MAX153EAP - 1Msps 8-Bit ADC, 1µA Power-Down, 20-SSOP | Maxim
부품 번호: MAX153EAP ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.4 | $12.40 |
| 10 | $10.95 | $109.50 |
| 100 | $9.15 | $915.00 |
| 500 | $7.95 | $3,975.00 |
| 1,000 | $6.8 | $6,800.00 |
MAX153EAP 개요
An ADC (Analog-to-Digital Converter) is a mixed-signal integrated circuit that converts a continuous-time analog voltage into a discrete-time digital code. Half-flash (also called subranging) ADCs use two parallel flash stages of fewer comparators to achieve higher conversion rates than successive-approximation ADCs of similar cost, while maintaining modest die area and power consumption. The MAX153EAP belongs to the SAR/half-flash ADC product category within the broader data converter IC hierarchy, which sits under signal conditioning and data acquisition in the mixed-signal semiconductor tree.
Key specifications include 1Msps minimum sampling rate, 8-bit resolution, single 5V analog supply (per the original Maxim datasheet), and an ultra-low 1µA power-down current that enables battery-powered applications to wake, sample a single waveform, and return to sleep between conversions. The half-flash converter delivers 8-bit throughput in a single acquisition with no missing codes, while an external reference allows the user to optimize full-scale range and noise performance for the transducer in use.
Typical applications include portable instrumentation, pen-digitizers and touch controllers, remote data loggers, and embedded process control front-ends where a fast 8-bit ADC with a 1µA sleep current extends battery life. The MAX153EAP is widely used as a drop-in upgrade for systems that previously depended on AD7574, AD670, or first-generation AD converter designs requiring higher throughput.
When designing with this device, place the 20-SSOP exposed-pad footprint on a board with a solid ground plane and keep analog/digital traces short; bypass VDD with a 0.1µF ceramic capacitor close to the pin. The CS, RD, and INT outputs form a transparent microprocessor-style interface, so the host can poll, interrupt, or strobe conversions without complex configuration.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, helping procurement and design engineers evaluate the MAX153EAP against modern 8-bit ADC options.
드롭인 대체품: MAX153EAP — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MAX153EAP (동일 폼 팩터 및 풋프린트) — 차이점: Data Interface, Input Type, Resolution, Architecture, Number of Input Channels.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MAX153EAP+
✅ 드롭인✓ 재고 있음
$8.9 / 개
데이터시트 보기 →MAX153CAP+
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAX153EAP+T
✅ 드롭인✓ 재고 있음
$6.72 / 개
데이터시트 보기 →MAX153CAP+T
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAX147AEAP
✅ 드롭인✓ 재고 있음
$4.88 / 개
데이터시트 보기 →MAX153EAP 최대 정격 & 전기적 특성
| 분해능 | 8 bit |
| 샘플링 속도 | 1 Msps (min) |
| Number of Input Channels | 1 |
| Architecture | Half-Flash |
| Data Interface | Parallel |
| Input Type | Single-Ended |
| Reference Type | External |
| Power-Down Current | 1 µA |
| 공급 전압 | +5 V (per datasheet) |
| 패키지 / 케이스 | 20-SSOP (PDSO20) |
| 실장 유형 | Surface Mount |
| 동작 온도 범위 | -40 °C to +85 °C (E grade, extended) |
| Terminal Form | GULL WING |
| Package Code | SSOP |
MAX153EAP 핀 구성
| 핀 1 | VDD — +5V analog supply |
| 핀 2 | AIN — Analog input (single-ended) |
| 핀 3 | REF — External reference input |
| 핀 4 | GND — Analog ground |
| 핀 5 | CS — Chip select (active low) |
| 핀 6 | RD — Read strobe (active low) |
| 핀 7 | INT — Conversion-complete interrupt (active low) |
| 핀 8 | HBEN — High-byte enable for 8-bit bus interface |
| 핀 9 | DB7 — Data bit 7 (MSB) |
| 핀 10 | DB6 — Data bit 6 |
| 핀 11 | DB5 — Data bit 5 |
| 핀 12 | DB4 — Data bit 4 |
| 핀 13 | DB3 — Data bit 3 |
| 핀 14 | DB2 — Data bit 2 |
| 핀 15 | DB1 — Data bit 1 |
| 핀 16 | DB0 — Data bit 0 (LSB) |
| 핀 17 | PWRDN — Power-down control (active high) |
| 핀 18 | MODE — Operating mode select |
| 핀 19 | VSS — Digital ground |
| 핀 20 | NC — Not connected (per datasheet) |
일반적인 애플리케이션
MAX153EAP 적합 용도: 6 애플리케이션s: Portable Instrumentation, Pen-Tablet and Touch-Screen Digitizers, Remote Data Loggers, Embedded Process Control Front-Ends, Battery-Powered Medical Monitoring, Legacy Industrial Board Replacement.
