MAXM17514ALI+ - 4A 2.4-5.5V Step-Down Power Module | Maxim
부품 번호: MAXM17514ALI+ ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.14 | $9.14 |
| 10 | $8.21 | $82.10 |
| 100 | $6.96 | $696.00 |
| 500 | $5.84 | $2,920.00 |
| 1,000 | $5.12 | $5,120.00 |
MAXM17514ALI+ 개요
A step-down (buck) DC-DC converter is a switching voltage regulator that efficiently reduces a higher DC input voltage to a lower DC output voltage by rapidly switching an inductor and rectifying the resulting waveform. Compared with linear regulators, buck converters achieve substantially higher efficiency (often 90-95%) by cycling a transistor between saturation and cutoff instead of dissipating excess voltage as heat. Power modules such as the MAXM17514ALI+ extend this architecture by co-packaging the controller, MOSFETs, inductor, and feedback compensation, simplifying PCB layout and shortening time to market in space-constrained designs.
Key specifications include a 2.4V to 5.5V input voltage window, 0.75V to 3.6V programmable output voltage, 4A continuous output current, integrated dual nMOSFET switches, internal shielded inductor, internal compensation network, and a thermally-enhanced SiP package that simplifies thermal management. The device is well suited for point-of-load (PoL) applications where a low-voltage, high-current rail must be derived locally from a 3.3V or 5V system bus with minimal PCB area and minimal external component count.
The MAXM17514ALI+ uses a peak current-mode control architecture with internal compensation, which simplifies stability analysis and removes the need to design a Type-III compensation network. The fully shielded inductor reduces radiated EMI, an important consideration for noise-sensitive analog and RF subsystems powered from the same board.
Typical applications include FPGA core and I/O rails, ASIC point-of-load supplies, industrial 5V bus distributed power, networking switch ASICs, telecom board rails, and portable/embedded system 3.3V-to-1.xV conversion. The wide input range makes it compatible with both 3.3V and 5V system buses without external front-end regulation.
A key design consideration is input and output capacitor selection: use ceramic capacitors with low ESR placed as close as possible to the IN and OUT pins to minimize ripple and maintain regulation loop bandwidth. Ensure the upstream 5V or 3.3V source can supply the full 4A load transient.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, enabling faster component selection and supply chain decisions.
드롭인 대체품: MAXM17514ALI+ — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MAXM17515ALI+
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAXM17504ALI+
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAXM17516ALI+
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAXM17503ALI+
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAXM17514ALI+ 최대 정격 & 전기적 특성
| 토폴로지 | Buck (Step-Down) |
| 기능 | Non-Isolated PoL Module DC-DC Converter |
| 입력 전압 범위 | 2.4 V to 5.5 V |
| 출력 전압 범위 | 0.75 V to 3.6 V (programmable) |
| 최대 출력 전류 | 4 A |
| 출력 구성 | Positive |
| 출력 수 | 1 |
| Switch Type | Dual n-channel MOSFET (integrated) |
| Inductor | Fully shielded (integrated) |
| Compensation | Internal |
| Package Type | System-in-Package (SiP) - thermally enhanced |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| 효율 | High (typical buck topology) |
MAXM17514ALI+ system-in-package (sip) - thermally enhanced 핀 구성 가이드
MAXM17514ALI+(system-in-package (sip) - thermally enhanced 패키지)의 핀 구성입니다. 이 전력 소자는 게이트, 드레인, 소스 단자를 갖추고 있습니다. 비편향 패키지의 경우 정확한 핀 1 방향과 풋프린트 세부 정보는 제조사 데이터시트를 참조하십시오. 일반적인 응용 분야로는 전원 공급 장치 설계, 모터 구동, 부하 스위칭이 있습니다.
다음에 대한 상세 핀아웃 데이터 없음: MAXM17514ALI+.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MAXM17514ALI+ 적합 용도: 6 애플리케이션s: FPGA Core and I/O Voltage Rails, ASIC Point-of-Load (PoL) Supplies, Industrial 5V Bus Distributed Power, Networking Switch ASIC Power, Telecom Board Local Regulation, Embedded System 3.3V-to-1.xV Conversion.
FPGA Core and I/O Voltage Rails
The MAXM17514ALI+ delivers 0.75V to 3.6V at 4A, directly serving mid-range FPGA core rails (0.85V, 1.0V, 1.2V) and aux I/O voltages (1.8V, 2.5V, 3.3V). Its integrated inductor minimizes radiated EMI near the FPGA, which is critical for SERDES jitter performance. According to the Maxim datasheet, the device supports up to 4A continuous, covering most mid-range FPGA power budgets. Unlike a discrete buck, the SiP eliminates the inductor footprint and simplifies PCB layout in tight FPGA-adjacent areas.
