A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
부품 번호: A3PE3000L-1FG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $128.5 | $128.50 |
| 10 | $118 | $1,180.00 |
| 100 | $104.75 | $10,475.00 |
| 500 | $96.2 | $48,100.00 |
| 1,000 | $89.9 | $89,900.00 |
A3PE3000L-1FG484I 개요
A flash-based FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash memory rather than an external configuration PROM or SRAM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital logic IC -> semiconductor), flash FPGAs occupy the single-chip, instant-on niche: they power up with logic already loaded, need no boot device, and are inherently more resistant to configuration disturbance than SRAM FPGAs.
Key features of the A3PE3000L include the low-power 'L' variant silicon operating from a 1.2 V core (the family also supports 1.5 V core options in the non-L ProASIC3E parts), Flash*Freeze technology that lets the device enter an ultra-low static-power mode without losing register state, and single-chip operation that lowers total cost of ownership by removing external configuration storage. The 130 nm flash process combines reprogrammability with non-volatility, and the abundant 341 I/Os support wide bus interfaces in compact 484-BGA packaging.
Architecturally, the ProASIC3L fabric is built from VersaTiles, a fine-grained lookup-table-based tile that can implement combinational and sequential logic without wasting routes, and embedded SRAM blocks totaling 516 Kbits for FIFOs and dual-port buffering. Timing closure is achieved with standard static timing analysis using Libero SoC design tools from Microchip.
Typical applications include industrial automation controllers, portable and battery-powered instrumentation, medical diagnostics hardware, and secure communications equipment where instant-on operation, low static power, and single-chip integration are decisive.
A key design consideration: the '-1' speed grade and industrial 'I' temperature suffix must both be matched when qualifying alternates, because timing and operating range differ across grade variants of the same die.
This page adds value beyond the manufacturer datasheet by synthesizing distributor stock and pricing, drop-in same-footprint alternates, and practical design notes in one AI-citable reference.
드롭인 대체품: A3PE3000L-1FG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-1FG484I (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, System Gates, RoHS Status, Configuration.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-1FGG484I
✅ 드롭인✓ 재고 있음
$104.5 / 개
데이터시트 보기 →A3PE3000L-FG484
✅ 드롭인✓ 재고 있음
$112 / 개
데이터시트 보기 →A3PE3000-2FGG484I
✅ 드롭인✓ 재고 있음
$89.4 / 개
데이터시트 보기 →A3PE1500-2FGG484I
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →A3PE3000L-1FG324
✅ 드롭인✓ 재고 있음
$135.9 / 개
데이터시트 보기 →A3PE3000L-1FG484I 최대 정격 & 전기적 특성
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3,000,000 gates |
| Logic Elements (LEs) | 35 KLEs |
| Total RAM Bits | 516096 bits |
| Number of I/O | 341 |
| Core Voltage | 1.2 V (family supports 1.2 V to 1.5 V) |
| Process Technology | 130 nm flash |
| Special Features | Flash*Freeze technology, non-volatile single-chip |
| Speed Grade | -1 |
| 패키지 | 484-ball FBGA (FG484) |
| 실장 유형 | Surface Mount |
| Terminal Form | Ball (BGA, square) |
| Temperature Grade | Industrial (I) |
| Configuration | On-chip flash, no external boot device |
| Packaging | Tray |
A3PE3000L-1FG484I 484-ball fbga (fg484) 핀 구성 가이드
A3PE3000L-1FG484I(484-ball fbga (fg484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-1FG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-1FG484I 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Battery-Powered Portable Instrumentation, Medical Diagnostics Hardware, Secure Communications Equipment, Aerospace and Defense Subsystems, Test and Measurement Equipment.
Industrial Automation Controllers
The A3PE3000L-1FG484I fits industrial automation because its 341 user I/Os aggregate wide parallel sensor and actuator buses, and its flash configuration means the controller is functional the instant 24 V panel power is applied - no configuration boot delay that could trip watchdogs or interlocks. The 1.2 V low-power core with Flash*Freeze mode keeps idle-line power low in intermittently active I/O modules. With 516096 bits of embedded SRAM, the fabric implements FIFOs between fieldbus MACs and host processors without external memory. Timing in the -1 industrial speed grade comfortably covers 25-50 MHz class control logic typical of PLC and motor-drive supervision, making it a reliable single-chip glue and control fabric on the 484-ball FG484 footprint.
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Battery-Powered Portable Instrumentation
Battery-operated instruments benefit directly from the 'L' low-power silicon and Flash*Freeze technology of the A3PE3000L-1FG484I. In Flash*Freeze mode the device retains all register and SRAM state while drawing ultra-low static current, so a handheld analyzer can duty-cycle its processing fabric without reconfiguration latency on wake. The 1.2 V core reduces dynamic energy per operation relative to the 1.5 V ProASIC3E variants, directly extending battery runtime in a design governed by mWh budgets. Instant-on flash boot eliminates the external configuration PROM's standby draw and board area, and the single-chip solution shortens the BOM. For portable designs that still need 3M gates of front-end logic, this part balances density and power on a compact 484-BGA footprint.
