M1AFS1500-FG484 - Fusion FPGA 1.5M Gates 484-BGA | Microchip
부품 번호: M1AFS1500-FG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $473.53 | $473.53 |
| 10 | $440 | $4,400.00 |
| 100 | $380 | $38,000.00 |
| 500 | $327.17 | $163,585.00 |
| 1,000 | $212.58 | $212,580.00 |
M1AFS1500-FG484 개요
A mixed-signal FPGA is a field-programmable gate array that combines digital programmable logic fabric with on-chip analog peripherals, flash configuration memory, and clock management circuitry in a single monolithic die. Within the semiconductor hierarchy, it sits above standard digital FPGAs and below full custom ASICs, occupying the system-on-chip programmable logic segment of the power and processing ecosystem.
Key features of the M1AFS1500-FG484 include flash-based configuration that is instant-on at power-up, eliminating the need for an external configuration PROM; 128-bit flash-based security lock with industry-leading AES decryption to protect programmed IP; and integrated configurable analog blocks alongside large flash memory blocks, which distinguishes Fusion from purely digital FPGA families.
The architecture uses a flash-based programmable fabric that mitigates the need for ASIC migration at higher volumes, making the Fusion family a cost-effective ASIC replacement. According to the manufacturer datasheet, Fusion devices begin working as soon as system power is applied within normal operating specifications, a significant advantage over SRAM FPGAs that require boot time and are vulnerable to configuration readback attacks.
Typical applications span consumer electronics, networking and communications equipment, computing platforms, avionics, and industrial systems that benefit from mixed-signal integration, secure flash configuration, and high I/O count in a ball-grid-array footprint.
When designing with this device, plan power distribution for the 1.5V core and appropriate I/O bank voltages, and verify BGA escape routing density for the 484-ball footprint early in layout.
This page synthesizes distributor pricing from multiple sources, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: M1AFS1500-FG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS1500-FG484 (동일 폼 팩터 및 풋프린트) — 차이점: System Gates, Family, Package, Configuration Memory, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1AFS1500-FGG484I
✅ 드롭인✓ 재고 있음
$152.28 / 개
데이터시트 보기 →M1AFS1500-1FGG484I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS1500-2FGG484
✅ 드롭인✓ 재고 있음
$201.11 / 개
데이터시트 보기 →M1AFS1500-FGG484I
✅ 드롭인✓ 재고 있음
$152.28 / 개
데이터시트 보기 →M1AFS1500-FG484K
✅ 드롭인✓ 재고 있음
$1327.1 / 개
데이터시트 보기 →M1AFS1500-2FG484
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →AFS1500-FG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M1AFS1500-1FGG484
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS1500-FG484 최대 정격 & 전기적 특성
| Family | Fusion Mixed-Signal FPGA |
| Equivalent Gates | 1500000 |
| Logic Cells | 38400 |
| User I/O | 223 |
| Flash Memory Bits | 276480 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm |
| Configuration Type | Flash-based (instant-on) |
| Security | 128-bit flash lock with AES decryption |
| 패키지 | 484-ball FBGA (FG484) |
| 실장 유형 | Surface Mount |
| Terminal Form | Ball (BGA) |
| Packaging | Tray |
| RoHS 상태 | Lead free / RoHS Compliant |
M1AFS1500-FG484 484-ball fbga (fg484) 핀 구성 가이드
M1AFS1500-FG484(484-ball fbga (fg484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS1500-FG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS1500-FG484 적합 용도: 6 애플리케이션s: Avionics and Aerospace Systems, Networking and Communications Equipment, Industrial Control and Automation, ASIC Replacement and Prototyping, Secure IP Protection Applications, Consumer and Computing Platforms.
Avionics and Aerospace Systems
The M1AFS1500-FG484 fits avionics designs because its flash-based configuration is instant-on and immune to configuration upsets that affect SRAM FPGAs, while the 128-bit flash lock with AES decryption protects flight-critical IP. With 1.5M gates, 38,400 logic cells, and 223 user I/Os in a 484-ball FBGA, it consolidates glue logic, interface bridging, and mixed-signal monitoring into one monolithic device. The Microsemi datasheet explicitly names avionics as a target market. Designers typically use the integrated analog blocks for board-level health monitoring (voltage and temperature telemetry), reducing discrete monitor ICs. Bitstream regeneration is required when migrating between speed grades, but the footprint is preserved across Fusion FG484 variants.
추천
Networking and Communications Equipment
In networking line cards, switches, and communication backplanes, the M1AFS1500-FG484 provides 223 user I/Os organized in banks supporting multiple I/O standards, letting one device bridge control planes, manage PHYs, and implement custom glue logic. The Microsemi datasheet identifies networking and communications as a core Fusion market. Its 276,480 flash bits store configuration on-chip, enabling systems that power up functional immediately - important for redundant and hot-swap telecom hardware. The integrated clock generation and management circuitry reduces the need for external clock-management ICs. Its 1.5V core on a 130nm process balances logic density against power, suiting always-on infrastructure equipment where board space at the 484-BGA footprint is at a premium.
추천
Industrial Control and Automation
Industrial controllers benefit from the Fusion family's monolithic integration of configurable analog, flash memory, clock management, and programmable logic. The M1AFS1500-FG484 can implement motor-control state machines, sensor interfacing, and system supervision in one 484-ball FBGA, while the flash-based fabric tolerates the electrically noisy environments typical of factory automation. For plants with wide ambient temperature swings, the FGG484I industrial-grade drop-in variant guarantees -40C to +100C operation on the identical footprint. The 128-bit flash lock and AES decryption protect proprietary control algorithms from cloning, an increasing concern in industrial equipment. According to the Microsemi datasheet, Fusion devices are active as soon as power is applied, simplifying fault-recovery behavior after brownouts.