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ASIC Point-of-Load (PoL) Supplies
Distributed PoL architectures benefit from the MAXM17514ALI+'s compact SiP and 4A output. Placing one module per ASIC rail eliminates the long trace inductance that causes voltage droop during load transients. The 2.4V-5.5V input range accepts standard 3.3V or 5V system bus power without an upstream regulator. Internal compensation removes the need to design a Type-III network, reducing engineering time-to-market for ASIC reference designs.
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Industrial 5V Bus Distributed Power
Industrial systems use a 5V rail that must be stepped down locally for digital subsystems. The MAXM17514ALI+ accepts 5V input and produces 0.75V-3.6V at 4A with high buck efficiency, minimizing heat dissipation in sealed enclosures. The thermally enhanced SiP package supports operation in industrial temperature environments. Per the Maxim datasheet, this module is designed for industrial distributed architectures where a 5V backplane powers multiple PoL modules.
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Networking Switch ASIC Power
Networking switches require low-voltage, high-current rails for switch ASICs and PHYs. The MAXM17514ALI+'s 4A output and 0.75-3.6V range supports common switch ASIC core voltages (0.9V, 1.0V, 1.2V), and the fully shielded inductor reduces EMI that could couple into adjacent high-speed SerDes channels. Its small footprint allows dense placement near each ASIC, minimizing PDN impedance.
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Telecom Board Local Regulation
Telecom boards derive 3.3V or 5V from a backplane and need local step-down to ASIC and DSP core levels. The MAXM17514ALI+'s 2.4V-5.5V input covers both bus voltages without a front-end regulator. The internal nMOSFETs and inductor enable efficient conversion at telecom load currents up to 4A. The SiP footprint reduces PCB area versus discrete buck solutions.
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Embedded System 3.3V-to-1.xV Conversion
Embedded processors increasingly require sub-1V cores powered from a 3.3V system rail. The MAXM17514ALI+ steps 3.3V down to 0.75-1.2V at 4A, supporting ARM Cortex-A cores, DSPs, and SoCs. High buck efficiency reduces battery drain in portable embedded designs. The internal compensation network eliminates loop design time versus discrete buck controllers.
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추천 제품 요약
엔지니어링 참조 데이터: MAXM17514ALI+ — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MAXM17515ALI+ | MAXM17504ALI+ | MAXM17516ALI+ | MAXM17503ALI+ |
|---|---|---|---|---|---|
| Brand | Maxim | Maxim | Maxim | Maxim | Maxim |
| Package | SiP (thermally enhanced) | SiP (thermally enhanced) - same family | SiP (thermally enhanced) - same family | SiP (thermally enhanced) - same family | SiP (thermally enhanced) - same family |
| Input Voltage Range | 2.4V to 5.5V | 2.4V to 5.5V | 2.4V to 5.5V | 2.4V to 5.5V | 2.4V to 5.5V |
| Output Voltage Range | 0.75V to 3.6V | 0.75V to 3.6V | 0.75V to 3.6V | 0.75V to 5.5V | 0.75V to 3.6V |
| Maximum Output Current | 4 A | 5 A (+25%) | 3.5 A (-12.5%) | 6 A (+50%) | 5 A (+25%) |
| Inductor | Integrated (shielded) | Integrated (shielded) | Integrated (shielded) | Integrated (shielded) | Integrated (shielded) |
| Compensation | Internal | Internal | Internal | Internal | Internal |
| Topology | Buck (Step-Down) | Buck (Step-Down) | Buck (Step-Down) | Buck (Step-Down) | Buck (Step-Down) |
주요 차별점
- Highest 4A rating in the 2.4-5.5V SiP family (vs MAXM17504ALI+)
- Lower output voltage cap than MAXM17516 (vs MAXM17516ALI+)
- Fully integrated SiP versus discrete buck (vs TPS54360 (discrete buck controller))
설계 노트
Estimated: place input and output ceramic capacitors as close as possible to the IN and OUT pins of the MAXM17514ALI+ SiP to minimize parasitic inductance. Use X5R or X7R MLCCs with low ESR. The SiP integrates the inductor, but external input/output capacitors must still be sized per the Maxim datasheet reference design to maintain stable operation and limit output ripple at 4A loads.
At 4A load stepping 5V to 3.3V, power dissipation is approximately 6.8W worst-case (10% efficiency derating from ideal). The thermally enhanced SiP relies on PCB copper spreading for heat removal; design at least 1 square inch of 2oz copper on the package footprint. Without this, junction temperature can exceed 125C under sustained 4A loads.
Do not operate the MAXM17514ALI+ above 5.5V input - the integrated MOSFETs and inductor are rated only for 5.5V. Output voltages above 3.6V are not supported by this specific module; for higher output use the MAXM17516 family. Also ensure the feedback resistor divider uses 1% tolerance resistors to maintain output voltage accuracy at low Vout (e.g., 0.75V).
규정 준수 정보
RoHS compliant per Maxim/Analog Devices product page. Not AEC-Q100 qualified (industrial/consumer grade); for automotive designs, contact Maxim about AEC-Q100 variants. Lead-free (Pb-free) per the part suffix.
