LPC18S50FET180E - 180MHz Cortex-M3 MCU | NXP
부품 번호: LPC18S50FET180E ✓ 활성LPC18S50FET180E 개요
A microcontroller is a programmable semiconductor that combines a processor core, memory, peripherals, and communication interfaces on one device. Within the embedded-control hierarchy, this part belongs to the Arm Cortex-M3 class of 32-bit real-time microcontrollers, combining efficient interrupt handling with integrated connectivity. The ROMless architecture allows the boot program and application firmware to be stored in external nonvolatile memory, supporting larger codebases, flexible field updates, and controlled security provisioning.
Key features include an Arm Cortex-M3 processor operating up to 180 MHz, 200 kB of SRAM, Ethernet connectivity, two high-speed USB ports, and LCD controller support. The security-oriented LPC18S family is suited to systems requiring hardware-assisted protection, controlled boot behavior, and connected communications. Its integration can reduce the component count in gateways, industrial controllers, human-machine interfaces, and network-attached equipment.
The 180-TFBGA package supports dense PCB layouts while providing direct access to the Ethernet, USB, display, and general-purpose microcontroller peripherals. Because the device is ROMless, firmware storage and the external memory interface form a central part of the hardware design. Designers should use the manufacturer pin-description table when assigning ball locations and should validate signal integrity, power sequencing, exposed-pad treatment, and BGA assembly requirements before release to production.
Typical applications include industrial Ethernet gateways, USB-to-Ethernet bridges, human-machine interface controllers, secure embedded network equipment, and connected factory-control systems. The combination of a 180 MHz Cortex-M3 core, 200 kB SRAM, dual high-speed USB, Ethernet, and LCD support allows the device to consolidate protocol processing, user-interface control, and secure connectivity in one compact design.
The principal design trade-off is the extra board complexity associated with a 180-ball BGA and external firmware storage. Plan power rails and decoupling for simultaneous Ethernet and USB activity, preserve the recommended ball-pad layout, and qualify the assembly process before volume production. This page organizes the verified device characteristics, sourcing information, practical design considerations, and clearly qualified comparison points for engineering review.
For firmware development, confirm the supported external-memory device, boot configuration, pin multiplexing, and peripheral clock settings against the LPC18Sx datasheet. The suffix E identifies the specific ordering configuration, so engineers should preserve the complete MPN when requesting documentation, quotes, or production components.
드롭인 대체품: LPC18S50FET180E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청LPC18S50FET180E 최대 정격 & 전기적 특성
| Product Type | 32-bit ARM Cortex-M3 microcontroller |
| CPU Core | Arm Cortex-M3 |
| Maximum CPU Frequency | 180 MHz |
| Architecture | 32-bit |
| On-Chip SRAM | 200 kB |
| Program Memory | ROMless |
| Ethernet Support | Yes |
| High-Speed USB Interfaces | 2 |
| LCD Support | Yes |
| Security Features | Yes |
| 패키지 | 180-TFBGA (12 x 12 mm) |
| 실장 유형 | Surface mount |
| JESD Code | e1 |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Peak Reflow Time | 30 s |
| Peak Reflow Temperature | 260 C |
| Terminal Finish | Tin silver copper |
LPC18S50FET180E 180-tfbga (12 x 12 mm) 핀 구성 가이드
LPC18S50FET180E(180-tfbga (12 x 12 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: LPC18S50FET180E.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
LPC18S50FET180E 적합 용도: 6 애플리케이션s: Industrial Ethernet Gateway, USB-to-Ethernet Communication Bridge, Human-Machine Interface Controller, Secure Connected Device, Factory Sensor Hub, USB-C Peripheral Controller.
Industrial Ethernet Gateway
The LPC18S50FET180E fits industrial Ethernet gateways because it combines a 180 MHz Arm Cortex-M3 processor with 200 kB of SRAM and integrated Ethernet connectivity in one ROMless microcontroller. The processor can handle protocol processing, data concentration, device management, and application logic, while external nonvolatile memory provides room for firmware and update images. Its two high-speed USB interfaces also allow configuration storage, service access, or peripheral connectivity without requiring a separate controller. For industrial deployment, validate the exact operating-temperature grade, isolation requirements, Ethernet magnetics, surge protection, and recovery behavior against the completed system specification.
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USB-to-Ethernet Communication Bridge
The LPC18S50FET180E is well suited to a USB-to-Ethernet bridge because it integrates two high-speed USB interfaces and Ethernet alongside a 180 MHz Cortex-M3 core. The 200 kB of SRAM supports buffering, protocol conversion, and packet-processing tasks, while the ROMless configuration allows application firmware to reside in external memory. This consolidation can reduce board area compared with a design using separate USB and Ethernet interface ICs. Firmware must preserve correct host, device, Ethernet timing, and USB enumeration behavior, and the PCB should follow the manufacturer’s BGA, differential-routing, and power-decoupling guidance.
