combine many parallel sensor inputs, actuator outputs, and deterministic state machines in one device. Its 6,000 logic cells provide room for sequencing, interlocking, counters, communications, and diagnostic logic, while 90 I/O reduce the number of external interface components. The -6 speed grade supports designs requiring greater timing margin than the -5 grade, and the industrial-temperature suffix suits equipment expected to operate above commercial-temperature limits. Place the FPGA near protected I/O circuitry and route critical timing paths away from switching-node activity.
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Data Acquisition System
The LFE2-6E-6TN144I can implement parallel data capture, digital filtering, trigger control, and interface conversion in a compact instrument. With 6,000 configurable logic cells, it can coordinate multiple data paths without requiring a separate controller for every protocol function. The 90 I/O provide substantial board-level connectivity for sample buses, clocks, status signals, and communications, while the 144-pin LQFP supports conventional surface-mount assembly. Engineers should use the manufacturer timing tables to confirm acquisition-clock rates and should treat analog-to-digital conversion performance as a system-level specification rather than an FPGA characteristic.
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Communications Interface
The LFE2-6E-6TN144I is appropriate for custom communication bridges, protocol translators, test interfaces, and equipment that needs programmable framing or bit manipulation. Its 6,000 logic cells can implement parallel-to-serial conversion, packet filtering, clock-domain-related control, and command decoding, while 90 I/O offer enough connections for multiple buses and status lines. The -6 grade provides more timing headroom than the -5 option for demanding interfaces. Final design work must verify each supported I/O standard, voltage tolerance, clocking topology, and maximum interface rate in the ECP2 documentation.
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Motor and Machine Control
The LFE2-6E-6TN144I can implement motion sequencing, pulse generation, encoder decoding, fault handling, and safety interlocks in programmable logic. Its 90 I/O provide direct access to position sensors, stepper or motor-control signals, limit switches, and diagnostic outputs, while the 6,000 logic cells allow multiple control tasks to operate concurrently. The industrial-temperature ordering option is relevant to equipment with an elevated internal ambient temperature, but enclosure heating, conducted noise, and motor-transient protection remain external design requirements. Use differential routing and grounded return paths for sensitive encoder and control signals.
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Signal Conditioning and DSP
The LFE2-6E-6TN144I supports digital filtering, correlation, counting, waveform generation, and fixed-point signal-processing tasks through its ECP2 programmable logic and DSP resources. Six thousand logic cells allow multiple pipeline stages to coexist with control logic, and the -6 grade provides additional timing margin for pipelined implementations. The 144-pin LQFP package also exposes numerous I/O for parallel data input, coefficient loading, and synchronized test outputs. Designers should estimate DSP, block RAM, and routing requirements before committing to the 6,000-cell device, because adding arithmetic stages can consume resources even when the package has sufficient I/O.
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Embedded Test Equipment
The LFE2-6E-6TN144I can implement programmable stimulus generation, pattern sequencing, response capture, and communication for embedded test systems. Its 90 I/O allow parallel connection to devices under test, while 6,000 logic cells support timing tables, counters, and protocol engines that adapt through configuration. The -6 speed grade is useful when test timing margins must be preserved around device-under-test stimulus. Board design should separate test clocks from digital data returns, provide controlled I/O reference voltages, and account for the LQFP package's lead geometry when planning probe access.
추천
추천 제품 요약
엔지니어링 참조 데이터: LFE2-6E-6TN144I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | LFE2-6E-6TN144C | LFE2-6E-5TN144I | LFE2-6E-6T144I | LFE2-6SE-6TN144I | LFE2-12E-6T144I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 144-pin LQFP | 144-pin LQFP | 144-pin LQFP | 144-pin LQFP | 144-pin LQFP | 144-pin LQFP |
| Logic Cells | 6,000 cells | 6,000 cells | 6,000 cells | 6,000 cells | 6,000 cells | 12,000 cells |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -6 | -6 | -5 | -6 | -6 | -6 |
| Temperature Grade | Industrial temperature | Commercial temperature | Industrial temperature | Industrial temperature | Industrial temperature | Industrial temperature |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Package Body Size | 20 mm x 20 mm | 20 mm x 20 mm | 20 mm x 20 mm | 20 mm x 20 mm | 20 mm x 20 mm | 20 mm x 20 mm |
| Shipping Package | Tray | Tray | Tray | Tray | Tray | Tray |
주요 차별점
- Combines 6,000 logic cells with 90 I/O in one ECP2 device (vs LFE2-12E-6T144I)
- Uses the faster -6 performance designation (vs LFE2-6E-5TN144I)
- Targets industrial-temperature equipment (vs LFE2-6E-6TN144C)
- Uses a conventional 144-pin LQFP footprint (vs LFE2-6E-6T144I)
설계 노트
Use the TQFP-144 land pattern associated with the 20 mm by 20 mm LQFP package and route every configuration, clock, JTAG, power, and ground connection exactly as shown in the manufacturer pin table. Keep the FPGA footprint inside the board-placement outline so that both sides remain accessible for inspection and rework. Do not infer configuration or dual-purpose I/O behavior from package position alone because several ECP2 pins can have functions determined by device options.
Separate the 1.2 V core rail from the applicable I/O rails and follow the manufacturer power-supply topology, decoupling values, and sequencing requirements. Place the required bypass capacitors adjacent to their designated package pins, with short, low-inductance connections and a solid ground reference. Validate startup, configuration behavior, and supply tolerance against the ECP2 electrical tables before adding independent rail sequencing or voltage adjustment.
Assign clock-capable pins according to the ECP2 clocking rules and keep high-speed or externally clocked traces short and continuously referenced. Provide clean returns for JTAG, configuration, and optional differential interfaces, and avoid routing sensitive clocks beside switching power nodes or motor-control outputs. For multi-source or multiplexed I/O, verify the selected standards and supported data rates in the manufacturer documentation before committing to the PCB layer stack.
Do not treat a shared LQFP footprint as proof that every ECP2 ordering code is interchangeable. The LFE2-6E-6TN144C changes the temperature grade, the LFE2-6E-5TN144I changes the speed grade, and the 6SE and omitted-N ordering forms require confirmation of configuration-related options. Before substitution, compare the exact ordering table, pin description, configuration bitstream support, timing grade, and environmental requirements.
규정 준수 정보
The product is identified as lead free. RoHS, REACH, halogen-free, and conflict-minerals status require confirmation from the manufacturer product documentation.