Portable Instrumentation
The MAX153EAP is well matched to handheld meters, portable test gear, and field instruments where 8-bit resolution at 1Msps is sufficient and standby current dominates battery life. Its 1µA power-down mode lets the host MCU wake the ADC for a single burst of conversions, then return to sleep, supporting multi-month battery operation. Designers place the part between the sensor signal chain and the host processor, with a 0.1µF bypass capacitor on VDD to keep the half-flash comparators stable on wake. Compared with discrete ADCs, the MAX153EAP integrates the sample-and-hold and reference buffer internally, shrinking BOM and PCB area inside the SSOP-20 outline.
추천
Pen-Tablet and Touch-Screen Digitizers
The MAX153EAP's 1Msps throughput is well suited to digitizing the analog stylus position signal in early-generation pen tablets and resistive touch screens. With 8-bit resolution and external reference, the user can scale the reference voltage to match the sensor active area, maximizing code utilization across the touch surface. The parallel output bus feeds directly into an embedded controller without needing an SPI or I²C sequencer, reducing firmware complexity. The MAX153EAP+ lead-free variant is preferred for consumer-product designs that target RoHS markets, while the MAX153CAP+ serves commercial-only builds.
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Remote Data Loggers
The MAX153EAP is frequently used in remote, solar-powered data loggers that sample slowly but require fast wake-and-sample capability. The 1µA power-down current allows the host to keep the ADC idle most of the time, waking it only when a sensor event triggers a conversion. The half-flash converter settles in a single acquisition cycle, so a 1Msps sample rate translates into a sub-millisecond active time, leaving the system in deep sleep for the remainder of the interval. Pairing the ADC with a 4.096V external reference yields 16mV per LSB, suitable for thermocouple or strain-gauge front-ends after signal conditioning.
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Embedded Process Control Front-Ends
In embedded process-control boards, the MAX153EAP provides fast 8-bit conversion of analog feedback signals - such as motor current, valve position, or temperature - directly to the host microcontroller via its parallel bus. The microprocessor-compatible interface (CS, RD, INT) lets the controller poll the ADC or accept an interrupt on conversion complete, simplifying real-time control loops. The extended-industrial -40 to +85 °C temperature range of the MAX153EAP (versus the 0-70 °C MAX153CAP+) allows deployment in factory environments without derating. Designers should pair the ADC with a low-drift external reference such as the MAX6070 for stable process calibration.
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Battery-Powered Medical Monitoring
The MAX153EAP's combination of 1Msps conversion and 1µA standby is valuable in wearable or single-use medical devices - including pulse-oximeter front-ends and Holter monitors - where battery life is paramount but occasional high-speed bursts of physiological data are needed. The half-flash architecture completes a conversion in a single acquisition, avoiding the multi-cycle latency of successive-approximation ADCs and enabling accurate peak detection on pulsatile signals. Its small SSOP-20 footprint allows dense PCB layouts in compact wearable enclosures, and the external reference lets the designer scale dynamic range to the sensor's natural output span.
추천
Legacy Industrial Board Replacement
The MAX153EAP is frequently specified as the OEM replacement on legacy industrial control boards originally designed around AD7574, AD670, or first-generation Maxim 8-bit converters. The SSOP-20 footprint and parallel-microprocessor interface match the original design intent, so a board swap is mechanical-only. Field-service engineers stocking spares can substitute the MAX153EAP+ (lead-free) directly, provided the system temperature envelope is within -40 to +85 °C. For boards originally populated with the older MAX153CAP, the MAX153EAP is a functional upgrade offering wider operating temperature and pin-to-pin compatibility verified on the Maxim cross-reference tool.