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Human-Machine Interface Controller
The LPC18S50FET180E can serve as the central controller in a human-machine interface that combines a display with network-connected equipment. Its LCD support and 180 MHz Cortex-M3 performance allow display refresh, touch or keypad handling, status presentation, and communications to share one controller. The 200 kB of SRAM provides working memory for graphics, messages, and protocol buffers, while the ROMless architecture supports larger firmware and controlled field upgrades. Designers should verify display timing, voltage levels, backlight control, and pin multiplexing, while the 180-TFBGA layout should be paired with a manufacturing process capable of inspecting this high-ball-count package.
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Secure Connected Device
The LPC18S50FET180E fits secure connected products that benefit from an Arm Cortex-M3 core, 200 kB of SRAM, hardware-oriented security features, Ethernet, and two high-speed USB interfaces. Its ROMless architecture can support a controlled boot chain in external nonvolatile memory, allowing firmware to be separated from application code or provisioned according to product-security requirements. The 180 MHz processing rate supports real-time protocol and application tasks without requiring a higher-power processor. Final security implementation should include secure boot, key protection, debug-access policy, authenticated updates, and production programming steps validated against the LPC18Sx reference documentation.
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Factory Sensor Hub
The LPC18S50FET180E can act as a factory sensor hub that gathers machine data, performs local processing, and forwards information over Ethernet. Its 180 MHz Cortex-M3 core and 200 kB of SRAM are suitable for managing sensor data, protocol conversion, diagnostics, and buffering when the board also uses USB for configuration or service. The ROMless architecture allows firmware to be updated or replaced through external storage as plant requirements evolve. Because the source data does not establish the complete peripheral list or ADC performance, individual sensor interfaces must be checked against the datasheet before selection, and industrial EMC, isolation, and operating-temperature requirements must be met at the board level.
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USB-C Peripheral Controller
The LPC18S50FET180E can serve in USB peripherals that need high-speed USB connectivity, protocol handling, and network-capable embedded logic. One USB interface may serve the external peripheral while the other supports host, service, or dual-role functions, depending on the exact configuration and firmware requirements. At 180 MHz with 200 kB of SRAM, the device has sufficient resources for control tasks, data movement, and boot-time services. The two-port feature does not by itself guarantee simultaneous dual-role operation, so developers must confirm supported use cases, descriptor handling, power sourcing, connector protection, and enumeration behavior in the LPC18Sx user manual and USB reference material.
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엔지니어링 참조 데이터: LPC18S50FET180E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Manufacturer | NXP Semiconductors |
| Package | 180-TFBGA (12 x 12 mm) |
| CPU Core | Arm Cortex-M3 |
| Architecture | 32-bit |
| Maximum CPU Frequency | 180 MHz |
| On-Chip SRAM | 200 kB |
| Program Memory Architecture | ROMless |
| Ethernet Support | Yes |
| High-Speed USB Interfaces | 2 |
| LCD Support | Yes |
주요 차별점
- Integrated connected peripherals (vs A discrete Ethernet and USB interface design)
- Substantial integrated working memory (vs Low-SRAM Cortex-M3 microcontrollers)
- ROMless security and boot architecture (vs Microcontrollers with internal flash)
설계 노트
Use the LPC18Sx datasheet’s complete 180-TFBGA land pattern rather than constructing a generic BGA footprint. Confirm ball assignments, solder-mask and paste geometry, thermal-via treatment, and any exposed thermal connection before releasing artwork. A 12 x 12 mm, 180-ball package also requires an assembly process capable of fine-pitch inspection and reliable X-ray or solder-joint verification.
Follow the manufacturer’s supply-rail, decoupling, and power-sequencing requirements for every voltage domain used by the MCU, Ethernet PHY, and USB interfaces. Place the recommended bypass capacitors immediately beside their corresponding balls and keep high-current Ethernet and USB return paths away from sensitive signal routing. Validate startup and shutdown behavior across worst-case input-voltage and temperature conditions.
Because the LPC18S50FET180E is ROMless, treat the external-memory interface as a critical synchronous layout region. Route the processor and memory connections over a continuous reference plane, control the length skew required by the selected memory and configuration, and avoid splitting planes beneath those nets. Confirm signal integrity through the manufacturer’s timing constraints and the memory interface’s I/O standard.
Do not substitute the base LPC18S50FET180 ordering code for LPC18S50FET180E without confirming all ordering options. Likewise, a microcontroller with similar CPU speed or package dimensions is not a drop-in replacement unless its 180-ball mapping, boot configuration, external-memory interface, security implementation, and peripheral assignments are identical. Preserve the complete MPN in firmware, programming, purchasing, and production documentation.
규정 준수 정보
The product record identifies JESD code e1, MSL 3, a 30-second maximum peak reflow time, a 260 C peak reflow temperature, and tin-silver-copper terminal finish. No explicit RoHS, REACH, AEC-Q100, halogen-free, lead-free, or conflict-minerals declaration was identified.