추천
ASIC Replacement and Prototyping
The Microsemi datasheet states that the Fusion architecture mitigates the need for ASIC migration at higher user volumes, positioning the M1AFS1500-FG484 as a cost-effective ASIC replacement. With 1.5 million equivalent gates and 38,400 logic cells, it absorbs medium-size SoC peripheral logic, custom interfaces, and control blocks that would otherwise require an ASIC NRE. Teams can prototype in Fusion hardware, then either stay in programmable silicon for production or use the same footprint knowledge to migrate. The 130nm flash process provides nonvolatile, secure configuration without external boot devices, reducing BOM cost versus SRAM FPGA plus configuration flash combinations. This makes it attractive for consumer and computing products with 10k-100k unit volumes.
추천
Secure IP Protection Applications
Designs carrying valuable intellectual property - cryptographic engines, proprietary algorithms, licensed interfaces - fit the M1AFS1500-FG484 because of its 128-bit flash-based lock and industry-leading AES decryption, per the Microsemi datasheet. Unlike SRAM FPGAs, whose bitstreams must be stored externally and are exposed at boot, Fusion stores configuration on-chip in flash and decrypts internally, eliminating the most common attack surface. The 1.5M-gate capacity is sufficient for AES/SHA engines, secure boot controllers, and authentication bridges. The instant-on flash fabric also enables zero-gap secure startup where the device must enforce policy from the first clock cycle. Designers should still follow Microsecurity application guidance on key storage and disable JTAG in production.
추천
Consumer and Computing Platforms
Consumer electronics and computing platforms use the M1AFS1500-FG484 where mixed-signal integration and a single-chip BOM reduce cost: the monolithic Fusion die combines programmable logic, flash memory blocks, configurable analog, and clock management, replacing several discrete components. The Microsemi datasheet lists consumer and computing among its target markets. At 1.5V core and 130nm, power is manageable for mains-powered and set-top-style products, and the 484-ball FBGA suits dense multilayer consumer PCBs. Volume pricing reflects strong competition among distributors (LCSC from $212.58 as of 2026-09-02), improving feasibility against ASIC alternatives. For lighter designs in the same footprint, the M1AFS600-FG484 offers a lower-cost migration path without a board respin.
추천
추천 제품 요약
엔지니어링 참조 데이터: M1AFS1500-FG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M1AFS1500-FGG484 | M1AFS1500-1FGG484I | AFS1500-FG484I | M1AFS1500-FGG676 |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA - same footprint | 484-ball FBGA - same footprint | 484-ball FBGA - same footprint | 676-ball FBGA (different package) |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology (Actel/Microsemi legacy) | Microchip Technology |
| Equivalent Gates | 1500000 | 1500000 | 1500000 | 1500000 | 600000 |
| Speed Grade | Standard | Standard | -1 (faster) | Standard | -2 (slower) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration / Security | Flash-based, 128-bit lock + AES | Flash-based, 128-bit lock + AES | Flash-based, 128-bit lock + AES | Flash-based, 128-bit lock + AES | Flash-based, 128-bit lock + AES |
주요 차별점
- Instant-on flash configuration with no external boot device (vs AFS1500-2FG484)
- Lead-free ball option within same footprint (vs M1AFS1500-FGG484)
- Industrial temperature availability without respin (vs M1AFS1500-1FGG484I)
- Integrated analog and AES security in monolithic die (vs AFS1500-FG484I)
설계 노트
The M1AFS1500-FG484 operates from a 1.5V core supply on a 130nm flash process, with separate I/O bank supplies. Estimate core current from your Libero SoC power calculator using utilized logic cells (of 38,400) and toggle rates - do not assume full-device worst case unless your design approaches full utilization. Sequence power so that I/O banks are biased before or with the core to avoid latch-up through the BGA balls, and decouple each supply ball group with bulk plus 0.1uF ceramics placed on the underside of the 484-ball footprint.
Escaping a 484-ball FBGA requires careful via-in-pad or dog-bone fanout planning. With 223 user I/Os, plan inner-layer routing channels early: a typical approach uses 2 signal layers for escape plus dedicated power/ground planes to minimize the power delivery network impedance. Keep JTAG programming balls accessible via test points or a header, since flash programming of the Fusion device occurs through JTAG in Microchip Libero SoC. Verify ball coordinates against the FG484 package table in the Fusion datasheet revision you are designing to before releasing the footprint.
A frequent pitfall is treating FG484 and FGG484 as electrically different parts - they share the same die and pinout, differing mainly in ball metallurgy, so a board laid out for one accepts the other. Conversely, FG676/F GG676 variants are NOT footprint-compatible. Another pitfall: because Fusion configuration is flash-based and instant-on, designers sometimes omit I/O pull resistors assuming Hi-Z at power-up; verify I/O states during flash power-up per the datasheet before relying on external circuit behavior.
규정 준수 정보
xsourcepart lists M1AFS1500-FG484 as Lead free / RoHS Compliant. The FGG484 suffix specifically denotes lead-free balls. REACH, halogen-free, and conflict minerals status not stated in provided data.