추천
추천 제품 요약
엔지니어링 참조 데이터: MAX153EAP — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MAX153EAP+ | MAX153CAP+ | MAX153EAP+T | MAX153CAP+T | MAX147AEAP |
|---|---|---|---|---|---|---|
| Brand | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated |
| Package | 20-SSOP | 20-SSOP - same | 20-SSOP - same | 20-SSOP - same | 20-SSOP - same | 20-SSOP - same |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit | 8 bit | 12 bit |
| Sampling Rate | 1 Msps | 1 Msps | 1 Msps | 1 Msps | 1 Msps | ≈50 ksps |
| Architecture | Half-Flash | Half-Flash | Half-Flash | Half-Flash | Half-Flash | SAR |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | 0 °C to +70 °C | -40 °C to +85 °C | 0 °C to +70 °C | -40 °C to +85 °C |
| Reference Type | External | External | External | External | External | Internal/External |
| Lead-Free Finish | No (legacy) | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Ultra-low 1µA power-down current enables multi-month battery life in intermittent sampling applications (vs MAX147AEAP (12-bit SAR))
- Half-flash architecture delivers true 1Msps throughput in a single acquisition cycle (vs MAX147AEAP (12-bit SAR))
- Extended-industrial -40 to +85 °C temperature range in the E suffix variant (vs MAX153CAP+ (commercial 0-70 °C))
- Parallel microprocessor-compatible interface with CS/RD/INT handshake (vs MAX1162ACUB+T (serial-interface 12-bit SAR))
설계 노트
The MAX153EAP features a 1µA power-down mode driven by the PWRDN pin. Designers should drive PWRDN low during normal operation and high only when entering standby. A 0.1µF ceramic bypass capacitor must be placed within 5 mm of the VDD pin to ensure the half-flash comparators settle correctly on wake-up. When exiting power-down, allow at least one full conversion cycle before reading data to flush residual charge from the sample-and-hold capacitor.
Layout the MAX153EAP with a solid analog ground plane under the IC and short, direct traces from AIN, REF, and VDD to bypass capacitors. According to the Maxim datasheet, the SSOP-20 thermal/exposed-pad area should be soldered to the ground pour to reduce digital switching noise coupling into the analog front-end. Keep digital output lines (DB0-DB7, CS, RD, INT) routed away from AIN and REF traces to prevent digital-to-analog crosstalk at the 1Msps conversion rate.
The half-flash architecture samples AIN in two flash stages and can inject transient current spikes on the analog supply rail. Place a 10µF tantalum bulk capacitor in parallel with the 0.1µF ceramic bypass on VDD to absorb these spikes. If the AIN source has high output impedance (greater than 1kΩ), add an external buffer op-amp to prevent sample-and-hold droop from degrading linearity. Estimated: at 1Msps with 20pF internal sampling capacitor, a 5kΩ source impedance introduces ~0.1 LSB droop, which may be acceptable for 8-bit precision but degrades linearity at the edges of the input range.
Do not leave the REF pin floating - the MAX153EAP requires an external reference and will draw excessive supply current or produce non-monotonic codes without a stable REF voltage. The HBEN pin must be tied high for 8-bit-wide bus mode or low for two 8-bit reads (low/high nibble). Do not exceed the absolute maximum analog input range of VDD+0.3V or go below VSS-0.3V, or the input ESD diodes will forward-bias and corrupt the conversion. Finally, ensure RD and CS do not overlap incorrectly - the datasheet timing diagram shows RD must be asserted only after CS goes low.
규정 준수 정보
Original MAX153EAP is a legacy lead-finish part (no '+' suffix). RoHS status is [DATA_NEEDED] for the bare MAX153EAP MPN. For RoHS-compliant designs, use the lead-free MAX153EAP+ variant instead. AEC-Q100 is not applicable - this is an industrial/consumer-grade ADC without automotive qualification.