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Medical Diagnostics Hardware
Medical diagnostic equipment such as blood analyzers and portable monitoring devices requires deterministic, instant-on logic and low idle power between measurement cycles - both strengths of the A3PE3000L-1FG484I. The flash fabric avoids configuration image integrity concerns in regulated environments, and 341 I/Os interface detector arrays, motor-driven samplers, and host communication ports simultaneously. The 516096-bit embedded SRAM buffers sample data between acquisition bursts, and Flash*Freeze mode cuts standby draw during idle periods in battery-backup scenarios. Industrial temperature rating supports the wide ambient range of clinical and point-of-care environments. The -1 speed grade timing headroom is ample for the 10-50 MHz class sequencing and data-path logic typical of diagnostic front ends.
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Secure Communications Equipment
Non-volatile flash configuration makes the A3PE3000L-1FG484I attractive in secure communications gear: there is no external configuration bitstream to intercept or disturb, supporting single-chip designs where configuration confidentiality matters. The 3M-gate fabric implements protocol bridges, encryption wrappers, and bus arbitration between processors and line cards, while 516096 bits of SRAM handle packet buffering for moderate line rates. Flash*Freeze mode cuts power during standby listening states in portable radio and mesh-node equipment. The 484-ball FG484 package with 341 I/Os supports wide parallel backplanes and multiple voltage-standard I/O banks. Designs that later require higher timing performance can drop in the A3PE3000-2FGG484I on the same footprint after re-timing.
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Aerospace and Defense Subsystems
Flash FPGAs are widely used in aerospace and defense subsystems because flash configuration is inherently more robust against single-event configuration upsets than SRAM-based fabrics. The A3PE3000L-1FG484I brings instant-on behavior needed for mission-critical boards that must be operational at power application, plus low static power for thermally constrained conduction-cooled enclosures. Its 3M gates implement payload processing, telemetry framing, and sensor-interface logic, while 341 I/Os cover legacy parallel MIL-STD-style buses and modern serial interfaces alike. The industrial-grade '-I' suffix shown in the ordering code indicates the temperature variant shipped here; space-flight variants should be sourced through Microchip's Hi-Rel channels. Libero SoC provides the timing signoff flow for high-reliability program documentation.
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Test and Measurement Equipment
Bench and modular instruments use the A3PE3000L-1FG484I as acquisition-timing and interface fabric. The -1 speed grade delivers dependable timing closure for trigger logic, time-stamping counters, and channel-sequencing state machines, while 516096 bits of embedded SRAM capture burst samples ahead of the host readout. Instant-on flash configuration means the instrument front-end is live as soon as power is applied, improving perceived responsiveness and simplifying boot sequencing. Flash*Freeze mode suits handheld and battery-backed test nodes that idle between measurements. The 341 I/Os connect ADC front ends, display interfaces, and USB or LAN bridge chips concurrently on one chip, and the 484-BGA footprint leaves routing channels open for high-speed signal access on a standard 4-6 layer board.
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추천 제품 요약
엔지니어링 참조 데이터: A3PE3000L-1FG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-1FGG484I | A3PE3000L-FG484 | A3PE3000-2FGG484I | A3PE1500-2FGG484I |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA (FGG484) - same footprint | 484-ball FBGA (FG484) - same | 484-ball FBGA (FGG484) - same footprint | 484-ball FBGA (FGG484) - same footprint |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | ~1,000,000 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V (L variant) | 1.5 V | 1.5 V |
| Speed Grade | -1 | -1 | standard (verify grade) | -2 | -2 |
| Special Features | Flash*Freeze, low-power L core, non-volatile | Flash*Freeze, low-power L core | Flash*Freeze, low-power L core | Higher performance 3E family, no L core | 3E family, smaller density |
주요 차별점
- Low-power 1.2 V core with Flash*Freeze (vs A3PE3000-2FGG484I)
- Industrial -1 speed grade in green-compatible footprint (vs A3PE3000L-1FGG484I)
- Full 3M-gate density (vs A3PE1500-2FGG484I)
설계 노트
Power the 1.2 V core rail with a regulator that tolerates the inrush of flash FPGA power-up; sequence I/O banks per the datasheet power-up order to avoid bus contention during configuration (the device is live with user logic immediately because configuration is on-chip flash). Verify Flash*Freeze entry/exit current on your rail design if battery runtime is a spec - the benefit depends on how much logic is static during the frozen period.
The 484-ball FBGA requires via-in-pad or dog-bone fanout; plan 0.8 mm-pitch-compatible geometry and keep core-voltage planes solid under the die area to minimize simultaneous-switching drop across 341 I/Os. Decouple each I/O bank supply with at least one bulk plus multiple 0.1 uF ceramics placed inside the fanout field. Refer to Microchip's ProASIC3 PCB layout application guidance in Libero SoC documentation for escape routing patterns.
Do not substitute between the 'L' (1.2 V) and non-L (1.5 V) core variants without changing the core rail - the A3PE3000-2FGG484I alternative shares the footprint but requires 1.5 V, and powering it at 1.2 V will miss -2 timing. Also confirm speed grade suffix in purchasing: the standard FG484 part may not be the -1 grade, so re-run static timing analysis in Libero SoC on any alternate before release.
규정 준수 정보
Compliance data not present in verified web data. The FGG484 'G' suffix variant (A3PE3000L-1FGG484I) is Microchip's green packaging line; verify RoHS/REACH status on the Microchip product page or environmental datasheet before procurement.